JP2011187188A - Luminaire - Google Patents

Luminaire Download PDF

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JP2011187188A
JP2011187188A JP2010048462A JP2010048462A JP2011187188A JP 2011187188 A JP2011187188 A JP 2011187188A JP 2010048462 A JP2010048462 A JP 2010048462A JP 2010048462 A JP2010048462 A JP 2010048462A JP 2011187188 A JP2011187188 A JP 2011187188A
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led
led lamp
socket
mounting
substrate
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Naoki Sugishita
直樹 杉下
Keiichi Shimizu
圭一 清水
Tatsuya Toshikawa
達也 利川
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a luminaire preventing mounting a general incandescent lamp and suppressing the temperature rise of LEDs. <P>SOLUTION: The luminaire includes: an LED lamp 1 having a substrate 11 mounted with a LED 17, a heat conductive member 12 thermally connected to the substrate 11 and exposed to the outer surface, and a base 15 provided on one end side and electrically connected to the LED 17; and a luminaire body 2 having a socket 23 to which the base 15 of the LED lamp 1 is mounted, and a heat conductive erroneous mounting preventing structure 3 preventing the general incandescent lamp from being mounted to the socket 23 and thermally connected to the heat conductive member 12 when the LED lamp 1 is mounted to the socket 23. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、光源としてLEDランプを適用する照明器具に関する。   The present invention relates to a luminaire that uses an LED lamp as a light source.

近時、照明用の発光源としてLEDが用いられるようになってきており、例えば、省エネ、長寿命が実現される電球形のLEDランプが発売されている。このLEDランプは、E型の口金を有しており、一般の白熱電球に代替されるものとして注目されている。   Recently, an LED has been used as a light source for illumination. For example, a light bulb-shaped LED lamp capable of realizing energy saving and long life has been put on the market. This LED lamp has an E-type base, and has attracted attention as a substitute for a general incandescent bulb.

また、光源としてLEDランプの適用を意図した照明器具が開発されている。しかしながら、この照明器具に一般の白熱電球が装着されてしまうと、白熱電球は、点灯中の温度が高温のため温度負荷が大きく、例えば、配線関係の部材の許容温度を超えてしまう可能性がある。一方、白熱電球が装着されることを想定すると、耐熱性を確保するため耐熱温度の高い部材を使用して温度対策を行う必要性がでてくる。   In addition, lighting fixtures intended for application of LED lamps as light sources have been developed. However, if a general incandescent bulb is mounted on this lighting fixture, the incandescent bulb has a high temperature load due to the high temperature during lighting, and may exceed the allowable temperature of wiring-related members, for example. is there. On the other hand, when it is assumed that an incandescent bulb is attached, it is necessary to take measures against the temperature by using a member having a high heat-resistant temperature in order to ensure heat resistance.

さらに、LEDは、その温度が上昇することによって、光出力の低下等の諸特性の変化や短寿命化をもたらすことが知られている。したがって、LEDを光源とする照明器具にあっては、諸特性や寿命を改善するためにLEDの温度上昇を抑制する必要がある。   Furthermore, it is known that the LED brings about changes in various characteristics such as a decrease in light output and shortens the lifetime as its temperature rises. Therefore, in a lighting fixture using an LED as a light source, it is necessary to suppress an increase in temperature of the LED in order to improve various characteristics and lifetime.

従来、電球型蛍光灯の適用を意図した照明器具において、一般の白熱電球が取付けられる場合を排除して、温度対策を行う部材を不要とすることができるものが知られている(特許文献1参照)。   2. Description of the Related Art Conventionally, there is known a lighting fixture intended for application of a bulb-type fluorescent lamp that eliminates the case where a general incandescent bulb is attached and eliminates the need for a temperature countermeasure member (Patent Document 1). reference).

特開2001−256804号公報JP 2001-256804 A

しかしながら、特許文献1に示されたものは、電球型蛍光灯の適用を意図したものであって、LEDランプの適用を意図したものではない。したがって、白熱電球が取付けられる場合を排除するものではあるが、これと同時に、当然のことながら、LEDの特性に着目し、LEDの温度上昇を抑制するものではない。   However, the one disclosed in Patent Document 1 is intended for application of a light bulb type fluorescent lamp, and is not intended for application of an LED lamp. Therefore, although the case where an incandescent lamp is attached is excluded, at the same time, as a matter of course, attention is paid to the characteristics of the LED, and the temperature rise of the LED is not suppressed.

本発明は、上記課題に鑑みなされたもので、一般の白熱電球の装着を防止するとともに、LEDの温度上昇を抑制することができる照明器具を提供すること目的とする。   This invention is made | formed in view of the said subject, and it aims at providing the lighting fixture which can suppress mounting | wearing of a general incandescent lamp and can suppress the temperature rise of LED.

請求項1に記載の照明器具は、LEDが実装された基板と、この基板と熱的に結合されるとともに外面に露出した熱伝導部材と、前記LEDと電気的に接続され一端側に設けられた口金とを備えたLEDランプと;LEDランプの口金が装着されるソケットと、一般の白熱電球のソケットへの装着を防止するとともにLEDランプがソケットに装着されたとき、前記熱伝導部材に熱的に結合される熱伝導性を有する誤装着防止手段とを備えた器具本体と;を具備することを特徴とする。   The lighting fixture according to claim 1 is provided on one end side, which is electrically connected to the LED, a board on which the LED is mounted, a heat conduction member that is thermally coupled to the board and exposed to the outer surface, and the LED. An LED lamp provided with a base, a socket to which the base of the LED lamp is attached, and a general incandescent light bulb are prevented from being attached to the socket, and when the LED lamp is attached to the socket, the heat conducting member is heated. And an instrument body provided with an erroneous attachment preventing means having thermal conductivity that is coupled to each other.

LEDの実装は、表面実装方式やLEDのベアチップを基板に直接実装するチップ・オン・ボード方式によって実装されたものが好ましいが、本発明の性質上、実装方式は特に限定されるものではない。   The LED is preferably mounted by a surface mounting method or a chip-on-board method in which an LED bare chip is directly mounted on a substrate. However, the mounting method is not particularly limited due to the nature of the present invention.

熱伝導部材は、例えば、ランプの外殻をなす本体によって構成できる。また、熱伝導部材が外面に露出していることにより、誤装着防止手段が容易に熱的に結合できる。
誤装着防止手段は、一般の白熱電球の装着を防止するとともに、熱伝導部材に熱的に結合されれば足り、その構成材料や形態が格別限定されるものではない。
The heat conducting member can be constituted by, for example, a main body that forms the outer shell of the lamp. Further, since the heat conducting member is exposed on the outer surface, the erroneous mounting preventing means can be easily thermally coupled.
The mis-mounting prevention means is only required to prevent the mounting of a general incandescent bulb and to be thermally coupled to the heat conducting member, and its constituent materials and forms are not particularly limited.

また、照明器具としては、LEDランプを用いるダウンライトが好適であるが、これに限るものではない。屋内又は屋外で使用される各種照明器具に適用可能である。   Moreover, although the downlight using an LED lamp is suitable as a lighting fixture, it is not restricted to this. It can be applied to various lighting fixtures used indoors or outdoors.

請求項1に記載の発明によれば、一般の白熱電球の装着が防止できるとともに、LEDの温度上昇を抑制することができる照明器具を提供することができる。   According to the first aspect of the present invention, it is possible to provide a lighting fixture that can prevent the mounting of a general incandescent bulb and can suppress the temperature rise of the LED.

本発明の第1の実施形態に係るLEDランプを示す斜視図である。It is a perspective view which shows the LED lamp which concerns on the 1st Embodiment of this invention. 同LEDランプを示す正面図である。It is a front view which shows the LED lamp. 同LEDランプにおいてグローブで覆われた部分を断面で示す正面図である。It is a front view which shows the part covered with the globe in the LED lamp in a cross section. 同照明器具の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the lighting fixture. 図4の照明器具にLEDランプを装着した状態を示す正面図である。It is a front view which shows the state which mounted | wore the lighting fixture of FIG. 4 with the LED lamp. 本発明の第2の実施形態に係るLEDランプを示す正面視図である。It is a front view which shows the LED lamp which concerns on the 2nd Embodiment of this invention. 第1の実施形態の図5に相当し、照明器具にLEDランプを装着した状態を示す正面図である。FIG. 6 corresponds to FIG. 5 of the first embodiment, and is a front view showing a state in which an LED lamp is mounted on a lighting fixture. 誤装着防止手段を示す斜視図である。It is a perspective view which shows an incorrect mounting | wearing prevention means.

以下、本発明の第1の実施形態について図1乃至図5を参照して説明する。図1乃至図3は、電球形LEDランプ1を示し、図4及び図5は、電球形LEDランプ1が装着される照明器具としてダウンライト2の概略構成を示している。   Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 3 show a bulb-type LED lamp 1, and FIGS. 4 and 5 show a schematic configuration of a downlight 2 as a lighting fixture to which the bulb-type LED lamp 1 is attached.

図1乃至図3において、電球形LEDランプ1は、複数のLEDが実装された基板11(図3参照)、この基板11と熱的に結合された熱伝導部材としての本体12、LEDを点灯制御する点灯装置13、この点灯装置13が収納されたカバー部材14、カバー部材14に取付けられた口金15及び基板11を覆って本体12に取付けられたグローブ16を備えて構成されている。   1 to 3, a light bulb shaped LED lamp 1 lights up a substrate 11 on which a plurality of LEDs are mounted (see FIG. 3), a main body 12 as a heat conductive member thermally coupled to the substrate 11, and the LEDs. A lighting device 13 to be controlled, a cover member 14 in which the lighting device 13 is housed, a base 15 attached to the cover member 14, and a glove 16 attached to the main body 12 so as to cover the substrate 11 are configured.

基板11は、金属又は絶縁材の略円形の平板からなり、光源となるLED17が設けられている。このLED17は、LEDのベアチップであり、基板11の表面上に直接実装され、その上が蛍光体層で封止されている。基板11には、セラミックス材料又は合成樹脂材料を適用できる。合成樹脂材料を用いる場合には、例えば、ガラスエポキシ樹脂等で形成できる。   The board | substrate 11 consists of a substantially circular flat plate of a metal or an insulating material, and LED17 used as a light source is provided. The LED 17 is a bare LED chip, and is directly mounted on the surface of the substrate 11 and is sealed with a phosphor layer. A ceramic material or a synthetic resin material can be applied to the substrate 11. When a synthetic resin material is used, it can be formed of, for example, a glass epoxy resin.

本体12は、例えば、熱伝導性が良好なアルミニウム等の金属材料からなり、一端側に円柱状部12aが形成され、この円柱状部12aから他端側へ向かって徐々に径が拡大された拡径部12bを有し、この拡径部12bには複数の放熱フィンが形成されている。なお、円柱状部12aの径は、後述する口金15の径と略同じ寸法に形成されている。さらに、本体12の他端側(図示上、上側)には、基板11を取付けるための取付面が形成されている The main body 12 is made of, for example, a metal material such as aluminum having good thermal conductivity, and a cylindrical portion 12a is formed on one end side, and the diameter is gradually enlarged from the cylindrical portion 12a toward the other end side. It has an enlarged diameter portion 12b, and a plurality of radiating fins are formed in the enlarged diameter portion 12b. In addition, the diameter of the cylindrical part 12a is formed in the dimension substantially the same as the diameter of the nozzle | cap | die 15 mentioned later. Further, an attachment surface for attaching the substrate 11 is formed on the other end side (upper side in the drawing) of the main body 12.

点灯装置13は、カバー部材14に収容されるようになっており、回路基板にトランジスタQや抵抗素子R等の回路部品が実装されて構成されている。点灯装置13は、LEDチップ16に接続され、その点灯を制御する機能をなしている。   The lighting device 13 is accommodated in a cover member 14 and is configured by mounting circuit components such as a transistor Q and a resistance element R on a circuit board. The lighting device 13 is connected to the LED chip 16 and has a function of controlling lighting thereof.

カバー部材14は、例えば、PBT樹脂等の絶縁性を有する材料により形成されており、その中間部の外周面には、本体12の一端側と口金15との間を絶縁するための絶縁部であるフランジ部14aが径方向に突出して周方向全体に介在している。   The cover member 14 is formed of, for example, an insulating material such as PBT resin, and an insulating portion for insulating between one end side of the main body 12 and the base 15 is provided on the outer peripheral surface of the intermediate portion. A certain flange portion 14a protrudes in the radial direction and is interposed in the entire circumferential direction.

口金15は、例えば、E26型のものであり、点灯装置13と配線により電気的に接続されており、照明器具本体のランプソケットにねじ込まれるねじ山を備えた筒状のシェルと、このシェルの頂部に絶縁部を介して設けられたアイレットとを備えている。
グローブ16は、光拡散性を有するガラス又は合成樹脂等により球面状に形成されて基板11を覆うようになっている。
次に、図4及び図5を参照して照明器具としてのダウンライト2及びこのダウンライト2に装着されるLEDランプ1の装着状態について説明する。
The base 15 is, for example, of the E26 type, and is electrically connected to the lighting device 13 by wiring, and has a cylindrical shell provided with a screw thread that is screwed into the lamp socket of the luminaire main body, And an eyelet provided on the top via an insulating part.
The globe 16 is formed in a spherical shape with glass or synthetic resin having light diffusibility and covers the substrate 11.
Next, with reference to FIG.4 and FIG.5, the mounting state of the downlight 2 as a lighting fixture and the LED lamp 1 with which this downlight 2 is mounted | worn is demonstrated.

ダウンライト2は、天井面Cの埋め込み穴に挿入されて設置されるもので、下側が開放した円筒状の本体21と、この本体21内に収容され光の照射方向に拡開した曲面状の反射鏡22と、ソケット23と、端子台24と、反射鏡22の照射開口に配設された化粧枠25とを備え、また、本体21の上面壁には、誤装着防止手段3が取付けられている。   The downlight 2 is installed by being inserted into an embedding hole in the ceiling surface C. The downlight 2 has a cylindrical main body 21 whose lower side is open, and a curved surface that is accommodated in the main body 21 and expands in the light irradiation direction. A reflecting mirror 22, a socket 23, a terminal block 24, and a decorative frame 25 disposed in the irradiation opening of the reflecting mirror 22 are provided. ing.

本体21は、冷間圧延鋼板等で形成された金属製であり、その内部には、反射鏡22が取付けられており、反射鏡22の上部には、図示しない支持金具によって本体21の上面壁にソケット23が取付けられている。このソケット23には、LEDランプ1の口金15が装着されるようになっている。端子台24は、本体21の上面壁に取付けられており、この端子台24には、ソケット23が電気的に接続されるとともに電源線が接続されて商用電源から電力が供給されるようになっている。   The main body 21 is made of metal formed of a cold rolled steel plate or the like, and a reflecting mirror 22 is attached to the inside of the main body 21, and an upper surface wall of the main body 21 is supported on the upper portion of the reflecting mirror 22 by a support fitting (not shown). A socket 23 is attached to the socket. A base 15 of the LED lamp 1 is attached to the socket 23. The terminal block 24 is attached to the upper surface wall of the main body 21, and the socket 23 is electrically connected to the terminal block 24 and a power line is connected to supply power from a commercial power source. ing.

誤装着防止手段3は、LEDランプ1以外の一般の白熱電球のソケット23への装着を困難にし、装着を防止するとともに、LEDランプ1からの熱を本体21へ伝導し放熱を促進する機能を有するものである。   The incorrect mounting preventing means 3 has a function of making it difficult to mount a general incandescent bulb other than the LED lamp 1 in the socket 23 and preventing the mounting, and conducting heat from the LED lamp 1 to the main body 21 to promote heat dissipation. It is what you have.

誤装着防止手段3は、アルミニウム材料等の熱伝導性の良好な材料から構成されており、側面形状が略L字状に形成され、支持部31と当接部32とを有している。支持部31の一端側は、本体21の上面壁に取付ねじによって取付けられており、他端側には、当接部32が設けられて、この当接部32は反射鏡22の中央部を通過して垂下するように配設されている。   The erroneous mounting preventing means 3 is made of a material having good thermal conductivity such as an aluminum material, has a side surface formed in a substantially L shape, and has a support portion 31 and a contact portion 32. One end side of the support portion 31 is attached to the upper surface wall of the main body 21 by a mounting screw, and a contact portion 32 is provided on the other end side. It is arranged to pass and hang down.

当接部32は、LEDランプ1の円柱状部12aの外径に沿うようにその当接面32aが弧状に形成されている。また、誤装着防止手段3は、LEDランプ1がソケット23に装着されたとき、この当接面32aがLEDランプ1の円柱状部12aに密着するように、密着方向へ若干の弾性が付与されている。   The abutting portion 32 has an abutting surface 32 a formed in an arc shape along the outer diameter of the columnar portion 12 a of the LED lamp 1. Further, the erroneous mounting preventing means 3 is given a little elasticity in the contact direction so that the contact surface 32a is in close contact with the columnar portion 12a of the LED lamp 1 when the LED lamp 1 is mounted in the socket 23. ing.

このように構成されたダウンライト1の本体21に、図5に示すように、LEDランプ1をその口金15をソケット23にねじ込んで装着する。この装着された状態では、誤装着防止手段3の当接面32aがLEDランプ1の円柱状部12aに密着して面接触する。したがって、LEDランプ1の点灯中において、LED17から発生する熱は、基板11の裏面側から本体12の円柱状部12a、誤装着防止手段3の当接部32及び支持部31へと伝わり、ダウンライト本体21へと伝導されて放熱される。   As shown in FIG. 5, the LED lamp 1 is attached to the main body 21 of the downlight 1 configured as described above by screwing the base 15 into the socket 23. In this mounted state, the contact surface 32a of the erroneous mounting preventing means 3 is in close contact with the columnar portion 12a of the LED lamp 1 and comes into surface contact. Therefore, during the lighting of the LED lamp 1, the heat generated from the LED 17 is transmitted from the back surface side of the substrate 11 to the cylindrical portion 12 a of the main body 12, the contact portion 32 of the erroneous mounting preventing means 3, and the support portion 31. It is conducted to the light body 21 and dissipated.

このようにLEDランプ1をソケット23に装着すると同時に、誤装着防止手段3がLEDランプ1の円柱状部12aに接触し、放熱促進の仕組みができあがる。   Thus, simultaneously with mounting the LED lamp 1 on the socket 23, the erroneous mounting preventing means 3 comes into contact with the cylindrical portion 12a of the LED lamp 1, and a mechanism for promoting heat dissipation is completed.

一方、この誤装着防止手段3によって、ランプがソケット23に装着される許容径φ1は、一般の白熱電球を装着して使用する照明器具より狭くなっている。図に示すように、白熱電球I(例えば、E26型口金、全長98mm、グローブ径55mm)を装着しようとした場合、白熱電球Iには、装着過程においてφ1より径が大きなφ2が存在するため、このφ2の部分が誤装着防止手段3の先端部に衝突し、ソケット23に装着できず、これにより、白熱電球Iの装着が防止される。なお、本実施形態の誤装着防止手段3は、複数設けるようにしてもよい。   On the other hand, the allowable mounting diameter φ1 at which the lamp is mounted in the socket 23 by the erroneous mounting preventing means 3 is narrower than that of a lighting fixture used by mounting a general incandescent bulb. As shown in the figure, when trying to attach an incandescent bulb I (for example, E26 type base, total length 98 mm, globe diameter 55 mm), the incandescent bulb I has φ2 having a diameter larger than φ1 in the mounting process. This φ2 portion collides with the tip of the erroneous mounting preventing means 3 and cannot be mounted on the socket 23, thereby preventing the incandescent bulb I from being mounted. Note that a plurality of erroneous mounting preventing means 3 of the present embodiment may be provided.

以上のように本実施形態によれば、一般の白熱電球Iの装着が防止できるとともに、LED17の放熱性を促進して、LED17の温度上昇を抑制することができる。   As described above, according to the present embodiment, it is possible to prevent the general incandescent bulb I from being mounted and to promote the heat dissipation of the LED 17 and to suppress the temperature rise of the LED 17.

次に、本発明の第2の実施形態について図6乃至図8を参照して説明する。なお、第1の実施形態と同一又は相当部分には、同一符号を付し重複した説明は省略する。   Next, a second embodiment of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent, and the overlapping description is abbreviate | omitted.

図6に示すように、本実施形態のLEDランプ1においては、本体12は、一端側を小径の円柱状部12cとして形成し、この円柱状部12cから他端側へ向かって大径の円柱状部12dとして形成したものである。そして、小径の円柱状部12cは、口金15の径と略同じ寸法に形成され、大径の円柱状部12dは、グローブ16の最大径と略同じ寸法に形成されている。   As shown in FIG. 6, in the LED lamp 1 of the present embodiment, the main body 12 has one end side formed as a small-diameter columnar portion 12 c and a large-diameter circle from the columnar portion 12 c toward the other end side. It is formed as a columnar part 12d. The small-diameter columnar portion 12 c is formed to have approximately the same size as the diameter of the base 15, and the large-diameter columnar portion 12 d is formed to have approximately the same size as the maximum diameter of the globe 16.

図7及び図8に示すように、誤装着防止手段3は、例えば、熱伝導性が良好なアルミニウム等の金属材料からなり、略円筒状に形成されており、両端に鍔部33、34を有している。一端側(上側)の鍔部33は、本体21の上面壁に取付けられており、他端側(下側)の鍔部34は、LEDランプ1がソケット23に装着されたとき、前記大径の円柱状部12dの背面側の面に当接され、面接触されるようになっている。つまり、LEDランプ1の口金15をソケット23にねじ込んで、その装着が完了した時点で、円柱状部12dの背面側の面と鍔部34とが丁度接触する寸法関係になっている。   As shown in FIGS. 7 and 8, the mismounting prevention means 3 is made of, for example, a metal material such as aluminum having good thermal conductivity, is formed in a substantially cylindrical shape, and has flanges 33 and 34 at both ends. Have. The flange 33 on one end (upper side) is attached to the upper surface wall of the main body 21, and the flange 34 on the other end (lower) has the large diameter when the LED lamp 1 is mounted on the socket 23. The cylindrical portion 12d is in contact with the surface on the back surface side so as to be in surface contact. In other words, when the cap 15 of the LED lamp 1 is screwed into the socket 23 and the mounting thereof is completed, the rear surface of the columnar portion 12d and the collar portion 34 are in contact with each other.

したがって、LEDランプ1の点灯中において、LED17から発生する熱は、基板11の裏面側から本体12の大径の円柱状部12d、誤装着防止手段3の鍔部34を経てダウンライト本体21へと伝導されて放熱される。   Therefore, during the lighting of the LED lamp 1, the heat generated from the LED 17 passes from the back surface side of the substrate 11 to the downlight main body 21 through the large-diameter cylindrical portion 12 d of the main body 12 and the flange portion 34 of the erroneous attachment preventing means 3. Is conducted and dissipated.

また、誤装着防止手段3によって、ランプがソケット23に装着される許容径φ1は、誤装着防止手段3の内径で規定され、この内径である許容径φ1は、一般の照明器具より狭くなっている。したがって、第1の実施形態と同様に、白熱電球Iを装着しようとした場合、白熱電球Iは、装着過程において内径φ1の部分に衝突し、ソケット23に装着できないこととなる。   Further, the allowable diameter φ1 at which the lamp is mounted in the socket 23 by the erroneous mounting preventing means 3 is defined by the inner diameter of the erroneous mounting preventing means 3, and the allowable diameter φ1 that is the inner diameter is narrower than that of a general lighting fixture. Yes. Therefore, as in the first embodiment, when the incandescent light bulb I is to be attached, the incandescent light bulb I collides with the portion of the inner diameter φ1 in the attachment process and cannot be attached to the socket 23.

以上のように本実施形態によれば、第1の実施形態と同様に、一般の白熱電球Iの装着が防止できるとともに、LED17の放熱性を促進して、LED17の温度上昇を抑制することができる。   As described above, according to the present embodiment, the mounting of the general incandescent bulb I can be prevented and the heat dissipation of the LED 17 can be promoted to suppress the temperature increase of the LED 17 as in the first embodiment. it can.

なお、本発明は、上記各実施形態の構成に限定されることなく、発明の要旨を逸脱しない範囲で種々の変形が可能である。例えば、LEDランプや誤装着防止手段の形態は、一般の白熱電球の装着が防止できるように構成されていれば、各種形態の実現が可能であり、格別限定されるものではない。
また、照明器具としては、ダウンライトが好適であるが、これに限るものではない。屋内又は屋外で使用される各種照明器具に適用可能である。
The present invention is not limited to the configuration of each of the embodiments described above, and various modifications can be made without departing from the spirit of the invention. For example, the form of the LED lamp and the erroneous attachment preventing means can be realized in various forms as long as it is configured to prevent the attachment of a general incandescent bulb, and is not particularly limited.
Moreover, although a downlight is suitable as a lighting fixture, it is not restricted to this. It can be applied to various lighting fixtures used indoors or outdoors.

1・・・LEDランプ、2・・・照明器具(ダウンライト)、
3・・・誤装着防止手段、11・・・基板、12・・・熱伝導部材(本体)、
15・・・口金、17・・・LED、23・・・ソケット
1 ... LED lamp, 2 ... Lighting fixture (downlight),
3 ... erroneous mounting prevention means, 11 ... substrate, 12 ... heat conduction member (main body),
15 ... base, 17 ... LED, 23 ... socket

Claims (1)

LEDが実装された基板と、この基板と熱的に結合されるとともに外面に露出した熱伝導部材と、前記LEDと電気的に接続され一端側に設けられた口金とを備えたLEDランプと;
LEDランプの口金が装着されるソケットと、一般の白熱電球のソケットへの装着を防止するとともにLEDランプがソケットに装着されたとき、前記熱伝導部材に熱的に結合される熱伝導性を有する誤装着防止手段とを備えた器具本体と;
を具備することを特徴とする照明器具。
An LED lamp comprising: a substrate on which the LED is mounted; a heat conducting member that is thermally coupled to the substrate and exposed to the outer surface; and a base that is electrically connected to the LED and provided on one end side;
A socket to which the base of the LED lamp is mounted and a socket of a general incandescent bulb are prevented, and when the LED lamp is mounted to the socket, it has a thermal conductivity that is thermally coupled to the heat conducting member. An instrument body provided with means for preventing erroneous mounting;
The lighting fixture characterized by comprising.
JP2010048462A 2010-03-04 2010-03-04 Luminaire Pending JP2011187188A (en)

Priority Applications (1)

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Publications (1)

Publication Number Publication Date
JP2011187188A true JP2011187188A (en) 2011-09-22

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Family Applications (1)

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JP2010048462A Pending JP2011187188A (en) 2010-03-04 2010-03-04 Luminaire

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115010A (en) * 2011-11-30 2013-06-10 Toshiba Lighting & Technology Corp Lighting apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115010A (en) * 2011-11-30 2013-06-10 Toshiba Lighting & Technology Corp Lighting apparatus

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