TW201508211A - Heat dissipation base of LED lamp - Google Patents
Heat dissipation base of LED lamp Download PDFInfo
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- TW201508211A TW201508211A TW102130307A TW102130307A TW201508211A TW 201508211 A TW201508211 A TW 201508211A TW 102130307 A TW102130307 A TW 102130307A TW 102130307 A TW102130307 A TW 102130307A TW 201508211 A TW201508211 A TW 201508211A
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Abstract
Description
本發明係與LED有關;特別是指一種LED燈具之散熱座。 The invention relates to LEDs; in particular to a heat sink of an LED lamp.
LED(發光二極體)是近年來應用漸趨廣泛的發光元件,早期由於發光亮度不足,通常只使用在指示燈或顯示板等用途,但隨著技術突破,LED的光度大幅提升,可發出白光的LED目前已普遍作為日常照明之用。由於LED具有效率高、壽命長、不易破損、反應速度快、可靠性高等優點,頗有取代傳統白熾燈泡及日光燈之勢,深具未來發展潛力。 LED (Light Emitting Diode) is a widely used light-emitting element in recent years. In the early days, due to insufficient brightness, it is usually only used in indicators such as indicator lights or display panels. However, with the breakthrough of technology, the luminosity of LEDs is greatly improved. White LEDs are now commonly used as everyday lighting. LED has the advantages of high efficiency, long life, not easy to break, fast response, high reliability, etc. It has the potential to replace traditional incandescent bulbs and fluorescent lamps, and has great potential for future development.
但LED的效能容易受到高溫影響而急劇下降,壽命也會因為高溫而縮短,再加上LED本身即會發熱,所以除了要避免在高溫環境下使用,還需配合良好的散熱設計,以維持最佳使用功效。因此一般LED燈具多設置有一散熱座,能使LED產生的熱能與周遭環境快速達到熱平衡;習知的散熱座多會利用具高導熱特性的金屬材質以加快熱能傳導,但金屬材質可接受加工而製成的形狀以及在散熱座上的適用位置有其侷限性,無法滿足更多樣的散熱座設計需求。 However, the performance of LEDs is easily affected by high temperature and drops sharply. The life expectancy is also shortened due to high temperature. In addition, the LED itself will generate heat. Therefore, in addition to avoiding use in high temperature environments, it is necessary to cooperate with a good heat dissipation design to maintain the most. Good use. Therefore, a general LED lamp is provided with a heat sink, which can quickly achieve thermal balance between the heat generated by the LED and the surrounding environment; the conventional heat sink uses a metal material with high thermal conductivity to accelerate heat conduction, but the metal material can be processed. The shape and the suitable position on the heat sink have their limitations and cannot meet the needs of more heat sink design.
有鑑於此,本發明之目的在於提供一種LED燈 具之散熱座,具有良好的散熱效果,且其供導熱之用的部件之形狀及適用位置能隨需求而有較為彈性的變化。 In view of this, an object of the present invention is to provide an LED lamp The heat sink has a good heat dissipation effect, and the shape and applicable position of the component for heat conduction can be more elastically changed according to requirements.
緣以達成上述目的,本發明提供一種LED燈具之散熱座,其中該LED燈具包含有一發光源與一導熱部,該導熱部用以傳導該發光源所產生的熱能;該LED燈具之散熱座包括一塑膠殼體以及一導熱填充件,其中該塑膠殼體內部具有一容置空間,該導熱填充件係一導熱材質經填充於該容置空間內而形成者。 In order to achieve the above object, the present invention provides a heat sink for an LED lamp, wherein the LED lamp includes a light source and a heat conducting portion for conducting heat energy generated by the light source; the heat sink of the LED lamp includes A plastic housing and a heat-conductive filling member, wherein the plastic housing has an accommodating space therein, and the heat-conductive filling member is formed by filling a heat-conducting material into the accommodating space.
藉此,由於該導熱填充件可以適切地設置於該容置空間內,且其導熱效果良好,故本發明所提供LED燈具之散熱座能有效散熱,並具有較多樣式的設計變化之可能性。 Therefore, since the heat conductive filler can be properly disposed in the accommodating space and the heat conduction effect thereof is good, the heat sink of the LED lamp provided by the invention can effectively dissipate heat, and has the possibility of design change with more styles. .
100‧‧‧散熱座 100‧‧‧ Heat sink
10‧‧‧塑膠殼體 10‧‧‧Plastic shell
12‧‧‧內筒 12‧‧‧ inner tube
14‧‧‧容置空間 14‧‧‧ accommodating space
16‧‧‧第一結合部 16‧‧‧ First Joint Department
18‧‧‧第二結合部 18‧‧‧Second junction
16a‧‧‧凸緣 16a‧‧‧Flange
16b‧‧‧結合孔 16b‧‧‧Combination hole
20‧‧‧導熱填充件 20‧‧‧ Thermal Filler
300‧‧‧散熱座 300‧‧‧ Heat sink
30‧‧‧塑膠殼體 30‧‧‧Plastic shell
32‧‧‧第一結合部 32‧‧‧ First Joint Department
34‧‧‧第二結合部 34‧‧‧Second junction
36‧‧‧容置空間 36‧‧‧ accommodating space
40‧‧‧導熱填充件 40‧‧‧ Thermal Filler
500‧‧‧散熱座 500‧‧‧ Heat sink
50‧‧‧塑膠殼體 50‧‧‧Plastic shell
52‧‧‧第一結合部 52‧‧‧ first joint
54‧‧‧第二結合部 54‧‧‧Second junction
56‧‧‧內筒 56‧‧‧Inner tube
56a‧‧‧容置空間 56a‧‧‧ accommodating space
60‧‧‧導熱填充件 60‧‧‧ Thermal Filler
700‧‧‧散熱座 700‧‧‧ Heat sink
70‧‧‧塑膠殼體 70‧‧‧Plastic shell
72‧‧‧容置空間 72‧‧‧ accommodating space
74‧‧‧第一結合部 74‧‧‧ first joint
76‧‧‧第二結合部 76‧‧‧Second junction
80‧‧‧導熱填充件 80‧‧‧ Thermal Filler
900‧‧‧燈具 900‧‧‧Lamps
92‧‧‧燈罩 92‧‧‧shade
93‧‧‧螺栓 93‧‧‧Bolts
94‧‧‧發光源 94‧‧‧Light source
96‧‧‧導熱部 96‧‧‧Transfer Department
96a‧‧‧鑽孔 96a‧‧‧Drilling
98‧‧‧燈頭 98‧‧‧ lamp holder
圖1係本發明第一較佳實施例LED燈具之散熱座的立體圖;圖2係圖1較佳實施例的剖視圖;圖3係圖1較佳實施例於實際使用時的立體圖;圖4係本發明第二較佳實施例LED燈具之散熱座的剖視圖;圖5係本發明第三較佳實施例LED燈具之散熱座的剖視圖;圖6係本發明第四較佳實施例LED燈具之散熱座的剖視圖。 1 is a perspective view of a heat sink of an LED lamp according to a first preferred embodiment of the present invention; FIG. 2 is a cross-sectional view of the preferred embodiment of FIG. 1; FIG. 3 is a perspective view of the preferred embodiment of FIG. 1 in actual use; FIG. 5 is a cross-sectional view of a heat sink of an LED lamp according to a third preferred embodiment of the present invention; FIG. 6 is a heat dissipation view of the LED lamp of the fourth preferred embodiment of the present invention; A cross-sectional view of the seat.
為能更清楚地說明本發明,茲舉較佳實施例並配合圖示詳細說明如後,請參圖1至圖2所示,為本發明第一較佳實施例LED燈具之散熱座100,包含有一塑膠殼體10與一導熱填充件20,其中該塑膠殼體10具有一第一結合部16與一第二結合部18,分別位於該塑膠殼體10的兩端,惟該第一及第二結合部16、18的作用請容後再敘;該塑膠殼體10的內部設置有一內筒12,該內筒12於本第一較佳實施例中係以塑膠製成,但其材質選用不視為本發明之限制所在;該內筒12與該塑膠殼體10的內壁面之間形成一容置空間14,該導熱填充件20係一導熱材質經填充於該容置空間14內而形成者,此處所述的該導熱材質於本較佳實施例中為一粉末,實務上可選自二氧化矽、石墨、陶瓷、金屬,或其中至少之一者,但該導熱材質並不以該粉末為限,於其他實施例中,形成該導熱填充件20的該導熱材質亦可以是一膏狀體(如散熱膏)或一液體,甚至是混合了該粉末、該膏狀體,以及該液體二者以上而形成之混合物;簡言之,舉凡任何具有高導熱係數,且能填充於該容置空間14內的材質,皆可選用作為該導熱材質。 The preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 to FIG. 2 show a heat sink 100 for an LED lamp according to a first preferred embodiment of the present invention. The plastic housing 10 includes a first joint portion 16 and a second joint portion 18 respectively located at two ends of the plastic shell 10, but the first and The function of the second joint portions 16 and 18 is described later. The inner portion of the plastic casing 10 is provided with an inner cylinder 12 which is made of plastic in the first preferred embodiment, but the material thereof is The accommodating space 14 is formed between the inner tube 12 and the inner wall surface of the plastic housing 10 , and the heat conductive filler 20 is filled with a heat conductive material in the accommodating space 14 . The heat conductive material described herein is a powder in the preferred embodiment, and may be selected from the group consisting of cerium oxide, graphite, ceramics, metal, or at least one of them, but the heat conductive material is Not limited to the powder, in other embodiments, the heat conduction of the thermally conductive filler 20 is formed. The substance may also be a paste (such as a thermal grease) or a liquid, or even a mixture of the powder, the paste, and the liquid; in short, any having a high thermal conductivity The material that can be filled in the accommodating space 14 can be selected as the heat conductive material.
請參照圖3,揭露本第一較佳實施例之散熱座100實際與一LED燈具900組合使用之態樣,該LED燈具900包含有一燈罩92、一發光源94、一導熱部96、一燈頭98以及一啟動器(圖未示);其中該導熱部96用以傳導該發光源94所產生的熱能,於本第一較佳實施例中,該發光源94係LED晶粒,設置於一以鋁板為基底製成的印刷電路板上,而該基板即構成該導熱部96;於其他實施例中,該導熱部96也可以是額外結合於該印刷電路板上的另一金屬板,該印刷電路板當然也能選擇不同材質作為基板,惟此些相關為習知技藝,並非本發明的重點。 Referring to FIG. 3, the heat sink 100 of the first preferred embodiment is actually used in combination with an LED lamp 900. The LED lamp 900 includes a lamp cover 92, a light source 94, a heat conducting portion 96, and a lamp cap. And a starter (not shown); wherein the heat conducting portion 96 is configured to conduct heat generated by the light source 94. In the first preferred embodiment, the light source 94 is an LED die disposed on the first The heat conducting portion 96 is formed on the printed circuit board which is formed on the printed circuit board. In other embodiments, the heat conducting portion 96 may be another metal plate additionally bonded to the printed circuit board. The printed circuit board can of course also be selected from different materials as the substrate, but such correlations are conventional techniques and are not the focus of the present invention.
該啟動器置於該散熱座100由該內筒12所圍設的空間內,與該發光源94電性連接,並能驅動該發光源94發亮。該燈頭98與前述的該第二結合部18形狀互相配合,使該散熱座100能透過該第二結合部18與該燈頭98結合,待該燈頭98與一外部電源(圖未示)電性連接後,該LED燈具900運作所需的電力即可由該燈頭98進入。前述的該第一結合部16則具有一凸緣16a,供容置該LED燈具的該導熱部96,且該導熱部96上設置有複數鑽孔96a,該第一結合部16於相對應位置上設有複數結合孔16b,故可藉由將複數螺栓93穿過該些鑽孔96a以及該些結合孔16b,而使該散熱座100與該導熱部96彼此固定。另,該燈罩92可提供保護及柔光效果,該燈罩92同樣覆蓋結合在該第一結合部16上。 The actuator is placed in a space surrounded by the inner cylinder 12 of the heat sink 100, electrically connected to the light source 94, and can drive the light source 94 to illuminate. The base 98 and the second coupling portion 18 are in a shape matching with each other, so that the heat sink 100 can be coupled to the base 98 through the second joint portion 18, and the lamp holder 98 and an external power source (not shown) are electrically connected. After the connection, the power required for the operation of the LED lamp 900 can be entered by the lamp holder 98. The first joint portion 16 has a flange 16a for receiving the heat conducting portion 96 of the LED lamp, and the heat conducting portion 96 is provided with a plurality of holes 96a. The first joint portion 16 is at a corresponding position. A plurality of coupling holes 16b are provided, so that the heat sink 100 and the heat conducting portion 96 can be fixed to each other by passing the plurality of bolts 93 through the holes 96a and the coupling holes 16b. In addition, the lamp cover 92 can provide a protective and soft light effect, and the lamp cover 92 is also covered and bonded to the first joint portion 16.
該LED燈具900的該導熱部96於本第一較佳實施例中與該導熱填充件20接觸,藉此,該發光源94所產生的熱能可由該導熱部96傳導至該導熱填充件20,再由該導熱填充件20往該塑膠殼體10的外表面傳送,最終與周遭環境達到熱平衡。需特別說明的是,雖圖3中所見係以本第一較佳實施例的該散熱座100作為與該LED燈具900的結合示範,但其他實施例中另一散熱座與另一LED燈具的結合使用態樣與此類似,容後不再贅述。 The heat conducting portion 96 of the LED illuminator 900 is in contact with the thermally conductive filler 20 in the first preferred embodiment, whereby the thermal energy generated by the illuminating source 94 can be conducted to the thermally conductive filler 20 by the thermally conductive portion 96. The thermally conductive filler member 20 is then transferred to the outer surface of the plastic housing 10 to eventually achieve thermal equilibrium with the surrounding environment. It should be particularly noted that although the heat sink 100 of the first preferred embodiment is shown in FIG. 3 as an example of the combination with the LED lamp 900, in another embodiment, another heat sink and another LED light fixture are used. The use of the combination is similar to this, and will not be described later.
請參照圖4,為本發明第二較佳實施例LED燈具之散熱座300,具有一塑膠殼體30以及一導熱填充材40,其中該塑膠殼體30同樣具有一第一結合部32與一第二結合部34,分別用以與前述該LED燈具900的該導熱部96與該燈頭98結合;本較佳實施例與前一較佳實施例不同之處,在於該塑膠殼體30並無設置有一內筒,而該塑膠殼體30的內部自然形成一容置空間36,該導熱填充材40係一導熱材 質經填充於該容置空間36內而形成;在與該LED燈具900結合使用的狀態下,該導熱填充材40除了與該LED燈具900的該導熱部96接觸外,亦包覆該LED燈具900的該啟動器,而能同時將該發光源94與該啟動器所產生的熱能傳導至該塑膠殼體30之外表面。值得一提的是,實務上該導熱填充材40並非一定得完整填滿該容置空間36,只要該導熱填充材40能與該導熱部96以及該啟動器接觸即可。 Please refer to FIG. 4 , which is a heat sink 300 of an LED lamp according to a second preferred embodiment of the present invention. The heat sink 300 has a plastic case 30 and a heat conductive filler 40 . The plastic case 30 also has a first joint portion 32 and a The second bonding portion 34 is respectively configured to be coupled to the heat conducting portion 96 of the LED lamp 900 and the lamp cap 98. The difference between the preferred embodiment and the previous preferred embodiment is that the plastic housing 30 is not An inner cylinder is disposed, and the interior of the plastic casing 30 naturally forms an accommodating space 36. The heat conductive filler 40 is a heat conductive material. Formed in the accommodating space 36, the thermal conductive filler 40 covers the LED illuminator in addition to the heat conducting portion 96 of the LED luminaire 900. The actuator of the 900 can simultaneously conduct the thermal energy generated by the illumination source 94 and the actuator to the outer surface of the plastic housing 30. It should be noted that the heat conductive filler 40 does not have to completely fill the accommodating space 36 as long as the heat conductive filler 40 can be in contact with the heat conducting portion 96 and the actuator.
請參照圖5,為本發明第三較佳實施例LED燈具之散熱座500,包含有一塑膠殼體50與一導熱填充材60,該塑膠殼體50兩端分別具有一第一結合部52與一第二結合部54,該塑膠殼體50的內部具有一內筒56,該內筒56與該塑膠殼體50的內壁貼合,且該內筒56的內部圍設形成一容置空間56a,該導熱填充材60係一導熱材質經填充於該容置空間56a內而形成。同前一較佳實施例所述,該第一結合部52與該第二結合部54用以與該LED燈具900結合,且在結合使用的狀態下,該導熱填充材60接觸該LED燈具90的該導熱部96,該啟動器則埋設於該導熱填充材60內部。附帶一提,本第三較佳實施例中,該內筒56係以金屬製成,但並不以此為限;由於金屬具有良好的熱傳導效能,故該內筒56可額外加速熱能傳導。 Referring to FIG. 5, a heat sink 500 for an LED lamp according to a third preferred embodiment of the present invention includes a plastic case 50 and a heat conductive filler 60. The two ends of the plastic case 50 respectively have a first joint portion 52 and The inner portion of the plastic housing 50 has an inner tube 56. The inner tube 56 is fitted to the inner wall of the plastic housing 50, and the inner portion of the inner tube 56 defines an accommodating space. 56a, the heat conductive filler 60 is formed by filling a heat conductive material into the accommodating space 56a. As shown in the previous preferred embodiment, the first bonding portion 52 and the second bonding portion 54 are used to be combined with the LED lamp 900, and the thermal conductive filler 60 contacts the LED lamp 90 in a combined use state. The heat conducting portion 96 is embedded in the heat conductive filler 60. Incidentally, in the third preferred embodiment, the inner cylinder 56 is made of metal, but not limited thereto; since the metal has good heat conduction performance, the inner cylinder 56 can additionally accelerate thermal energy conduction.
請參照圖6,為本發明第四較佳實施例LED燈具之散熱座700,包含有一塑膠殼體70與一導熱填充件80,該塑膠殼體70同前些較佳實施例,二端分別具有一第一結合部74與一第二結合部76,用以與該LED燈具900結合;該塑膠殼體70內部並無設置內筒等結構,故其內部自然形成一容置空間72,該導熱填充件80同樣為一導熱材質經填充於該容置空間72內而形成;惟請特別注意,於本第四較佳實施例中,該導熱材質之較佳者為粉末或膏狀體(亦即, 該導熱材質於此不宜使用液體材質),直接透過膠料或其他塗佈(Coating)加工方式成型於該塑膠殼體70的內壁上。在該散熱座700與該LED燈具900結合使用的狀態下,該導熱填充件80與該LED燈具900的該導熱部96接觸,以利熱能傳導。當然,該導熱填充件80能透過較厚的塗佈加工而與該LED燈具的該啟動器接觸,在其他實施例中,該導熱填充件80亦可只接觸到該LED燈具900的該導熱部96或該啟動器的其中之一者,端視散熱需求而定。 Referring to FIG. 6 , a heat sink 700 for an LED lamp according to a fourth preferred embodiment of the present invention includes a plastic case 70 and a heat conductive filler member 80. The plastic case 70 is the same as the previous preferred embodiment. The first bonding portion 74 and the second bonding portion 76 are configured to be coupled to the LED lamp 900. The plastic housing 70 is not provided with an inner cylinder or the like, so that an inner space 72 is formed therein. The heat conductive filler 80 is also formed by filling a heat conductive material into the accommodating space 72. However, it is particularly noted that in the fourth preferred embodiment, the heat conductive material is preferably a powder or a paste ( that is, The heat conductive material is not suitable for liquid material, and is directly formed on the inner wall of the plastic casing 70 through a rubber compound or other coating process. In the state in which the heat sink 700 is used in combination with the LED lamp 900, the heat conductive filler 80 is in contact with the heat conducting portion 96 of the LED lamp 900 to facilitate heat conduction. Of course, the thermally conductive filler member 80 can be in contact with the actuator of the LED lamp through a thick coating process. In other embodiments, the thermally conductive filler member 80 can also contact only the heat conducting portion of the LED lamp 900. 96 or one of the starters depends on the cooling requirements.
綜上所述,由於各該較佳實施例中的該導熱填充材(20、40、60、80)可為粉末、膏狀或液態之導熱材質填充於各該容置空間(14、36、56a、72)內而形成,故能適用於變化更為多樣的散熱座設計,無論於其他實施例中,散熱座的容置空間如何安排,導熱填充材皆可適切地設置於其中,並能發揮良好的導熱效能。雖在上述各該較佳實施例中,該導熱填充材(20、40、60、80)與該LED燈具900的該導熱部96或該啟動器接觸,但若有不同的散熱考量,導熱填充材不見得一定要接觸到該導熱部96,也不見得一定要完整包覆該啟動器。另,上述各該較佳實施例皆與設置有該啟動器的該LED燈具900搭配使用,但本發明LED燈具之散熱座亦可適用於不具有啟動器LED燈具(如AC LED);當然,若是搭配不具有啟動器的LED燈具使用本發明所提供之散熱座,亦可將其他於使用中會散發熱能之零件(例如電阻)設置於該容置空間中,並視散熱需求而使該導熱填充材與該零件接觸;而該導熱填充材與該零件接觸(或不接觸)的實施態樣類似於前述該些實施例中關於啟動器之敘述,於此不再詳加說明。 In summary, the heat conductive filler (20, 40, 60, 80) in each of the preferred embodiments may be filled with a heat conductive material of powder, paste or liquid in each of the accommodating spaces (14, 36, 56a, 72) are formed inside, so it can be applied to a more varied heat sink design. Regardless of the arrangement of the heat sink seat in other embodiments, the heat conductive filler can be properly disposed therein and can be Give good thermal conductivity. In the above preferred embodiments, the heat conductive filler (20, 40, 60, 80) is in contact with the heat conducting portion 96 of the LED lamp 900 or the actuator, but if there are different heat dissipation considerations, the heat conductive filling The material does not necessarily have to be in contact with the heat conducting portion 96, and it is not necessarily necessary to completely cover the actuator. In addition, each of the above preferred embodiments is used in combination with the LED lamp 900 provided with the actuator, but the heat sink of the LED lamp of the present invention can also be applied to an LED lamp without an initiator (such as an AC LED); If the heat sink provided by the present invention is used with the LED lamp without the starter, other components (such as resistors) that dissipate heat during use may be disposed in the accommodating space, and the heat conduction is required according to heat dissipation requirements. The filler material is in contact with the component; and the embodiment in which the thermally conductive filler is in contact with (or not in contact with) the component is similar to the description of the actuator in the foregoing embodiments, and will not be described in detail herein.
以上所述,僅為本發明較佳可行實施例而已,舉凡應用本發明說明書及申請專利範圍所為之等效結構變 化,理應包含在本發明之專利範圍內。 The above is only a preferred embodiment of the present invention, and equivalent structural changes are made to the application of the present specification and the scope of the patent application. It should be included in the scope of the patent of the present invention.
100‧‧‧散熱座 100‧‧‧ Heat sink
10‧‧‧塑膠殼體 10‧‧‧Plastic shell
12‧‧‧內筒 12‧‧‧ inner tube
14‧‧‧容置空間 14‧‧‧ accommodating space
16‧‧‧第一結合部 16‧‧‧ First Joint Department
18‧‧‧第二結合部 18‧‧‧Second junction
20‧‧‧導熱填充件 20‧‧‧ Thermal Filler
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TWI570357B (en) * | 2015-10-16 | 2017-02-11 | Unity Opto Technology Co Ltd | The heat lamp using LED bulb |
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TWI570357B (en) * | 2015-10-16 | 2017-02-11 | Unity Opto Technology Co Ltd | The heat lamp using LED bulb |
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