JP2014235114A - Probe inspection device and probe inspection method - Google Patents

Probe inspection device and probe inspection method Download PDF

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Publication number
JP2014235114A
JP2014235114A JP2013117813A JP2013117813A JP2014235114A JP 2014235114 A JP2014235114 A JP 2014235114A JP 2013117813 A JP2013117813 A JP 2013117813A JP 2013117813 A JP2013117813 A JP 2013117813A JP 2014235114 A JP2014235114 A JP 2014235114A
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Prior art keywords
probe
load
value
plunger
displacement amount
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JP6036557B2 (en
Inventor
植田 淑之
Toshiyuki Ueda
淑之 植田
守道 金沢
Morimichi Kanazawa
守道 金沢
竹迫 憲浩
Norihiro Takesako
憲浩 竹迫
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三菱電機株式会社
Mitsubishi Electric Corp
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Abstract

A probe inspection apparatus and a probe inspection method capable of accurately inspecting the quality of a probe are obtained.
A probe includes a conductive cylindrical barrel, a conductive plunger that comes into contact with an object to be inspected, and a conductive material that is disposed in the barrel and biases the plunger in an axial direction. The elastic member 4 is provided. The load applying portion 7 applies a load to the plunger 3 to displace it. The electrical resistance measuring instrument 11 measures the electrical resistance of the probe 1. The displacement measuring device 12b measures the displacement amount of the plunger 3. The determination unit 14 determines the quality of the probe 1 by comparing the electrical resistance with respect to the displacement amount with a standard value.
[Selection] Figure 1

Description

  The present invention relates to a probe inspection apparatus and a probe inspection method capable of accurately inspecting the quality of a probe.

  An inspection apparatus is used to electrically inspect semiconductor chips, printed wiring boards, and the like. This inspection apparatus includes a sample stage on which a measurement object is placed and a probe that is pressed against an electrode to be inspected. Spring probes are widely used as probes (see, for example, Patent Document 1).

  It is necessary to inspect the sample stage and probe for contamination before measurement. Therefore, the load / displacement characteristic of the probe is obtained in a state where it has been confirmed in advance that the sample stage and the probe are cleaned and there is no foreign substance, and this is referred to as a reference displacement characteristic. Before the measurement, the load / displacement characteristic of the probe is obtained, and the sample stage and the probe are inspected for contamination based on the difference from the reference displacement characteristic.

JP 2000-147003 A

  However, in the spring probe, not only the contact resistance (electrical resistance) at the tip part but also the sliding part has the contact resistance (electrical resistance). Since the contact resistance of the sliding portion varies depending on the amount of pushing and the number of sliding times, the probe quality cannot be accurately inspected only by inspecting the contamination of the probe.

  The present invention has been made to solve the above-described problems, and an object thereof is to obtain a probe inspection apparatus and a probe inspection method capable of accurately inspecting the quality of a probe.

  A probe inspection apparatus according to the present invention includes a conductive cylindrical barrel, a conductive plunger that contacts an object to be inspected, and a conductive plunger that is disposed in the barrel and biases the plunger in the axial direction. An apparatus for inspecting a probe having an elastic member, comprising: a load applying unit for applying a load to the plunger to displace; an electric resistance measuring device for measuring an electric resistance of the probe; and a displacement amount of the plunger. It is characterized by comprising a displacement measuring device to be measured and a determination unit that compares the electrical resistance with respect to the displacement amount with a standard value to determine the quality of the probe.

  According to the present invention, the quality of a probe can be accurately inspected.

It is a side view which shows the probe test | inspection apparatus which concerns on Embodiment 1 of this invention. It is an expanded sectional view which shows the probe of FIG. It is a flowchart which shows the probe test | inspection method which concerns on Embodiment 1 of this invention. It is a figure which shows the electrical resistance of a probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 2 of this invention. It is a figure which shows the load with respect to the displacement amount of the plunger used with the probe inspection method which concerns on Embodiment 3 of this invention. It is a figure which shows the electrical resistance of the probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 4 of this invention. It is a figure which shows the load with respect to the displacement amount of the plunger used with the probe inspection method which concerns on Embodiment 5 of this invention. It is a figure which shows the electrical resistance and load of a probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 6 of this invention. It is a figure which shows the electrical resistance of a probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 7 of this invention. It is a figure which shows the load with respect to the displacement amount of the plunger used with the probe inspection method which concerns on Embodiment 8 of this invention. It is a figure which shows the electrical resistance of a probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 9 of this invention. It is a figure which shows the load with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 10 of this invention. It is a figure which shows the electrical resistance of a probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 11 of this invention. It is a figure which shows the load with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 12 of this invention. It is a figure which shows the electrical resistance of a probe with respect to the displacement amount of the plunger used with the probe test | inspection method which concerns on Embodiment 13 of this invention. It is an expanded sectional view showing an inclined probe.

  A probe inspection apparatus and a probe inspection method according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a side view showing a probe inspection apparatus according to Embodiment 1 of the present invention. FIG. 2 is an enlarged cross-sectional view showing the probe of FIG. The probe inspection apparatus inspects the quality of the probe 1.

  The probe 1 has a conductive cylindrical barrel 2, a conductive plunger 3 that comes into contact with the object to be inspected, and a conductive spring such as a spring that is disposed in the barrel 2 and biases the plunger 3 in the axial direction. And an elastic member 4. When the probe 1 is actually used, the tip of the plunger 3 is brought into contact with an electrode to be inspected, such as a semiconductor chip or a printed wiring board, and electricity is passed through the probe 1 to cause electrical characteristics of the object to be inspected. Inspect.

  The barrel 2 of the probe 1 is inserted into a socket of the probe unit 6 and fixed. In this state, the load applying portion 7 applies a load to the plunger 3 of the probe 1 to displace it. The load applying unit 7 includes a probe 8 that contacts the plunger 3 of the probe 1, a probe holder 9 that holds the probe 8, and a load cell 10 that moves the probe 8 together with the probe holder 9.

  The electrical resistance measuring instrument 11 measures the electrical resistance of the probe 1 through the probe unit 6 and the probe 8. The load applying unit 7 is attached to a robot (not shown) that is driven in the X and Z axis directions, and the probe unit 6 is attached to a robot (not shown) that is driven in the Y axis direction, and their positions are controlled. . When positioning the probe 8 and the tip of the probe 1 in the XY direction, the camera 12a measures the positional relationship between them. A displacement measuring device 12b connected to a robot that drives the load applying section 7 in the Z-axis direction measures the displacement amount of the plunger 3. The origin of the displacement can be recognized by measuring the load measuring device 13 while bringing the contact 8 and the probe 1 close at a low speed and changing the load at the contact position. Alternatively, the origin of the amount of displacement can also be recognized by measuring the change in electrical resistance with the electrical resistance measuring instrument 11. Note that the height of the tip of the probe 1 can be shortened if the value calculated from the design position is registered in the measurement condition as the origin. The load measuring device 13 measures the load applied to the plunger 3.

  The determination unit 14 determines the quality of the probe 1 by comparing the electrical resistance with respect to the displacement amount with a standard value. Furthermore, the determination unit 14 determines the quality of the probe 1 by comparing the load with respect to the displacement amount with a standard value. The determination unit 14 is a computer into which a program for determining such quality is introduced. Here, the standard value will be described. First, the resistance value and load value of a plurality of new probes are measured using the probe inspection apparatus of the present embodiment. The resistance value is 6 times the standard deviation value with respect to the displacement amount X within the pass / fail judgment range, and the difference in resistance value with respect to the same displacement amount X in the direction in which the probe is contracted and extended is obtained, and 6 times the standard deviation value is obtained. Each standard value (maximum value is 1Ω, minimum value is several tens of mΩ). Similarly, with respect to the load value, the standard deviation value of the inclination with respect to each displacement amount X within the pass / fail judgment range is 6 times, and the difference between the load values with respect to the same displacement amount X in the direction in which the probe is contracted and extended is obtained. The standard value is 6 times the value (the maximum value and the minimum value add, for example, an allowable value of ± 20% to ± 50% to the design value of the elastic member 4). In addition, the initial resistance value and load value measured in a new state for each probe plus the allowable value is taken as the standard value, and the initial standard value and the resistance value and load value after use are compared for each probe. It may be judged as good or bad. Note that the standard values shown here are only examples, and it is desirable to determine in consideration of the required accuracy, yield, and the like of the object to be inspected.

  FIG. 3 is a flowchart showing the probe inspection method according to Embodiment 1 of the present invention. First, the determination unit 14 reads the XY coordinates of the probe 1, inspection conditions, and standard values for determination of pass / fail (step S1). A probe unit 6 to which the probe 1 is fixed is placed on a stage (not shown) of a probe inspection apparatus and connected to an electrical resistance measuring instrument 11.

  Next, the probe 8 is moved to the position of the probe 1 (step S2). The displacement measuring device 12b recognizes the position of the probe 1 and corrects the deviation from the XY coordinates of the probe 1 registered in advance so that the position of the probe 8 and the probe 1 is not displaced at the time of measurement. The probe 8 descends in the Z direction under the measurement conditions registered in advance, contacts the tip of the plunger 3 and contracts the probe 1.

  Next, the electrical resistance and the load of the probe 1 are measured while applying a load to the plunger 3 to change the direction in which the probe 1 is contracted (step S3). At this time, the displacement measuring device 12b measures the amount of displacement of the plunger 3 in the Z direction. Next, the electric resistance and the load of the probe 1 are measured while the load on the plunger 3 is weakened and changed in the extending direction of the probe 1 (step S4). These measurement data are taken into the determination unit 14.

  Next, the determination unit 14 determines the quality of the probe 1 by comparing the electrical resistance with respect to the displacement amount with a standard value (step S5). Furthermore, the determination unit 14 determines the quality of the probe 1 by comparing the load with respect to the displacement amount with a standard value (step S6).

  Here, when the probe 1 is normal, the electric resistance gradually changes with the displacement, but there is a stable region in which the electric resistance hardly changes even when displaced. On the other hand, the load changes in proportion to the amount of displacement. If measurement data deviates from the standard values of such electrical resistance and load, it is determined as abnormal.

  In the present embodiment, by comparing the electrical resistance with respect to the displacement amount with a standard value, not only the contact resistance of the distal end portion of the plunger 3 but also the contact of the sliding portion 5 of the plunger 3 that slides in the barrel 2. Resistance can also be tested. And the load by the elastic member 4 can also be test | inspected by comparing the load with respect to the displacement amount with a standard value. For this reason, the quality of the probe 1 can be correctly inspected. In addition, the inspection can be automatically performed in a short time without depending on the judgment of the operator.

Embodiment 2. FIG.
FIG. 4 is a diagram showing the electrical resistance of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 2 of the present invention. The determination unit 14 determines the quality of the probe 1 by comparing the change in electrical resistance when the probe 1 is changed in the contracting direction or the extending direction with a standard value waveform.

  When the probe 1 is normal, the electrical resistance gradually changes with displacement. However, when the Au plating of the sliding part 5 is peeled off or the metal on the surface of the plunger 3 or the inside of the barrel 2 is scraped and a foreign object is caught, the change of the electric resistance with respect to the displacement amount is a standard value waveform. Therefore, it is determined as abnormal. Thereby, it can be test | inspected whether the contact resistance of the sliding part 5 of the plunger 3 is normal.

Embodiment 3 FIG.
FIG. 5 is a diagram showing a load with respect to a displacement amount of the plunger used in the probe inspection method according to the third embodiment of the present invention. The determination unit 14 determines the quality of the probe 1 by comparing the change in load when the probe 1 is changed in the contracting direction or the extending direction with the waveform of the standard value.

  When the probe 1 is normal, the load changes in proportion to the amount of displacement. However, when the elastic member 4 is damaged or sagged, or when the Au plating of the sliding portion 5 of the plunger 3 is peeled off and does not slide smoothly, the change in the load with respect to the displacement is a waveform of the standard value. Therefore, it is determined as abnormal. Thereby, it can be test | inspected whether the load by the elastic member 4 is normal.

Embodiment 4 FIG.
FIG. 6 is a diagram showing the electrical resistance of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 4 of the present invention. The determination unit 14 determines the quality of the probe 1 by comparing the change in electric resistance when the probe 1 is changed in the contracting direction and the extending direction with the waveform of the standard value.

  As a result, the electrical resistance in the vicinity of the maximum displacement amount corresponding to the displacement amount when the probe 1 is actually used to inspect the electrical characteristics of the object to be inspected is measured. For this reason, it is possible to detect an abnormality in which the electrical resistance with respect to the displacement corresponding to the variation in the length and mounting height of the probe 1 and the thickness variation of the object to be measured deviates significantly from the standard value.

Embodiment 5 FIG.
FIG. 7 is a diagram showing a load with respect to the displacement amount of the plunger used in the probe inspection method according to Embodiment 5 of the present invention. The determination unit 14 determines the quality of the probe 1 by comparing the change in load when the probe 1 is changed in the contracting direction and the extending direction with the waveform of the standard value.

  As a result, the load near the maximum displacement amount corresponding to the displacement amount when the probe 1 is actually used to inspect the electrical characteristics of the object to be inspected is measured. For this reason, it is possible to detect an abnormality in which the load with respect to the displacement corresponding to the variation in the length and mounting height of the probe 1 and the variation in the thickness of the object to be measured deviates significantly from the standard value.

Embodiment 6 FIG.
FIG. 8 is a diagram showing the electrical resistance and load of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 6 of the present invention. The electrical resistance and the load when the probe 1 is changed in the contracting direction and the extending direction are measured simultaneously. And the determination part 14 compares those changes with the waveform of a standard value, respectively, and performs the quality determination of the probe 1. FIG.

  The measurement time can be shortened by measuring the electrical resistance and the load simultaneously. Furthermore, since it is possible to confirm whether or not the probe 8 has contacted the probe 1, it is possible to distinguish between disconnection, non-contact, and contact with foreign matter.

Embodiment 7 FIG.
FIG. 9 is a diagram showing the electrical resistance of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 7 of the present invention. The determination unit 14 obtains a standard deviation value of the difference in electric resistance with respect to the same displacement amount X when the probe 1 is changed in the contracting direction and when the probe 1 is changed in the extending direction within the range of the displacement amount for determining pass / fail. The standard deviation value is compared with the standard value to determine whether the probe 1 is good or bad. As a result, a standard deviation value outside the standard can be detected as abnormal. Note that a total value may be obtained instead of the standard deviation value, and those whose total value is out of specification may be detected as abnormal.

Embodiment 8 FIG.
FIG. 10 is a diagram showing a load with respect to the displacement amount of the plunger used in the probe inspection method according to Embodiment 8 of the present invention. The determination unit 14 obtains a standard deviation value of a difference in load with respect to the same displacement amount X when the probe 1 is changed in the contracting direction and when the probe 1 is changed in the extending direction within the range of the displacement amount for determining pass / fail. The standard deviation value is compared with the standard value to determine whether the probe 1 is good or bad. As a result, a standard deviation value outside the standard can be detected as abnormal. Note that a total value may be obtained instead of the standard deviation value, and those whose total value is out of specification may be detected as abnormal.

Embodiment 9 FIG.
FIG. 11 is a diagram showing the electrical resistance of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 9 of the present invention. The determination unit 14 determines the minimum electric resistance and the maximum electric resistance within the range of the displacement amount for determining the quality, and compares the minimum electric resistance and the maximum electric resistance with the standard values to determine the quality of the probe 1. Thereby, it is possible to detect that the minimum electric resistance and the maximum electric resistance are out of specification as abnormal.

Embodiment 10 FIG.
FIG. 12 is a diagram showing a load with respect to the displacement amount of the plunger used in the probe inspection method according to Embodiment 10 of the present invention. The determination unit 14 determines the minimum load and the maximum load within the range of the displacement amount for determining the quality, and compares the minimum load and the maximum load with the standard values to determine the quality of the probe 1. As a result, it is possible to detect a case where the minimum load and the maximum load are out of specification as abnormal.

Embodiment 11 FIG.
FIG. 13 is a diagram showing the electrical resistance of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 11 of the present invention. The determination unit 14 obtains a standard deviation value of the electric resistance within the range of the displacement amount for which the quality judgment is performed, and compares the standard deviation value with a standard value to judge the quality of the probe 1. As a result, a standard deviation value outside the standard can be detected as abnormal. Note that a total value may be obtained instead of the standard deviation value, and those whose total value is out of specification may be detected as abnormal.

Embodiment 12 FIG.
FIG. 14 is a diagram showing a load with respect to the displacement amount of the plunger used in the probe inspection method according to Embodiment 12 of the present invention. The determination unit 14 obtains a standard deviation value of the load inclination with respect to each displacement amount within the range of the displacement amount for which the quality determination is performed, and compares the standard deviation value with a standard value to determine the quality of the probe 1. As a result, a standard deviation value outside the standard can be detected as abnormal. Note that a total value may be obtained instead of the standard deviation value, and those whose total value is out of specification may be detected as abnormal.

Embodiment 13 FIG.
FIG. 15 is a diagram showing the electrical resistance of the probe with respect to the amount of displacement of the plunger used in the probe inspection method according to Embodiment 13 of the present invention. A plurality of determination ranges such as first, second, and third determination ranges and standard values corresponding thereto are set as ranges of displacement amounts for performing pass / fail determination.

  The determination unit 14 determines the pass / fail of the probe 1 by comparing the electrical resistance with a standard value corresponding to the range of the displacement amount for which the pass / fail determination is performed. As a result, when the gap between the sliding portion of the barrel 2 and the plunger 3 becomes large due to manufacturing variations, when foreign matter adheres to the tip of the plunger 3, and when peeling of the plating occurs, the electrical resistance Changes can be detected as abnormal.

  It is preferable to combine the electrical resistance determination method and the load determination method according to the first to thirteenth embodiments. Thereby, the abnormality of electrical resistance and load can be detected with higher accuracy.

  Moreover, it is preferable to make it slower than the speed of the direction in which the load addition part 7 extends the speed of the direction which shrinks the probe 1. FIG. 16 is an enlarged cross-sectional view showing a tilted probe. In general, the plunger 3 has an inclination, and the probe 1 has an inclination depending on the mounting accuracy. Even when there is such an inclination, if the speed in the direction in which the probe 1 is contracted is made slower than the speed in the direction in which the probe 1 is stretched, the measuring element 8 is reliably brought into contact with the foreign matter 15 attached to the tip of the plunger 3. Electrical resistance can be measured.

  Further, it is preferable that the load applying portion 7 repeatedly slides in the direction in which the probe 1 is contracted and the direction in which the probe 1 is extended before the measurement. Thereby, since the contact resistance of the sliding part 5 of the plunger 3 can be lowered particularly in the new probe 1, the defect rate of the probe 1 can be reduced and the electrical characteristics can be measured stably.

  The probe 1 is used when an electric current is passed through a power semiconductor element or the like to measure electrical characteristics. It is preferable to measure the electrical resistance and the load of the probe 1 in a state where the same current as the actual use condition is applied. Thereby, the measurement which considered the influence by sending the same electric current as an actual use condition can be implemented.

DESCRIPTION OF SYMBOLS 1 Probe, 2 Barrel, 3 Plunger, 4 Elastic member, 7 Load addition part, 11 Electrical resistance measuring device, 12b Displacement measuring device, 13 Load measuring device, 14 Determination part

Claims (18)

  1. Inspecting a probe having a conductive cylindrical barrel, a conductive plunger in contact with an object to be inspected, and a conductive elastic member disposed in the barrel and biasing the plunger in the axial direction A device,
    A load applying portion for applying a load to the plunger to displace the plunger;
    An electrical resistance measuring instrument for measuring the electrical resistance of the probe;
    A displacement measuring device for measuring a displacement amount of the plunger;
    A probe inspection apparatus comprising: a determination unit that compares the electrical resistance with respect to the displacement amount with a standard value to determine whether the probe is good or bad.
  2. A load measuring device for measuring a load applied to the plunger;
    The probe inspection apparatus according to claim 1, wherein the determination unit determines whether the probe is good or bad by comparing the load with respect to the displacement amount with a standard value.
  3.   2. The determination unit according to claim 1, wherein the determination unit performs pass / fail determination of the probe by comparing a change in the electrical resistance when the probe is changed in a contracting direction or an extending direction with a waveform of a standard value. Probe inspection equipment.
  4.   The said determination part performs the quality determination of the said probe by comparing the change of the said load when changing the said probe in the direction to shorten or to extend, with the waveform of a standard value. Probe inspection device.
  5.   2. The determination unit according to claim 1, wherein the determination unit performs pass / fail determination of the probe by comparing a change in the electrical resistance when the probe is changed in a contraction direction and an extension direction with a waveform of a standard value. Probe inspection equipment.
  6.   The said determination part performs the quality determination of the said probe by comparing the change of the said load when changing the said probe in the direction to shrink and the direction to extend with the waveform of a standard value. Probe inspection device.
  7.   The determination unit performs pass / fail determination of the probe by comparing the change in electrical resistance and the change in load when the probe is changed in a contracting direction and a extending direction with a waveform of a standard value, respectively. The probe inspection apparatus according to claim 2.
  8.   The determination unit includes a standard deviation value of a difference in the electric resistance with respect to the same displacement amount when the probe is changed in the contracting direction and when the probe is changed in the extending direction within the range of the displacement amount for performing pass / fail determination. The probe inspection apparatus according to claim 1, wherein a total value is obtained, and the quality of the probe is determined by comparing the standard deviation value or the total value with a standard value.
  9.   The determination unit is a standard deviation value or a sum of a difference of the load with respect to the same displacement amount when the probe is changed in the contracting direction and when the probe is changed in the extending direction within the range of the displacement amount for performing pass / fail determination. 3. The probe inspection apparatus according to claim 2, wherein a value is obtained, and the quality of the probe is determined by comparing the standard deviation value or the total value with a standard value.
  10.   The determination unit obtains a minimum electric resistance and a maximum electric resistance within a range of the displacement amount for performing the quality determination, and compares the minimum electric resistance and the maximum electric resistance with a standard value to perform the quality determination of the probe. The probe inspection apparatus according to claim 1.
  11.   The determination unit obtains a minimum load and a maximum load within a range of the displacement amount for performing pass / fail determination, and compares the minimum load and the maximum load with a standard value to perform pass / fail determination of the probe. The probe inspection apparatus according to claim 2.
  12.   The determination unit obtains a standard deviation value or a total value of the electric resistance within a range of the displacement amount for performing the quality determination, and compares the standard deviation value or the total value with a standard value to determine the quality of the probe. The probe inspection device according to claim 1, wherein the probe inspection device is performed.
  13.   The determination unit obtains a standard deviation value or a total value of the inclination of the load with respect to each displacement amount within the range of the displacement amount for performing pass / fail determination, and compares the standard deviation value or the total value with a standard value, The probe inspection apparatus according to claim 2, wherein the quality of the probe is determined.
  14.   The said determination part compares the said electrical resistance with the standard value corresponding to the range about the several range of the said displacement amount which performs quality determination, The quality determination of the said probe is characterized by the above-mentioned. Probe inspection device.
  15.   The probe inspection apparatus according to any one of claims 1 to 14, wherein the load applying unit is slower than a speed in a direction of extending a speed in a direction of contracting the probe.
  16.   The probe inspection apparatus according to claim 1, wherein the load applying unit repeatedly slides in a direction in which the probe is contracted and a direction in which the probe is extended before measurement.
  17. Inspecting a probe having a conductive cylindrical barrel, a conductive plunger in contact with an object to be inspected, and a conductive elastic member disposed in the barrel and biasing the plunger in the axial direction A method,
    Measuring the electrical resistance of the probe while applying a load to the plunger and displacing the plunger;
    Measuring the amount of displacement of the plunger;
    A probe inspection method comprising: comparing the electrical resistance with respect to the displacement amount with a standard value to determine whether the probe is good or bad.
  18. Further comprising measuring a load applied to the plunger;
    The probe inspection method according to claim 17, wherein the probe is judged to be good or bad by comparing the load with respect to the displacement amount with a standard value.
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000147003A (en) * 1998-11-17 2000-05-26 Canon Inc Probe pin
JP2004053415A (en) * 2002-07-19 2004-02-19 Sharp Corp Inspection system for electronic component
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
JP2007535657A (en) * 2003-12-08 2007-12-06 ネオコニックス,インコーポレイテッドNeoconix, Incorporated Small array contact with precise operating range
JP2010101687A (en) * 2008-10-22 2010-05-06 Shikahama Seisakusho:Kk Contact probe
JP2010107365A (en) * 2008-10-30 2010-05-13 Mitsubishi Electric Corp Inspection device for substrate connection
JP2010223852A (en) * 2009-03-25 2010-10-07 Toshiba Corp Electric inspection probe, manufacturing method of the same and manufacturing method of semiconductor device
JP2011117882A (en) * 2009-12-07 2011-06-16 Rika Denshi Co Ltd Contact probe

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000147003A (en) * 1998-11-17 2000-05-26 Canon Inc Probe pin
JP2004053415A (en) * 2002-07-19 2004-02-19 Sharp Corp Inspection system for electronic component
JP2007535657A (en) * 2003-12-08 2007-12-06 ネオコニックス,インコーポレイテッドNeoconix, Incorporated Small array contact with precise operating range
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
JP2010101687A (en) * 2008-10-22 2010-05-06 Shikahama Seisakusho:Kk Contact probe
JP2010107365A (en) * 2008-10-30 2010-05-13 Mitsubishi Electric Corp Inspection device for substrate connection
JP2010223852A (en) * 2009-03-25 2010-10-07 Toshiba Corp Electric inspection probe, manufacturing method of the same and manufacturing method of semiconductor device
JP2011117882A (en) * 2009-12-07 2011-06-16 Rika Denshi Co Ltd Contact probe

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