JP2014232646A - Lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp which maintains proper reflection characteristics of a reflector by taking heat countermeasures for the reflector against heat generated by drive of a semiconductor light-emitting element, and which enables expectation of stable light-emitting characteristics.SOLUTION: A lamp 1 has a housing 11 in which a light-emitting module 2 and a reflector 8 are housed by being thermally coupled together in internal different positions. A first opening 80A of the reflector 8 getting close to the light-emitting module 2 is arranged in the state of facing a surface of a substrate 20 of the light-emitting module 2, and a gap G exists between the reflector 8 and the substrate 20 to make the reflector 8 held in the housing 11.

Description

  The present invention relates to a lamp using a semiconductor light emitting element such as an LED (Light Emitting Device).

In recent years, a bulb-type lamp using a semiconductor light emitting element such as an LED is becoming popular as an alternative to an incandescent bulb.
As an example, the lamp includes a housing, a mounting board on which a light emitting unit is mounted on the surface of the board, a lighting circuit unit for the LED, and a reflector disposed so as to surround the LED above the mounting board. And an optical member arranged to transmit the reflected light from the reflector, and a base that is attached to a socket of an external lighting fixture and receives power supply. A mounting board, a lighting circuit unit, and a reflector are housed inside the housing. In order to increase the reflection efficiency of the reflector, the reflector may be placed on the mounting substrate so as to surround the light emitting portion.

  When the lamp is driven, light emitted from the LED is reflected by the reflecting surface of the reflector and is incident on the optical member. Light passes through the inside of the optical member and is emitted to the outside as illumination light.

JP 2010-86946 A

When the lamp having the above configuration is driven, the semiconductor light emitting element generates heat by driving. On the other hand, when the reflector is exposed to a high temperature state, the reflector may be thermally damaged and the reflection characteristics may be deteriorated. Therefore, in order to obtain stable light emission characteristics in a lamp using a semiconductor light emitting element, it is important to take measures against the heat of the reflector against heat generated by driving the semiconductor light emitting element.
The present invention has been made in view of the above problems, and by taking measures against the heat of the reflector against the heat generated by driving the semiconductor light emitting element, the reflector has good reflection characteristics and stable light emission characteristics. It is an object to provide a lamp that can be expected.

  In order to solve the above-described problem, a lamp according to one embodiment of the present invention includes a mounting substrate on which a semiconductor light emitting element is mounted on a surface of a substrate, and an opening, and the opening of the opening when the surface of the substrate is viewed in plan view. A reflector is disposed so as to surround the semiconductor light-emitting element and overlap the surface of the substrate, and the reflector that reflects the light of the semiconductor light-emitting element incident from the opening, and the reflector and the mounting substrate are accommodated therein. The reflector and the mounting substrate are arranged inside the casing in a state of being spaced apart from each other.

Further, in another aspect of the present invention, the surface of the mounting substrate has a wiring extending in electrical connection with the semiconductor light emitting element, and the power is supplied to the semiconductor light emitting element through the wiring. A lighting circuit unit for lighting the semiconductor light emitting element may be provided, and the gap may be set to be larger than the wire diameter of the wiring.
In another aspect of the present invention, the reflector may be made of a polycarbonate resin.

In another aspect of the present invention, the reflector may include a base and a reflective film formed on the surface of the base and containing a metal or a metal compound.
Moreover, in another aspect of the present invention, a configuration may be adopted in which a light-transmitting optical member that is attached to the housing and transmits reflected light from the reflector is provided.
In another aspect of the present invention, the optical member may be made of a resin material.

  According to another aspect of the present invention, the casing has an opening, the peripheral edge of the one opening of the reflector is arranged so as to contact the peripheral edge of the opening of the casing, and the optical member is the reflector. The peripheral edge of the one opening of the reflector may be sandwiched between the optical member and the casing.

In the lighting device according to one embodiment of the present invention, the semiconductor light-emitting element is surrounded by the periphery of one opening of the reflector, and the reflector is disposed so as to overlap the surface of the substrate. Makes it easy to reflect.
Further, the reflector and the mounting substrate are arranged in a state of being spaced apart from each other inside the housing. As a result, the housing is interposed in the heat transfer path between the semiconductor light emitting element and the reflector, making it difficult to transfer the heat generated in the semiconductor light emitting element to the reflector.

  As a result, it is possible to provide a lamp capable of maintaining the good reflection characteristics of the reflector and expecting stable light emission characteristics.

External appearance block diagram of lamp 1 in the first embodiment Sectional drawing which shows the internal structure of the lamp 1 Exploded view showing the internal structure of the lamp 1 The figure which shows each structure of the reflector 8 and the optical member 9 The figure which shows the arrangement | positioning relationship between 80 A of 1st openings of the reflector 8, and the light emission part 21. FIG. Partial sectional view showing a gap G between the reflector 8 and the light emitting module 2 The figure which shows the structure of the housing | casing 11. Partial sectional view for explaining the effect produced by the lamp 1 Partial sectional view for explaining the effect exerted on the wiring 41 The fragmentary sectional view which shows the structure of the lamp | ramp 1A in Embodiment 2. FIG.

<Embodiment 1>
Hereinafter, the lamp | ramp concerning Embodiment 1 is demonstrated, referring drawings.
(Configuration of lamp 1)
As shown in FIGS. 1 to 3, the lamp 1 includes a light emitting module 2, a base 3, a lighting circuit unit 4, a circuit case 5, a case lid 6, a seal member 7, a reflector 8, and an optical unit. A member 9, a base 10, and a housing 11 are provided.

The lamp 1 is a so-called LED bulb, and has the same appearance as a general bulb-type halogen lamp. When the lamp 1 is used, it can be used as it is by attaching it to a socket of a lighting fixture to which the base 10 can be attached.
The lamp 1 will be described for each component.
[Light Emitting Module 2]
The light emitting module (mounting substrate) 2 includes a substrate 20, a light emitting unit 21 mounted on the surface of the substrate, and a socket 22.

  The substrate 20 includes an aluminum substrate, an insulating layer formed on one main surface of the aluminum substrate, and a wiring pattern formed on the insulating layer. The main surface of the substrate 20 is rectangular. The aluminum substrate transfers heat generated by driving the LED 210 to the base 3 side. The insulating layer insulates the aluminum substrate from the wiring pattern. An LED 210 is mounted on the wiring pattern.

Insertion holes 200 exist at the four corners of the substrate 20. In the lamp 1, a screw is inserted into the insertion hole 200, and the light emitting module 2 is screwed together with the base 3 into the screw hole 112 a of the base portion 112 of the housing 11.
The light emitting unit 21 is a main light emitting unit of the lamp 1 and includes a total of 26 LEDs 210 electrically connected to the wiring pattern of the substrate 20 in a predetermined arrangement (13 series × 2 parallel). The light emitting unit 21 is formed in a circular shape as a whole.

The LED 210 is an SMD (Surface Mount Device) type and is an example of a semiconductor light emitting element. The LED 210 includes an element main body, a mortar-shaped reflection member surrounding the element main body, and a sealing body filled in the reflection member.
The socket 22 is electrically connected to the connector of the wiring 41 in the lighting circuit unit 4. As shown in FIG. 3, the socket 22 is electrically connected to the wiring pattern of the substrate 20.

[Base 3]
The base 3 is a heat radiating plate that transfers heat generated by the LED 210 to the housing 11 side during driving. The base 3 is made of a material having excellent heat conductivity, such as an aluminum plate. Similar to the insertion hole 200 of the substrate 20, the base 3 has an insertion hole 300 through which a screw is inserted. Inside the housing 11, the base 3 is placed so as to be in direct contact with the pedestal portion 112. The light emitting modules 2 are densely stacked on the upper surface of the base 3, and the light emitting modules 2 are thermally coupled to the housing 11 through the base 3.
[Lighting circuit unit 4]
The lighting circuit unit 4 converts AC power supplied from the outside into constant DC power and supplies it to each LED 210. The lighting circuit unit 4 includes a substrate 40, a plurality of electronic components mounted on the substrate 40, and a plurality of wirings 41 and 42 that are electrically connected to the electronic components and extend. The electronic component includes an electrolytic capacitor (43 in FIG. 2) and the like. The two wires 41 have a connector 410 at the tip, and are electrically connected to each LED 210 of the light emitting module 2 via the connector 410. Each wire diameter of the wiring 41 is about 1.2 mm. The two wires 42 are electrically connected to the shell 100 and the eyelet 102 of the base 10, respectively. The lighting circuit unit 4 incorporates an AC / DC converter circuit, a constant current circuit, and the like.
[Circuit case 5]
The circuit case 5 houses the lighting circuit unit 4 therein. The circuit case 5 is made of an insulating material such as resin and has a substantially cylindrical shape as shown in FIG. As a specific configuration, the circuit case 5 has an engagement claw 50 and a reduced diameter portion 51 at one end in the longitudinal direction, and an enlarged diameter portion 52 at the other end. The engagement claw 50 engages with the engagement claw 60 of the case lid 6. The base 10 is arranged in the reduced diameter portion 51 as shown in FIG. The circuit case 5 is accommodated in the internal space 110A so that the reduced diameter portion 51 is exposed from the housing 11 and the enlarged diameter portion 52 is fitted into the stepped portion 111 of the housing 11 facing the internal space 110A.

Inside the circuit case 5, a strip-shaped substrate 40 of the lighting circuit unit 4 is accommodated along the cylindrical axis direction.
[Case lid 6]
The case lid 6 closes the enlarged diameter portion 52 of the circuit case 5. The case lid 6 is made of an insulating material such as a resin like the circuit case 5. As shown in FIG. 3, the engagement claw 60 that can be engaged with the circuit case 5 and the wiring 41 are arranged on the light emitting module 2 side. And a guide hole 61 for guiding. The case lid 6 is engaged with the engagement claw 50 of the circuit case 5 in the engagement claw 60 in a state where the wiring 41 extending from the lighting circuit unit 4 is exposed to the light emitting module 2 side.
[Seal member 7]
The seal member 7 accommodates the circuit case 5 in the internal space 110 </ b> A of the housing 11 without rattling. The seal member 7 is a so-called O-ring, and has an inner diameter larger than the outer diameter of the circuit case 5. The seal member 7 is disposed on the step portion 111 of the housing 11.

When the case lid 6 is attached to the circuit case 5 and the light emitting module 2 and the base 3 are screwed to the housing 11, the circuit case 5 and the case lid 6 are pressed against the base 3, thereby sealing the circuit case 5. The entire peripheral portion of the member 7 is pressed toward the stepped portion 111 by the enlarged diameter portion 52. As a result, the circuit case 5 is positioned and accommodated inside the housing 11 without rattling.
[Reflector 8]
The reflector (reflecting member) 8 reflects the light emitted from each LED 210 and enters the optical member 9. As shown in FIG. 4, the reflector 8 is a cylindrical body as a whole, and has one opening (first opening 80A) having a small inner diameter and the other opening (second opening 80B) having a large inner diameter. A region corresponding to the inner surface of the cylindrical body functions as a reflecting surface that reflects the emitted light of the LED 210. A folded portion 81 is formed at the periphery of the second opening 80B. The peripheral edge of the first opening 80 </ b> A surrounds the light emitting unit 21 and is disposed so as to overlap the substrate 20 of the light emitting module 2. The peripheral edge of the second opening 80B is disposed to face the optical member 9. When the lamp 1 is driven, the inner surface of the reflector 8 functions as a reflecting surface.

Although the inner diameter of the first opening 80A can be adjusted as appropriate, the diameter is set so that the reflection efficiency of the light emitted from each LED 210 in the reflector 8 can be increased as much as possible. Specifically, as shown in FIG. 5, when the light emitting module 2 is viewed in plan, the inner diameter D <b> 1 of the first opening 80 </ b> A is as close as possible to the outer diameter D <b> 2 of the light emitting unit 21 and reflected at a position close to the light emitting unit 21. desirable.
Moreover, although the inclination angle of the reflecting surface with respect to the optical axis (Y) direction can be adjusted as appropriate, it is preferably 30 ° or more and 60 ° or less as an example. Facets may be formed on the reflecting surface.

The folded portion 81 is combined so as to overlap the inner peripheral rib 113 of the housing 11. When the optical member 9 is combined with the housing 11 with the folded portion 81 overlapped with the inner peripheral rib 113, the reflector 8 is thermally coupled to the housing 11, and between the optical member 9 and the housing 11. It is pinched.
Here, as one of the features of the lamp 1, the reflector 8 is in contact with the housing 11 at the inner peripheral rib 113, so that a constant gap is provided between the periphery of the first opening 80 </ b> A and the light emitting module 2 as shown in FIG. 6. G is provided, and direct contact between the reflector 8 and the light emitting module 2 is avoided. The gap G is desirably adjusted to be larger than at least each wire diameter of the wiring 41. In the lamp 1, the gap G is adjusted to about 1.3 mm or more, which is larger than each wire diameter of the wiring 41. Note that by limiting the gap G to the necessary minimum, the emitted light of each LED 210 leaking from between the light emitting module 2 and the reflector 8 can be reduced.

The reflector 8 is formed by forming a reflective film having a high reflectance with respect to visible light on a metal base surface made of, for example, aluminum or an aluminum alloy. The reflective film can be formed of a material containing a metal or a metal compound, for example. More specifically, in addition to a metal such as aluminum or chromium, any one of silicon dioxide (SiO ₂ ), titanium dioxide (TiO ₂ ), magnesium fluoride (MgF ₂ ), zinc sulfide (ZnS), etc. is deposited. Vapor deposited films can be used.

Alternatively, the reflector 8 can be configured by injection molding a polycarbonate (PC) resin material mixed with a white pigment. Thereby, weight reduction of the lamp | ramp 1 is realizable compared with the case where the reflector 8 is comprised with a metal material.
Alternatively, the reflector 8 is formed by forming a reflective film having a high reflectance with respect to visible light on the surface of a base on which a resin material is injection-molded. The reflective film can be formed of a material containing a metal or a metal compound, such as the above-described deposited film.
[Optical member 9]
The optical member 9 has translucency that allows the reflected light from the reflector 8 to pass therethrough, and adjusts the optical path of the emitted light from each LED 210. As shown in FIG. 4, the optical member 9 has a lens portion 90 and a groove portion 91. The lens unit 90 has a disk-shaped Fresnel lens structure, and adjusts the emitted light of each LED 210 to parallel light or light collection. The groove portion 91 is formed at the periphery of the lens portion 90, and the outer peripheral rib 114 of the housing 11 is inserted into the groove portion 91 as shown in FIG. When the optical member 9 is viewed in plan, the folded portion 81 of the reflector 8 and the inner peripheral rib 113 of the housing 11 are arranged in the same order on the inner side of the groove portion 91. The optical member 9 is formed using, for example, an acrylic resin such as PMMA, a transparent resin material such as polyethylene terephthalate (PET) or polycarbonate, or a glass material.
[Base 10]
The base 10 is a part where the lamp 1 is connected to the socket of the lighting fixture, and receives power supply from the lighting fixture through the socket. As shown in FIG. 2, the base 10 includes a shell 100, an insulating portion 101, and an eyelet 102. The shell 100 is made of a metal member, and a male screw is formed on the outer surface. The insulating part 101 is made of an insulating material such as ceramic and insulates the shell 100 and the eyelet 102. Inside the base 10, the wiring 42 of the lighting circuit unit 4 is electrically connected to the shell 100 and the eyelet 102.

The base 10 is fixed to the reduced diameter portion 51 of the circuit case 5 by caulking the shell 100.
[Case 11]
The housing 11 houses therein the light emitting module 2, the base 3, the lighting circuit unit 4, the circuit case 5, the case lid 6, the seal member 7, the reflector 8, and the like. The housing 11 also serves as a heat sink that dissipates heat generated by driving the LEDs to the outside through the base 3.

  As shown in FIG. 7, the casing 11 is a cylindrical body having a shade (umbrella) -like appearance as a whole. As a specific configuration, the housing 11 includes an internal space 110A that communicates with each other and an internal space 110B that communicates with the internal space 110A. In addition, the housing 11 includes a step portion 111 and a pedestal portion 112 each having an inner diameter changed stepwise between the internal space 110A and the internal space 110B. The internal space 110A communicates with the outside through the first opening 11a and the internal space 110B communicates with the outside through the second opening 11b. As shown in FIG. 2, the base 10 is exposed to the outside through the first opening 11a. A rib-shaped inner peripheral rib 113 is erected around the second opening 11b. An outer peripheral rib 114 exists on the outer periphery of the inner peripheral rib 113.

The lighting circuit unit 4, the circuit case 5, and the case lid 6 are accommodated in the internal space 110A. The reflector 8 is accommodated in the internal space 110B. The light emitting module 2 and the base 3 are fixed to the pedestal portion 112 by screws. The seal member 7 is placed on the step portion 111.
With the folded portion 81 of the reflector 8 being combined with the inner peripheral rib 113 and the groove portion 91 of the optical member 9 being fitted to the outer peripheral rib 114, the housing 11 and the optical member 9 are mutually bonded using a silicon-based adhesive. It is glued.

The casing 11 is made of a material having excellent heat dissipation characteristics, such as aluminum, aluminum alloy, or magnesium alloy.
(Driving of lamp 1)
When driving the lamp 1, the user previously attaches the base 10 of the lamp 1 to the socket of the lighting fixture. The user operates the power supply and turns on the lamp 1 through the socket of the lighting fixture. As a result, each LED 210 in the light emitting module 2 receives power and emits light. The light emitted from each LED 210 is reflected by the reflecting surface of the reflector 8 and enters the optical member 9. The light is adjusted to parallel light having the Y direction as the main emission direction in the lens portion 90 of the optical member 9, and is emitted to the outside to become illumination light.

Here, in the lamp 1, the following various effects can be expected.
[Thermal countermeasure effect of reflector 8]
In the lamp 1, the reflector 8 is held by the housing 11 by combining the inner peripheral rib 113 of the housing 11 with the folded portion 81 of the reflector 8. As a result, a certain gap G exists between the periphery of the first opening 80A of the reflector 8 and the light emitting module 2, and the reflector 8 and the light emitting module 2 are attached to the housing 11 in a state of being spaced apart from each other. .

  Therefore, when the lamp 1 is driven, even if heat generated by driving the LEDs 210 is generated as shown in FIG. The The housing 11 has a capacity for housing the reflector 8, the light emitting module 2, etc., and has a sufficiently large heat capacity. Further, since the surface of the housing 11 is in contact with the outside air, the heat transmitted to the housing 11 is radiated from the entire surface of the housing 11 to the outside air. Therefore, even if a high temperature is transferred from the light emitting module 2 to the housing 11, the high temperature is not easily transmitted from the housing 11 to the reflector 8. Thereby, compared with the case where a reflector and a light emitting module are made to contact directly, the heat | fever produced by the drive of each LED210 can be made hard to be transmitted to the reflector 8 in the lamp | ramp 1. FIG.

As a result, it is possible to prevent the reflector 8 from being thermally damaged by the heat generated by driving each LED 210 and to expect to exhibit good light emission characteristics over a long period of time.
In the confirmation test conducted by the inventors of the present application, it was found that when a general lamp was driven, the temperature of the light emitting module rose to around 100 ° C. Therefore, if the reflector is formed by depositing a metal vapor deposition film on a resin material such as polycarbonate resin, and maintaining the reflector at a heating temperature of 100 ° C. for 40000 hours, the reflector is thermally damaged, and the reflectivity is reduced to about 10% of the initial value. Confirmed to do. From this experiment, it is considered that when the heat generated by driving the LED directly reaches the reflector, the reflector is thermally damaged and the light emission characteristics of the lamp may be deteriorated.

In contrast, the lamp 1 can effectively prevent thermal damage to the reflector 8 due to heat generated by driving the LED 210 by adopting the above configuration.
[Thermal countermeasure effect of optical member 9]
In the lamp 1, the optical member 9 is fitted and bonded to the outer peripheral rib 114 at the periphery of the second opening 11 b of the housing 11. The optical member 9 is in contact with the folded portion 81 of the reflector 8 but is not in direct contact with the light emitting module 2. Further, the peripheral edge of the second opening 11b of the housing 11 is present at a position separated from the pedestal portion 112 where the light emitting module 2 is disposed.

Thus, when the lamp 1 is driven, the heat generated by driving each LED 210 is adjusted so that the heat is transmitted through the housing 11 when the heat is transmitted to the optical member 9. Therefore, compared with the case where an optical member and a light emitting module are made to contact directly, the lamp 1 can make it difficult to transmit the heat generated by driving each LED 210 to the optical member 9.
When the optical member is made of an acrylic resin material, the heat resistant temperature is around 100 ° C., and if it exceeds 100 ° C., deformation may occur. On the other hand, in the lamp 1, since the heat generated by driving each LED 210 is difficult to be transmitted to the optical member 9 as described above, the optical member 9 is heated to 100 ° C. or more by the heat transmitted from each LED 210 to the optical member 9. Heating can be suppressed.

As a result, it is possible to prevent the optical member 9 from being thermally damaged by the heat generated in each LED 210 and to expect to exhibit good light emission characteristics over a long period of time.
[Effect of preventing pinching of wiring 41]
In the lamp 1, the gap G between the reflector 8 and the light emitting module 2 is adjusted to a value that is at least larger than the diameter of each wire 41. As a result, as shown in FIG. 9, even if the wiring 41 is present between the first opening 80A of the reflector 8 and the light emitting module 2, the wiring 41 is sandwiched between the periphery of the reflector 8 and the first opening 80A. Is prevented. When the reflector 8 is made of a metal material or a metal vapor deposition film, the weight is considerable. However, by adjusting the gap G to a gap larger than each wire diameter of the wiring 41, the reflector 8 and the light emitting module having a large weight can be used. 2 is not sandwiched between the two.

Thereby, in the lamp 1, it is possible to prevent the wiring 41 from being sandwiched between the reflectors 8 and causing problems such as damage, short circuit, and disconnection. In addition, since the reflector 8 is lifted on the wiring 41 and the reflector 8 is lifted and the optical axis of the reflector 8 is prevented from being displaced, it is possible to expect good light emission characteristics.
Hereinafter, another embodiment of the present invention will be described focusing on differences from the first embodiment.
<Embodiment 2>
A lamp 1A according to the second embodiment will be described with reference to FIG. The lamp 1A includes a flat portion 81A formed on the periphery of the second opening 80B of the reflector 8A, and a step portion 113A formed so that the flat portion 81A is placed on the periphery of the second opening 11b of the housing 11A. Have A rib 114A is erected on the outer periphery of the step portion 113A. The rib 114A is bonded to the peripheral portion 91A with a silicon-based adhesive while being overlapped with the peripheral portion 91A of the optical member 9A. The flat part 81A is sandwiched between the step part 113A and the optical member 9A, whereby the reflector 8A is held by the housing 11A. A gap G exists between the reflector 8A and the light emitting module 2 as in the first embodiment.

Also in the lamp 1A having the above configuration, the same effect as in the first embodiment can be expected. Since the lamp 1A does not use the inner peripheral rib 113, the outer peripheral rib 114, and the folded portion 81, it has an advantage that the configuration can be simplified and the production cost can be reduced accordingly.
<Other matters>
In the lamp of the present invention, heat generated by driving the LED is relatively difficult to be transmitted to the reflector 8, so that even when the reflector 8 is made of a resin material, good reflection characteristics can be expected over a long period of time.

In each of the above embodiments, the LED 210 is an SMD type, but a COB (Chip On Board) type LED may be used.
The semiconductor light emitting element is not limited to the LED. For example, either a laser diode (LD) or an organic EL element (OLED) may be used.
In the above-described embodiment, the hanging type illumination device is shown. However, the lighting device of the present invention is not limited to this type. For example, a lighting device such as a desk stand type, a ceiling type, or a downlight type may be used.

Although the main surface of the light emitting module 2 is rectangular, the present invention is not limited to this. For example, it may be any one of a polygonal shape, an elliptical shape, and a circular shape. A plurality of light emitting modules 2 can also be used.
The total number of LEDs 210 in the light emitting module 2 is not limited to 26, and may be other numbers. Further, the overall shape of the light emitting unit 21 on the light emitting module 2 is not limited to a circular shape, and may be any of a rectangular shape, a linear shape, and the like.

A heat conductive member such as a heat conductive sheet or a heat conductive grease may be interposed between the light emitting module 2 and the base 3.
In the present invention, it is desirable that the light emitting module 2 and the reflector 8 are completely separated from each other, but actually, the light emitting module 2 and the reflector 8 may be slightly in contact with each other due to manufacturing errors or the like. In the present invention, contact due to such a manufacturing error may occur to some extent. Further, a pin or a very small rib may protrude from the peripheral edge of the first opening 80 </ b> A of the reflector 8 toward the light emitting module 2, and these may be brought into contact with the light emitting module 2. However, it is desirable that the light emitting module 2 and the reflector 8 be completely separated from each other in order to fully exhibit the effects of the present invention.

  The reflector 8 may be fixed to the housing 11 by various methods such as screwing or bonding. By fixing the reflector 8 to the housing 11 in this way, the optical member 9 can be omitted.

DESCRIPTION OF SYMBOLS 1, 1A lamp 2 Light emitting module 3 Base 4 Lighting circuit unit 5 Circuit case 6 Case cover 7 Seal member 8 Reflector 9 Optical member 10 Base 11, 11A Case 81 Folding part 81A Flat part 91 Groove part 91A Peripheral part 110A, 110B Inside Space 113 Inner rib 113A Stepped portion 114 Outer rib 114A Rib

Claims (7)

A mounting substrate having a semiconductor light emitting element mounted on the surface of the substrate;
The cylindrical body is arranged so that the periphery of one opening surrounds the semiconductor light emitting element and overlaps the surface of the substrate when the surface of the substrate is viewed in plan, and is incident from the one opening. A reflector that reflects the light of the semiconductor light emitting element on the inner surface and emits the light from the other opening;
A housing that houses the reflector and the mounting board inside,
The reflector and the mounting substrate are attached to the housing in a state of being spaced apart from each other. A lighting circuit unit that has a wiring that is electrically connected to the semiconductor light emitting element on the surface of the mounting substrate and that powers the semiconductor light emitting element through the wiring to turn on the semiconductor light emitting element; Prepared,
The lamp according to claim 1, wherein the gap is set to be equal to or larger than a wire diameter of the wiring. The lamp according to claim 1, wherein the reflector is made of polycarbonate resin. The lamp according to claim 2, wherein the reflector includes a base and a reflective film formed on the surface of the base so as to include a metal or a metal compound. The lamp according to claim 1, further comprising a translucent optical member that is attached to the housing and transmits reflected light from the reflector. The lamp according to claim 5, wherein the optical member is made of a resin material. The housing has an opening;
The peripheral edge of the one opening of the reflector is arranged so as to contact the peripheral edge of the opening of the housing,
The optical member is attached to the casing so as to cover the reflector, and a peripheral edge of the one opening of the reflector is sandwiched between the optical member and the casing. The lamp described.

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