CN203880460U - Lamp - Google Patents
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- CN203880460U CN203880460U CN201420274329.2U CN201420274329U CN203880460U CN 203880460 U CN203880460 U CN 203880460U CN 201420274329 U CN201420274329 U CN 201420274329U CN 203880460 U CN203880460 U CN 203880460U
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Abstract
A lamp is provided with an installation base plate, a reflector and a frame body, wherein the surface of the base plate is provided with a semiconductor light-emitting element; the reflector is cylindrical and is configured in a mode that when the surface of the base plate is observed in an overlooking mode, the circumferential edge of an opening of one side surrounds the semiconductor light-emitting element and is overlapped with the surface of the base plate, and the light of the semiconductor light-emitting element transmitted in from the opening of one side is reflected on the inner surface and is transmitted out from the opening of the other side; the frame body contains the reflector and the installation base plate and the reflector and the installation base plate are arranged in the frame body in a mode that the reflector and the installation plate are separated from each other through a gap between the reflector and the installation base plate. According to the lamp, for heat generated through driving of the semiconductor light-emitting element, heat countermeasures of the reflector are achieved, so that good reflection characteristics of the reflector can be maintained, and the stable light-emitting characteristic of the lamp can be expected.
Description
Technical field
The utility model relates to the lamp that uses the semiconductor light-emitting elements such as LED (Light Emitting Diode, light emitting diode).
Background technology
In recent years, as the substitute of incandescent lamp bulb, utilize the lamp of the bulb-shaped of the semiconductor light-emitting elements such as LED to popularize gradually.
As an example, light fixture is standby: framework; Installation base plate, is equipped with illuminating part, and this illuminating part is installed LED at substrate surface and formed; The lamp circuit unit of LED; Reflector, is configured to surround LED above installation base plate; Optics, is configured to make the reverberation from reflector to see through; And lamp holder, be assembled to the lamp socket of outside ligthing paraphernalia and accept electric power supply with.At the storage of the inside of framework installation base plate, lamp circuit unit and reflector.In order to improve the reflection efficiency of reflector, reflector sometimes overlaps and configures with installation base plate in the mode of surrounding illuminating part.
In the time that lamp drives, reflect and be incident to optics at the reflecting surface of reflector from the emergent light of LED.The inside of light transmission optics, extremely outside as illumination light outgoing.
Patent documentation 1: TOHKEMY 2010-86946 communique
In the time that driving has the lamp of above-mentioned formation, semiconductor light-emitting elements is because driving is generated heat.On the other hand, if reflector is exposed to the condition of high temperature, there is sometimes fire damage and reflection characteristic reduction.So, in the lamp that utilizes semiconductor light-emitting elements, in order to obtain the stable characteristics of luminescence, the heat producing for the driving by semiconductor light-emitting elements, the hot countermeasure that realizes reflector is extremely important.
Utility model content
The utility model is made in view of the above problems, its object is, following lamp is provided: for the heat of the driving generation by semiconductor light-emitting elements, realize the hot countermeasure of reflector, thereby can maintain the good reflection characteristic of reflector, and expect the stable characteristics of luminescence.
In order to address the above problem, the lamp of a kind of mode of the present utility model is following formation, and it possesses: installation base plate, is provided with semiconductor light-emitting elements on the surface of substrate; Reflector, for cylindrical body, be configured to surround described semiconductor light-emitting elements and overlap with the surface of described substrate at the periphery of overlooking one side's opening while observing described substrate surperficial, by the light of the described semiconductor light-emitting elements of the opening incident through one at internal surface reflection and from the opposing party's opening outgoing; And framework, described reflector and described installation base plate are accommodated in to inside; Described reflector is installed on described framework with the state that described installation base plate separates with spaced gap.
In addition, in another way of the present utility model, can also form for following: possess lamp circuit unit, this lamp circuit unit has the wiring that is electrically connected and extends with described semiconductor light-emitting elements on the surface of described installation base plate, via described wiring, described semiconductor light-emitting elements is supplied with to electric power, thereby described semiconductor light-emitting elements is lit a lamp; More than described gap is set to the wire diameter of described wiring.
In addition, in another way of the present utility model, can also be following formation: described reflector uses polycarbonate resin to form.
In addition, in another way of the present utility model, can also form for following: described reflector has substrate and reflectance coating forms, and this reflectance coating is film forming by contain metal or metallic compound on the surface of described substrate.
In addition, in another way of the present utility model, can also form for following: have the optics of light transmission, the optics of this light transmission is installed on described framework, makes to see through from the reverberation of described reflector.
In addition, in another way of the present utility model, can also form for following: described optics is made up of resin material.
In addition, in another way of the present utility model, can also form for following: described framework has opening; The periphery of described the opposing party's of described reflector opening is arranged to the periphery of the opening of described framework and contacts; Described optics is installed on described framework to cover the mode of described reflector, and the periphery of described the opposing party's of described reflector opening is folded between described optics and described framework.
The effect of utility model
According in the lighting device of a kind of mode of the present utility model, surround semiconductor light-emitting elements and overlap with the surface of substrate by reflector arrangement being become by the periphery of a side's of reflector opening, thereby being easy to make the light of semiconductor light-emitting elements by the internal surface reflection of reflector.
Moreover, in the inside of framework, the state configuration that reflector is separated with spaced gap with installation base plate.Thus, make framework get involved the heat-transfer path of semiconductor light-emitting elements and reflector, be difficult to the heat being generated by semiconductor light-emitting elements to be passed to reflector.
As a result, can provide following lamp: can maintain the good reflection characteristic of reflector, and expect the stable characteristics of luminescence.
Brief description of the drawings
Fig. 1 is the outward appearance pie graph of the lamp 1 in embodiment one.
Fig. 2 is the sectional view that the inside of indication lamp 1 forms.
Fig. 3 is the exploded view that the inside of indication lamp 1 forms.
Fig. 4 is the figure that represents each formation of reflector 8 and optics 9.
Fig. 5 is the figure that represents the first opening 80A of reflector 8 and the configuration relation of illuminating part 21.
Fig. 6 is the partial cross section figure that represents the clearance G between reflector 8 and light emitting module 2.
Fig. 7 is the figure that represents the formation of framework 11.
Fig. 8 is the partial cross section figure for the effect being played by lamp 1 is described.
Fig. 9 is for the partial cross section figure for wiring 41 effects that play is described.
Figure 10 is the partial cross section figure that represents the formation of the lamp 1A in embodiment two.
The explanation of symbol:
1,1A lamp; 2 light emitting modules; 3 pedestals; 4 lamp circuit unit; 5 circuit cases; 6 casing covers; 7 seal members; 8 reflectors; 9 opticses; 10 lamp holders; 11,11A framework; 81 return portion; 81A par; 91 slot parts; 91A circumference; 110A, 110B inner space; 113 interior all ribs; 113A stage portion; 114 external circumferential ribs; 114A rib
Detailed description of the invention
< embodiment one >
Below, with reference to the accompanying drawings of the lamp of embodiment one.
(formation of lamp 1)
As shown in FIG. 1 to 3, lamp 1 possesses: light emitting module 2, pedestal 3, lamp circuit unit 4, circuit case 5, casing cover 6, seal member 7, reflector 8, optics 9, lamp holder 10 and framework 11.
Lamp 1 is so-called LED bulb, has the outward appearance same with general bulb-shaped Halogen lamp LED.In the time of the use of lamp 1, can be assemblied in the ligthing paraphernalia that can assemble lamp holder 10 lamp socket and directly use.
By each inscape bright lamp.
[light emitting module 2]
Light emitting module (installation base plate) 2 possesses: substrate 20, the surperficial illuminating part 21 that is installed on substrate and socket 22.
Substrate 20 has with lower member and forms: aluminium base; Insulating barrier, is formed on an interarea of aluminium base; And wiring pattern, be formed on insulating barrier.The interarea of substrate 20 is rectangular-shaped.The heat that aluminium base produces the driving by LED210 is passed to pedestal 3 sides.Insulating barrier is by aluminium base and wiring pattern insulation.LED210 is installed on wiring pattern.
Four jiaos at substrate 20 there is inserting hole 200.In lamp 1, screw is inserted to inserting hole 200, and light emitting module 2 is screwed to the screwed hole 112a of the pedestal portion 112 of framework 11 together with pedestal 3.
Illuminating part 21 is main light emission portions of lamp 1, is made up of the LED210 that adds up to 26 arrangements with regulation (13 series connection × 2 parallel connections) to be electrically connected to the wiring pattern of substrate 20.Illuminating part 21 is formed as circle as a whole.
LED210 is SMD (Surface Mount Device, surface mount device) type, is an example of semiconductor light-emitting elements.LED210 has: the reflection part of the mortar shape of element body, embracing element main body and be filled in the packaging body of the inside of reflection part.
Socket 22 is electrically connected with the connector of the wiring 41 in lamp circuit unit 4.As shown in Figure 3, socket 22 is electrically connected to the wiring pattern of substrate 20.
[pedestal 3]
Pedestal 3 is heat sinks, and the heat being produced by LED210 during by driving is passed to framework 11 sides.Pedestal 3 is made up of for example aluminium sheet of material of conductivity of heat excellence.In pedestal 3, same with the inserting hole 200 of substrate 20, there is the inserting hole 300 of inserting for screw.In the inside of framework 11, pedestal 3 loads in pedestal portion 112 in the mode directly contacting.Light emitting module 2 is closely contacted on the upper surface of pedestal 3, and light emitting module 2 is via pedestal 3 and framework 11 thermal.
[lamp circuit unit 4]
The alternating electromotive force that outside is supplied with in lamp circuit unit 4 is transformed to certain direct current power and is supplied to each LED210.Lamp circuit unit 4 possesses: substrate 40; Multiple electronic components, are installed on substrate 40; And many wirings 41,42, be electrically connected with electronic component and extend.Electronic component comprises electrolytic capacitor (43 in Fig. 2) etc.Article two, wiring 41 has connector 410 at front end, is electrically connected with each LED210 of light emitting module 2 via connector 410.Each wire diameter of wiring 41 is respectively about 1.2mm.Article two, wiring 42 is electrically connected with housing 100 and the lamp eye 102 of lamp holder 10 respectively.In lamp circuit unit 4, pack AC/DC change-over circuit, constant-current circuit etc. into.
[circuit case 5]
Circuit case 5 is in storage lamp circuit unit 4, inside.Circuit case 5 is made up of insulating properties materials such as resins, has as shown in Figure 3 general cylindrical shape shape.As concrete formation, circuit case 5 has engagement pawl 50 and wide diameter portion 52 in one end of length direction, have reducing diameter part 51 at the other end.Engagement pawl 50 engages with the engagement pawl 60 of casing cover 6.In reducing diameter part 51, configure as shown in Figure 2 lamp holder 10.Circuit case 5 is accommodated in inner space 110A as follows: reducing diameter part 51 exposes to outside from framework 11, and wide diameter portion 52 embedded surfaces are to the stage portion 111 of the framework 11 of inner space 110A.
In the inside of circuit case 5, be accommodated with the substrate 40 of the rectangular shape of lamp circuit unit 4 along its Cylindorical rod direction.
[casing cover 6]
The wide diameter portion 52 of casing cover 6 lock-out circuit shells 5.Casing cover 6 is same with circuit case 5, is made up of insulating properties materials such as resins, as shown in Figure 3, has: engagement pawl 60, can engage with respect to circuit case 5; And bullport 61, wiring 41 is guided to light emitting module 2 sides.Casing cover 6 so that the state that the wiring 41 of extending from lamp circuit unit 4 is exposed in light emitting module 2 sides engage with the engagement pawl 50 of circuit case 5 by engagement pawl 60.
[seal member 7]
Seal member 7 makes circuit case 5 non-loosenings and is accommodated in the inner space 110A of framework 11.Seal member 7 is so-called O-ring gaskets, has the internal diameter larger than the external diameter of circuit case 5.Seal member 7 is configured in the stage portion 111 of framework 11.
In the time that casing cover 6 is assemblied in circuit case 5 and light emitting module 2 and pedestal 3 and is screwed to framework 11, circuit case 5 and casing cover 6 are pressed by pedestal 3, and thus, the all-round part of seal member 7 is pressed to stage portion 111 sides by wide diameter portion 52.Thus, be positioned the inside of framework 11 circuit case 5 non-loosenings and be contained.
[reflector 8]
The emergent light of the each LED210 of reflector (reflection part) 8 reflection, and make it be incident to optics 9.As shown in Figure 4, reflector 8 is cylindrical body as a whole, has the opposing party's that the side's that internal diameter is little opening (the first opening 80A) and internal diameter are large opening (the second opening 80B).Work as the reflecting surface of the emergent light of reflection LED210 in the region suitable with the inner surface of cylindrical body.Periphery at the second opening 80B forms return portion 81.The periphery of the first opening 80A is configured to surround illuminating part 21, and overlaps with the substrate 20 of light emitting module 2.The configuration relative to optics 9 of the periphery of the second opening 80B.In the time that lamp 1 drives, the inner surface of reflector 8 works as reflecting surface.
In addition, the internal diameter of the first opening 80A can suitably regulate, but adopts the diameter that can improve as much as possible the reflection efficiency of the emergent light of the each LED210 in reflector 8.Particularly, as shown in Figure 5, in the time overlooking observation light emitting module 2, the inner diameter D 1 that is preferably the first opening 80A approaches the outer diameter D 2 of illuminating part 21 as much as possible, is approaching the position reflection of illuminating part 21.
In addition, reflecting surface can suitably be adjusted with respect to the angle of inclination of optical axis (Y) direction, but as an example, is preferably 30 ° above below 60 °.Also can on reflecting surface, form facet.
Return portion 81 combines in the mode overlapping with interior all ribs 113 of framework 11.By under the state overlapping with interior all ribs 113 in return portion 81, optics 9 and framework 11 being combined, reflector 8 and framework 11 thermal, and be clamped between optics 9 and framework 11.
At this, as one of feature of lamp 1, reflector 8 is by interior all ribs 113 and framework 11 butts, thereby as shown in Figure 6, between the periphery of the first opening 80A and light emitting module 2, certain clearance G is set, and avoids reflector 8 to contact with the direct of light emitting module 2.Clearance G is preferably adjusted at least larger than each wire diameter of wiring 41.In lamp 1, clearance G is adjusted into than more than the large 1.3mm of each wire diameter of wiring 41 left and right.In addition,, by clearance G being restricted to necessary Min., can reduce the emergent light of the each LED210 from spilling between light emitting module 2 and reflector 8.
Reflector 8 for example, on the surface of the metallic substrates being made up of aluminum or aluminum alloy, will have the reflectance coating film forming of high reflectance and form for visible ray.Reflectance coating for example can be with the material filming that contains metal or metallic compound.More specifically, except the metal such as aluminium and chromium, can also utilize silica (SiO
2), titanium dioxide (TiO
2), magnesium fluoride (MgF
2), the vapor-deposited film that forms of any evaporation in zinc sulphide (ZnS) etc.
Or reflector 8 can also will mix Merlon (PC) the resin material injection moulding of Chinese white and form.Thus, with formed the situation of reflector 8 by metal material compared with, can realize the lighting of lamp 1.
Or reflector 8, by the surface of the substrate of resin material injection moulding, will have the reflectance coating film forming of high reflectance and form for visible ray.Reflectance coating is for example as above-mentioned vapor-deposited film, can be with the material filming that contains metal or metallic compound.
[optics 9]
Optics 9 has makes the light transmission that sees through from the reverberation of reflector 8, regulates the light path of the emergent light of each LED210.As shown in Figure 4, optics 9 has lens section 90 and slot part 91.Lens section 90 has discoid Fresnel Lenses structure, and the emergent light of each LED210 is adjusted to directional light or converging light.Slot part 91 is formed at the periphery of lens section 90, in the inside of slot part 91, inserts as shown in Figure 2 the external circumferential ribs 114 of framework 11.In addition, in the time overlooking viewing optics parts 9, in the inner side of slot part 91, interior all ribs 113 of the return portion 81 of reflector 8 and framework 11 overlap and configure by this order.Optics 9 for example uses any formation in resin material or the glass material that the acrylic resins such as PMMA, polyethylene terephthalate (PET), Merlon etc. are transparent.
[lamp holder 10]
Lamp holder 10 is positions that lamp 1 is connected to the lamp socket of illumination utensil, accepts electric power supply with by lamp socket from illumination with utensil.As shown in Figure 2, lamp holder 10 has housing 100, insulation division 101 and lamp eye 102.Housing 100 is made up of metal parts, forms pin thread at outer surface.Insulation division 101 is made up of insulating properties materials such as potteries, and housing 100 and lamp eye 102 are insulated.In the inside of lamp holder 10, the wiring 42 of lamp circuit unit 4 is electrically connected with housing 100 and lamp eye 102 respectively.
By housing 100 is riveted to processing, lamp holder 10 is fixed to the reducing diameter part 51 of circuit case 5.
[framework 11]
Framework 11 is at inner storage light-emitting module 2, pedestal 3, lamp circuit unit 4, circuit case 5, casing cover 6, seal member 7, reflector 8 etc.In addition, the heat that framework 11 doubles as the driving by LED is produced is dispelled the heat to outside radiator via pedestal 3.
As shown in Figure 7, framework 11 as a whole, for thering is the cylindrical body of outward appearance of shade (umbrella) shape.As concrete formation, framework 11 has the inner space 110A communicating with each other and the inner space 110B being communicated with inner space 110A in inside.In addition, framework 11 has stage portion 111 and pedestal portion 112 that internal diameter is formed with stepped variation respectively between inner space 110A and inner space 110B.Inner space 110A is communicated with outside at the first opening 11a, and inner space 110B is communicated with outside at the second opening 11b.As shown in Figure 2, lamp holder 10 exposes to outside from the first opening 11a.Around the second opening 11b, be uprightly provided with interior all ribs 113 of rib shape.There is external circumferential ribs 114 in the periphery of interior all ribs 113.
Lamp circuit unit 4, circuit case 5, casing cover 6 are accommodated in inner space 110A.Reflector 8 is accommodated in inner space 110B.Light emitting module 2 and pedestal 3 are by screwing togather the pedestal portion 112 that is fixed to.Seal member 7 loads in stage portion 111.
The return portion 81 of reflector 8 combine with interior all ribs 113 and the slot part 91 of optics 9 and the chimeric state of external circumferential ribs 114 under, framework 11 and optics 9 use silicon class adhesive bonded to each other.
Framework 11 is used any formation in material for example aluminum or aluminum alloy, the magnesium alloy of heat dissipation characteristics excellence.
(driving of lamp 1)
In the time driving lamp 1, user is assembled to the lamp holder of lamp 1 10 lamp socket of illumination utensil in advance.User's operating power device, uses the lamp socket of utensil to access electric power to lamp 1 by illumination.Thus, the each LED210 in light emitting module 2 accept electric power supply with and luminous.The emergent light of each LED210 is incident to optics 9 by the reflecting surface reflection of reflector 8.Light is adjusted to the directional light taking Y-direction as main exit direction in the lens section 90 of optics 9, and outgoing becomes illumination light to outside.
At this, in lamp 1, can expect following many effects.
[the hot countermeasure effect of reflector 8]
In lamp 1, combine with interior all ribs 113 of framework 11 by the return portion 81 that makes reflector 8, thereby reflector 8 is remained in framework 11.Thus, between the periphery of the first opening 80A of reflector 8 and light emitting module 2, there is certain clearance G, reflector 8 is mounted to framework 11 with the state that light emitting module 2 separates with spaced gap.
So be adjusted into, in the time that lamp 1 drives, even if produce heat by the driving of each LED210 as shown in Figure 8, framework 11 also gets involved the heat-transfer path between each LED210 and reflector 8.Framework 11 has the volume of storage reflector 8 and light emitting module 2 etc., and has fully large thermal capacity.In addition, because the surface of framework 11 contacts with extraneous gas, thereby the heat that is passed to framework 11 is dispelled the heat to extraneous gas from the surface integral of framework 11.So even if heat is passed to framework 11 from light emitting module 2, heat is also difficult to be passed to reflector 8 from framework 11.Thus, compare with the situation that reflector is directly contacted with light emitting module, in lamp 1, can make the heat being produced by the driving of each LED210 be difficult to be passed to reflector 8.
As a result, can prevent that fire damage can expect to bring into play the good characteristics of luminescence within the long term to reflector 8 due to the heat of the driving generation of each LED210.
In addition, in the validation test of carrying out the invention people of the application's utility model, recognize, in the case of the general lamp of driving, the temperature rise to 100 of light emitting module DEG C left and right.At this, if metal steam plated film masking is formed to reflector on the resin materials such as polycarbonate resin, reflector is maintained to 40000 hours at 100 DEG C of heating-up temperatures, confirm reflector fire damage, its reflectivity is reduced to 10% initial left and right.Can expect by this experiment, if the heat being produced by the driving of LED directly arrives reflector, reflector fire damage may occur and the characteristics of luminescence reduction of lamp.
On the other hand, in lamp 1, by adopting above-mentioned formation, can effectively prevent the heat that produced by the driving of the LED210 fire damage to reflector 8.
[the hot countermeasure effect of optics 9]
In lamp 1, at the periphery of the second opening 11b of framework 11, optics 9 is chimeric and bonding with external circumferential ribs 114.Optics 9 contacts with the return portion 81 of reflector 8, but does not directly contact with light emitting module 2.In addition, the periphery of the second opening 11b of framework 11 is present in the position separating with the pedestal portion 112 that disposes light emitting module 2.
Be adjusted into thus, in the time that lamp 1 drives, in the time that the heat of the driving generation by each LED210 is passed to optics 9, heat is transmitted via framework 11.So, compare with the situation that optics is directly contacted with light emitting module, in lamp 1, can make the heat being produced by the driving of each LED210 be difficult to be passed to optics 9.
In addition,, in the situation that forming optics by acrylic materials, its heat resisting temperature is 100 DEG C of left and right, if exceed 100 DEG C, may produce distortion.On the other hand, in lamp 1, as mentioned above, the heat being produced by the driving of each LED210 is difficult to be passed to optics 9, thereby can suppress optics 9 is passed to optics 9 heat from each LED210 and be heated to more than 100 DEG C.
As a result, can prevent that fire damage can expect to bring into play the good characteristics of luminescence within the long term to optics 9 due to the heat of each LED210 generation.
[wiring 41 sandwich preventing effectiveness]
In lamp 1, the clearance G between reflector 8 and light emitting module 2 is adjusted at least than the larger value of each wire diameter of wiring 41.Thus, as shown in Figure 9, just in case wiring 41 is present between the first opening 80A and light emitting module 2 of reflector 8, also can prevents from connecting up and 41 be clamped by the periphery of reflector 8 and the first opening 80A.In addition, in the situation that reflector 8 is made up of metal material or metal steam plated film, there is sizable weight, but by clearance G being adjusted into gap more than wiring each wire diameter of 41, wiring 41 can not be clipped between heavy weight reflector 8 and light emitting module 2.
Thus, in lamp 1, can suppress to connect up and 41 clamped by reflector 8 and produce the problem such as damage or short circuit, broken string.In addition, can also prevent that reflector 8 from padding in wiring 41 and make the generation of the problem that reflector 8 lifts, the optical axis deviation of reflector 8 is such, thereby can expect the good characteristics of luminescence.
Below, for another embodiment of the present utility model, stress the difference with embodiment one.
< embodiment two >
Use Figure 10 that the lamp 1A of embodiment two is described.Lamp 1A has: par 81A, is formed at the periphery of the second opening 80B of reflector 8A; And stage portion 113A, the periphery mounting par 81A of the second opening 11b being formed as at framework 11A.Periphery at stage portion 113A is uprightly provided with rib 114A.Rib 114A is under the state overlapping with the circumference 91A of optics 9A, bonding by silicon class adhesive and circumference 91A.Par 81A is clamped by stage portion 113A and optics 9A, and thus, reflector 8A is maintained on framework 11A.Between reflector 8A and light emitting module 2, similarly there is clearance G with embodiment one.
In the lamp 1A with above formation, also can expect the effect same with embodiment one.Owing to not using interior all ribs 113, external circumferential ribs 114, return portion 81 in lamp 1A, thus correspondingly have advantages of can simplify form and reduce production costs.
Other item of < >
In lamp of the present utility model, the ratio of specific heat being produced by the driving of LED is difficult to be passed to reflector 8, even thereby form reflector 8 by resin material, also can within the long term, expect good reflection characteristic.
In the respective embodiments described above, LED210 is made as to SMD type, but also can uses the LED of COB (Chip On Board, encapsulates on plate) type.
Semiconductor light-emitting elements is not limited to LED.For example, can be also any in laser diode (LD), organic EL (OLED).
In the above-described embodiment, show the lighting device of hanging type.But lighting device of the present utility model is not limited to this form.For example, can also be any lighting device in the vertical type of table, ceiling type, lower photograph type etc.
The interarea of light emitting module 2 is rectangular-shaped, but the utility model is not limited thereto.For example, can also be any in polygon, ellipse, circle.In addition, can also use multiple light emitting modules 2.
The sum of LED210 in light emitting module 2 is not limited to 26, can be also quantity in addition.In addition, the global shape of the illuminating part 21 on light emitting module 2 is not limited to circle, can be also that rectangular-shaped, wire etc. is any.
Also can between light emitting module 2 and pedestal 3, get involved the thermal conductivity parts such as thermal conductivity plate or thermal conductivity grease are set.
In the utility model, be preferably light emitting module 2 and separate completely with reflector 8, but can also expect, in fact due to foozle etc. and the situation that light emitting module 2 contacts a little with reflector 8.The utility model allows how many contacts that such foozle causes that produce.In addition, also can give prominence to pin or minimum rib are set towards light emitting module 2 from the periphery of the first opening 80A of reflector 8, make their butts to light emitting module 2.But, for effect of the present utility model being brought into play fully, being preferably, light emitting module 2 is fully separated with reflector 8.
Reflector 8 also can be for fixing to framework 11 by the whole bag of tricks such as be spirally connected or bonding.Like this, by reflector 8 is fixed to framework 11, can also omit optics 9.
Claims (7)
1. a lamp, possesses:
Installation base plate, is provided with semiconductor light-emitting elements on the surface of substrate;
Reflector, for cylindrical body, be configured to surround described semiconductor light-emitting elements and overlap with the surface of described substrate at the periphery of overlooking one side's opening while observing described substrate surperficial, by the light of the described semiconductor light-emitting elements of the opening incident from one at internal surface reflection and from the opposing party's opening outgoing; And
Framework, is accommodated in inside by described reflector and described installation base plate,
Described reflector is installed on described framework with the state that described installation base plate separates with spaced gap.
2. lamp according to claim 1, is characterized in that,
Possesses lamp circuit unit, this lamp circuit unit has the wiring that is electrically connected and extends with described semiconductor light-emitting elements on the surface of described installation base plate, via described wiring, described semiconductor light-emitting elements is supplied with to electric power, thereby described semiconductor light-emitting elements is lit a lamp
More than described gap is set to the wire diameter of described wiring.
3. lamp according to claim 1 and 2, is characterized in that,
Described reflector uses polycarbonate resin to form.
4. lamp according to claim 2, is characterized in that,
Described reflector has substrate and reflectance coating and forms, and this reflectance coating is film forming by contain metal or metallic compound on the surface of described substrate.
5. lamp according to claim 1, is characterized in that,
Have the optics of light transmission, the optics of this light transmission is installed on described framework, makes to see through from the reverberation of described reflector.
6. lamp according to claim 5, is characterized in that,
Described optics is made up of resin material.
7. according to the lamp described in claim 5 or 6, it is characterized in that:
Described framework has opening;
The periphery of described the opposing party's of described reflector opening is arranged to the periphery of the opening of described framework and contacts;
Described optics is installed on described framework to cover the mode of described reflector, and the periphery of described the opposing party's of described reflector opening is folded between described optics and described framework.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-112945 | 2013-05-29 | ||
| JP2013112945A JP2014232646A (en) | 2013-05-29 | 2013-05-29 | Lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203880460U true CN203880460U (en) | 2014-10-15 |
Family
ID=51680952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420274329.2U Expired - Fee Related CN203880460U (en) | 2013-05-29 | 2014-05-27 | Lamp |
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| Country | Link |
|---|---|
| JP (1) | JP2014232646A (en) |
| CN (1) | CN203880460U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6601653B2 (en) * | 2015-02-12 | 2019-11-06 | パナソニックＩｐマネジメント株式会社 | Lighting device |
| JP6432504B2 (en) * | 2015-12-25 | 2018-12-05 | 日亜化学工業株式会社 | Lighting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000100204A (en) * | 1998-09-25 | 2000-04-07 | Toshiba Lighting & Technology Corp | Lighting system |
| JP4471169B2 (en) * | 2005-04-21 | 2010-06-02 | 株式会社小糸製作所 | Projector type vehicle lamp unit |
| JP2010129275A (en) * | 2008-11-26 | 2010-06-10 | Toshiba Lighting & Technology Corp | Lamp device and lighting apparatus |
| JP2011060450A (en) * | 2009-09-07 | 2011-03-24 | Taniguchi Shokai:Kk | Lighting device |
| JP6046878B2 (en) * | 2011-03-25 | 2016-12-21 | 東芝ライテック株式会社 | Lamp apparatus and lighting apparatus |
| WO2013015140A1 (en) * | 2011-07-22 | 2013-01-31 | 京セラ株式会社 | Lighting device |
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2013
- 2013-05-29 JP JP2013112945A patent/JP2014232646A/en active Pending
-
2014
- 2014-05-27 CN CN201420274329.2U patent/CN203880460U/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| JP2014232646A (en) | 2014-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20200527 |