JP2014229701A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device in which noise, that occurs during operation of the device, can be reduced.SOLUTION: A processing device includes sound receiving means for receiving noise generated from the processing device, opposite phase sound wave signal generation means connected with the sound receiving means and generating a sound wave signal of opposite phase with the same level as that of the noise, and sound production means for producing a sound of opposite phase with the same level as that of the noise.

Description

  The present invention relates to a processing apparatus such as a cutting apparatus or a grinding apparatus.

  For example, in a cutting device for dicing a semiconductor wafer or the like, cutting is performed by cutting a cutting blade that rotates at a high speed while jetting cutting water toward a processing point. Along with this, noise is generated. In order to reduce this noise, Japanese Utility Model Laid-Open No. 5-66991 discloses a blade cover for preventing noise during high-speed rotation of the blade.

  In general cutting equipment, the spindle is supported by a radial air bearing and a thrust air bearing and rotated at a high speed. However, in dicing work where a large amount of contamination such as cutting waste is generated, the contamination is caused between the spindle housing and the spindle. An air seal is formed so as not to enter between them.

  However, when the amount of air blown from the air seal is increased, an irritating and troublesome blowout sound is generated. Japanese Patent Application Laid-Open No. 11-245102 discloses a dicing apparatus that suppresses this blowing sound.

  On the other hand, in a grinding apparatus, grinding is performed by sliding a grinding wheel on a workpiece such as a wafer held on a chuck table, but this sliding noise generated during grinding becomes noise, This reduction is desired.

Japanese Utility Model Publication No. 5-66991 JP-A-11-245102

  As described above, in processing devices such as a cutting device and a grinding device, various noises are generated with the operation of the device, but it is difficult to completely prevent the noise of the processing device, and noise can be further reduced. It is requested.

  This invention is made | formed in view of such a point, The place made into the objective is providing the processing apparatus which can reduce the noise which generate | occur | produces at the time of apparatus operation.

  According to the present invention, the processing device is configured to receive sound generated from the processing device, and to be connected to the sound receiving device, and generate a sound wave signal having an opposite phase at the same level as the noise level. Provided is a processing apparatus comprising: an anti-phase sound wave signal generating unit; and a sound generation unit that is connected to the anti-phase sound wave signal generating unit and generates a sound having an opposite phase at the same level as the noise level. Is done.

  Preferably, the processing apparatus further includes a holding unit that holds the workpiece, a processing unit that processes the workpiece held by the holding unit, and a housing that houses at least the holding unit and the processing unit. The sounding means is disposed on the housing.

  According to the processing apparatus of the present invention, the noise generated by the processing apparatus is received by the sound receiving means such as a microphone, the reverse phase sound wave having the same level as the noise level is generated by the reverse phase sound wave generating means, and the sound generation means such as a speaker. Thus, the sound having the same level as the noise level and the opposite phase is generated, so that the noise and the sound wave having the opposite phase cancel each other, and the noise generated by the processing apparatus can be reduced.

It is a perspective view of the cutting device concerning a 1st embodiment of the present invention. It is explanatory drawing which cancels noise. It is a perspective view of the cutting device of 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device 2 according to a first embodiment of the present invention, which is a kind of processing device, is shown. The mechanical part of the cutting device 2 is accommodated in a housing 4 formed by combining a plurality of panels.

  A chuck table 6 is configured to be rotatable and movable in the X-axis direction. As is well known, the chuck table 6 is provided with a plurality of clamps 8 for clamping an annular frame that supports the wafer via a dicing tape.

  The cutting device 2 includes a first cutting unit 10 and a second cutting unit 12 that are aligned in the Y-axis direction. Both the first cutting unit 10 and the second cutting unit 12 are guided by a guide rail 14 extending in the Y-axis direction and are movable in the Y-axis direction, and are also movably arranged in the Z-axis direction (height direction). Has been.

  Reference numeral 16 denotes a cassette mounting table for mounting a cassette containing a plurality of wafers therein, and is configured to be movable in the vertical direction (Z-axis direction) by a cassette elevator. Reference numeral 18 denotes a display lamp for displaying the operating status of the cutting device 2, which lights up in green when the cutting device 2 is operating normally, and flashes red when some failure occurs.

  Reference numeral 20 denotes a touch panel display monitor, which allows an operator to input an operation command for the apparatus, and displays the operating status of the apparatus on the display monitor 20. 22 and 24 are emergency stop buttons. When the operator presses the emergency stop buttons 22 and 24, the operation of the cutting apparatus 2 can be stopped immediately.

  A microphone 26 as sound receiving means is disposed adjacent to the first cutting unit 12 and the second cutting unit 14. Further, a speaker 28 as a sounding means is disposed adjacent to the microphone 26. The microphone 26 and the speaker 28 are connected to an antiphase sound wave signal generation unit 32 built in the controller 30.

  When a workpiece such as a wafer held on the chuck table 6 is cut by a cutting blade disposed in the first cutting unit 12 or the second cutting unit 14, an irritating and annoying blowing sound is generated from the air seal formed on the spindle housing. In addition, noise is generated along with the cutting of the workpiece by the cutting blade.

  This noise is picked up by the microphone 26, and an antiphase sound wave signal generating means 32 built in the controller 30 generates a sound wave signal having the same level as that of the noise and an inverse sound wave having the same level as that of the noise from the speaker 28. Phase sound waves are emitted.

  That is, as shown in FIG. 2, the generated sound emitted from the speaker 28 is in the same level as the noise picked up by the microphone 26 and in the opposite phase, so that the noise and the generated sound cancel each other, resulting in synthesis. The sound level is substantially 0 (silence), and the noise can be effectively canceled by the sound generated from the speaker 28.

  In the embodiment shown in FIG. 1, the microphone 26 and the speaker 28 are disposed in the housing 4 in the vicinity of the noise generation source. However, as shown in FIG. 3, the operator (operator) stands up during the cutting operation. You may make it arrange | position the microphone 26A and the speaker 28A in the housing 4 of the monitor 20 vicinity.

  By arranging the microphone 26A and the speaker 28A on the front side of the cutting device 2 adjacent to the display monitor 20, the microphone 26A can pick up the noise of the cutting device 2 and the noise in the factory, and the noise from the speaker 28A. Therefore, the noise of the operator standing toward the display monitor 20 is suppressed and heard.

  In the above-described embodiment, the example in which the noise canceller of the present invention is attached to the housing 4 of the cutting device has been described. However, the present invention is not limited to the cutting device, and other processing devices such as a grinding device and a polishing device. It can be similarly applied to.

2 Cutting device 4 Housing 10 First cutting unit 12 Second cutting unit 20 Display monitor 26, 26A Microphone 28, 28A Speaker 32 Antiphase sound wave signal generating means

Claims (2)

A processing device,
Sound receiving means for receiving noise generated from the processing device;
An anti-phase sound wave signal generating means connected to the sound receiving means for generating an anti-phase sound wave signal at the same level as the magnitude of the noise;
A sound generating means connected to the anti-phase sound wave signal generating means for generating a sound of the opposite phase at the same level as the magnitude of the noise;
A processing apparatus comprising: A holding means for holding the workpiece; a processing means for processing the workpiece held by the holding means; and a housing for accommodating at least the holding means and the processing means.
The processing device according to claim 1, wherein the sound generation means is disposed on the housing.

Images