JP2015205376A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable efficient maintenance and inspection works to be implemented on a grinding device for grinding a wafer.SOLUTION: In performing maintenance and inspection works, a second opening/closing door 18 formed in the vicinity of second grinding means 6 is opened while a first opening/closing door 17 formed in the vicinity of first grinding means 5 is open, notification means 19 notifies that the second opening/closing door 18 is open.

Description

  The present invention relates to a processing apparatus for processing a wafer.

  A wafer in which a plurality of devices such as IC and LSI are formed on the front surface is ground to have a predetermined thickness by grinding the back surface, and then divided into individual devices by a dividing device such as a dicing device. Used in electronic equipment.

  A processing apparatus for grinding the back surface of a wafer is covered with an exterior cover having first and second opening / closing doors, and includes a grinding means for rough grinding and a grinding means for finish grinding. A first opening / closing door is formed in the vicinity of the grinding means for rough grinding, and a second opening / closing door is formed in the vicinity of the grinding means for finish grinding. These doors are opened during maintenance and inspection, and these doors are closed during grinding. For example, the operator sets the processing apparatus to the maintenance mode, opens the first door, and performs maintenance inspection of the grinding means for rough grinding. When the maintenance mode is set, each means of the processing apparatus can be individually operated. For example, the operator operates the operation panel to move the grinding means for rough grinding, or moves the grinding means for finish grinding.

JP 2008-053369 A

  However, in the maintenance mode, for example, when the operator opens the first door and performs a maintenance check on the grinding means for rough grinding, the operator does not notice that the second door is open. When the grinding means for finish grinding is moved, grinding debris and the like come out from the second opening / closing door, and there is a problem that the working efficiency is deteriorated.

  Therefore, the present invention has been made in view of the above, and an object of the present invention is to provide a processing apparatus that can efficiently perform maintenance and inspection work of processing means for performing grinding or the like.

  In order to solve the above-described problems and achieve the object, a machining apparatus according to the present invention includes a chuck table that holds a workpiece, and a workpiece that is held on the chuck table by attaching a tool to the tip of a spindle. A processing device, and a control device that controls each component, and is a processing device covered with an exterior cover having an opening and closing door, the first processing means, the second processing means, A first opening / closing door formed in the vicinity of the first processing means, a second opening / closing door formed in the vicinity of the second processing means, and a notification means for informing an alarm signal, When the second opening / closing door is opened in a state where the first opening / closing door is opened, the notification means notifies that the second opening / closing door is opened.

  According to the processing apparatus according to the present invention, when the second opening / closing door is opened in a state where the first opening / closing door is opened, the notification means notifies that the second opening / closing door is opened. There is an effect that the maintenance and inspection work of the processing means for performing grinding or the like can be carried out efficiently.

FIG. 1 is an external perspective view showing a grinding apparatus according to the present embodiment. FIG. 2 is a block diagram illustrating a configuration example of the notification unit. FIG. 3 is a flowchart illustrating an operation example of the control unit. FIG. 4 is a diagram illustrating a state in which the first door is open and the second door is closed. FIG. 5 is a diagram illustrating an open state of the first door and the second door.

  Hereinafter, a grinding apparatus which is the best mode for carrying out the present invention will be described with reference to the drawings. The grinding device is a processing device according to the present invention.

  FIG. 1 is an external perspective view showing a grinding apparatus according to the present embodiment. FIG. 2 is a block diagram illustrating a configuration example of the notification unit. The grinding apparatus 1 according to the present embodiment includes an apparatus base 2, support columns 3 and 4 erected on the right end side of the apparatus base 2, and rough grinding mounted on the support column 3 so as to be movable up and down. The first grinding means 5, the second grinding means 6 for finish grinding mounted on the support pillar 4 so as to be movable up and down, and the grinding means 5 and 6 are disposed below these grinding means 5 and 6 to hold the wafer W 3. Each chuck table 7. The first grinding means 5 is a first processing means, the second grinding means 6 is a second processing means, and each grinding means 5, 6 processes the wafer W held on the chuck table 7. . The wafer W is a workpiece according to the present invention.

  The first grinding means 5 includes a housing 51, a grinding wheel 52 that is rotatably mounted on the tip of a spindle (not shown) provided inside the housing 51, and a grinding wheel 52 that is mounted on the upper end of the housing 51 and rotates the grinding wheel 52. Servo motor 53 to be operated. The second grinding means 6 is configured in the same manner as the first grinding means 5, and includes a housing 61 and a grinding wheel 62 that is rotatably mounted on the tip of a spindle (not shown) provided inside the housing 61. And a servo motor 63 that is mounted on the upper end of the housing 61 and rotates the grinding wheel 62. The grinding wheels 52 and 62 are tools according to the present invention.

  The grinding apparatus 1 includes a turntable 8 that positions the three chuck tables 7 at predetermined positions. The three chuck tables 7 arranged on the turntable 8 are sequentially moved as the turntable 8 is appropriately rotated, and are moved to a wafer carry-in / out region E1, a rough grinding region E2, and a finish grinding region E3. Positioned sequentially.

  The grinding apparatus 1 is provided in front of the apparatus base 2, and includes a first cassette 9 for stocking the wafer W before grinding, a second cassette 10 for stocking the ground wafer W, and a first cassette. 9 and a wafer loading / unloading area E1 are disposed between the wafer loading / unloading area E1 and the center positioning means 11 for temporarily placing the wafer W to align the center position of the wafer W, and the wafer loading / unloading area E1 and the second cassette 10 The wafer W stored in the first cassette 9 and the wafer W accommodated in the first cassette 9 are carried out to the center aligning means 11 and the wafer W cleaned by the spinner cleaning means 12 is transferred to the second cassette 10. A carry-in / out means 13 for carrying in, and a chuck placed on the wafer carry-in / out area E1 of the wafer W placed on the center alignment means 11 and center-aligned. Loading means 14 for loading onto the table 7, and unloading means 15 for unloading the ground wafer W placed on the chuck table 7 positioned in the wafer loading / unloading area E1 to the spinner cleaning means 12. . Each component such as the first grinding means 5 and the second grinding means 6 is controlled by a control means (not shown) to perform a grinding process.

  The upper part of the apparatus base 2 of the grinding apparatus 1 is covered with a rectangular parallelepiped outer cover 16. A first opening / closing door 17 and a second opening / closing door 18 are provided on the side surface of the exterior cover 16 so as to face each other. In order to facilitate understanding of the invention, the exterior cover 16 is indicated by a two-dot chain line, and the first and second doors 17 and 18 are indicated by a solid line. The first door 17 is formed in the vicinity of the first grinding means 5, and the second door 18 is formed in the vicinity of the second grinding means 6. The first opening / closing door 17 is attached to a window frame portion 172 having an opening 171, and the second opening / closing door 18 is attached to a window frame portion 182 having an opening 181. The opening 171 is opened to approximately the same size as the first grinding means 5, and the opening 181 is opened to approximately the same size as the second grinding means 6.

  The first open / close door 17 is attached to the edge of the window frame portion 172 by hinges 173 attached at two locations so as to be freely opened and closed. Similarly, the second opening / closing door 18 is attached to the edge of the window frame portion 182 by hinges 183 attached at two places so as to be freely opened and closed. During the grinding process, the doors 17 and 18 are closed and the openings 171 and 181 are closed. On the other hand, when carrying out maintenance and inspection, the opening and closing doors 17 and 18 are opened as necessary, the openings 171 and 181 are opened, and the grinding means 5 and 6 are inspected, respectively.

  The grinding apparatus 1 is provided with a grinding mode for performing grinding and a maintenance mode for performing maintenance and inspection. When the maintenance mode is set, each means of the grinding apparatus 1 can be individually operated. For example, in the maintenance mode, the operator operates the operation panel (not shown) to move the first grinding means 5 for rough grinding or the second grinding means 6 for finish grinding to perform maintenance. Check.

  The grinding apparatus 1 has a notification means 19. The notification means 19 notifies a warning signal and notifies when the first door 17 and the second door 18 are opened in the maintenance mode. For example, when the second opening / closing door 18 is opened while the first opening / closing door 17 is opened, the notification means 19 notifies that the second opening / closing door 18 is opened. In addition, the alerting | reporting means 19 does not alert | report only if either one of the 1st door 17 or the 2nd door 18 is open | released.

  As shown in FIG. 2, the notification unit 19 includes a first detection unit 191, a second detection unit 192, a control unit 193, and a notification unit 194. The control unit 193 is connected to the first detection unit 191, the second detection unit 192, and the mode setting unit 20. The first detection unit 191 is installed in the vicinity of the window frame unit 172 and detects the open / closed state of the first open / close door 17 attached to the window frame unit 172. The second detection unit 192 is installed in the vicinity of the window frame unit 182 and detects the open / closed state of the second door 18 attached to the window frame unit 182. For the first detection unit 191 and the second detection unit 192, for example, a microswitch or an optical sensor is used. Of course, as long as the open / closed state of the door can be detected, other sensors may be used instead of the exemplified sensors.

  When receiving the mode switching signal SS indicating the maintenance mode from the mode setting unit 20, the control unit 193 controls the notification unit 194 based on the detection signals output from the first detection unit 191 and the second detection unit 192. . For example, the first detection unit 191 outputs to the control unit 193 a first detection signal S1 indicating that the switch has been switched from ON to OFF when the closed first door 17 is opened. The second detection unit 192 outputs a second detection signal S2 indicating that the switch has been switched from ON to OFF when the closed second door 18 is opened, to the control unit 193. When the control unit 193 receives the first detection signal S1 and the second detection signal S2 during the maintenance mode, the control unit 193 determines that the first and second doors 17 and 18 are opened, and notifies the notification unit 194. A control signal S3 indicating that this is to be output is output. The notification unit 194 inputs the control signal S3 and performs notification. For example, the notification member 195 of the notification unit 194 sounds and emits an alarm sound, and the display 196 of the notification unit 194 displays notification contents indicating that the first and second doors 17 and 18 are opened.

  The notification unit 194 is installed on the outer surface of the exterior cover 16 and includes a rod-shaped notification member 195 and a display 196. The notification member 195 is installed on the ceiling of the exterior cover 16, and sounds an alarm sound based on the detection results of the first detection unit 191 and the second detection unit 192. For example, the notification member 195 includes a speaker (not shown) and a light emitting unit 197, and an alarm sound is emitted from the speaker and the light emitting unit 197 is turned on. The display 196 is installed on the side surface of the exterior cover 16 and displays notification contents based on the detection results of the first detection unit 191 and the second detection unit 192.

  Next, operation | movement of the grinding device 1 which consists of the said structure is demonstrated. First, the operation in the grinding mode in which grinding is performed will be described, and then the operation in the maintenance mode in which maintenance inspection is performed will be described.

  In the grinding mode, the unground wafer W housed in the first cassette 9 is unloaded by the up-and-down movement and the back-and-forth movement of the loading / unloading means 13, and further reversed 180 degrees to reverse the front and back of the wafer W It is placed on the center alignment means 11 so that the back surface faces upward. The wafer W placed on the center alignment means 11 is placed on the chuck table 7 positioned in the wafer carry-in / out area E1 by the turning operation of the carry-in means 14 after the center alignment. The wafer W placed on the chuck table 7 is sucked and held on the chuck table 7. Next, the turntable 8 is rotated 120 degrees counterclockwise by a rotation drive mechanism (not shown), so that the chuck table 7 holding the wafer W is positioned in the rough grinding region E2.

  When the chuck table 7 holding the wafer W is positioned in the rough grinding region E2, the chuck table 7 is rotated counterclockwise by a rotation drive mechanism (not shown). On the other hand, the grinding wheel 52 of the first grinding means 5 for rough grinding is ground and fed at a predetermined lowering speed while being driven to rotate counterclockwise. As a result, rough grinding is performed on the back surface of the wafer W on the chuck table 7.

  During this time, the wafer W before grinding is placed and sucked and held on the next chuck table 7 positioned in the wafer carry-in / out region E1. Next, the turntable 8 is rotated 120 degrees counterclockwise, the chuck table 7 holding the wafer W after rough grinding is positioned in the finish grinding region E3, and the chuck holding the wafer W before grinding is held. The table 7 is positioned in the rough grinding region E2.

  In this way, the back surface of the pre-grinding wafer W positioned on the rough grinding region E2 and held on the chuck table 7 is subjected to rough grinding by the first grinding means 5 for rough grinding, and finished. The rear surface of the rough-grinded wafer W, which is positioned on the grinding region E3 and held on the chuck table 7, is subjected to finish grinding by the second grinding means 6 for finish grinding. Next, the turntable 8 is rotated 120 degrees counterclockwise, and the chuck table 7 holding the wafer W subjected to finish grinding is positioned in the wafer carry-in / out area E1. Note that the chuck table 7 holding the wafer W subjected to rough grinding in the rough grinding region E2 is in the finish grinding region E3, and the chuck table 7 holding the wafer W before grinding in the wafer carry-in / out region E1 is rough grinding. Each is moved to the machining area E2.

  The chuck table 7 that has returned to the wafer carry-in / out region E1 via the rough grinding region E2 and the finish grinding region E3 releases the suction and holding of the wafer W that has undergone the finish grinding. Then, the wafer W that has been subjected to finish grinding on the chuck table 7 positioned in the wafer carry-in / out region E1 is carried out by the carry-out means 15 to the spinner cleaning means 12. The wafer W conveyed to the spinner cleaning means 12 is cleaned and removed from the back surface (grinding surface) and the grinding debris adhering to the side surface while being spin-dried. The washed and removed wafer W is transported and stored in the second cassette 10 by the loading / unloading means 13. In this way, the wafer W is ground. When the grinding process for the fixed number of wafers W is completed, the maintenance and inspection work for the grinding apparatus 1 is performed.

  Next, an operation example of the grinding apparatus 1 in the maintenance mode set when performing maintenance inspection will be described. FIG. 3 is a flowchart illustrating an operation example of the control unit 193 of the notification unit 19. In step ST1 shown in FIG. 3, the control unit 193 determines whether or not the grinding apparatus 1 is in the maintenance mode. For example, the control unit 193 waits until the mode switching signal SS indicating the maintenance mode is input from the mode setting unit 20, and moves to step ST2 when determining that the mode switching signal SS indicating the maintenance mode is input.

  In step ST2, the control unit 193 receives a first detection signal S1 indicating that the first door 17 is opened and a second detection signal S2 indicating that the second door 18 is opened. It is determined whether it has been input. If the first detection signal S1 and the second detection signal S2 are not input, the control unit 193 continues the determination process of steps ST1 and ST2. For example, as shown in FIG. 4, when the first door 17 is opened by the operator A and the second door 18 is closed, the control unit 193 inputs only the first detection signal S1. Therefore, the determination process of steps ST1 and ST2 is continued. On the other hand, as shown in FIG. 5, when the second opening / closing door 18 is opened by the worker B in a state where the first opening / closing door 17 is opened by the worker A, the control unit 193 causes the first opening / closing door 17 to open. Since the detection signal S1 and the second detection signal S2 are input, the process proceeds to step ST3.

  In step ST3, the control unit 193 performs notification processing. For example, the control unit 193 sounds an alarm sound of the notification member 195 shown in FIG. 5 and lights the light emitting unit 197. Furthermore, the notification content is displayed on the display 196. Thereby, the worker A shown in FIG. 5 can immediately recognize that the second opening / closing door 18 has been opened by listening to the alarm sound or watching the lit notification member 195. Further, by looking at the notification content on the display 196, it can be confirmed that the second door 18 is opened. Therefore, since the grinding scraps by the second grinding means 6 do not come out of the opening 181 to which the second opening / closing door 18 is attached, the first grinding means 5 and the second grinding means 6 are prevented. This makes it possible to efficiently perform maintenance and inspection work. Subsequently, the process proceeds to step ST4.

  In step ST4, the control unit 193 determines whether or not the notification process should be stopped. For example, when the control unit 193 stops inputting one of the first detection signal S1 and the second detection signal S2, the first and second doors 17 and 18 are opened from the opened state. It is determined that at least one of the second open / close doors 17 and 18 is closed, and it is determined that the notification should be stopped. Not only this but when a stop button (not shown) is pushed by the worker, it may be judged to stop the notification of the notification unit 194. If control part 193 judges that information processing should be stopped, it will shift to Step ST5. On the other hand, when there is no stop instruction from the operator and the first detection signal S1 and the second detection signal S2 are continuously input, the control unit 193 continues the notification process in step ST3.

  In step ST5, the control unit 193 stops the notification of the notification unit 194. For example, the control unit 193 performs control so that the alarm sound of the notification member 195 is stopped and the light emitting unit 197 is turned off. In addition, the control unit 193 performs control so as to delete the notification content displayed on the display 196.

  According to the grinding apparatus 1 of the present embodiment, when the second opening / closing door 18 is opened while the first opening / closing door 17 is opened, the notification means 19 causes the second opening / closing door 18 to open. Can be prevented from driving the second grinding means 6 without knowing that the second opening / closing door 18 has been opened at the time of maintenance and inspection work. It is possible to avoid grinding scraps from the grinding means 6 from coming out of the opening 181 to which the second door 18 is attached. Therefore, the maintenance and inspection work for the first grinding means 5 and the second grinding means 6 can be performed efficiently. That is, since the first opening / closing door 17 and the second opening / closing door 18 are provided with the grinding means 5, 6 interposed therebetween, conventionally, the first opening / closing door 17 is opened and the first grinding means 5 Although it is difficult for the operator who is inspecting to confirm the open / closed state of the second door 18, it is possible to easily open / close the second door 18 by providing the notification means 19 as in the present invention. Can be confirmed.

  Although the grinding apparatus 1 according to the present embodiment has been described, the present invention is not limited to this, and the present invention can also be applied to a semiconductor wafer cutting apparatus and polishing apparatus.

  Further, when the first detection signal S1 and the second detection signal S2 are input in the maintenance mode, the control unit 193 determines that the first and second doors 17 and 18 are opened, and notifies the notification unit 194. However, when the first detection signal S1 and the second detection signal S2 are input even in a mode other than the maintenance mode (for example, the grinding mode), the first and second control signals S3 are output. It may be determined that the second open / close doors 17 and 18 are opened, and control may be performed so as to output a control signal S3 indicating notification to the notification unit 194.

  Further, when the second door 18 is opened while the first door 17 is opened, only the first grinding means 5 can be driven and the second grinding means 6 cannot be driven. It is also possible to do. As a result, the second grinding means 6 is driven without knowing that the second opening / closing door 18 has been opened, and grinding scraps etc. come out from the opening 181 to which the second opening / closing door 18 is attached. You can avoid that.

DESCRIPTION OF SYMBOLS 1 Grinding device 2 Device base 5 First grinding means 6 Second grinding means 7 Chuck table 16 Exterior cover 17 First opening / closing door 171 Opening portion 172 Window frame portion 173 Hinge 18 Second opening / closing door 181 Opening portion 182 Window frame portion 183 Hinge 19 Notifying means 191 First detecting portion 192 Second detecting portion 193 Control portion 194 Notifying portion 20 Mode setting portion 52 Grinding wheel 62 Grinding wheel W Wafer

Claims (1)

An opening / closing door comprising: a chuck table for holding a workpiece; a processing means for processing a workpiece held on the chuck table by attaching a tool to a tip of a spindle; and a control means for controlling each component. A processing device covered with an exterior cover having
A first processing means;
A second processing means;
A first opening / closing door formed in the vicinity of the first processing means;
A second opening / closing door formed in the vicinity of the second processing means;
An informing means for informing an alarm signal,
When the second opening / closing door is opened in a state where the first opening / closing door is opened, the processing unit notifies that the second opening / closing door is opened.

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