JP2014229686A - Solid-state imaging apparatus and electronic camera - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make humidity from the outside hard to enter a space between an imaging area and a translucent member of a semiconductor chip.SOLUTION: A solid-state imaging apparatus 1 includes: a semiconductor chip 2 having an imaging region 2a; a wiring board 3 which has an opening 3a in an area corresponding to at least the imaging region 2a, being adhered to the surface of the imaging region 2a side in the semiconductor chip 2 and has the outermost layer made of a material having low moisture permeability on both surfaces; and a translucent member 4 which is adhered onto the surface opposite to the semiconductor chip 2 of the wiring board 3 so as to block the opening 3a.

Description

  The present invention relates to a solid-state imaging device and an electronic camera using the same.

  As an example of the solid-state imaging device, FIG. 4 of Patent Document 1 below shows a wiring board in which a light passage hole is formed, and a cover glass installed so as to close the light passage hole on one surface of the wiring board. And an image pickup unit including a solid-state image pickup device (bare chip image pickup device) installed so as to close the light passage hole on the other surface of the wiring board.

JP 2000-147346 A

  However, in such a solid-state imaging device, when moisture (water vapor) enters the space between the imaging region and the cover glass from the outside, condensation occurs in the imaging region, or electrode pads (for example, due to condensation) Al surface) may be corroded, resulting in wire breakage.

  The present invention has been made in view of such circumstances, and a solid-state imaging device in which moisture hardly enters from the outside into the space between the imaging region of the semiconductor chip and the translucent member, and uses the same. The purpose is to provide an electronic camera.

  The following aspects are presented as means for solving the problems. The solid-state imaging device according to the first aspect has a semiconductor chip having an imaging region, an opening at least in a region corresponding to the imaging region, and is bonded to a surface of the semiconductor chip on the imaging region side, and both surfaces A wiring board having an outermost layer made of a material having low moisture permeability, and a translucent member bonded to the surface of the wiring board opposite to the semiconductor chip so as to close the opening. Is.

  In the solid-state imaging device according to the second aspect, in the first aspect, the material is a liquid crystal polymer.

  In the solid-state imaging device according to the third aspect, in the first or second aspect, the wiring board is a flexible wiring board, and the moisture permeability of the material is lower than the moisture permeability of polyimide.

  In the solid state imaging device according to a fourth aspect, in the third aspect, the wiring board is a double-sided flexible wiring board or a multilayer flexible wiring board, and the outermost layer on one side is a coverlay film on one side, The outermost layer on the other side is a coverlay film on the other side.

  The solid-state imaging device according to a fifth aspect is the solid-state imaging device according to the third aspect, wherein the wiring board is a single-sided flexible wiring board, the outermost layer on one side is a coverlay film, and the outermost layer on the other side is a base film. It is what is.

  In the solid-state imaging device according to a sixth aspect, in the first or second aspect, the wiring board is a rigid wiring board, and the moisture permeability of the material is lower than the moisture permeability of the resist.

  A solid-state imaging device according to a seventh aspect includes, in any one of the first to sixth aspects, a spacer made of a material having low moisture permeability interposed between the wiring board and the light-transmissive member. Is.

  In the solid-state imaging device according to an eighth aspect, in the seventh aspect, the spacer is made of a liquid crystal polymer or a material having lower moisture permeability than the liquid crystal polymer.

  An electronic camera according to a ninth aspect includes the solid-state imaging device according to any one of the first to eighth aspects.

  According to the present invention, it is possible to provide a solid-state imaging device in which moisture hardly enters from the outside into the space between the imaging region of the semiconductor chip and the translucent member, and an electronic camera using the same.

1 is a schematic cross-sectional view schematically showing a solid-state imaging device according to a first embodiment of the present invention. FIG. 2 is a partial schematic cross-sectional view schematically showing a wiring board in FIG. 1. It is a schematic sectional drawing which shows typically the electronic camera by the 2nd Embodiment of this invention. It is a partial schematic sectional drawing which shows typically the wiring board of the solid-state imaging device by the 3rd Embodiment of this invention. It is a partial schematic sectional drawing which shows typically the wiring board of the solid-state imaging device by the 4th Embodiment of this invention. It is a schematic sectional drawing which shows typically the solid-state imaging device by the 5th Embodiment of this invention. It is a schematic sectional drawing which shows typically the solid-state imaging device by the 6th Embodiment of this invention. It is a partial schematic sectional drawing which shows typically the wiring board of the solid-state imaging device by the 7th Embodiment of this invention.

  Hereinafter, a solid-state imaging device and an electronic camera according to the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic cross-sectional view schematically showing a solid-state imaging device 1 according to the first embodiment of the present invention.

  The solid-state imaging device 1 according to the present embodiment includes a semiconductor chip 2 having an imaging region 2a, a wiring board 3, and a translucent plate 4 as a translucent member.

  In the present embodiment, the semiconductor chip 2 is an image sensor such as a CMOS or CCD configured as a chip, and a plurality of pixels (not shown) are two-dimensionally arranged in the imaging region 2a. The semiconductor chip 2 photoelectrically converts incident light incident on the imaging region 2a via the translucent plate 4 and outputs an image signal. For example, a read circuit (not shown) that reads the image signal by driving the pixel and a processing circuit (for example, an AD conversion circuit) that processes the output signal may be mounted on the semiconductor chip 2.

  In the present embodiment, the substrate material of the semiconductor chip 2 is silicon, and the semiconductor chip 2 is a so-called silicon chip. However, in the present invention, the substrate material of the semiconductor chip 2 is not necessarily limited to silicon.

  In the present embodiment, a flexible wiring board is used as the wiring board 3. A circuit component may be mounted on the wiring board 3 so as to mount a predetermined circuit, or only the relay wiring may be mounted without mounting the circuit component. The wiring board 3 has an opening 3 a formed at least in a region facing the imaging region 2 a of the semiconductor chip 2.

  An electrode pad (not shown) is formed on the upper surface (surface on the imaging region 2 a side) near the outer periphery of the semiconductor chip 2, and an electrode pad (not shown) is formed on the lower surface around the opening 3 a in the wiring substrate 3. These are electrically connected by bumps 5. An adhesive 6 is formed between the vicinity of the outer periphery of the semiconductor chip 2 and the periphery of the opening 3a in the wiring board 3 (including the vicinity of the bump 5) over the entire periphery of the opening 3a. Are bonded together so that the airtightness of the space between the imaging region 2a and the translucent plate 4 is maintained. Further, the bonding by the bumps 5 is reinforced by the adhesive 6.

  The translucent plate 4 is bonded to the upper surface of the wiring substrate 3 (the surface opposite to the wiring substrate 3) with an adhesive 7 so as to close the opening 3a of the wiring substrate 3. The adhesive 7 is provided over the entire circumference of the opening 3a in the wiring board 3, and the translucent plate 4 is maintained so that the airtightness of the space between the imaging region 2a and the translucent plate 4 is maintained. And the wiring board 3 are sealed.

  As a material of the translucent plate 4, for example, glass for measures against α rays (glass in which the amount of α rays emitted is sufficiently reduced), quartz that is an optical low-pass filter, or the like can be used.

  FIG. 2 is a partial schematic cross-sectional view schematically showing the wiring board 3 in FIG. In the present embodiment, the wiring board 3 is configured as a double-sided flexible wiring board, and is composed of a flexible base film 11 made of an insulating material and a conductor made of a conductor such as copper formed on the upper surface of the base film 11. A protective cover lay film 14 made of an insulating material bonded to the layer 12 so as to cover the base film 11 and the conductor layer 12 with an adhesive 13 interposed therebetween, and copper formed on the lower surface of the base film 11 And a protective cover lay film 17 made of an insulating material adhered to the base film 11 and the conductive layer 15 so as to cover the base film 11 and the conductive layer 15 with an adhesive 16 therebetween. doing.

  Although not shown in the drawings, the conductor layers 12 and 15 are patterned into desired wiring and electrode pad shapes. Although not shown in the drawing, an opening is formed in the adhesive 13 and the coverlay film 14 in the electrode pad portion of the conductor layer 12 so that bump bonding can be performed on the electrode pad. In the present embodiment, the adhesive 13 and the coverlay film 14 are formed over the entire region other than the electrode pad portion of the conductor layer 12. These points also apply to the conductor layer 15, the adhesive 16, and the coverlay film 17.

  In the present embodiment, the cover lay film 14 forming the outermost layer on one side of the wiring board 3 and the cover lay film 17 forming the outermost layer on the other side are made of a material having low moisture permeability. The moisture permeability of this material is preferably lower than the moisture permeability of polyimide, which is a material for a coverlay film of a general flexible wiring board. Specific examples of such a material include liquid crystal polymer (LCP), and the coverlay films 14 and 17 are preferably made of, for example, a liquid crystal polymer. The liquid crystal polymer has a low moisture permeability and a high gas barrier property including a barrier property against moisture (water vapor) permeation as compared with polyimide. In addition, since the liquid crystal polymer has low outgas and high chemical resistance, if the coverlay films 14 and 17 are made of liquid crystal polymer, mounting caused by chemical damage, outgas from the wiring board 3, and the like. It is possible to suppress damage and image quality deterioration caused by foreign matters mixed in the imaging surface later. Furthermore, since the liquid crystal polymer has a low dielectric constant compared to polyimide, there is an advantage that the dielectric loss is small, the signal is not attenuated even with a long wiring length, and high-speed signal transmission is possible.

  In addition, in this Embodiment, although the base film 11 is comprised with the polyimide, you may comprise with a liquid crystal polymer, for example.

  According to the present embodiment, since the coverlay films 14 and 17 of the wiring board 3 are made of a material with low moisture permeability, the coverlay films 14 and 17 are made of a material with high moisture permeability. In comparison, moisture entering from the outside via the wiring board 3 into the space between the imaging region 2 a of the semiconductor chip 2 and the translucent plate 4 is reduced. Therefore, according to the present embodiment, moisture does not easily enter the space from the outside, so that it is difficult for condensation to occur in the imaging region 2a and the like, and disconnection of the wiring due to corrosion of the electrode pad due to condensation is prevented. It becomes difficult to occur. For this reason, according to the present embodiment, it is possible to suppress deterioration of the image quality of the captured image due to dew condensation on the imaging region 2a and the like, and it is possible to suppress a decrease in reliability due to the disconnection, thereby improving image quality. In addition, high reliability can be achieved.

  Note that the adhesive 13 and the cover lay film 14 do not necessarily have to be formed over the entire region other than the electrode pad portion of the conductor layer 12, and include, for example, a region bonded by the adhesive 6 and a region in the vicinity thereof. The adhesive 13 and the coverlay film 14 may be formed in the region, and also in this case, it becomes difficult for moisture to enter the space from the outside. This also applies to the adhesive 16 and the coverlay film 17.

[Second Embodiment]
FIG. 3 is a schematic cross-sectional view schematically showing an electronic camera 100 according to the second embodiment of the present invention.

  The solid-state imaging device 1 according to the first embodiment is incorporated in the body 101 of the electronic camera 100 according to the present embodiment. The electronic camera 100 according to the present embodiment is configured as a single-lens reflex type electronic still camera. However, the solid-state imaging device 1 according to the first embodiment is different from other electronic still cameras, video cameras, and mobile phones. You may incorporate in various electronic cameras, such as a camera mounted in.

  In electronic camera 100 according to the present embodiment, body 101 is provided with interchangeable photographic lens 102. The subject light that has passed through the photographing lens 102 is reflected upward by the quick return mirror 103 and forms an image on the screen 104. The subject image formed on the screen 104 is observed from the finder observation window 107 through the eyepiece lens 106 from the penta roof prism 105. When the release button (not shown) is fully pressed, the quick return mirror 103 jumps upward, and the subject image from the photographing lens 102 enters the solid-state imaging device 1 described above.

  The solid-state imaging device 1 is positioned and fixed in the body 101 by being attached to the body 101 via a bracket (not shown) and a position adjusting mechanism (not shown).

  According to the present embodiment, since the solid-state imaging device 1 according to the first embodiment is used, high image quality and high reliability can be achieved.

[Third Embodiment]
FIG. 4 is a partial schematic cross-sectional view schematically showing the wiring board 23 of the solid-state imaging device according to the third embodiment of the present invention, and corresponds to FIG. 4, elements that are the same as or correspond to those in FIG. 2 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The difference between the present embodiment and the first embodiment is that a wiring board 23 is used instead of the wiring board 3 in the first embodiment.

  The wiring board 23 in the present embodiment is different from the wiring board 3 in the first embodiment in that layers 24 and 25 made of polyimide are used instead of the layers 14 and 17 made of liquid crystal polymer or the like in the wiring board 3. The layers 14 and 17 are formed on the outside of the layers 24 and 25 to be coverlay films made of a liquid crystal polymer or the like. Although not shown in the drawings, openings are formed in the adhesive 13 and the layers 24 and 14 in the electrode pad portion of the conductor layer 12, and the adhesive 16 and the electrode pad portion of the conductor layer 15 are formed. Openings are formed in the layers 25 and 17. In addition, the wiring board 23 has an opening corresponding to the opening 3 a of the wiring board 3.

  The wiring board 23 in this embodiment is made of a liquid crystal polymer or the like on both sides of a general flexible wiring board using polyimide composed of the elements 11, 12, 13, 24, 15, 16, 25 described above. The cover lay films 14 and 17 can be additionally coated.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained. The solid-state imaging device according to the present embodiment can be used in place of the solid-state imaging device 1 in the electronic camera 100 according to the second embodiment. This is the same for each solid-state imaging device described later.

  In addition, although the wiring boards 3 and 23 are comprised as a double-sided flexible wiring board, you may comprise the wiring boards 3 and 23 as a multilayer flexible wiring board in this invention.

[Fourth Embodiment]
FIG. 5 is a partial schematic cross-sectional view schematically showing a wiring board 33 of the solid-state imaging device according to the fourth embodiment of the present invention, and corresponds to FIG.

  The present embodiment is different from the first embodiment in that a wiring board 33 is used in place of the wiring board 3 in the first embodiment.

  In the present embodiment, the wiring board 33 is configured as a single-sided flexible wiring board, and is made of a flexible base film 41 made of an insulating material and a conductor made of a conductor such as copper formed on the lower surface of the base film 41. And a protective cover lay film 44 made of an insulating material adhered to the base film 41 and the conductor layer 42 so as to cover the base film 41 and the conductor layer 42 with an adhesive 43 interposed therebetween. Although not shown in the drawing, the wiring board 33 has an opening corresponding to the opening 3 a of the wiring board 3.

  Although not shown in the drawing, the conductor layer 42 is patterned into a desired wiring or electrode pad shape. Although not shown in the drawing, an opening is formed in the adhesive 43 and the coverlay film 44 in the electrode pad portion of the conductor layer 42 so that the bump can be bonded to the electrode pad. In the present embodiment, the adhesive 43 and the coverlay film 44 are formed over the entire region other than the electrode pad portion of the conductor layer 12. However, the adhesive 43 and the coverlay film 44 do not necessarily need to be formed over the entire region other than the electrode pad portion of the conductor layer 42, and include, for example, a region bonded by the adhesive 6 and a region in the vicinity thereof. The adhesive 43 and the coverlay film 44 may be formed in the region.

  And in this Embodiment, the base film 41 which makes the outermost layer of the one side of the wiring board 3, and the coverlay film 44 which makes the outermost layer of the other side are comprised with the material with low moisture permeability. The moisture permeability of this material is preferably lower than that of polyimide, and the films 41 and 44 are preferably made of, for example, a liquid crystal polymer.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

[Fifth Embodiment]
FIG. 6 is a schematic cross-sectional view schematically showing a solid-state imaging device 51 according to the fifth embodiment of the present invention, and corresponds to FIG. In FIG. 6, the same or corresponding elements as those in FIG. 1 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The solid-state imaging device 51 according to the present embodiment is different from the solid-state imaging device 1 according to the first embodiment in that it is moisture permeable between the wiring board 3 and the translucent plate 4 and at a bonding point therebetween. A spacer 52 made of a low material is interposed. In the present embodiment, the spacer 52 is formed on the wiring substrate 3, and the upper surface of the spacer 52 is bonded to the translucent plate 4 with the adhesive 7. However, when the spacer 52 itself does not have adhesiveness to the wiring substrate 3, the lower surface of the spacer 52 may be adhered to the wiring substrate 3 with an adhesive (not shown).

  The material of the spacer 52 is preferably a liquid crystal polymer or a material having lower moisture permeability than the liquid crystal polymer. Examples of materials having lower moisture permeability than liquid crystal polymers include ceramics and metals. In the case where the spacer 52 is formed of a liquid crystal polymer, it can be realized by forming the liquid crystal polymer on the wiring substrate 3. When the spacer 52 is formed of a resin such as a liquid crystal polymer, the spacer 52 can be formed by stacking a plurality of layers each having a desired height, for example, a film having a thickness of 25 μm, depending on the height. Further, when the spacer 52 is made of ceramic, metal, or the like, the lower surface of the spacer 52 is bonded onto the wiring substrate 3 with an adhesive (not shown).

  Also in the present embodiment, as in the first embodiment, the space enters between the imaging region 2a of the semiconductor chip 2 and the translucent plate 4 from the outside via the wiring board 3. Since moisture is reduced, high image quality and high reliability can be achieved.

  Moreover, according to this Embodiment, since the spacer 52 is provided, the distance between the translucent board 4 and the imaging area 2a of the semiconductor chip 2 can be enlarged. Therefore, the influence of foreign matter and scratches on the translucent plate 4 can be reduced, and the standards for foreign matter such as dust and scratches on the translucent plate 4 are relaxed. The yield of the imaging device 51 is improved, and the cost can be reduced.

  However, if the moisture permeability of the spacer 52 is high, moisture enters from the outside via the spacer 52 into the space between the imaging region 2 a of the semiconductor chip 2 and the light transmissive plate 4. However, in this embodiment, since the spacer 52 is made of a material having low moisture permeability, the spacer 52 passes through the spacer 52 in the space between the imaging region 2a of the semiconductor chip 2 and the translucent plate 4. Moisture entering from the outside is reduced. Therefore, according to the present embodiment, it is possible to achieve higher image quality and higher reliability even though the influence of foreign matters and scratches on the translucent plate 4 can be reduced.

  In the present embodiment, instead of the wiring board 3, the above-described wiring boards 23 and 33 and a wiring board 73 described later may be used in the present embodiment. This also applies to a sixth embodiment described later.

[Sixth Embodiment]
FIG. 7 is a schematic sectional view schematically showing a solid-state imaging device 61 according to the sixth embodiment of the present invention, and corresponds to FIG. 1 and FIG. 7, elements that are the same as or correspond to those in FIGS. 1 and 6 are given the same reference numerals, and redundant descriptions thereof are omitted. This embodiment is different from the seventh embodiment in the points described below.

  In the present embodiment, on the lower surface of the wiring board 3, in addition to the semiconductor chip 2 having the imaging region 2a, two semiconductor chips 62 that are electrically connected to the semiconductor chip 2 are mounted. In the present embodiment, for example, the semiconductor chip 2 includes a plurality of pixels and a readout circuit that drives these to read out an image signal, and one semiconductor chip 62 outputs one image output from the semiconductor chip 2. A processing circuit for performing processing such as AD conversion on the image signal of the part is mounted, and processing for performing processing such as AD conversion on the remaining image signal output from the semiconductor chip 2 is mounted on the other semiconductor chip 62. A circuit is installed. The circuit mounted on the semiconductor chip 62 is not limited to such a circuit.

  In the present embodiment, the electrode pads (not shown) on the lower surface of the wiring substrate 3 and the electrode pads (not shown) on the upper surface of the semiconductor chip 62 are joined by the bumps 63 and 64. Although not shown in the drawing, the wiring board 3 has wirings connecting between the electrode pads bonded by the bumps 5 and the electrode pads bonded by the bumps 63, and electrode pads bonded by the bumps 64. A wiring for connecting to an electrode pad (not shown) for external connection is formed.

  At locations including the vicinity of the bumps 63 and 64, the wiring substrate 3 and the semiconductor chip 62 are bonded by adhesives 65 and 66, and the bonding by the bumps 63 and 64 is reinforced.

  Also in this embodiment, the same advantages as those in the fifth embodiment can be obtained. In the present invention, the spacer 52 may not be provided in the present embodiment, as in the first embodiment.

[Seventh Embodiment]
FIG. 8 is a schematic cross-sectional view schematically showing a wiring board 73 of the solid-state imaging device according to the seventh embodiment of the present invention, and corresponds to FIG.

  The present embodiment is different from the first embodiment in that a wiring board 73 is used instead of the wiring board 3 in the first embodiment.

  In the present embodiment, the wiring board 73 is configured as a single-sided rigid wiring board, and is made of a rigid base substrate 81 made of an insulating material such as glass epoxy and a conductor such as copper formed on the lower surface of the base substrate 81. A conductor layer 82, a resist layer 83 formed so as to cover the base substrate 81 and the conductor layer 82, and an outermost layer bonded to the resist layer 83 so as to cover the resist layer 83 with an adhesive 84 interposed therebetween. The outer layer 85 and the outermost layer 87 on the other side bonded to the base substrate 81 so as to cover the upper surface of the base substrate 81 with an adhesive 86 interposed therebetween. Although not shown in the drawing, the wiring board 73 has an opening corresponding to the opening 3 a of the wiring board 3.

  Although not shown in the drawing, the conductor layer 82 is patterned into a desired wiring or electrode pad shape. Although not shown in the drawing, openings are formed in the resist layer 83, the adhesive 84, and the outermost layer 85 in the electrode pad portion of the conductor layer 82, and can be bump-bonded to the electrode pad. ing. In the present embodiment, the adhesive 84 and the outermost layer 85 are formed over the entire region other than the electrode pad portion of the conductor layer 82. However, the adhesive 84 and the outermost layer 85 are not necessarily formed over the entire region other than the electrode pad portion of the conductor layer 82, for example, a region including a region bonded by the adhesive 6 and a region in the vicinity thereof. The adhesive 84 and the layer 85 may be formed. In the present embodiment, the adhesive 86 and the outermost layer 87 are formed over the entire region, but the present invention is not limited to this, and the adhesive 86 and the outermost layer 87 are, for example, an adhesive region with the spacer 52. In addition, the adhesive 86 and the layer 86 may be formed in a region including a region in the vicinity thereof.

  In this embodiment, the outermost layers 85 and 87 on both sides of the wiring board 73 are made of a material having low moisture permeability. The moisture permeability of this material is preferably lower than that of polyimide or the resist layer 83, and the outermost layers 85 and 87 are preferably made of, for example, a liquid crystal polymer.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained. Although the wiring board 73 is configured as a single-sided rigid wiring board, in the present invention, the wiring board 73 may be configured as a double-sided rigid wiring board or a multilayer rigid wiring board.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

1, 51, 61 Solid-state imaging device 2 Semiconductor chip 2a Imaging area 3, 23, 33, 73 Wiring substrate 3a Opening 4 Translucent plate (translucent member)
14,17 Coverlay film

Claims (9)

A semiconductor chip having an imaging region;
A wiring board having an opening in at least a region corresponding to the imaging region, adhered to the surface of the semiconductor chip on the imaging region side, and having an outermost layer made of a material having low moisture permeability on both sides;
A translucent member bonded to the surface of the wiring board opposite to the semiconductor chip so as to close the opening;
A solid-state imaging device comprising:   The solid-state imaging device according to claim 1, wherein the material is a liquid crystal polymer. The wiring board is a flexible wiring board,
The solid-state imaging device according to claim 1, wherein the moisture permeability of the material is lower than that of polyimide. The wiring board is a double-sided flexible wiring board or a multilayer flexible wiring board,
The outermost layer on one side is a coverlay film on one side;
4. The solid-state imaging device according to claim 3, wherein the outermost layer on the other side is a coverlay film on the other side. The wiring board is a single-sided flexible wiring board,
The outermost layer on the one side is a coverlay film,
The solid-state imaging device according to claim 3, wherein the outermost layer on the other side is a base film. The wiring board is a rigid wiring board;
The solid-state imaging device according to claim 1, wherein moisture permeability of the material is lower than moisture permeability of the resist.   The solid-state imaging device according to claim 1, further comprising a spacer made of a material having low moisture permeability, interposed between the wiring board and the light transmissive member.   The solid-state imaging device according to claim 7, wherein the spacer is made of a liquid crystal polymer or a material having lower moisture permeability than the liquid crystal polymer.   An electronic camera comprising the solid-state imaging device according to claim 1.

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