JP2014225515A - Shield case and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To block degradation of shield function for an electronic component, by maintaining the contact state of a shield case and other component, while bringing the shield case and other component into contact state depending on the installation.SOLUTION: A shield case (2, 50, 120) includes a frame (6, 58, 124) surrounding the periphery of an electronic component (22, mounting component 56) mounted on a substrate (4, 36), and a lid (8, 60, 122). A support (12, support protrusion 68, support recess 132) is formed on the frame in contact with the lid. The lid includes an upper plate (16, 62) covering the upper surface side of the frame and in contact with an external component, and a sidewall (14, 64, 126) on which a displacement support (18, support recess 66, support protrusion 128), engaging displaceably along the support of the frame and generating a biasing force depending on the displacement, is formed. The lid is supported by the upper plate separating from the frame.

Description

The present invention relates to a shield case and an electronic apparatus having a protection function for electronic components mounted on a substrate.

  In an electronic device, a substrate on which electronic components are mounted is installed in a housing. Some electronic components are provided with a shield case that covers a mounting portion with respect to a substrate in order to protect the electronic components from contact with foreign matters mixed in from the outside or interference due to electromagnetic waves emitted from other electronic components. The shield case can be used not only to protect the covered electronic component from external factors, but also to prevent electromagnetic waves emitted from the electronic component from diffusing around.

  Some shield cases combine a frame body that surrounds an electronic component and a lid portion that is installed on the upper surface side of the frame body. Such a shield case is, for example, a shape for engaging the frame and the lid in order to simplify the joint structure and stabilize the bonding pressure at the joint between the frame and the lid. What is formed in this invention and what interposes spring parts etc. are known.

With respect to such a shield case, there is known one in which a circular locking shape is formed on either the frame body or the lid portion in order to engage the frame body and the lid portion (for example, Patent Document 1). And Patent Document 2). It is known that a groove is formed at the front end of the frame, the end of the lid is inserted into the groove and elastically deformed, and the connection between the lid and the frame is maintained by the restoring force (for example, Patent Document 3). There is known a technique in which an upper case and a lower case are coupled with a printed circuit board interposed therebetween, and a protrusion of a long protruding piece of the lower case is detachably engaged with a recess of the upper case (for example, Patent Document 4). In addition, a part of the shield cover is provided with a tongue piece to be brought into contact with the shield partition plate, and is engaged with the projection of the shield partition plate in a tapered notch formed in the tongue piece. (For example, Patent Document 5).

JP 2009-135410 A JP 2012-097881 A JP 2003-078273 A No. 05-013040 Japanese Utility Model Publication No. 62-080397

  By the way, a shield case to be mounted on a substrate is, for example, one that is installed in an electronic device by bringing a part of a lid part into contact with another component arranged outside. Although the shield case can protect electronic parts even if it is a single unit, it can improve the heat radiation function and installation strength, as well as the shielding function to the electronic parts against magnetism and electromagnetic waves, by contacting with other parts.

  However, there is a possibility that an error in the installation position of the substrate or a variation in the installation state may occur in the electronic device, and the shield case may not come into contact with other components. If the contact state between the shield case and other parts is checked or adjusted in the assembly process of the electronic device, the assembly process becomes complicated. In addition, for example, vibration and aging deterioration during use of electronic equipment, or displacement or deformation of the substrate or other parts caused by heat generated by driving the electronic equipment may cause the shield case to be in contact with other parts. May not be able to maintain. For this reason, the shield case has a problem of maintaining the contact state with other components and preventing the shield function from being lowered.

  In addition to the downsizing of electronic equipment, it is difficult for the shield case to form a complex adjustment structure to maintain contact with other components, or to add components to maintain contact. There is a problem of being.

  Therefore, the purpose of the shield case and the electronic device of the present disclosure is to bring the shield case and other components into contact with each other according to the installation state of the shield case and other components.

Another object of the shield case and the electronic device according to the present disclosure is to maintain a contact state between the shield case and other components and prevent a decrease in the shield function with respect to the electronic components.

In order to achieve the above object, one aspect of the present disclosure is a shield case including a frame body that surrounds the periphery of an electronic component mounted on a substrate, and a lid portion that is installed across the frame body, The frame is formed with a support portion that contacts and supports the lid portion. The lid portion is engaged with an upper plate portion that covers the upper surface side of the frame body and is in contact with an external part so as to be displaceable along the support portion of the frame body. And a side wall portion on which a displacement support portion for generating an urging force is formed. And the said cover part is spaced apart and supported by the said upper board part from the said frame.

  According to the shield case or the electronic apparatus of the present disclosure, any of the following effects can be obtained.

  (1) The lid and the external component can be brought into contact with each other according to the installation interval between the shield case and the external component.

  (2) The lid part is displaced along the side wall part and is biased toward the external part, so that the contact state between the lid part and the external part can be maintained, and the shielding function of the electronic device can be maintained.

Other objects, features, and advantages of the present invention will become clearer with reference to the accompanying drawings and each embodiment.

It is a figure which shows the structural example of the shield case which concerns on 1st Embodiment. It is a figure which shows the cross-sectional structural example of a shield case. It is a flowchart which shows an example of the mounting process of a shield case. It is a figure which shows an example of the electronic device which concerns on 2nd Embodiment. It is a figure which shows one surface of a front case. It is a fragmentary sectional view which shows the internal structural example of an electronic device. It is a figure which shows the example of an external appearance structure of a shield case. It is a figure which shows an example of the state which isolate | separated the cover part. It is a figure which shows the other example of the displacement support structure of a shield case. It is a figure which shows an example of the displacement state of the shield case by installation of a board | substrate. It is a figure which shows an example of the deformation | transformation state of a side wall part. It is a figure which shows the other structural example of a cover part. It is a figure which shows another example of the displacement support structure of a shield case. It is a figure which shows the structural example of the electronic device which concerns on 3rd Embodiment. It is a figure which shows an example of the displacement state of the shield case by installation of a board | substrate. It is a figure which shows an example of the displacement state of the shield case by installation of a board | substrate. It is a figure which shows an example of the displacement state of the shield case by installation of a board | substrate. It is a figure which shows the modification of a support recessed part. It is a figure which shows the other example of an electronic device. It is a figure which shows the structural example of the support recessed part which concerns on other embodiment. It is a figure which shows the structural example of the shield case which concerns on other embodiment. It is a figure which shows the example of a displacement state of a cover part. It is a figure which shows the structural example of the shield case which concerns on other embodiment.

  [First Embodiment]

  FIG. 1 shows a configuration example of the shield case according to the first embodiment, and FIG. 2 shows a cross-sectional configuration example of the shield case. The configurations shown in FIGS. 1 and 2 are examples, and the present invention is not limited to such configurations.

  A shield case 2 shown in FIG. 1 is an example of the shield case of the present disclosure, and is installed on the mounting surface side of the substrate 4 on which the electronic component 22 (FIG. 2) is mounted. The shield case 2 covers, for example, the periphery and the upper surface side of the electronic component 22 on the substrate 4. The shield case 2 blocks the contact of foreign matter and prevents damage to the electronic component 22 and short-circuiting with the foreign matter, blocks the influence of disturbance due to electromagnetic waves, etc., or electromagnetic waves emitted from the electronic component 22. This is an example of a means for preventing diffusion of the above. The substrate 4 on which the shield case 2 is installed has a mounting surface formed on one or both sides of a flat portion, for example, and is used as a functional component constituting a computer such as a mobile phone or a PC (Personal Computer).

  For example, as shown in FIG. 1A, the shield case 2 includes a frame body 6 installed on one surface of the substrate 4 and a lid portion 8 installed across the upper surface side of the frame body 6. The frame body 6 and the lid portion 8 are formed of, for example, a metal member, or are formed by applying conductive plating on the exterior surface, and the frame body 6 and the lid portion 8 are electrically connected by contact.

<About the structure of the frame 6>

  The frame body 6 includes, for example, a standing wall portion 10 surrounding the periphery of the electronic component 22 mounted on the substrate 4. The standing wall portion 10 is connected to the grounding portion of the substrate 4 with respect to the mounting surface of the substrate 4, for example. Thereby, the shield case 2 guides electrical energy such as electromagnetic waves received by the frame body 6 or the lid portion 8 to the ground side of the substrate 4.

  Further, the standing wall portion 10 is formed with a support portion 12 that contacts and supports the lid portion 8. The support portion 12 is a contact point that conducts to the lid portion 8 and is an example of means for supporting the lid portion 8 at a predetermined height. The support part 12 is formed in, for example, a hemispherical shape, and one or more support parts 12 are formed on each surface of the frame body 6. More preferably, the support part 12 is formed symmetrically between the standing wall parts 10 facing each other, for example, so that the upper plate part 16 of the lid part 8 can be supported in parallel to the mounting surface of the substrate 4. The support portion 12 may be integrally formed on the surface side of the standing wall portion 10, for example, or may be formed as a separate member and bonded to the standing wall portion 10.

<About the structure of the cover part 8>

  The lid portion 8 includes, for example, a side wall portion 14 that covers the outer peripheral side of the standing wall portion 10 of the frame body 6 and an upper plate portion 16 that covers the upper surface side of the frame body 6. The side wall portion 14 is supported by being in contact with the frame body 6 via the support portion 12, and is in a conductive state with the frame body 6 via this contact portion. Further, for example, as shown in FIG. 1B, the lid portion 8 is installed so as to be displaced in the vertical direction along the standing wall portion 10 while being in contact with the support portion 12.

  The side wall portion 14 is formed with a displacement support portion 18 that is supported to be displaceable with respect to the frame body 6 via the support portion 12, for example. The displacement support portion 18 is formed, for example, by opening a part of the side wall portion 14 and engages the support portion 12 inside the opening. The displacement support portion 18 is formed longer than the diameter of the support portion 12 in the displacement direction of the lid portion 8, and displaces the lid portion 8 along the support portion 12 in the opening direction.

  Further, as shown in FIG. 1B, the displacement support portion 18 causes the lid portion 8 to move to the substrate 4 in accordance with, for example, the displacement of the lid portion 8 toward the substrate 4 due to the engagement with the support portion 12. Energize in the direction away from The displacement support part 18 is formed so as to narrow the opening diameter with respect to the support part 12 to be engaged, for example, according to the displacement of the side wall part 14. Further, as shown in A of FIG. 1, the lid portion 8 has a minimum urging force generated at an engagement portion with the frame body 6 in a state where the contact with the external component 20 is released.

  The upper plate portion 16 is an example of a shielding unit that covers the upper surface side of the frame body 6, and is formed integrally with the side wall portion 14. The upper plate portion 16 is formed in, for example, a flat plate shape, and the lid portion 8 is supported so as to be in a parallel or nearly parallel state with respect to the substrate 4. Moreover, the upper plate part 16 makes the external part 20 contact the back side of the cover part 8, for example. The external component 20 includes, for example, a functional component installed in an electronic device on which the substrate 4 is installed, another substrate, and the like.

  <About the displacement state of the lid 8>

  For example, the distance H2 between the external component 20 and the substrate 4 is set inside the electronic device. This distance H2 is set smaller than the height H1 in a state where nothing is brought into contact with the lid portion 8 of the shield case 2 and no load is applied. Thereby, when the board | substrate 4 is installed in the predetermined position of an electronic device, the cover part 8 will contact the external component 20, will be pressed by force F1, and the shield case 2 will be displaced to the frame 6 side. On the other hand, the lid portion 8 receives an urging force F <b> 2 in a direction in which the lid portion 8 is separated from the frame body 4 by the engagement between the displacement support portion 18 and the support portion 12.

  As shown in FIG. 2A, when the load is not applied to the upper plate portion 16 of the lid portion 8, the shield case 2 is engaged with the support portion 12 and the displacement support portion 18, thereby engaging the lid portion 8. Is supported in a state of being most separated from the frame body 6. At this time, a space is formed between the upper frame portion 24 of the frame body 6 and the upper plate portion 16 of the lid portion 8. The upper surface frame portion 24 is formed on one end side of the standing wall portion 10 and covers a part of the substrate 4 to protect the upper surface side of the electronic component 22. The upper surface frame 24 is formed with an opening 26 in the central portion of the frame body 6. For example, the electronic component 22 can be attached and detached without removing the frame body 6.

  In the shield case 2, as shown in FIG. 2B, when the lid portion 8 is displaced, the displacement support portion 18 is displaced along the support portion 12. At this time, a part of the side wall part 14 is elastically deformed, for example, by contact with the support part 12, and a restoring force is generated so as to return to the original shape toward the frame body 6 side, whereby the upper plate part 16 is externally attached. A biasing force toward the component side can be obtained.

  <About the installation process of the shield case 2>

  FIG. 3 shows an example of the mounting process of the shield case 2. The processing contents and processing procedures shown in FIG. 3 are examples, and the present invention is not limited to such contents.

  In this mounting process, for example, the frame 6 is installed at a predetermined position of the substrate 4 (S1). For example, the frame 6 is installed on the substrate 4 via a conductive adhesive or soldered to one end side of the frame 6. Thereby, the frame 6 is electrically connected to the ground terminal of the substrate 4.

  The mounting process of the electronic component 22 on the substrate 4 may be performed before the installation process of the frame body 6 or after the installation of the frame body 6, for example.

  When the installation process of the frame body 6 is completed, the lid portion 8 is installed in accordance with the position of the standing wall portion 10 (S2), and the shield case 2 is mounted. Next, the board | substrate 4 is arrange | positioned, for example in the mounting position of an electronic device (S3). What is necessary is just to arrange | position the board | substrate 4 according to the external apparatus 20 installed in an electronic device, for example. The substrate 4 is placed at a predetermined position inside the electronic device while pressing the lid portion 8 of the shield case 2 against the external component 20 (S4). At this time, the cover portion 8 is maintained in contact with the external component 20 by the restoring force from the support portion 12 and the displacement support portion 18 generated by pressing.

  According to such a configuration, the upper plate portion 16 is separated from the frame body 6 and the lid portion 8 is installed so as to be displaceable. Further, the frame body 6 is biased according to the displacement of the lid portion 8, The lid portion 8 and the external component 20 can be maintained in contact with each other according to the installation interval between the shield case 2 and the external component 20. The lid portion 8 is displaced according to the contact with the external component 20, and the contact state between the lid portion 8 and the external component 20 is maintained by applying an urging force (F 2) to the lid portion 8 along with the displacement. And the shielding property of the electronic device can be maintained. Further, since the shielding property can be maintained, it is possible to prevent the shielding function from being deteriorated due to physical or electrical disturbance to the electronic component.

  [Second Embodiment]

  FIG. 4 shows a configuration example of an electronic device according to the second embodiment. The configuration shown in FIG. 4 is an example.

  An electronic device 30 illustrated in FIG. 4 is an example of the electronic device of the present disclosure, and includes, for example, a mobile phone, an information processing apparatus, and the like. The electronic device 30 includes a front case 32, a sheet metal 34, a first substrate 36, a second substrate 38, and a rear case 40. The front case 32 and the rear case 40 are examples of a housing of the electronic device 30, and the sheet metal 34, the first substrate 36, the second substrate 38, and the like are accommodated therein by bonding.

  In the front case 32, for example, a display window part 42 for arranging display means and the like is formed on the front side of the electronic device 30, and a panel 44 for displaying an image and the like is installed from the display window part 42. In addition to image display, the panel 44 may have a touch panel function that allows an input operation to the electronic device 30 to be performed by contact with a user's finger or the like. Further, the front case 32 includes an LCD (Liquid Crystal Display) unit 52 on the back side of the panel 44 as display means for generating image information, for example, as shown in FIG. In addition, the front case 32 may be provided with a speaker, a receiver, or the like used for a call or voice input / output.

  The sheet metal 34 supports, for example, the LCD unit 52 installed in the front case 32 and is an example of a shield part for the LCD unit 52, and is installed in the front case 32. The sheet metal 34 covers the LCD unit 52 installed in the front case 32, thereby blocking the contact of other functional components with the LCD unit 52 and disturbances such as electromagnetic waves. The panel 44, the LCD unit 52, and the sheet metal 34 are accommodated in the front case 32.

  The first substrate 36 is an example of a main substrate that realizes the computer function of the electronic device 30, for example, and a plurality of functional components are mounted thereon. The second board 38 is an example of a sub-board on which functional components that control one or a plurality of functions are mounted. The first substrate 36 and the second substrate 38 are provided with a shield case 50 that protects one or a plurality of mounted components, for example.

  Note that the electronic device 30 may be configured with only the first substrate 36 or may be mounted with three or more substrates, for example, depending on the functions to be mounted.

  <About the installation state of the shield case 50>

  FIG. 6 shows an internal configuration example of the electronic device. In the electronic device 30, for example, as shown in FIG. 6, when the front case 32 and the rear case 40 are joined, the sheet metal 34 and the substrate 36 installed on the front case 32 side approach each other. At this time, a part of the shield case 50 installed on the first substrate 36 is in contact with the sheet metal 34. That is, the sheet metal 34 functions as an external component of the present disclosure with respect to the shield case 50. The shield case 50 includes, for example, a frame body 58 that surrounds the periphery of the mounting component 56 mounted on one surface of the substrate 36 and a lid portion 60 that is installed across the upper surface side of the frame body 58.

  The shield case 50 is improved in heat dissipation, installation strength, and other shielding properties against magnetism and electromagnetic waves by bringing the upper surface portion of the lid portion 60 into contact with the sheet metal 34.

  In addition, the shield case 50 installed on the second substrate 38 may have the lid portion 60 in contact with a part of the back surface side of the first substrate 36, or the first substrate 36 and the second substrate. A metal plate or the like may be interposed between the metal plate 38 and the lid 60 may be brought into contact with the metal plate.

  <About Shield Case 50>

  7 and 8 show a configuration example of the shield case. As shown in FIG. 7, the shield case 50 is installed with a lid 60 straddling the periphery and upper surface of the frame body 58 installed on the substrates 36 and 38. Support means for supporting the height of the lid 60 so as to be displaceable with respect to the frame body 58 is formed at the peripheral portion of the shield case 50.

  As this support means, for example, as shown in FIG. 8, a support convex portion 68 is formed on the standing wall portion 70 of the frame body 58, and a support concave portion 66 is formed on the side wall portion 64 of the lid portion 60. The support convex portion 68 is an example of the support portion of the present disclosure, and may be formed integrally with the standing wall portion 70 or may be provided with another member. The support recess 66 is an example of the displacement support portion of the present disclosure. The support protrusion 68 of the frame body 58 is fitted inside, and the lid portion 60 is attached to the sheet metal 34 by installing the substrates 36 and 38 with respect to the electronic device 30. The support convex portion 68 is slid inside according to the displacement in contact with the contact.

  In addition, the lid portion 60 is formed with an upper plate portion 62 that covers the upper surface side of the frame body 58 and is brought into contact with the sheet metal 34. The upper plate portion 62 is formed in a flat plate shape, for example, and is formed so that a large contact area with the sheet metal 34 can be obtained. Further, the lid portion 60 is formed with a side wall portion 64 including a support concave portion 66 on the four sides of the upper plate portion 62. For example, the number of the support concave portions 66 is formed between the opposing side wall portions 64 in order to maintain the parallel state of the upper plate portion 62, the sheet metal 34, and the substrates 36 and 38. Thereby, the cover part 60 can maintain equally the pressing force received according to a displacement, and the urging | biasing force to the sheet metal 34 side between the side wall parts 64 which oppose.

  The frame body 58 is formed with, for example, an upper surface frame portion 72 that is orthogonal to the upper side of the standing wall portion 70 and extends toward the inside of the shield case 50. In the upper surface portion of the frame body 58, for example, an opening 74 is formed along the upper surface frame portion 72. The upper surface frame portion 72 covers the upper surfaces of the substrates 36 and 38 to protect the mounting component 56 and, for example, improves the rigidity of the vertical wall portion 70 that is orthogonal. Further, the upper surface frame 72 enables the lid 8 that has been displaced to the lowermost side to be placed, for example, so that the lid 8 stops at the limit of displacement, and the lid against the pressure received by contact with the sheet metal 34. The function of maintaining the shape of the portion 60 is exhibited.

  <About the structure which supports the cover part 60 so that a displacement is possible>

  9, 10 and 11 show an example of the displacement structure of the lid 60. FIG. For example, as shown in FIG. 9A, the support recess 66 is formed in an isosceles triangle shape with the substrate side of the side wall portion 64 as the base. The opening height H3 of the support recess 66 sets a range in which the support protrusion 68 is fitted and displaced.

  The support concave portion 66 is formed with a locking portion P1 having a width L2 for locking the lid 60 by fitting a support convex portion 68 having a width L1 inside the bottom side, for example. The width L2 of the locking portion P1 is formed, for example, equivalent to the support convex portion 68. When the lid 60 is not pressed from the sheet metal 34 or the like, the support convex portion 68 fitted to the locking portion P1 is, for example, a narrow portion where a part of the peripheral surface portion is formed on the upper side of the support concave portion 66. It is supported by being locked.

  As for the support recessed part 66, when the cover part 60 is pushed down by press, the support convex part 68 approachs the narrow part side. For example, as shown in FIG. 9B, the lid portion 60 has a lateral width W <b> 2 between the side wall portions 64 formed substantially equal to the lateral width W <b> 1 of the frame body 70. Therefore, when the support convex portion 68 enters the narrow portion of the support concave portion 66, the side wall portion 64 is elastically deformed by the force from the frame body 58. The narrow portion of the support recess 66 is formed in communication with the locking portion P1 and is an example of the guide portion of the present disclosure that guides the support projection 68 along the opening portion, and is displaced in the direction in which the lid portion 60 is set. Let Thus, by the engagement between the support concave portion 66 and the support convex portion 68, the lid portion 60 maintains the upper plate portion 62 in a parallel state with respect to the metal plate 34 side, thereby increasing the contact area with the metal plate 34. Can take.

  Furthermore, the opening height H <b> 3 of the support recess 66 is an example of a guide length of a sliding distance with respect to the support protrusion 68, and corresponds to the displacement amount of the lid 60. That is, the lid 60 can be displaced until the support convex portion 68 reaches the tip portion of the support concave portion 66 with respect to contact with an external component such as the sheet metal 34.

  In the installation process of the substrate 36 on which the shield case 50 is installed, for example, as shown in FIG. 10A, the support convex portion 68 is locked in the locking portion P1 of the support concave portion 66, so The upper plate part 62 is in the state most separated from the frame body 58. In the assembly process of the electronic device 30, for example, the rear case 40 on which the substrates 36 and 38 are installed is approached toward the sheet metal 34, but the front case 32 on which the sheet metal 34 is installed approaches the substrates 36 and 38. You may let them.

  For example, as shown in FIG. 10B, when the substrates 36 and 38 are disposed at the installation position with respect to the front case 32 side including the sheet metal 34, the shield case 50 comes into contact with the sheet metal 34. . In the electronic device 30, for example, the front case 32 and the rear case 40 are joined to a predetermined thickness by fastening means such as screws (not shown). Therefore, before the fastening process, the distance H4 between the sheet metal 34 and the substrate 36 is separated from the distance H6 when the assembly process of the electronic device 30 is completed, as shown in FIG.

  When the substrate 36 is installed, when the front case 32 and the rear case 40 are joined to the distance H5 between the upper side of the support concave portion 66 and the support convex portion 68, the lid portion 60 is displaced and the support concave portion is displaced. A distance H7 is formed between the upper side of 66 and the support convex portion 68, and the distance is reduced. This (distance H5-distance H7) is the displacement distance of the lid 60.

  The lid 60 receives a pressing force F3 due to a reaction force, for example, by being pressed against the sheet metal 34 by assembling the electronic device 30. By this pressing, the side wall portion 64 of the lid portion 60 is elastically deformed by the support convex portion 68 that has entered the guide portion side. In response to this elastic deformation, for example, the side wall 64 generates a restoring force F <b> 5 with the deformed portion directed toward the frame body 58. Due to this restoring force F5, the lid 60 is displaced in the direction of the sheet metal 34 so that the position of the support convex portion 68 is restored to the locking portion P1 side in the support concave portion 66 in the support concave portion 66. The biasing force F4 to be generated is generated.

  For example, as shown in FIG. 11A, the lid 60 is not in a pressed state before being displaced by contact with the sheet metal 34, and the support convex portion 68 is disposed in the locking portion P <b> 1 of the support concave portion 66. On the other hand, in the lid portion 60 in the displaced state, for example, as shown in FIG. 11B, the support convex portion 68 is pressed from the support convex portion 68 by entering the narrow portion of the support concave portion 66, and the side wall A deformed portion 80 is formed in which the peripheral portion of the support concave portion 66 of the portion 64 is expanded.

  On the other hand, the side wall portion 64 generates an urging force so as to press the lid portion 60 against the sheet metal 34 side by a restoring force generated by elastic deformation of the deformation portion 80 portion.

  <Regarding Another Configuration Example of the Lid 60>

  12 and 13 show other configuration examples of the lid. The configuration shown in FIGS. 12 and 13 is an example.

  The support recess 82 of the lid 60 shown in FIG. 12 is formed in a trapezoidal shape having, for example, a height in the displacement direction of the lid 60 and long and short sides parallel to the substrates 36 and 38. The support recess 82 has a long side on the bottom side of the side wall part 64 and a short side on the upper side, and is opened by an inclined side having a symmetrical inclination angle between the two sides.

  When the lid 60 is not pressed, the support concave portion 82 is arranged on the long side as shown in FIG. 13A. The long side is formed with a locking portion P1 having a width L3 for locking the support convex portion 68 having a width L1, for example. The support convex portion 68 fitted to the locking portion P1 is supported, for example, by locking a part of the peripheral surface portion with a narrow portion formed on the upper side of the support concave portion 82. The long side width L3 may be set equal to the width L2 of the bottom side of the support recess 66 described above.

  In the lid 60, for example, as shown in FIG. 13B, the support concave portion 82 is displaced along the support convex portion 68, and the support convex portion 68 is locked to the narrow portion. At this time, the lid 60 is urged against the sheet metal 34 and the like that are in contact with each other by a restoring force due to elastic deformation of the side wall 64.

  Further, the short side on the distal end side of the support concave portion 82 holds the support convex portion 68 at a narrow portion of the support concave portion 82, for example, and locks a part of the support convex portion 68 to thereby displace the lid portion 60. You may make it function as a stopper to block.

  According to such a configuration, the upper plate portion 62 is separated from the frame body 58 and the lid portion 60 is supported to be displaceable. Further, the frame body 58 urges the lid portion 60 in accordance with the displacement of the lid portion 60. Thus, the shield case 50 can be brought into contact with the space between the external parts such as the sheet metal 34. The lid 60 is displaced according to the contact with the sheet metal 34, and a biasing force is applied to the lid 60 in accordance with the displacement, thereby maintaining the contact state between the lid 60 and the sheet metal 34. It is possible to maintain the shielding function for the components mounted on the substrate 34. Furthermore, the support recesses 66 and 82 can change the restoring force generated by the deformation of the side wall portion 64 by narrowing the width to be engaged with the support projection 68 in accordance with the displacement amount of the lid portion 60. The pressure that the frame 58 receives from the sheet metal 34 can be adjusted. By supporting the lid portion 60 of the shield case 50 so as to be displaceable, confirmation of the contact state between the sheet metal 34 and the lid portion 60 and adjustment of the installation positions of the substrates 36 and 38 can be omitted. Can be simplified.

  [Third Embodiment]

  FIG. 14 shows a configuration example of an electronic device according to the third embodiment. 15 and 16 show examples of the displacement state of the shield case in the substrate installation process. The configuration shown in FIGS. 14 to 16 is an example.

  An electronic device 90 illustrated in FIG. 14 is an example of the electronic device of the present disclosure, and includes shield cases 50A and 50B on the mounting surfaces of the substrates 36 and 38. The mounting surfaces of the substrates 36 and 38 are arranged in opposing directions inside the electronic device 90. The shield cases 50A and 50B installed on the substrates 36 and 38 are arranged so that the respective lid portions 60A and 60B are in contact with each other.

  The shield case 50A is installed, for example, on the first substrate 36 of the electronic device 90, and the lid 60A is supported by the frame 58A so as to be displaceable. The shield case 50B is installed on, for example, the second substrate 38 of the electronic device 90, and the lid 60B is supported by the frame 58B so as to be displaceable. For example, the first substrate 36 is installed in the front case 32, and the second substrate 38 is installed in the rear case 40.

  The shield cases 50A and 50B are configured so that the lids 60A and 60B are brought into contact with each other in accordance with the distance between the substrates 36 and 38 set by joining the front case 32 and the rear case 40, whereby the frame bodies 58A and 58B. Are displaced and pressed against each other.

  In the assembly process of the electronic device 90, for example, as shown in FIG. 15A, the substrates 36 and 38 are made to face each other at a position where the shield cases 50A and 50B come into contact with each other. This alignment may be set, for example, by bonding alignment of the front case 32 and the rear case 40 on which the substrates 36 and 38 are installed.

  When the substrates 36 and 38 are separated from each other and the lid portions 60A and 60B are not in contact with each other, the lid portions 60A and 60B are in the most separated state from the frame bodies 58A and 58B as shown in FIG. 15B. ing. And the cover parts 60A and 60B are made to contact by making the board | substrates 36 and 38 approach toward an opposing direction.

  When the substrates 36 and 38 are brought close to each other, the lid portions 60A and 60B come into contact with each other at predetermined positions. Further, when the substrates 36 and 38 are brought close to each other, the cover portions 60A and 60B are formed so that the support convex portions 68A and 68B of the frame bodies 58A and 58B are supported by the support concave portions 66A and the contact portions, respectively, as shown in FIG. Displace within 66B. At this time, as shown in FIG. 16B, for example, as shown in FIG. 16B, the lid portions 60A and 60B are formed with bent portions 100 in the respective side wall portions, and pressed together at the contact portions, thereby maintaining the contact state and contacting firmly. Is done.

  <When the installation heights of the shield cases 50A and 50B are different>

  FIG. 17 shows an example of the displacement state of the shield case due to the installation of the substrate. The shield cases 50A and 50B can be brought into contact with each other by displacing the lid portions 60A and 60B even when an installation height error occurs with respect to the substrates 36 and 38, for example. In the electronic device 90, for example, as shown in FIG. 17A, a frame 58A of the shield case 50A is formed from the substrate 36 at a height H8. And according to the installation space | interval of this frame 58A and frame 58B, cover part 60A, 60B displaces and will be in a contact state.

  On the other hand, the frame body 58A shown in FIG. 17B is set at the installation height H9 from the substrate 36, for example, when a dimensional tolerance is generated in the standing wall 70A by molding or the installation state with respect to the substrate 36. With respect to the difference in installation height of the frame body 58A, the displacement amounts of the lid portions 60A and 60B with respect to the support convex portions 68A and 68B can be adjusted to be in a contact state. At this time, the contact positions of the lid portions 60A and 60B are displaced according to, for example, the difference D1 (= H8−H9) between the height H8 and the height H9 of the frame body 58A.

  The function for adjusting the contact position is not limited to the case where the installation heights on the frame body 58A side are different, and the same applies to the case where the installation heights of the frame body 58A and the frame body 58B are different. Further, the contact position adjustment function is not limited to the case where the molding errors and the installation heights of the shield cases 50A and 50B are different, but also corresponds to the case where an error occurs in the installation position between the substrates 36 and 38.

  Moreover, although the cover parts 60A and 60B showed the case where they were made to contact in the middle vicinity between the frame bodies 58A and 58B which oppose, for example, it is not restricted to this. The shield cases 50A and 50B include a case where the lid portions 60A and 60B with respect to the frame bodies 58A and 58B are not displaced evenly. That is, the distance between the substrates 36 and 38 is determined by, for example, the joining of the installed front case 32 and rear case 40. At this time, when the distance from the joint portion of the front case 32 to the substrate 36 and the distance from the joint portion of the rear case 40 to the substrate 38 are different, the distances from the joint positions of the cases to the shield cases 50A and 50B are different. Thereby, the displacement amounts of the lid portions 60A and 60B may be different. Even in this case, the shield cases 50A and 50B can contact the lid portions 60A and 60B.

  <About other variations of the support recess>

  For example, as shown in FIG. 18A, trapezoidal support concave portions 82A and 82B may be used for the lid portions 60A and 60B. As described above, the lid portions 60A and 60B provided with the support concave portions 82A and 82B are brought into contact with each other when the substrates 36 and 38 are close to each other. At this time, the support concave portions 82A and 82B are displaced by sliding the support convex portions 68A and 68B in the opening portions. The distance between the substrates 36 and 38 is set. Then, the lid portions 60A and 60B are formed with bent portions on the respective side wall portions, and pressed against each other at the contact portions, so that the contact state is maintained and the lid portions 60A and 60B are firmly in contact with each other.

  <Other configuration examples of electronic devices>

  FIG. 19 illustrates another configuration example of the electronic device. In the electronic device having the above-described configuration, the external part brought into contact with the shield case 50 is either the sheet metal 34 or the other shield case 50, but is not limited thereto. An electronic device 102 shown in FIG. 19 includes a substrate 104 that can be mounted on both sides together with, for example, the second substrate 38. The substrate 104 is provided with a plurality of shield cases 50 on the upper surface side, for example. The shield case 50 is brought into contact with the sheet metal 34 installed on the front case 32. The substrate 104 includes a shield case 50 </ b> A on the back side, and is in contact with the shield case 50 </ b> B installed on the second substrate 38.

  In this way, even when the plurality of shield cases 50 are installed and the contact target is different, in the shield case or the electronic device of the present disclosure, the lid 60 is set in accordance with the installation position of the external component that is the contact target. Since it can be displaced, it is not necessary to check or adjust the contact state.

  According to such a configuration, the shield cases 50A and 50B can be reliably brought into contact by displacing the lid portions 60A and 60B in accordance with the installation state of the substrates 36 and 38, and maintain the shield function. Can do. Further, the shield cases 50A and 50B support the lid portions 60A and 60B so that they can be displaced, so that confirmation of contact state and adjustment of the installation positions of the substrates 36 and 38 can be omitted, and the assembly process of the electronic device is simplified. Can be achieved.

  [Other Embodiments]

  (1) In the above embodiment, the case where the height of the lid portion 8 is displaced only in accordance with the pressing due to the contact with the external component 20 with respect to the displacement support portion 18 is shown, but the present invention is not limited to this. For example, as shown in FIG. 20, the shield case 2 may include a lid portion 110 on which a displacement support portion 112 that supports the support portion 12 so as to be displaceable in multiple stages is formed. FIG. 20 shows a modification of the support recess.

  The displacement support part 112 includes, for example, a first displacement support part 114, a connection support part 116 that connects the first displacement support part 114 and the second displacement support part 118, the lid part 110, and the substrate 4. A second displacement support portion 118 that is supported in close proximity is included. For example, as shown in FIG. 20A, the first displacement support portion 114 is provided with a wide locking portion P <b> 1 that supports the lid portion 110 in a state of being most separated from the substrate 4. And the 1st displacement support part 114 is formed so that the opening diameter with respect to the support part 12 engaged may be narrowed according to the displacement of the cover part 110, for example.

  For example, as shown in FIG. 20B, the connection support portion 116 is formed to have the same width as the narrow portion of the first displacement support portion 114, and contacts a part of the surface of the support portion 12 to guide the displacement direction. To do. When the support part 12 is disposed at the position of the connection support part 116, the lid part 110 is elastically deformed by pressing from the frame body 6 side, so that a restoring force is applied and biased toward the external component 20 side. Is done.

  For example, as shown in FIG. 20C, the second displacement support portion 118 is provided with a locking portion P2 that supports the displacement in a state in which the lid portion 110 is close to the substrate 4 by a certain distance. Yes. The support portion 12 is engaged with the second displacement support portion 118 by, for example, contact with the external component 20 or installation work of the shield case 2. The second displacement support portion 118 is formed so as to narrow the opening diameter with respect to the support portion 12 to be engaged, for example, according to the displacement of the lid portion 110.

  For example, when the distance of the lid portion 110 with respect to the external component 20 is clear and the displacement amount of the lid portion 110 is small, the displacement support portion 112 can set the position of the support portion 12 with respect to the displacement support portion 112 in advance. Yes. In other words, when the space between the lid part 110 and the external component 20 is wide as determined from the installation position of the substrate 4, the support part 12 is arranged in advance on the locking part P <b> 1 of the first displacement support part 114. For this purpose, the support portion 12 may be disposed on the locking portion P2 of the second displacement support portion 118. No urging force is generated by engagement between the support portion 12 and the displacement support portion 112 in the locking portions P1 and P2. In this way, the displaceable width of the lid 110 is determined in advance based on the distance between the lid 110 and the external component 20. Then, by reducing the amount of displacement of the lid part 110 according to the distance between the lid part 110 and the external part 20, the pressure applied to the external part 20, the frame body 6, and the lid part 110 is reduced when the shield case 2 is installed. As a result, the assembling property of the electronic device can be improved. In addition, since the displacement amount of the lid portion 110 is reduced, damage due to the sudden opening of the lid portion can be avoided even in the disassembling process of the electronic device.

  (2) In the above embodiment, the shield case 50 includes the support convex portion 68 formed on the frame body 58 as a support portion for supporting the lid portion 60, and the support concave portion 66 as a displacement support portion formed on the lid portion 60. However, the present invention is not limited to this. The shield case 120 shown in FIG. 21 is formed, for example, by forming a support convex portion 128 as a displacement support portion inside the side wall portion 126 of the lid portion 122 and forming a support concave portion 132 as a support portion on the standing wall portion 130 of the frame 124. Also good. The lid portion 122 is locked by inserting the support convex portion 128 into the support concave portion 132 with the side wall portion 126 straddling the peripheral side of the standing wall portion 130 of the frame body 124.

  The support concave portion 132 of the frame body 124 is formed in an inverted triangular shape, for example, having a wide upper portion and narrowing toward the bottom. For example, as shown in FIG. 22A, the cover 122 installed on the frame 124 is a wide portion on the upper side of the support recess 132 when the support projection 128 is not in contact with the external component 20 and is not pressed. It is locked to. Thereby, the lid | cover part 122 can be maintained in the state most spaced apart from the frame 124, when not receiving a press.

  Moreover, when the cover part 122 is pressed by contact with the external component 20 as shown to B of FIG. 22, for example, it will displace toward the frame body 124 side. At this time, the support convex portion 128 is displaced along the support concave portion 132 of the frame body 124 and engages with the narrow portion, and the amount of insertion into the support concave portion 132 is reduced and pushed toward the outer peripheral side of the frame body 124. It is. Then, as the support convex portion 128 is pushed out from the support concave portion 132, the lid portion 122 is formed with a bent portion 140 due to elastic deformation in a part of the side wall portion 126. Due to the formation of the bent portion 140, the side wall portion 126 generates a restoring force against elastic deformation toward the standing wall portion 130 side of the frame body 124, and the supporting convex portion 128 receives the restoring force so that the supporting convex portion 128 is on the narrow side of the supporting concave portion 132. The cover portion 122 is biased toward the external component 20 by being displaced toward the wide side.

  With such a configuration, the lid portion 122 can maintain a close contact state with the external component 20 that is in contact therewith. In addition, the lid 122 is supported to be displaceable by the engagement of the support convex portion 128 and the support concave portion 132, so that the height of the lid portion 122 can be increased according to the installation error of the substrate on which the shield case 120 is installed or the electronic device. The thickness can be adjusted and brought into contact with external parts.

  (3) In the above-described embodiment, the side wall portion 14 of the lid portion 8 is integrally formed with respect to adjacent sides. However, the present invention is not limited to this. For example, as shown in FIG. 23A, the shield case 150 may be provided with a slit 152 that separates adjacent sides of the side wall portion 14 of the lid portion 8. For example, the slit 152 is formed so as to be deformed independently for each side of the side wall portion 14 and may be formed with a predetermined width.

  By forming this slit 152, the side wall portion 14 is displaced by contact of an external part or the like as shown in FIG. 23B, and the support portion 12 of the frame body 6 is displaced from the displacement support portion 18. When engaged with a narrow portion, it can be greatly deformed. Thereby, the side wall part 14 can take large restoring force with respect to the frame 6, and contact property is improved by taking large urging | biasing force with respect to an external component.

  (4) In the above-described embodiment, the cover 60 is a sheet metal 34 as an external component to be brought into contact, for example, but is not limited thereto. In this external component, for example, a part of the casing of the electronic device 30 or other electronic components to be mounted, or the sub-board is disposed so as to face the board 36, and the lid portion installed on the sub-board is displaced. You may make it contact the conventional shield case which is not made.

  (5) The support convex portions 68 and 128 are not limited to being integrally formed with the metal member of the frame body 58 or the lid portion 122. The support convex portions 68 and 128 are formed of, for example, an elastically deformable resin material, and may be installed on the standing wall portion 70 or the side wall portion 126. And the support convex parts 68 and 128 installed by the resin material will compress-deform, if it approachs the narrow part side of the support recessed parts 66 and 132 in the displacement of the cover parts 60 and 122, for example. And the support convex parts 68 and 128 give the urging | biasing force to the cover parts 60 and 122 by trying to displace toward the latching | locking part P1 side of the support recessed parts 66 and 132 with the restoring force with respect to a compressive deformation. Also good.

  Next, the following additional notes are disclosed with respect to the embodiment described above. The present invention is not limited to the following supplementary notes.

(Additional remark 1) It is a shield case provided with the frame surrounding the circumference of the electronic component mounted in the board, and the lid part installed ranging over the frame,
The frame body is formed with a support portion that contacts and supports the lid portion,
The lid portion is engaged with an upper plate portion that covers the upper surface side of the frame body and is in contact with an external part so as to be displaceable along the support portion of the frame body. A side wall portion formed with a displacement support portion for generating a biasing force,
The shield case is characterized in that the upper plate portion is supported separately from the frame body.

  (Additional remark 2) The said upper plate part is pressed by the said upper plate part by the contact with the said external part, and the said side wall part faces the said external part according to the displacement of the said side wall part by this press. The shield case according to appendix 1, wherein the shield case is biased.

  (Supplementary note 3) The supplementary note 1 or the supplementary note 2, wherein the lid portion has a minimum urging force of an engagement portion with the frame body when the contact with the external part is released. Shield case.

  (Supplementary Note 4) The lid portion is deformed by a displacement due to the pressing to the upper plate portion, and the peripheral portion of the displacement support portion that engages with the support portion is deformed, and the attaching portion directed toward the external component by a restoring force against the deformation. The shield case according to any one of appendix 1 to appendix 3, wherein a force is generated.

(Additional remark 5) The said displacement support part and the said support part are formed combining a support convex part and the support recessed part fitted to this support convex part,
The support concave portion is formed to be narrower than the support convex portion and a locking portion for locking the support convex portion, and comes into contact with a part of the support convex portion by displacement of the lid portion. The shield case according to any one of supplementary notes 1 to 4, further comprising a guide portion that guides the lead to the locking portion side.

  (Appendix 6) The shield according to appendix 5, wherein the guide portion is formed to communicate with the locking portion and guides the support convex portion along the displacement direction of the lid portion. Case.

  (Supplementary Note 7) The supporting recess is configured such that, as the displacement distance of the lid portion increases, a width of engagement with the support convex portion is narrowed to set an urging force to the lid portion. The shield case according to appendix 5.

(Appendix 8) a board on which electronic components are mounted;
A shield case that shields the electronic component by a frame that surrounds the periphery of the electronic component that is installed and mounted on the substrate, and a lid that covers the frame;
An external part disposed on the upper surface side of the shield case and brought into contact with a part of the shield case;
With
The frame body is formed with a support portion that contacts and supports the lid portion,
The lid portion is engaged with an upper plate portion that covers an upper surface side of the frame body and is brought into contact with the external component, and is displaceably engaged along the support portion of the frame body, and the upper plate portion according to the displacement. A displacement support portion that generates a biasing force against the side wall portion,
The electronic device according to claim 1, wherein the lid portion is supported by the upper plate portion being separated from the frame body.

  (Additional remark 9) As for the said cover part, the said upper plate part is pressed by contact with the said external component, and according to the displacement of the said side wall part by this press, the said side wall part faces the said external component, and the said upper plate part 9. The electronic device according to appendix 8, wherein the electronic device is biased.

  (Additional remark 10) The said external component contains the other shield case which shields the electronic component mounted in the other board | substrate, and makes the upper-plate part of the said shield case, and the upper-plate part of this other shield case contact. The electronic device according to appendix 8 or appendix 9, wherein the electronic device is biased in the opposite direction.

As described above, the most preferable embodiment of the present invention has been described. However, the present invention is not limited to the above description, and is described in the claims or disclosed in the specification. It goes without saying that various modifications and changes can be made by those skilled in the art based on the gist, and such modifications and changes are included in the scope of the present invention.

2, 50, 50A, 50B, 120, 150 Shield case 4, 104 Substrate 6, 58, 58A, 58B, 124 Frame 8, 60, 60A, 60B, 110, 122 Lid 10, 70, 70A, 70B, 130 Standing wall portion 12 Support portion 14, 64, 126 Side wall portion 16, 62 Upper plate portion 18, 112 Displacement support portion 20 External component 22 Electronic component 24, 72 Upper frame portion 26, 74 Opening portion 30, 90, 102 Electronic device 32 Front Case 34 Sheet metal 36 First substrate 38 Second substrate 40 Rear case 56 Mounting parts 66, 66A, 66B, 82, 132 Support recesses 68, 68A, 68B, 128 Support protrusions 80 Deformation parts 100, 140 Bending parts 114 1 displacement support portion 116 connection support portion 118 second displacement support portion

Claims (5)

A shield case comprising a frame body that surrounds the periphery of an electronic component mounted on a substrate, and a lid that is installed across the frame body,
The frame body is formed with a support portion that contacts and supports the lid portion,
The lid portion is engaged with an upper plate portion that covers the upper surface side of the frame body and is in contact with an external part so as to be displaceable along the support portion of the frame body. A side wall portion formed with a displacement support portion for generating a biasing force,
The shield case is characterized in that the upper plate portion is supported separately from the frame body.   In the lid portion, the upper plate portion is pressed by contact with the external component, and the side wall portion biases the upper plate portion toward the external component in accordance with the displacement of the side wall portion due to the pressing. The shield case according to claim 1, wherein: The displacement support part and the support part are formed by combining a support convex part and a support concave part fitted to the support convex part,
The support concave portion is formed to be narrower than the support convex portion and a locking portion for locking the support convex portion, and comes into contact with a part of the support convex portion by displacement of the lid portion. The shield case according to claim 1, further comprising a guide portion that guides the lead to the locking portion side.   The urging force with respect to the lid portion is set by narrowing a width of the support recess to engage with the support convex portion in accordance with an increase in a displacement distance of the lid portion. Shield case described in. A board on which electronic components are mounted;
A shield case that shields the electronic component by a frame that surrounds the periphery of the electronic component that is installed and mounted on the substrate, and a lid that covers the frame;
An external part disposed on the upper surface side of the shield case and brought into contact with a part of the shield case;
With
The frame body is formed with a support portion that contacts and supports the lid portion,
The lid portion is engaged with an upper plate portion that covers an upper surface side of the frame body and is brought into contact with the external component, and is displaceably engaged along the support portion of the frame body, and the upper plate portion according to the displacement. A displacement support portion that generates a biasing force against the side wall portion,
The electronic device according to claim 1, wherein the lid portion is supported by the upper plate portion being separated from the frame body.

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