JP6125264B2 - Electronic device with flexible lead board - Google Patents

Description

  The present invention relates to an electronic device such as a communication terminal, and more particularly to an electronic device incorporating a flexible lead substrate.

Conventionally, in electronic devices such as communication terminals, a plurality of electronic components are mounted on a circuit board, and a plurality of electronic components such as sensors and IC chips are mounted on the flexible lead board. A substrate structure connected to the substrate is employed (see, for example, Patent Document 1).
According to such a board structure, it is possible to arrange the electronic components on the flexible lead board at a suitable position away from the circuit board and to simplify the assembly of the electronic device.

  In an electronic device having such a substrate structure, when an electronic component to be installed at an accurate height inside the device, such as a proximity sensor, is mounted on the flexible lead substrate, the flexible lead substrate is placed inside the device. It is necessary to securely fix the chassis surface so that there is no lifting.

  Therefore, conventionally, a plurality of end portions of the flexible lead substrate are bonded and fixed to the surface of the main chassis with a double-sided adhesive tape or the like.

JP 2011-205493 A

  However, in an electronic device in which a plurality of end portions of a flexible lead substrate are bonded and fixed to the chassis surface inside the device with a double-sided adhesive tape or the like, it is necessary to secure a plurality of adhesive regions on the flexible lead substrate. There was a problem that the area became large. Since a large number of electronic components are arranged around the flexible lead substrate, the size of the device increases as the area of the flexible lead substrate increases.

  Accordingly, an object of the present invention is to provide an electronic device capable of reducing the installation area of a flexible lead substrate.

  In the electronic apparatus according to the present invention, one or a plurality of electronic components are mounted between the front-side main body chassis (11) and the rear-side main body chassis (12) which are joined together to form the main body (1). A lead substrate (6) is installed.

  Here, the flexible lead substrate (6) includes a U-shaped elastic base portion (67) formed by bending a flat elastic base portion (68) into a U-shape, and the U-shaped elastic base portion. The one or more electronic components are mounted on the surface of (67).

  The end of the U-shaped elastic base portion (67) opposite to the bent portion (65) is fixed to at least one of the body chassis (11), and the U-shaped elastic base portion ( 67) due to the elastic restoring force exerted by the bent portion (65), both surfaces of the U-shaped elastic base portion (67) are opposed to the front surface main body chassis (11) and the rear surface main body chassis (12). ) (18), thereby holding the flexible lead substrate (6).

  According to the electronic apparatus of the present invention, the end of the flexible lead substrate (6) opposite to the bent portion (65) of the U-shaped elastic base portion (67) is bonded to at least one of the body chassis. However, both ends of the bent portion (65) side are opposed to the front-side main body chassis (11) and the rear-side main body chassis (12) by the elastic repulsive force of the bent portion (65), respectively. Since the flexible lead substrate (6) is held in pressure contact with the surfaces (17) and (18), it is not necessary to fix the end on the bent portion (65) side with a double-sided adhesive tape or the like.

  In a specific aspect, the flexible lead substrate (6) has the one or more electronic components mounted on one surface of the flat elastic base portion (68), and the U-shaped elastic base with the one surface facing outward. Part (67) is formed, and openings (19) and (16) for accommodating the one or a plurality of electronic components are formed in both or one of the front side main body chassis (11) and the rear side main body chassis (12). ing.

  According to this specific embodiment, one or a plurality of electronic components on the U-shaped elastic base portion (67) are formed on both or one of the front side body chassis (11) and the back side body chassis (12). Since they are accommodated in the openings (19) and (16), the height of the one or more electronic components does not affect the thickness of the device.

  In a more specific embodiment, a boss (15) projects from one of the main body chassis toward the other main body chassis, and the boss (15) is a U-shape of the flexible lead board (6). The elastic base portion (67) penetrates through holes (63) and (64) provided at the end opposite to the bent portion (65).

  According to the specific embodiment, in the assembly process of the device, the boss (15) is inserted into the through hole (64) provided at one end of the flat elastic base portion (68) constituting the flexible lead substrate (6). ), When the flat elastic base portion (68) is bent into a U shape, the boss (15) is inserted into the through hole (63) formed at the other end of the flat elastic base portion (68). ), The flat elastic base portion (68) is accurately bent, and the U-shaped elastic base portion (67) having the desired shape is obtained.

  According to the electronic device of the present invention, it is not necessary to fix the end of the flexible lead substrate (6) on the bent portion (65) side of the U-shaped elastic base portion (67) with a double-sided adhesive tape or the like. The bonding area of the lead substrate (6) can be reduced, and thereby the installation area of the flexible lead substrate (6) can be reduced.

FIG. 1 is a perspective view showing a front surface of a communication terminal according to an embodiment of the present invention. FIG. 2 is a perspective view showing the back of the communication terminal. FIG. 3 is an exploded perspective view corresponding to FIG. 1 of the communication terminal. 4 is an exploded perspective view of the same as seen from a different direction from FIG. FIG. 5 is an exploded perspective view of the communication terminal corresponding to FIG. 6 is an exploded perspective view of the same as seen from a different direction from FIG. FIG. 7 is a cross-sectional view taken along the line SS of FIG. FIG. 8 is an enlarged cross-sectional view of part A of FIG. FIG. 9 is a perspective view showing the flexible lead substrate before bending. FIG. 10 is a perspective view showing a state in which the flexible lead board of FIG. 9 is turned upside down. FIG. 11 is a perspective view showing the flexible lead substrate after bending. FIG. 12 is a perspective view showing a state in which the flexible lead board of FIG. 11 is turned upside down. FIG. 13 is a front view of the flexible lead substrate before bending. FIG. 14 is a front view of the flexible lead substrate after bending.

Hereinafter, embodiments of the present invention implemented in a communication terminal will be described in detail with reference to the drawings.
As shown in FIGS. 1 and 2, a communication terminal according to an embodiment of the present invention includes a touch operation unit (4) built in a flat rectangular parallelepiped body (1), and the touch operation unit (4) is touched. The operation surface (41) is exposed from the front surface of the main body (1). The touch operation unit (4) includes a flat display and a touch panel arranged so as to cover the surface of the display.
A back cover panel (2) is fixed to the back surface of the main body (1) so as to cover the back surface, and a battery cover (3) is attached so as to be removable.

As shown in FIG. 7, the main body (1) is configured by joining a front-side main body chassis (11) and a rear-side main body chassis (12) to each other.
A circuit board (5) and a flexible lead board (6) are arranged between the front side main body chassis (11) and the rear side main body chassis (12), as shown in FIGS. A lead part (62) extending from the lead board (6) is connected to the circuit board (5).

  In addition, the rear body chassis (12) is provided with an earphone jack (13), and the earphone jack (13) is connected to the rear side by a holder member (14) constituting a part of the rear side body chassis (12). It is held in the main chassis (12).

  The flexible lead substrate (6) has a U-shaped elastic base formed by bending a flat elastic base portion (68) shown in FIGS. 9, 10 and 13 into a U-shape as shown in FIGS. A portion (67) and a lead portion (62) drawn from the U-shaped elastic base portion (67).

  As shown in FIGS. 9 and 10, the flexible lead substrate (69) before bending includes a flat elastic base portion (68) and a lead portion (62) drawn from the flat elastic base portion (68). In particular, one proximity sensor (7) and a plurality of IC chips (61) are mounted on one surface of the flat elastic base portion (68).

The proximity sensor (7) is disposed in the vicinity of the receiver unit described later, and is turned on when the receiver unit is brought close to the ear to generate a signal for reducing the illuminance of the display of the touch operation unit (4). For accurate operation of the proximity sensor (7), it is necessary to accurately define the distance to the surface of the touch operation unit (4) shown in FIG. 3, that is, the height position inside the main body (1). .
The plurality of IC chips (61) process signals from the proximity sensor (7).

As shown in FIGS. 9 and 10, a terminal portion (66) is provided at the tip of the lead portion (62) of the flexible lead board (69) before bending, and the terminal portion (66) is shown in FIGS. 6 is connected to the connector (51) on the circuit board (5).
Further, on the back side of the touch operation unit (4), as shown in FIG. 8, a bone conduction vibration element (9) constituting a receiving part is disposed in the vicinity of the proximity sensor (7).

As shown in FIGS. 9 and 10, through holes (63) and (64) are formed at both ends of the flat elastic base portion (68) of the flexible lead substrate (69) before bending, respectively. In the flexible lead board (6) after being bent as shown in FIG. 12, the two through holes (63) (at the end of the U-shaped elastic base part (67) opposite to the bent part (65)). 64) will overlap each other.
In the flexible lead substrate (6) after being bent, the proximity sensor (7) and the IC chip (61) are arranged on both surfaces of the U-shaped elastic base portion (67).

As shown in FIG. 8, a boss (15) is projected from the front side main body chassis (11) toward the rear side main body chassis (12), and the boss (15) passes through the flexible lead board (6). It penetrates the holes (63) and (64).
The front body chassis 11 has an opening 19 for receiving the proximity sensor 7 of the flexible lead board 6 (see FIGS. 5 and 6), and the rear body chassis. The holder member (14) constituting a part of (12) has an opening (16) in which a plurality of IC chips (61) of the flexible lead substrate (6) are to be accommodated (FIGS. 3 and 4). reference).

  Here, as shown in FIG. 8, the flexible lead substrate (6) has a U-shaped elastic base portion (67) at the end opposite to the bent portion (65) by a double-sided adhesive tape (8). 11) and the two base part regions forming the end opposite to the bent part (65) of the U-shaped elastic base part (67) are fixed to each other by the double-sided adhesive tape (81). ing.

  On the other hand, at the end of the flexible lead substrate (6) on the bent portion (65) side of the U-shaped elastic base portion (67), the U-shaped elastic base portion ( 67) are pressed against the front body chassis (11) and the opposed surfaces (17) and (18) of the holder member (14), whereby the flexible lead board (6) is connected to the front body chassis (11). It is held between the rear body chassis (12).

  A shallow groove into which the U-shaped elastic base portion (67) of the flexible lead substrate (6) is fitted is formed in the opposing surfaces (17) and (18) of the front body chassis (11) and the holder member (14). However, the U-shaped elastic base part (67) is fixed to the opposed surfaces (17) and (18) of the front body chassis (11) and the holder member (14) at the end on the bent part (65) side. A double-sided adhesive tape is not provided.

  In the assembly process of the communication terminal, the flexible lead is attached with the double-sided adhesive tape (8) (81) attached to the end of the flexible lead substrate (69) before bending as shown in FIGS. The board (69) is installed on the front body chassis (11), and the through hole (63) of the front body chassis (11) is passed through one through hole (64) of the flexible lead board (69). At the same time, one end of the flat elastic base portion (68) is fixed to the front side main body chassis (11) with a double-sided adhesive tape (8).

Next, the flat elastic base portion (68) of the flexible lead substrate (69) is bent into a U shape, and the front side body chassis (11) is inserted into the other through hole (63) of the flexible lead substrate (69). While passing through the through hole (63), the other end of the flat elastic base portion (68) is fixed to one end of the flat elastic base portion (68) by the double-sided adhesive tape (81).
Accordingly, the flat elastic base portion (68) is bent so as to be accurately overlapped to form the U-shaped elastic base portion (67) having an intended U-shape.

Thereafter, the rear side main body chassis (12) is fixed to the front side main body chassis (11).
As a result, the flexible lead board (6) is sandwiched between the front-side main body chassis (11) and the rear-side main body chassis (12), and the U-shaped elastic base portion (67) is elastically compressed. Due to the elastic repulsive force exerted by the bent portion (65) of the elastic base portion (67), both sides of the end portion of the U-shaped elastic base portion (67) on the bent portion (65) side are front side body chassis (11). And it comes in pressure contact with the opposing surfaces (17) and (18) of the holder member (14).

  According to the above communication terminal, the end of the flexible lead board (6) opposite to the bent portion (65) of the U-shaped elastic base portion (67) is attached to the front side main body chassis by the double-sided adhesive tape (8). Although fixed to (11), the end on the bent portion (65) side faces the front-side body chassis (11) and the holder member (14) by the elastic repulsive force of the bent portion (65), respectively. Since the flexible lead substrate (6) is held in pressure contact with the surfaces (17) and (18), it is not necessary to fix the end on the bent portion (65) side with a double-sided adhesive tape or the like.

Further, since the thickness of the U-shaped elastic base portion (67) of the flexible lead substrate (6) is only about 0.5 mm, the thickness of the flexible lead substrate (6) increases the thickness of the communication terminal. There is nothing.
However, the proximity sensor (7) and the IC chip (61) on the U-shaped elastic base (67) are accommodated in the front side body chassis (11) and the openings (19) and (16) of the holder member (14). Therefore, the height of the proximity sensor (7) and the IC chip (61) does not affect the thickness of the communication terminal.

As described above, according to the communication terminal according to the present invention, the flexible lead board (6) is constituted by the U-shaped elastic base portion (67) formed by bending the flat elastic base portion (68) into a U shape. Therefore, the area of the planar shape of the flexible lead substrate (6) is halved. However, the flexible lead substrate (6) does not need to be fixed to the bent portion (65) side of the U-shaped elastic base portion (67) with a double-sided adhesive tape or the like. The area can be reduced.
As a result, the installation area of the flexible lead substrate (6) can be reduced, and as a result, the size of the communication terminal can be reduced.

  Further, since the proximity sensor (7) and the IC chip (61) are mounted on only one side of the flat elastic base portion (68) forming the flexible lead substrate (69) before bending, the flexible lead substrate The manufacturing cost of (6) is low.

  In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim. For example, a double-sided pressure-sensitive adhesive tape (81) for fixing two base portion regions forming an end opposite to the bent portion (65) of the U-shaped elastic base portion (67) of the flexible lead substrate (6) is It can be omitted.

  In addition, the present invention is not limited to a communication terminal in which a proximity sensor (7) is mounted on a flexible lead board (6), but also various electronic devices in which electronic components other than the proximity sensor (7) are mounted on a flexible lead board (6). Can be implemented on equipment.

(1) Body
(11) Front side chassis
(12) Rear side chassis
(14) Holder material
(15) Boss
(16) Opening
(19) Opening
(17) Opposite surface
(18) Opposite surface
(2) Back cover panel
(4) Touch operation unit
(5) Circuit board
(6) Flexible lead board
(62) Lead
(63) Through hole
(64) Through hole
(65) Bend
(67) U-shaped elastic base
(68) Flat elastic base
(7) Proximity sensor

Claims (6)

In an electronic device incorporating a flexible lead board on which one or more electronic components are mounted between a front-side main body chassis and a rear-side main body chassis that are joined together to form a main body,
The flexible lead board includes a U-shaped elastic base portion formed by bending a flat elastic base portion into a U shape, and the one or more electronic components are mounted on the surface of the U-shaped elastic base portion. And an end of the U-shaped elastic base portion opposite to the bent portion is fixed to at least one of the body chassis, and an elastic restoring force exerted by the bent portion of the U-shaped elastic base portion Accordingly , both surfaces of the U-shaped elastic base portion are in contact with the opposing surfaces of the front-side main body chassis and the rear-side main body chassis, respectively , thereby holding the flexible lead substrate.
Electronic equipment with built-in flexible lead board.   A circuit board on which a plurality of electronic components are mounted is disposed between the front side main body chassis and the rear side main body chassis, and the flexible lead board is disposed at a position away from the circuit board, The electronic device according to claim 1, wherein a lead portion of the flexible lead substrate is connected to the circuit substrate.   The flexible lead board has the one or more electronic components mounted on one side of the flat elastic base part, the U-shaped elastic base part is formed with the one side facing outward, and the front-side main body chassis and The electronic device according to claim 1, wherein an opening for accommodating the one or a plurality of electronic components is formed in both or one of the back side main body chassis. Wherein said U-shaped resilient base portion of the flexible lead substrate, the provided is fixed by the adhesive member end opposite to the one of the body chassis and the bent portion, the end portion of the bent portion side is not fixed,
The electronic device according to claim 1. Wherein said U-shaped resilient base portion of the flexible lead substrate, the at the end opposite to the bent portion, claims two base regions for forming the end portion are fixed to each other by the adhesive member 1 The electronic device according to claim 4. The one of the main chassis, the boss is projected toward the other of the body chassis, the boss is on the end opposite to the bent portion of the U-shaped resilient base portion of the flexible lead substrate 6. The electronic device according to claim 1, wherein the electronic device passes through the established through hole.

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