JP2014220190A - Light source module and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source module which does not need to prepare heat radiation fins having heat radiation amounts adapted to luminosity levels of respective lighting fixtures, also does not need to prepare common heat radiation fins adaptable to all the luminosity levels, and is adapted to the luminosity levels required by the lighting fixtures.SOLUTION: A light source module comprises an attachment base board 1 having a plurality of penetration holes 2 formed therein, and a heat radiation base board 3 having an LED 5 as a light source on one face, and heat radiation fins 4 for radiating heat generated by the LED 5 on the other face. The heat radiation base board 3 is attached to the attachment base board 1 so that the LED 5 is arranged at the penetration hole 2 side.

Description

  The present invention relates to a light source module having an LED as a light source, and a lighting fixture including the light source module.

  A conventional light source module is provided in a lighting device such as a downlight that is embedded in a ceiling, and includes an LED used as a light source and a heat radiation fin for effectively releasing heat generated by the LED. (For example, refer to Patent Document 1).

JP 2012-48996 A

However, since the light source module described in Patent Document 1 is generally provided with a dedicated heat radiation fin having a heat radiation amount corresponding to the brightness level of the light source, it corresponds to the brightness level of each lighting fixture. Since it was necessary to prepare each radiation fin having the heat radiation amount, there was a problem that the manufacturing cost was high.
In addition, it is possible to prepare a common radiating fin that can handle all brightness levels and use it without distinguishing lighting fixtures. However, for example, lighting fixtures with a large brightness level have a sufficient heat dissipation effect. In the case of a lighting fixture that cannot be obtained or has a low brightness level, there are problems that the heat dissipating fins are too large to be incorporated into the lighting fixture as they are, and the weight of the lighting fixture becomes heavy.

  The present invention has been made in order to solve the above-described problems, and it is not necessary to prepare heat radiating fins each having a heat radiation amount corresponding to the brightness level of each luminaire, and at all brightness levels. It is an object of the present invention to provide a light source module and a luminaire corresponding to the brightness level required by the luminaire without the need to prepare a common heat radiation fin.

  A light source module according to the present invention includes a mounting substrate having a plurality of through holes, an LED as a light source on one surface, and a heat dissipation fin that releases heat generated by the LED on the other surface. The heat dissipation board is attached to the attachment board so that the LEDs are arranged on the through hole side.

According to the light source module according to the present invention, it is possible to make a light source module according to the brightness level required by the lighting fixture by changing the number of heat dissipating substrates attached to the mounting substrate.
For this reason, it is not necessary to prepare heat radiating fins each having a heat radiating amount corresponding to the brightness level of each lighting fixture, so that the manufacturing cost can be reduced.
In addition, since it is not necessary to prepare a common radiating fin that can handle all brightness levels, a lighting device with a large brightness level may not provide the necessary heat dissipation effect. With a small luminaire, it is possible to avoid the fact that the radiating fins are too large to be incorporated into the luminaire as they are, and that the weight of the luminaire becomes heavy.

It is a front view of the attachment board | substrate of the light source module which concerns on embodiment of this invention. It is a top view of the thermal radiation board | substrate of the light source module which concerns on embodiment of this invention. It is a bottom view of the thermal radiation board | substrate of the light source module which concerns on embodiment of this invention. It is the top view and bottom view of the light source module of the low brightness level which concern on embodiment of this invention. It is the upper side figure and bottom view of the light source module of the intermediate | middle brightness level which concerns on embodiment of this invention. It is the top view and bottom view of the light source module of the high brightness level which concern on embodiment of this invention. It is a perspective view of the lighting fixture provided with the light source module which concerns on embodiment of this invention. It is a bottom view of the lighting fixture provided with the light source module which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below. Moreover, in the following drawings, the relationship of the size of each component may be different from the actual one.
Embodiment.
1 is a front view of a mounting substrate 1 of a light source module according to an embodiment of the present invention, FIG. 2 is a top view of a heat dissipation substrate 3 of the light source module according to the embodiment of the present invention, and FIG. It is a bottom view of the heat sink substrate 3 of the light source module according to the embodiment.
The light source module according to the present embodiment includes an attachment substrate 1 and a heat dissipation substrate 3.
As shown in FIG. 1, the mounting substrate 1 is a circular metal plate, and a plurality of fan-shaped through holes 2 are formed on the surface. Here, as for the circular attachment board | substrate 1, the area | region which can arrange | position the thermal radiation board | substrate 3 becomes narrow as it goes to the center. Therefore, the heat dissipation substrate 3 can be arranged in a narrow region of the mounting substrate 1 by making the shape of the through hole 2 a fan shape as in the present embodiment, or other shape whose width becomes narrower toward the center, The arrangement area of the mounting substrate 1 can be used effectively.

A plurality of through-holes 2 are formed on two concentric circles of the mounting substrate 1 at equal intervals while being shifted in the circumferential direction, and the through-holes 2 are formed so that the width decreases toward the center of the mounting substrate 1. (Through hole 2a shown in FIG. 1). One is also formed at the center of the mounting substrate 1 (through hole 2b shown in FIG. 1).
By forming in this way, as many through holes 2 as possible can be formed by effectively using the surface of the mounting substrate 1.

  Each through hole 2 is closed by a metal lid portion 2c having the same shape as the through hole 2, and the lid portion 2c is removed by punching out the lid portion 2c at a predetermined position when necessary. Thus, the through hole 2 is opened. Therefore, the through-hole 2 that is not used is closed by the lid portion 2c, and the through-hole 2 is not conspicuous when incorporated in a lighting fixture, and it looks good.

  The heat dissipating board 3 is made of, for example, aluminum die-cast having excellent heat conductivity. For example, a COB spec or multi-lamp spec LED 5 is attached to the lower surface as a light source. It is designed to communicate effectively. In addition, on the upper surface, heat radiation fins 4 that release heat generated by the LEDs 5 are integrally formed. In the present embodiment, the number of the LEDs 5 attached to the heat dissipation board 3 is one, but it may be two or more according to the required brightness.

  As shown in FIG. 3, the heat radiating substrate 3 is formed in the same fan shape as the through hole 2 of the mounting substrate 1 in plan view, and its outline is slightly larger than the through hole 2. This is because the heat dissipation substrate 3 is attached to the attachment substrate 1 so that the entire LED 5 can be seen from the through hole 2. The heat radiating board 3 integrally formed with the heat radiating fins 4 is formed in such a size or shape as to be able to radiate the amount of heat generated by the LEDs 5 that output a brightness of about 1000 lm, for example.

In addition, although the shape of the through hole 2 of the mounting substrate 1 is a fan shape, the shape is not limited to the shape, and may be arbitrarily selected according to the shape of the mounting substrate 1 such as a rectangular shape, a triangular shape, a trapezoidal shape, and the like. The size of the through hole 2 can be arbitrarily determined according to the shape of the heat dissipation substrate 3 to be used.
Further, the shape and size of the heat dissipation substrate 3 can be arbitrarily determined according to the through hole 2.
Further, although the heat radiating fins 4 are integrally formed on the lower surface of the heat radiating substrate 3, a separate heat radiating fin 4 may be attached to the heat radiating substrate 3.
Moreover, as a method of attaching the heat dissipation board 3 to the mounting board 1, for example, a fitting portion is provided on both of them, and they are attached by fitting.

  In the above configuration, a plurality of heat dissipation substrates 3 in which LEDs 5 as light sources are attached in advance to form a unit are prepared, and a necessary number of heat dissipation substrates 3 are attached to the mounting substrate 1 according to a predetermined brightness level as a lighting fixture. .

FIG. 4 is a top view and a bottom view of the light source module 10a having a low brightness level according to the embodiment of the present invention. (A) is a top view and (b) is a bottom view.
For example, in the case of a lighting fixture having a brightness of class 500, five heat dissipating boards 3 (5000 lm) are required as shown in FIG. Therefore, the lid 2c is removed to open the five through holes 2 so that these heat radiating substrates 3 are arranged in a balanced manner with respect to the mounting substrate 1, and the LEDs 5 can be seen from the opened through holes 2. In this way, each heat dissipation board 3 is arranged and attached to the mounting board 1.

FIG. 5 is a top view and a bottom view of a light source module 10b having an intermediate brightness level according to the embodiment of the present invention. (A) is a top view and (b) is a bottom view.
Next, in the case of a lighting fixture whose brightness is class 700, nine heat dissipation boards 3 (7000 lm) are required as shown in FIG. Therefore, the cover portion 2c is removed to open the nine through holes 2 so that these heat radiating substrates 3 are arranged in a balanced manner with respect to the mounting substrate 1, and the LEDs 5 can be seen from the opened through holes 2. In this way, each heat dissipation board 3 is arranged and attached to the mounting board 1.

FIG. 6 is a top view and a bottom view of the light source module 10c having a high brightness level according to the embodiment of the present invention. (A) is a top view and (b) is a bottom view.
Next, in the case of a lighting fixture whose brightness is class 900, as shown in FIG. 6, 13 heat dissipation boards 3 (9000 lm) are required. Therefore, all the lid portions 2c of the mounting substrate 1 are removed to open the thirteen through holes 2, and the heat dissipating substrates 3 are arranged so that the LEDs 5 can be seen from the opened through holes 2, Install.

FIG. 7 is a perspective view of a lighting fixture including the light source module 10 according to the embodiment of the present invention, and FIG. 8 is a bottom view of the lighting fixture including the light source module 10 according to the embodiment of the present invention.
As shown in FIG. 7, the light source module 10 assembled as described above has an attachment arm 11 attached to the side of the attachment substrate 1 on which the heat dissipation substrate 3 is attached, and the LED 5 on the opposite side is attached. As shown in FIG. 8, a translucent cover 12 having a lens 12 a provided at a position facing the LED 5 is attached to the visible surface.
The mounting arm 11 has a plurality of screw holes (three in the present embodiment), and is used for screw fixing to a ceiling or the like.
The translucent cover 12 is for protecting the LED 5 and diffusing the light of the LED 5, and has the purpose of improving the design.
Further, a power supply device 14 for supplying power is attached to the light source module 10 via a connection cord 13.

  As described above, according to the light source module 10 according to the present embodiment, the light source module 10 corresponding to the brightness level required by the lighting fixture is made by changing the number of the heat dissipation boards 3 attached to the attachment board 1. be able to.

For this reason, it is not necessary to prepare heat radiating fins each having a heat radiating amount corresponding to the brightness level of each lighting fixture, so that the manufacturing cost can be reduced.
Also, since it is not necessary to prepare a common radiating fin that can handle all brightness levels, a lighting device with a high brightness level may not provide the necessary heat dissipation effect, and the brightness level may not be sufficient. With a small luminaire, it is possible to avoid the fact that the radiating fins are too large to be incorporated into the luminaire as they are, and that the weight of the luminaire becomes heavy.

  DESCRIPTION OF SYMBOLS 1 Mounting board, 2 Through-hole, 2a (Concentric circle) Through-hole, 2b (Center part) Through-hole, 2c Cover part, 3 Radiation board, 4 Radiation fin, 5 LED, 10 Light source module, 10a Light source module, 10b Light source module, 10c Light source module, 11 Mounting arm, 12 Translucent cover, 12a Lens, 13 Connection cord, 14 Power supply device.

Claims (10)

A mounting substrate having a plurality of through holes;
A heat dissipating board having an LED as a light source on one surface and a heat dissipating fin for releasing heat generated by the LED on the other surface;
The light radiating board is attached to the mounting board so that the LEDs are arranged on the through hole side. 2. The light source module according to claim 1, wherein a number of the heat dissipation boards corresponding to a required brightness are attached to the attachment board. The light source module according to claim 1, wherein the through hole is formed in a fan shape. 4. The light source module according to claim 1, wherein the heat dissipation substrate is formed in a fan shape in plan view. The light source module according to claim 4, wherein the heat dissipation substrate has a larger outline than the through hole. The light source module according to any one of claims 1 to 5, wherein the mounting substrate is circular, and the through holes are formed on a concentric circle at equal intervals. The light source module according to claim 6, wherein the through holes are formed at equal intervals on at least two or more concentric circles while being shifted in the circumferential direction. The said through-hole is formed so that a width | variety may become narrow toward the center of the said attachment board | substrate. The Claim 3 which depends on the Claim 3 or Claim 4-7 according to Claim 3 characterized by the above-mentioned. The light source module described. The light source module according to any one of claims 1 to 8, wherein the through hole is opened by punching and removing a lid that closes the through hole.   The lighting fixture provided with the light source module as described in any one of Claims 1-9.

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