JP2010218852A - Module structure of heat dispersion unit for led light - Google Patents

Module structure of heat dispersion unit for led light Download PDF

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JP2010218852A
JP2010218852A JP2009063563A JP2009063563A JP2010218852A JP 2010218852 A JP2010218852 A JP 2010218852A JP 2009063563 A JP2009063563 A JP 2009063563A JP 2009063563 A JP2009063563 A JP 2009063563A JP 2010218852 A JP2010218852 A JP 2010218852A
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led light
aluminum substrate
heat
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light unit
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JP5222188B2 (en
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Gao-Shan Chen
高山 陳
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a module structure of a heat dispersion unit for an LED light capable of being quickly assembled and removed by screws. <P>SOLUTION: The module structure consists of an outer shell 10 having a vertex lid 11 and a bottom shell 12, and an independent type single illumination lamp module 20 made up of a heat dispersion component 23, an LED light unit, and a lamp shade 25, and equipped with an aluminum substrate 21 and a heat-dispersion component 23. Inside the bottom shell 12, a housing installation tub equipped with a housing installation space is formed, at a lower end face of which, several pieces of bored holes 121 and a device hole 122 are opened, and several pieces of screw holes 211 are opened at the four peripheries of the device hole 122. The several screw holes 211 are opened on the aluminum substrate 21, in correspondence to screw holes 123 of the bottom shell 12, and a layer of a circuit plate 22 is fitted on the lower end face. The heat-dispersion component 23 is set and fixed on a top-end face of the aluminum substrate 21, the LED light unit is set on the circuit plate 22 at a lower end face of the aluminum substrate 21, and the lamp shade 25 is screwed and fitted in with screws on the circuit plate 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、LEDライト用散熱器のモジュール構造に係り、特にアルミニウム基板、散熱部品、LEDライトユニット、ランプシェードを備えた照明灯モジュールであって、ネジにより迅速な組み立て、取り外しを可能としたLEDライト用散熱器のモジュール構造に関するものである。   The present invention relates to a module structure of a heat dissipator for an LED light, and in particular, an illuminating light module including an aluminum substrate, a heat dissipating component, an LED light unit, and a lamp shade, which can be quickly assembled and removed with screws. The present invention relates to a module structure of a heat dissipator for lights.

図１、２に示す米国特許第7338186号に記載の従来の散熱器構造は、四側面にそれぞれ数個の散熱孔41を設置した外殼40、散熱部品50、アルミニウム基板60、LEDライトユニット71、回路板72を備えるライトユニット70、ランプシェード80を備えて構成されている。前記散熱部品50は、前記アルミニウム基板60の上端面に設置し、前記外殼40と該アルミニウム基板60を固定している。これにより、前記散熱部品50は、前記外殼40内に覆われ、前記ライトユニット70はアルミニウム基板60の下端面に設置し、さらにランプシェード80を固定している。   The conventional heat dissipator structure described in US Pat. No. 7,338,186 shown in FIGS. A light unit 70 including a circuit board 72 and a lamp shade 80 are provided. The heat dissipating component 50 is installed on the upper end surface of the aluminum substrate 60 and fixes the outer casing 40 and the aluminum substrate 60 to each other. Thus, the heat dissipation component 50 is covered in the outer casing 40, the light unit 70 is installed on the lower end surface of the aluminum substrate 60, and the lamp shade 80 is fixed.

しかしながら、上記従来の構造には、以下のような欠点が存在する。   However, the conventional structure has the following drawbacks.

1. 従来の散熱器構造において、アルミニウム基板60には穿孔が設置されていないため、散熱部品50とLEDライトユニット71が発する熱が、対流により迅速に発散されることはなく、しかも外殼40内に異物或いは水が入った時にも、適時に排出されない。 1. In the conventional heat dissipator structure, since the aluminum substrate 60 is not perforated, the heat generated by the heat dissipating component 50 and the LED light unit 71 is not quickly dissipated by convection, and the inside of the outer casing 40 Even if foreign matter or water gets in, it will not be discharged in a timely manner.

2. 従来の散熱器構造において、アルミニウム基板60には穿孔が設置されていないため、異物が外殼40内に大量に進入し、排出不能となる状況を回避しようと、外殼40の散熱孔41は側面のみに設置されている。 2. In the conventional heat dissipator structure, since the aluminum substrate 60 is not perforated, the heat dissipating holes 41 of the outer casing 40 are designed to avoid a situation where a large amount of foreign matter enters the outer casing 40 and cannot be discharged. It is installed only on the side.

3. 従来の散熱器構造において、散熱部品50の交換、メンテナンス時には、アルミニウム基板60と外殼40を取り外して分離しなければ、交換、メンテナンスを行なうことはできない。しかも、散熱部品50とLEDライトユニット71は、別々に組み立て、取り外す設計であるため、その構造は複雑で、しかも組み立ては不便である。 3. In the conventional heat spreader structure, at the time of replacement and maintenance of the heat dissipation component 50, replacement and maintenance cannot be performed unless the aluminum substrate 60 and the outer casing 40 are removed and separated. Moreover, since the heat dissipating component 50 and the LED light unit 71 are designed to be assembled and removed separately, the structure is complicated and the assembly is inconvenient.

本発明は、従来のLEDライト用散熱器のモジュール構造の上記した欠点に鑑みてなされたものである。   The present invention has been made in view of the above-mentioned drawbacks of the module structure of a conventional heat spreader for LED lights.

米国特許第7338186号U.S. Patent No. 7338186

本発明が解決しようとする課題は、ネジにより迅速な組み立て、取り外しが可能なLEDライト用散熱器のモジュール構造を提供することである。   The problem to be solved by the present invention is to provide a module structure of an LED light heat dissipator that can be quickly assembled and removed with screws.

上記課題を解決するため、本発明によるLEDライト用散熱器のモジュール構造は、頂点蓋と底殼とを有する外殼、及びアルミニウム基板、散熱部品、LEDライトユニット、ランプシェードを備える照明灯モジュールからなり、
前記底殼は内部に収容設置空間を備える収容設置槽を形成し、その下端面には数個の穿孔と装置孔を開設し、装置孔の四周には数個のネジ孔を開設し、
前記アルミニウム基板上には数個のネジ孔を開設し、該底殼のネジ孔と相互に対応し、該下端面には一層の回路板を設置し、該散熱部品はアルミニウム基板の上端面に設置して固定し、該LEDライトユニットはアルミニウム基板下端面の回路板上に設置し、回路板上にはネジによりランプシェードを螺合して嵌める。 In order to solve the above problems, the module structure of the LED light heat dissipator according to the present invention comprises an outer casing having a top cover and a bottom lamp, and an illuminating lamp module including an aluminum substrate, a heat dissipation component, an LED light unit, and a lamp shade. ,
The bottom gutter forms a storage installation tank having a storage installation space inside, and opens several perforations and device holes on its lower end surface, and opens several screw holes on the four circumferences of the device holes,
Several screw holes are opened on the aluminum substrate, corresponding to the screw holes on the bottom wall, a single circuit board is installed on the lower end surface, and the heat dissipation component is formed on the upper end surface of the aluminum substrate. The LED light unit is installed on a circuit board on the lower end surface of the aluminum substrate, and a lamp shade is screwed onto the circuit board by screws.

本発明のLEDライト用散熱器のモジュール構造は、ネジにより迅速な組み立て、及び取り外しが可能である。   The module structure of the heat dissipator for LED light according to the present invention can be quickly assembled and removed with screws.

従来の構造を示す構造分解図である。It is a structure exploded view which shows the conventional structure. 従来の構造を示す側面断面図である。It is side surface sectional drawing which shows the conventional structure. 本発明の実施の形態に係る照明灯モジュール構造の分解図である。It is an exploded view of the illumination lamp module structure which concerns on embodiment of this invention. 本発明の実施の形態に係る照明灯モジュールの立体図である。It is a three-dimensional view of the illumination lamp module which concerns on embodiment of this invention. 本発明の実施の形態に係る構造分解図である。It is a structure exploded view concerning an embodiment of the invention. 本発明の実施の形態に係る構造立体図である。FIG. 3 is a structural three-dimensional view according to an embodiment of the present invention. 本発明の実施の形態に係る側面断面図である。It is side surface sectional drawing which concerns on embodiment of this invention. 本発明の他の実施形態に係る分解図である。It is an exploded view concerning other embodiments of the present invention. 本発明の他の実施形態において固定台に穿孔を増設する模式図である。It is a schematic diagram which adds a perforation to a fixed base in other embodiment of this invention. 本発明の他の実施形態の複数の照明灯モジュールの分解図である。It is an exploded view of the some illumination lamp module of other embodiment of this invention. 本発明の他の実施形態の模式図である。It is a schematic diagram of other embodiment of this invention.

以下に、面を参照しながら本発明を実施するための最良の形態について詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

図３ないし図９に示すように、本実施の形態のLEDライト用散熱器のモジュール構造は、頂点蓋11と底殼12を備える外殼10、アルミニウム基板21、散熱部品23、LEDライトユニット24、ランプシェード25を備える照明灯モジュール20からなる。   As shown in FIGS. 3 to 9, the module structure of the LED light heat dissipator of the present embodiment includes an outer casing 10 having a top cover 11 and a bottom lamp 12, an aluminum substrate 21, a heat dissipation component 23, an LED light unit 24, The illumination lamp module 20 includes a lamp shade 25.

前記頂点蓋11上には、空気を進入させる数個の散熱孔111を設置する。   On the apex lid 11, several heat dissipation holes 111 through which air enters are installed.

前記底殼12は環状の箱体設計で、その四側面にも、空気を進入させる数個の散熱孔124を設置し、内部には、収容設置空間を備える収容設置槽125を形成する。   The bottom rod 12 has an annular box design, and on its four side surfaces, several heat dissipation holes 124 for allowing air to enter are installed, and an accommodation installation tank 125 having an accommodation installation space is formed inside.

前記底殼12の下端面には、面積が比較的小さい数個の穿孔121と面積が比較的大きい数個の装置孔122を開設する。該装置孔122の四周には、数個のネジ孔123を開設する。   In the lower end surface of the bottom rod 12, several holes 121 having a relatively small area and several device holes 122 having a relatively large area are opened. Several screw holes 123 are formed in the four circumferences of the device hole 122.

図３及び４に示すように、前記アルミニウム基板21の面積は、該底殼12の下端面に設置する装置孔122より大きく、該アルミニウム基板2の上には、数個のネジ孔211を開設し、該底殼12のネジ孔123と相互に対応する。   As shown in FIGS. 3 and 4, the area of the aluminum substrate 21 is larger than the device hole 122 installed on the lower end surface of the bottom rod 12, and several screw holes 211 are opened on the aluminum substrate 2. And correspond to the screw holes 123 of the bottom rod 12.

前記アルミニウム基板21は、下端面に一層の回路板22を設置し、該散熱部品23は、該アルミニウム基板21の上端面に設置して固定する。   The aluminum substrate 21 is provided with a single-layer circuit board 22 on the lower end surface, and the heat dissipating component 23 is installed and fixed on the upper end surface of the aluminum substrate 21.

前記LEDライトユニット24は、アルミニウム基板21下端面の回路板22上に設置し、該回路板22上において、ネジによりランプシェード25を螺合して嵌める。   The LED light unit 24 is installed on the circuit board 22 on the lower end surface of the aluminum substrate 21, and the lamp shade 25 is screwed onto the circuit board 22 by screws.

これにより、前記LEDライトユニット24は、該ランプシェード25内に包まれ、図５に示すように、散熱部品23は、該照明ジュール20の上方の位置を保持し、該LEDライトユニット24と該ランプシェード25は下方の位置を保持する。   Thereby, the LED light unit 24 is wrapped in the lamp shade 25, and as shown in FIG. 5, the heat dissipating component 23 holds the position above the illumination module 20, and the LED light unit 24 and the The lamp shade 25 maintains a lower position.

さらに、前記ネジ孔123と該ネジ孔211を相対させ、ネジにより螺合し、該照明灯モジュール20は、該底殼12と相互に接合する。   Further, the screw hole 123 and the screw hole 211 are opposed to each other and screwed together with a screw, and the illuminating lamp module 20 is joined to the bottom rod 12.

図６及び７に示すように、前記アルミニウム基板21の面積は、装置孔122より大きいため、該アルミニウム基板21は該装置孔122を通過せず、該底殼12の下端面に密着する。しかも、前記散熱部品23は、該装置孔122を通過し、該底殼12内の収容設置槽125に位置する。   As shown in FIGS. 6 and 7, since the area of the aluminum substrate 21 is larger than the device hole 122, the aluminum substrate 21 does not pass through the device hole 122 and is in close contact with the lower end surface of the bottom rod 12. In addition, the heat dissipating component 23 passes through the device hole 122 and is positioned in the accommodation installation tank 125 in the bottom gutter 12.

次に、図８に示すように、本発明の他の実施形態では、前記実施形態で用いた外殼10を使用せず、代わりに固定台30を使用する。該固定台30上には、装置孔31を設置し、該装置孔31中には、照明灯モジュール20を設置する。   Next, as shown in FIG. 8, in another embodiment of the present invention, the outer casing 10 used in the above embodiment is not used, but a fixed base 30 is used instead. A device hole 31 is installed on the fixed base 30, and the illumination lamp module 20 is installed in the device hole 31.

この実施の形態では、前記外殼10を使用しないため、全体的な散熱、排水効果がさらに向上し、該LEDライトユニット24の使用寿命を大幅に延長することができる。   In this embodiment, since the outer casing 10 is not used, the overall heat dissipation and drainage effects are further improved, and the service life of the LED light unit 24 can be greatly extended.

さらに、図９に示すように、前記固定台30は、装置孔31の四周において、穿孔32を増設し、排水効率を一層向上させることができる。   Furthermore, as shown in FIG. 9, the fixing base 30 can further increase drainage efficiency by increasing the number of perforations 32 in the four circumferences of the device hole 31.

続いて、図１０及び１１に示すように、前記複数の照明灯モジュール81は、２個以上の単一の照明灯モジュール20を組み合わせて構成する（図８参照）。   Subsequently, as shown in FIGS. 10 and 11, the plurality of illumination lamp modules 81 are configured by combining two or more single illumination lamp modules 20 (see FIG. 8).

よって、前記アルミニウム基板21の上端面には、２個以上の散熱部品23を設置可能で、下端面には、２個以上の回路板22及びLEDライトユニット24を設置可能で、さらに、該ランプシェード25により、それらを覆う。   Therefore, two or more heat dissipating parts 23 can be installed on the upper end surface of the aluminum substrate 21, and two or more circuit boards 22 and LED light units 24 can be installed on the lower end surface. Shade 25 covers them.

上記構造により、本発明の実施形態によれば以下の長所がある。   With the above structure, the embodiment of the present invention has the following advantages.

1. 底板には、数個の穿孔32を設置するため、上、下層の対流が起こり、照明灯モジュール20の散熱を加速し、LEDライトユニット24の寿命を延長することができる。しかも、外殼10内に異物或いは水が進入した時にも、穿孔32を通して自然に排出される。 1. Since several perforations 32 are provided in the bottom plate, upper and lower convections occur, the heat dissipation of the illumination lamp module 20 can be accelerated, and the life of the LED light unit 24 can be extended. Moreover, even when foreign matter or water enters the outer casing 10, it is naturally discharged through the perforations 32.

2. 底板には、数個の穿孔32を設置するため、頂点蓋11の散熱孔111を上方へと口を開く設計とすることができ、これにより上、下層対流が起き、散熱加速の効果はさらに明確となる。 2. Since several perforations 32 are installed in the bottom plate, the heat spreader hole 111 of the apex lid 11 can be designed to open its mouth upward, which causes the lower layer convection and the effect of heat dissipation acceleration. Becomes even clearer.

3. 照明灯モジュール20は独立式の単一照明灯モジュール20であるが、該単一の照明灯モジュール20はアルミニウム基板21、散熱部品23、LEDライトユニット24、ランプシェード25により構成され、該単一の照明灯モジュール20全体を、外殼10の装置孔122内に簡単に組み立て、或いは簡単に取り外すことができる。よって、メンテナンス時には、単一の照明灯モジュール20を交換するだけで良いため、従来の構造のように、大型のライトユニット全体を取り外し、メンテナンス後に再度設置するというメンテナンス上の面倒を軽減することができる。 3. The illuminating lamp module 20 is an independent single illuminating lamp module 20, and the single illuminating lamp module 20 includes an aluminum substrate 21, a heat dissipation component 23, an LED light unit 24, and a lamp shade 25. The entire single lamp module 20 can be easily assembled or removed in the device hole 122 of the outer casing 10. Therefore, it is only necessary to replace the single illuminating lamp module 20 at the time of maintenance, so that it is possible to reduce the trouble of maintenance such as removing the entire large light unit and installing it again after maintenance as in the conventional structure. it can.

上記の実施形態で説明した内容は、本発明の技術内容の説明に用いたのみで、本発明を限定するものではない。本発明の精神に基づく等価応用或いはいは部品（構造）の転換、置換、数量の増減はすべて、本発明の保護範囲に含むものとする。   The contents described in the above embodiment are only used for explaining the technical contents of the present invention, and do not limit the present invention. All equivalent applications based on the spirit of the present invention, or conversion (replacement), replacement, and quantity increase / decrease of parts (structure) are all included in the protection scope of the present invention.

本発明によるLEDライト用散熱器のモジュール構造は、ネジにより迅速な組み立て、及び取り外しが可能である。   The modular structure of the heat dissipator for LED light according to the present invention can be quickly assembled and removed with screws.

10 外殼
11 頂点蓋
111 散熱孔
12 底殼
121 穿孔
122 装置孔
123 ネジ孔
124 散熱孔
125 収容設置槽
20 照明灯モジュール
21 アルミニウム基板
211 ネジ孔
22 回路板
23 散熱部品
24 LEDライトユニット
25 ランプシェード
30 固定台
31 装置孔
32 穿孔
40 外殼
41 散熱孔
50 散熱部品
60 アルミニウム基板
70 ライトユニット
71 LEDライトユニット
72 回路板
80 ランプシェード
81 複数の照明灯モジュール 10 Bund
11 Vertex lid
111 Heat dissipation holes
12 bottom
121 drilling
122 Device hole
123 Screw hole
124 Heat dissipation hole
125 storage tank
20 Lighting module
21 Aluminum substrate
211 Screw hole
22 Circuit board
23 Heat dissipation parts
24 LED light unit
25 Lampshade
30 Fixed base
31 Device hole
32 drilling
40 Bund
41 Heat dissipation hole
50 Heat dissipation parts
60 Aluminum substrate
70 Light unit
71 LED light unit
72 circuit board
80 Lampshade
81 Multiple lighting modules

Claims (3)

頂点蓋と底殼を備える外殼、及び散熱部品、LEDライトユニット、ランプシェードにより構成し、アルミニウム基板、散熱部品を備える独立式の単一照明灯モジュールからなり、
前記頂点蓋上に、空気を進入させる数個の散熱孔を設け、
前記底殼を環状の箱体に形成し、該箱体の四側面に空気を進入させる数個の散熱孔を設け、内部に収容設置空間を備える収容設置槽を形成し、
前記底殼の下端面に、数個の穿孔と装置孔を開設し、該装置孔の四周に数個のネジ孔を設け、前記照明灯モジュールが前記装置孔をとおして固定され、
前記アルミニウム基板表面上に、前記底殼上のネジ孔に相互に対応させて数個のネジ孔を設け、前記散熱部品を該アルミニウム基板の上端面に粘着させて固定し、該アルミニウム基板下端面に、一層の回路板を設置し、前記LEDライトユニットを前記回路板下端に設置し、ランプシェードをネジにより螺合して該回路板及びLEDライトユニットを覆い、
前記アルミニウム基板の面積を、前記装置孔の面積より大きくして該アルミニウム基板を前記底殼の下端面に緊密に接着させ、前記散熱部品を前記装置孔をとおして前記底殼内の収容設置槽内に位置させたことを特徴とするLEDライト用散熱器のモジュール構造。 Consists of an outer casing with a top cover and a bottom lamp, and a heat dissipation component, an LED light unit, a lamp shade, an aluminum substrate, and an independent single illumination lamp module with a heat dissipation component,
On the top cover, several heat dissipation holes for allowing air to enter are provided,
Forming the bottom gutter in an annular box, providing several heat dissipating holes for allowing air to enter the four sides of the box, and forming a storage installation tank with a storage installation space inside;
Opening several perforations and device holes on the lower end surface of the bottom gutter, providing several screw holes around the device holes, the illumination lamp module is fixed through the device holes,
On the surface of the aluminum substrate, several screw holes are provided so as to correspond to the screw holes on the bottom plate, and the heat-dissipating component is adhered and fixed to the upper end surface of the aluminum substrate. In addition, a single circuit board is installed, the LED light unit is installed at the lower end of the circuit board, and the lamp shade is screwed with a screw to cover the circuit board and the LED light unit,
The area of the aluminum substrate is made larger than the area of the device hole so that the aluminum substrate is closely adhered to the lower end surface of the bottom wall, and the heat-dissipating component is accommodated and installed in the bottom wall through the device hole. The module structure of a heat sink for LED lights, characterized by being located inside. 前記LEDライトと散熱器のモジュール構造は、外殼を使用せず、固定台を代わりに使用し、該固定台上に装置孔を設け、穿孔は有っても無くても良いことを特徴とする、請求項１記載のLEDライト用散熱器のモジュール構造。   The module structure of the LED light and the heat dissipator does not use an outer casing, uses a fixed base instead, provides a device hole on the fixed base, and may or may not have a perforation. The module structure of the heat dissipator for LED lights according to claim 1. 。
前記複数の照明灯モジュールは、２個以上の単一の照明灯モジュールを組み合わせて構成し、前記アルミニウム基板の上端面には、２個以上の散熱部品を設置可能で、下端面には２個以上の回路板及びLEDライトユニットを設置可能で、ランプシェードにより、それらを覆ったことを特徴とする請求項１記載のLEDライト用散熱器のモジュール構造。 .
The plurality of illumination lamp modules are configured by combining two or more single illumination lamp modules. Two or more heat dissipating parts can be installed on the upper end surface of the aluminum substrate, and two on the lower end surface. The module structure of the heat dissipator for LED light according to claim 1, wherein the circuit board and the LED light unit can be installed and covered with a lamp shade.
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012500457A (en) * 2008-12-08 2012-01-05 シャンハイ サンス エレクトロニクス エンジニアリング カンパニー リミテッド Convection heat radiation type LED lighting lamp
KR101230872B1 (en) 2011-11-08 2013-02-07 주식회사 레더스 Heat sink for led lamp
JP2013084612A (en) * 2011-10-10 2013-05-09 Posco Led Co Ltd Optical semiconductor lighting device
KR101438140B1 (en) 2013-04-03 2014-09-12 (주)썬래이 Flood lighting style light emitting diode lighting device and assembling structure of the same
JP2014220190A (en) * 2013-05-10 2014-11-20 三菱電機株式会社 Light source module and lighting fixture
JP2015079642A (en) * 2013-10-17 2015-04-23 日立アプライアンス株式会社 Illumination device
JP2015079641A (en) * 2013-10-17 2015-04-23 日立アプライアンス株式会社 Illumination device
JP2017135083A (en) * 2016-01-29 2017-08-03 東芝ライテック株式会社 Lighting device
JP2020042919A (en) * 2018-09-06 2020-03-19 三菱電機株式会社 Luminaire

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101495101B1 (en) 2014-04-03 2015-02-25 유버 주식회사 Hybrid type radiating device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235779A (en) * 2001-08-09 2005-09-02 Matsushita Electric Ind Co Ltd Led lighting fixture and card type led lighting light source
JP3126337U (en) * 2006-08-10 2006-10-19 超▲ちょ▼科技股▲ふん▼有限公司 Large LED lamp
JP2006310138A (en) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd Light emitting unit, lighting system and display device
JP2008041639A (en) * 2006-08-09 2008-02-21 Samsung Electronics Co Ltd Backlight unit and display device equipped with it
JP2008130397A (en) * 2006-11-22 2008-06-05 Matsushita Electric Works Ltd Lighting system
JP3146628U (en) * 2007-09-14 2008-11-20 安提亞科技股▲ふん▼有限公司 Light emitting diode lamp
JP2009016095A (en) * 2007-07-02 2009-01-22 Sharp Corp Illuminating device and substrate
JP2009176578A (en) * 2008-01-24 2009-08-06 Panasonic Electric Works Co Ltd Columnar light emitter

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235779A (en) * 2001-08-09 2005-09-02 Matsushita Electric Ind Co Ltd Led lighting fixture and card type led lighting light source
JP2006310138A (en) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd Light emitting unit, lighting system and display device
JP2008041639A (en) * 2006-08-09 2008-02-21 Samsung Electronics Co Ltd Backlight unit and display device equipped with it
JP3126337U (en) * 2006-08-10 2006-10-19 超▲ちょ▼科技股▲ふん▼有限公司 Large LED lamp
JP2008130397A (en) * 2006-11-22 2008-06-05 Matsushita Electric Works Ltd Lighting system
JP2009016095A (en) * 2007-07-02 2009-01-22 Sharp Corp Illuminating device and substrate
JP3146628U (en) * 2007-09-14 2008-11-20 安提亞科技股▲ふん▼有限公司 Light emitting diode lamp
JP2009176578A (en) * 2008-01-24 2009-08-06 Panasonic Electric Works Co Ltd Columnar light emitter

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012500457A (en) * 2008-12-08 2012-01-05 シャンハイ サンス エレクトロニクス エンジニアリング カンパニー リミテッド Convection heat radiation type LED lighting lamp
JP2013258163A (en) * 2011-10-10 2013-12-26 Posco Led Co Ltd Optical semiconductor lighting device
EP2767757A4 (en) * 2011-10-10 2015-03-18 Posco Led Co Ltd Optical semiconductor-based lighting apparatus
JP2013084610A (en) * 2011-10-10 2013-05-09 Posco Led Co Ltd Optical semiconductor type lighting device
JP2013084560A (en) * 2011-10-10 2013-05-09 Posco Led Co Ltd Optical semiconductor lighting device
JP2013084611A (en) * 2011-10-10 2013-05-09 Posco Led Co Ltd Optical semiconductor lighting device
JP2013084612A (en) * 2011-10-10 2013-05-09 Posco Led Co Ltd Optical semiconductor lighting device
KR101230872B1 (en) 2011-11-08 2013-02-07 주식회사 레더스 Heat sink for led lamp
KR101438140B1 (en) 2013-04-03 2014-09-12 (주)썬래이 Flood lighting style light emitting diode lighting device and assembling structure of the same
JP2014220190A (en) * 2013-05-10 2014-11-20 三菱電機株式会社 Light source module and lighting fixture
JP2015079642A (en) * 2013-10-17 2015-04-23 日立アプライアンス株式会社 Illumination device
JP2015079641A (en) * 2013-10-17 2015-04-23 日立アプライアンス株式会社 Illumination device
JP2017135083A (en) * 2016-01-29 2017-08-03 東芝ライテック株式会社 Lighting device
JP2020042919A (en) * 2018-09-06 2020-03-19 三菱電機株式会社 Luminaire
JP7135615B2 (en) 2018-09-06 2022-09-13 三菱電機株式会社 lighting equipment

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