JP2014197632A5 - - Google Patents

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Publication number
JP2014197632A5
JP2014197632A5 JP2013072982A JP2013072982A JP2014197632A5 JP 2014197632 A5 JP2014197632 A5 JP 2014197632A5 JP 2013072982 A JP2013072982 A JP 2013072982A JP 2013072982 A JP2013072982 A JP 2013072982A JP 2014197632 A5 JP2014197632 A5 JP 2014197632A5
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JP
Japan
Prior art keywords
substrate
preheat
output
operation output
flux
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JP2013072982A
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English (en)
Japanese (ja)
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JP6200182B2 (ja
JP2014197632A (ja
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Priority to JP2013072982A priority Critical patent/JP6200182B2/ja
Priority claimed from JP2013072982A external-priority patent/JP6200182B2/ja
Priority to CN201410130833.XA priority patent/CN104070258B/zh
Publication of JP2014197632A publication Critical patent/JP2014197632A/ja
Publication of JP2014197632A5 publication Critical patent/JP2014197632A5/ja
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Publication of JP6200182B2 publication Critical patent/JP6200182B2/ja
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JP2013072982A 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置 Active JP6200182B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013072982A JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置
CN201410130833.XA CN104070258B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072982A JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (3)

Publication Number Publication Date
JP2014197632A JP2014197632A (ja) 2014-10-16
JP2014197632A5 true JP2014197632A5 (fr) 2016-03-24
JP6200182B2 JP6200182B2 (ja) 2017-09-20

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ID=51592086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072982A Active JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Country Status (2)

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JP (1) JP6200182B2 (fr)
CN (1) CN104070258B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10933483B2 (en) 2017-12-05 2021-03-02 Illinois Tool Works Inc. IR non-contact temperature sensing in a dispenser
JP6742386B2 (ja) * 2018-11-13 2020-08-19 キヤノンマシナリー株式会社 ボンディング装置、ダイボンダ、及びボンディング方法
KR20210113190A (ko) * 2019-01-14 2021-09-15 일리노이즈 툴 워크스 인코포레이티드 분배기에서의 ｉｒ 비접촉식 온도 감지
CN115279531A (zh) * 2020-03-27 2022-11-01 三菱电机株式会社 铜构件用自动火焰钎焊装置及铜构件用自动火焰钎焊方法
CN113579478B (zh) * 2021-08-18 2023-04-18 江南造船(集团)有限责任公司 一种激光焊磁感预热自适应系统及其工作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
JPH01124727A (ja) * 1987-11-10 1989-05-17 Matsushita Electric Ind Co Ltd 加熱装置
JPH0677639A (ja) * 1992-08-27 1994-03-18 Sharp Corp フローハンダ付け装置およびリフローハンダ付け装置
JP3634076B2 (ja) * 1996-08-06 2005-03-30 松下電器産業株式会社 リフロー条件設定方法
JPH10107423A (ja) * 1996-09-30 1998-04-24 Matsushita Electric Works Ltd リフロー半田付け装置
JP2002290027A (ja) * 2001-03-28 2002-10-04 Seiko Epson Corp 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

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