JP2014197632A5 - - Google Patents
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- Publication number
- JP2014197632A5 JP2014197632A5 JP2013072982A JP2013072982A JP2014197632A5 JP 2014197632 A5 JP2014197632 A5 JP 2014197632A5 JP 2013072982 A JP2013072982 A JP 2013072982A JP 2013072982 A JP2013072982 A JP 2013072982A JP 2014197632 A5 JP2014197632 A5 JP 2014197632A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- preheat
- output
- operation output
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 description 13
- 230000004907 flux Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013072982A JP6200182B2 (ja) | 2013-03-29 | 2013-03-29 | 基板加熱装置及びはんだ付装置 |
CN201410130833.XA CN104070258B (zh) | 2013-03-29 | 2014-03-28 | 基板加热装置和软钎焊装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013072982A JP6200182B2 (ja) | 2013-03-29 | 2013-03-29 | 基板加熱装置及びはんだ付装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014197632A JP2014197632A (ja) | 2014-10-16 |
JP2014197632A5 true JP2014197632A5 (da) | 2016-03-24 |
JP6200182B2 JP6200182B2 (ja) | 2017-09-20 |
Family
ID=51592086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013072982A Active JP6200182B2 (ja) | 2013-03-29 | 2013-03-29 | 基板加熱装置及びはんだ付装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6200182B2 (da) |
CN (1) | CN104070258B (da) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10933483B2 (en) | 2017-12-05 | 2021-03-02 | Illinois Tool Works Inc. | IR non-contact temperature sensing in a dispenser |
JP6742386B2 (ja) * | 2018-11-13 | 2020-08-19 | キヤノンマシナリー株式会社 | ボンディング装置、ダイボンダ、及びボンディング方法 |
WO2020149970A1 (en) * | 2019-01-14 | 2020-07-23 | Illinois Tool Works Inc. | Ir non-contact temperature sensing in a dispenser |
CN115279531A (zh) * | 2020-03-27 | 2022-11-01 | 三菱电机株式会社 | 铜构件用自动火焰钎焊装置及铜构件用自动火焰钎焊方法 |
CN113579478B (zh) * | 2021-08-18 | 2023-04-18 | 江南造船(集团)有限责任公司 | 一种激光焊磁感预热自适应系统及其工作方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595494Y2 (ja) * | 1979-10-04 | 1984-02-18 | 権士 近藤 | プリント基板予備加熱装置 |
US4632291A (en) * | 1983-02-28 | 1986-12-30 | Electrovert Ltd. | Automatic wave soldering machine |
JPH01124727A (ja) * | 1987-11-10 | 1989-05-17 | Matsushita Electric Ind Co Ltd | 加熱装置 |
JPH0677639A (ja) * | 1992-08-27 | 1994-03-18 | Sharp Corp | フローハンダ付け装置およびリフローハンダ付け装置 |
JP3634076B2 (ja) * | 1996-08-06 | 2005-03-30 | 松下電器産業株式会社 | リフロー条件設定方法 |
JPH10107423A (ja) * | 1996-09-30 | 1998-04-24 | Matsushita Electric Works Ltd | リフロー半田付け装置 |
JP2002290027A (ja) * | 2001-03-28 | 2002-10-04 | Seiko Epson Corp | 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置 |
CN102566625A (zh) * | 2010-12-09 | 2012-07-11 | 西安中科麦特电子技术设备有限公司 | 一种回流焊机温度控制系统 |
-
2013
- 2013-03-29 JP JP2013072982A patent/JP6200182B2/ja active Active
-
2014
- 2014-03-28 CN CN201410130833.XA patent/CN104070258B/zh active Active
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