JP2014192456A - Vehicular electronic control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vehicular electronic control device capable of reducing thermal influences upon a thermally weak component such as a capacitor while sufficiently presenting a heat dissipation capability of a radiation fin disposed in the vehicular electronic control device.SOLUTION: The vehicular electronic control device comprises: a substrate 5 in which heating components 2 and 8 and a tall component 3 are electrically connected; a metallic case 7 accommodating the substrate 5; a heating component accommodation chamber 71 accommodating the heating components 2 and 8 within the case 7; heating component fixing parts 50 and 90 fixing the heating components 2 and 8 within or on an inner surface of the case 7; a tall component accommodation chamber 72 accommodating the tall component 3 within the case 7; and a radiation fin 6 erected from an outer surface of the case 7. The tall component accommodation chamber 72 is expanded from the heating component accommodation chamber 71 to the outside of the case 7, the case 7 includes an inclined wall 73 separating the heating component accommodation chamber 71 and the tall component accommodation chamber 72, and the inclined wall 73 is inclined in such a manner that a top portion 75 thereof is away from the heating component fixing parts 50 and 90.

Description

  The present invention relates to an electronic control device for a vehicle, and more particularly to an electronic control device for a vehicle in which a heat sink fin is provided in a case in which a substrate on which a semiconductor element or the like is mounted is accommodated.

  In recent years, in vehicles such as motorcycles and automobiles, various functional components mounted on the vehicle have been electrically operated using battery power, etc. A vehicle electronic control device that electronically controls the vehicle is used.

  In addition, the vehicle electronic control device includes a large number of semiconductor elements such as transistors that generate heat during operation. However, as the number of various functional parts mounted increases and the electrical control thereof increases, The number of mounted devices and power consumption are increasing, and the amount of heat generated by the vehicle electronic control device tends to increase.

  For this reason, in order to improve the heat dissipation by the vehicle electronic control device itself, the vehicle electronic control device is provided with a heat dissipation fin, and the heat dissipation fin is enlarged, in other words, the surface area of the heat dissipation fin is increased. You will not get. However, when the surface area of the heat dissipating fins is increased in this way, the size of the vehicle electronic control device is increased, so that it is necessary to secure the accommodation space with a larger volume.

  Under such circumstances, Patent Document 1 relates to a vehicle control device, and includes a heat radiating fin on the heat radiating surface of the case, and a shallow concave portion and a deep concave portion are provided in the case so that a semiconductor element generating a large amount of heat is contained in the shallow concave portion. A configuration is disclosed in which a tall control element is accommodated in a deep recess to promote heat dissipation of a semiconductor element that generates a large amount of heat.

Japanese Patent No. 4034937

  However, according to the study by the present inventor, in the configuration disclosed in Patent Document 1, the heat generated from a semiconductor element having a large heat generation such as a field effect transistor is efficiently passed through the heat radiating fin, so that the vehicle electronic control is performed. Although the device can be cooled, the heat generated in this manner is transmitted to the concave control portion, which accommodates the tall control element, specifically, the capacitor, through the radiation fin. Become.

  Here, according to further studies by the present inventor, the heat transmitted to the wall on the side of the heat generating component of the capacitor housing is transferred to the direction of the heat radiating fin along the wall. In the case of a vertical wall that is erected substantially vertically with only a gradient, it has been found that heat tends to be difficult to be transmitted from the wall to the heat radiating fin above the wall or the heat radiating fin on the capacitor housing portion side.

In particular, a capacitor is a heat-sensitive component. Therefore, if heat is difficult to transfer from the heat-generating component side wall of the capacitor housing part to the heat-dissipation fins above the wall or the heat-sink fins of the capacitor housing part, the wall It is thought that there is a tendency for heat to remain in the capacitor and to have a thermal effect on the capacitor. In such a case, it is difficult to say that the heat dissipating ability of the heat dissipating fins provided in the vehicle electronic control device is sufficiently exerted, and it is considered that the functions of these heat dissipating fins are wasted. But there is room for improvement.

  In other words, at present, there is a vehicle electronic control device with a novel configuration that can reduce the thermal influence on heat-weak parts such as a capacitor while sufficiently exerting the heat dissipation capability of the heat dissipation fins arranged in the vehicle electronic control device. A long-awaited situation.

  The present invention has been made after the above examination, and can reduce the thermal influence on heat-weak parts such as a capacitor while sufficiently exhibiting the heat dissipating ability of the heat dissipating fins arranged in the vehicle electronic control device. An object of the present invention is to provide a vehicle electronic control device.

  In order to achieve the above object, the present invention provides a substrate on which a heat generating component and a tall component are electrically connected, a metal case for accommodating the substrate, and the heat generating component accommodated inside the case. A heating component housing chamber, a heating component fixing portion for fixing the heating component inside or inside the case, a tall component housing chamber for housing the tall component inside the case, and an outer surface of the case In the vehicular electronic control device, the tall component housing chamber is extended toward the outside of the case from the heat generating component housing chamber, and the case is housed in the heat generating component housing. It has a sloping wall that separates the chamber from the tall component housing chamber, and the sloping wall is slanted so that the top of the sloping wall is away from the heat generating component fixing portion.

  Moreover, in addition to this 1st aspect, this invention makes it 2nd aspect that the plate | board thickness of the said inclination wall is thicker than the plate | board thickness of the general part except the said inclination wall of the said case.

  According to the first aspect of the present invention, the substrate on which the heat generating component and the tall component are electrically connected, the metal case for storing the substrate, and the heat generating component storage for storing the heat generating component inside the case. A heat generating component fixing portion that fixes a heat generating component inside or inside the case, a tall component containing chamber that accommodates tall components inside the case, and a heat radiation fin that stands upright from the outer surface of the case In the vehicular electronic control device, the tall component housing chamber is expanded to the outside of the case from the heat generating component housing chamber, and the case has an inclined wall that separates the heat generating component housing chamber from the tall component housing chamber. And the inclined wall is inclined so that the top part is away from the heat generating component fixing part, so that the radiating fin provided corresponding to the inclined wall and the radiating fin provided corresponding to the capacitor housing chamber Even heat generating parts The heat generated can be reliably convey, while sufficiently exhibited heat dissipation capacity of the heat radiating fins arranged in an electronic control device for a vehicle, it is possible to reduce the thermal influence on the Netsujaku components such as a capacitor.

  According to the second aspect of the present invention, the thickness of the inclined wall is set to be thicker than the thickness of the general portion excluding the inclined wall of the case, thereby reducing the thermal resistance of the inclined wall and The heat generated by the heat-generating component can be more reliably transmitted to the heat sink fins corresponding to the walls and the heat sink fins corresponding to the capacitor housing chamber, and the heat shielding performance of the inclined walls can be improved. The ratio of the heat generated by the heat-generating component to the capacitor housing chamber through the inclined wall can be reduced, and the heat dissipation ability of the heat dissipating fins arranged in the vehicle electronic control device can be sufficiently exerted while the capacitor etc. The thermal influence on the heat-weak parts can be reduced.

It is a perspective view of the electronic controller for vehicles in the embodiment of the present invention. Fig.2 (a) is a partial rear view which shows the vehicle electronic control apparatus in this embodiment, FIG.2 (b) is AA sectional drawing of Fig.2 (a). Fig.3 (a) is a partial rear view which shows the vehicle electronic control apparatus in the modification of this embodiment, FIG.3 (b) is BB sectional drawing of Fig.3 (a).

  Hereinafter, an electronic control device for a vehicle according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the figure, the x-axis, y-axis, and z-axis form a three-axis orthogonal coordinate system, and the direction of the z-axis may correspond to the vertical direction for convenience of explanation.

  FIG. 1 is a perspective view of a vehicle electronic control device according to the present embodiment. Moreover, Fig.2 (a) is a partial rear view which shows the vehicle electronic control apparatus in this embodiment, FIG.2 (b) is AA sectional drawing of Fig.2 (a). FIG. 2B typically shows the cross-sectional configuration of the connection terminal 4V, but the connection terminal 4U and the connection terminal 4W have the same cross-sectional configuration.

  As shown in FIGS. 1 and 2, the vehicle electronic control device 1 according to the present embodiment is typically an ECU (Electronic Control Unit), and is typically mounted on a vehicle such as a motorcycle that is not shown. Is done. The vehicular electronic control device 1 operates by being supplied with electric power from a battery (not shown) mounted on the vehicle.

  Specifically, in the vehicle electronic control device 1, the semiconductor element 2, the capacitor 3, the connection terminals 4U, 4V, and 4W, and the semiconductor element 2, the capacitor 3, and the connection terminals 4U, 4V, and 4W are electrically connected. Circuit board 5, heat radiation fins 6, and case 7 for housing and fixing circuit board 5 and standing heat radiation fins 6.

  The semiconductor element 2 is typically a semiconductor element such as a field effect transistor, and is a heat-generating component that generates a relatively large amount of heat during its operation. The semiconductor element 2 is electrically connected to the circuit board 5 via the leads 20 and mounted on the upper surface of the circuit board 5. A portion of the circuit board 5 in which the semiconductor element 2 is mounted on the circuit board 5 in this way is referred to as a semiconductor element fixing portion 50.

  The capacitor 3 is typically a capacitor such as a large-capacity electrolytic capacitor, and the amount of heat generated during its operation is smaller than that of the semiconductor element 2. The capacitor 3 is mounted by being electrically connected to the circuit board 5 via the lead 30. In FIG. 2, the capacitor 3 is shown in a mode in which the peripheral surface thereof is mounted in a horizontal posture along the circuit board 5. However, the present invention is not limited to this, and the capacitor 3 is erected upward from the circuit board 5. And it can be implemented in it.

  Each of the connection terminals 4U, 4V, and 4W is typically a connection terminal that is made of a conductive member such as a metal material and that is provided for three-phase alternating current including a U phase, a V phase, and a W phase. The connection terminals 4U, 4V, and 4W are each fixed to the case 7 and electrically connected to the circuit board 5 through the respective leads 40 in an electrically insulated manner as necessary. Each of the connection terminals 4U, 4V, and 4W is electrically connected to a bus bar that communicates with an external device (not shown). The connection terminals 4U, 4V, and 4W may be directly electrically connected to the circuit board 5 without using the leads 40. The current used here is not limited to a three-phase alternating current, but may be a one-phase alternating current or a current of another aspect such as a direct current.

  The circuit board 5 has a main surface parallel to the xy plane, and is a circuit board such as a printed wiring board made of glass epoxy resin, and the semiconductor element 2 and the capacitor 3 are electrically connected and mounted thereon. In the state, and in a state where the connection terminals 4U, 4V and 4W are electrically connected thereto, they are accommodated in the case 7 and fixed by a fastening member which omits the reference numerals.

  The radiating fin 6 has good thermal conductivity and is typically made of a metal such as an aluminum alloy, and the upper wall of the wall portion 70 of the case 7 except for the portion where the connection terminals 4U, 4V, and 4W are disposed. It has a plurality of fin portions erected over the entire upper surface. Although the heat radiation efficiency per unit area of the heat dissipating fins 6 is lowered, the heat dissipating fins 6 may be provided other than the entire surface of the upper wall of the wall portion 70 of the case 7. Further, the heat dissipating fin 6 is configured integrally with the upper wall of the wall portion 70 of the case 7 and as the same member as the case 7, from the viewpoint of reducing the number of manufacturing steps while ensuring strength and rigidity. preferable. Of course, if necessary, the radiating fin 6 may be formed of a member different from the case 7 and joined to the upper wall of the wall portion 70 of the case 7.

  The case 7 has good thermal conductivity and is typically made of a metal such as an aluminum alloy. The case 7 has a wall portion 70, and the semiconductor element 2 and the capacitor 3 are disposed in an internal space surrounded by the wall portion 70. Is mounted while being electrically connected, and the circuit board 5 to which the connection terminals 4U, 4V and 4W are electrically connected is accommodated and fixed.

  Specifically, the case 7 is adjacent to the semiconductor element accommodation chamber 71 in the internal space surrounded by the wall portion 70, the semiconductor element accommodation chamber 71 for accommodating the semiconductor element 2 mounted on the circuit board 5, and the circuit board 5. And a capacitor storage chamber 72 for storing the capacitor 3 mounted on the capacitor. The volume of the capacitor housing chamber 72 is larger than the volume of the semiconductor element housing chamber 71 and is expanded upward due to the fact that the vertical size of the capacitor 3 is larger than the vertical size of the semiconductor element 2. Yes. That is, the length from the circuit board 5 to the upper wall 70 of the case 7 in the capacitor housing chamber 72 is longer than the length from the circuit board 5 to the upper wall 70 of the case 7 in the semiconductor element housing chamber 71. large. In FIG. 2, the capacitor 3 is mounted on the circuit board 5 in a horizontal posture with its peripheral surface along the circuit board 5, but may be mounted upright on the circuit board 5. .

  Here, the semiconductor element housing chamber 71 and the capacitor housing chamber 72 are separated by an inclined wall 73. The inclined wall 73 is typically a part of the wall portion 70 of the case 7 and forms an inclination angle θ smaller than 90 °, which is an acute angle, on the capacitor housing chamber 72 side with respect to the circuit board 5. The base portion 74 and the top portion 75 are inclined and extend. The inclined wall 73 has the same inclined configuration in the y-axis direction.

  Specifically, the inclined wall 73 is located on the base 74 that contacts the circuit board 5 and on the wall 70 of the case 7 above the capacitor housing chamber 72 and positioned above the base 74 on the negative side of the x axis. The top 75 connected to the wall is inclined from the base portion 74 toward the top portion 75 away from the semiconductor element 2 and the semiconductor element fixing portion 50 and closer to the capacitor 3 side at an inclination angle θ that is an acute angle. It is a standing wall. That is, the inclined wall 73 is connected in an aspect inclined at an acute angle with respect to the portion of the heat radiation fin 6 thereabove, and the capacitor housing chamber 72 and the capacitor 3 therein are connected from the semiconductor element 2 and the semiconductor element fixing portion 50. keep away. Further, the upper wall of the wall portion 70 of the case 7 corresponding to the semiconductor element housing chamber 71 is in communication with the inclined wall 73 between the base portion 74 and the top portion 75.

  The inclined wall 73 mainly transfers heat transferred from the semiconductor element fixing portion 50 of the circuit board 5 to which heat generated by the operating semiconductor element 2 is transferred to the radiation fins 6 above the inclined wall 73. It becomes a heat transfer path. In addition, the inclined wall 73 is secondarily heated from the upper wall of the wall portion 70 of the case 7 above the semiconductor element housing chamber 71 that receives heat radiated by the semiconductor element 2 in operation, and It becomes a heat transfer path for transferring heat directly received by the semiconductor element 2 in operation to the heat dissipating fins 6 above the inclined wall 73. A part of the heat received by the inclined wall 73 is also transferred to the upper wall of the wall portion 70 of the case 7 above the capacitor housing chamber 72. Further, the inclined wall 73 serves as a shielding member that shields the heat generated by the operating semiconductor element 2 from being radiated to the capacitor housing chamber 72 and the capacitor 3 therein.

  In addition, the inclined wall 73 receives heat transmitted from the semiconductor element fixing portion 50 of the circuit board 5 to which heat generated by the semiconductor element 2 in operation and heat generated by the semiconductor element 2 in operation are received. The heat transferred from the upper wall of the wall portion 70 of the case 7 above the semiconductor element housing chamber 71 and the heat directly received by the semiconductor element 2 in operation are heated above the inclined wall 73, respectively. From the viewpoint of providing a heat transfer path for transferring heat to the heat dissipating fins 6 and the heat dissipating fins 6 above the capacitor containing chamber 72, and not to radiate the heat generated by the operating semiconductor element 2 to the capacitor containing chamber 72 and the capacitors 3 therein. From the viewpoint of providing a shielding member for shielding, it is preferable to increase the cross-sectional area of the inclined wall 73 to lower the thermal resistance and increase the heat insulation distance. That is, the plate thickness t1 of the inclined wall 73 is preferably thicker than the plate thickness t2 of a general portion such as the upper wall of the wall portion 70 of the case 7.

  Further, considering that the inclined wall 73 directly receives heat radiated by the semiconductor element 2 in operation and can be a secondary heat source although the strength is weak, the capacitor 3 in the capacitor housing chamber 72 is In order not to be positioned below the inclined wall 73, the peripheral edge portion on the positive side of the x axis of the capacitor 3 may be positioned farther from the top portion 75 of the inclined wall 73 and further on the negative side of the x axis. preferable.

  2A, the wall surface on the semiconductor element housing chamber 71 side is shown as a vertical surface, but the inclined wall 73 may be inclined at an inclination angle θ as in the case of the wall surface on the capacitor housing chamber 72 side. .

  In the vehicular electronic control device 1 configured as described above, when the semiconductor element 2 starts operating, the semiconductor element 2 generates heat.

  The heat thus generated is radiated from the semiconductor element 2 through the semiconductor element accommodation chamber 71 to the upper wall of the wall portion 70 of the case 7 above the semiconductor element accommodation chamber 71 to receive heat, and is provided thereabove. While transferring heat to the radiated fin 6, the radiating fin 6 provided above the inclined wall 73 from the semiconductor element 2 through the heat transfer path of the semiconductor element fixing portion 50 and the inclined wall 73 of the circuit board 5. Heat is transferred to. Further, a part of the heat radiated from the semiconductor element 2 to the upper wall of the wall portion 70 of the case 7 above the semiconductor element accommodation chamber 71 through the semiconductor element accommodation chamber 71 is transferred from there to the inclined wall 73. It heats and transfers heat to the radiating fins 6 provided above it. At the same time, the heat radiated from the semiconductor element 2 to the inclined wall 73 and received by the inclined wall 73 through the semiconductor element accommodating chamber 71 is transferred to the radiating fins 6 provided above the inclined wall 73. Further, the heat transferred to the inclined wall 73 and a part of the heat received by the inclined wall 73 are transferred to the upper wall of the wall portion 70 of the case 7 above the capacitor housing chamber 72 and above it. Heat is transferred to the radiating fin 6 provided. On the other hand, the heat generated by the operating semiconductor element 2 is substantially shielded by the inclined wall 73 and is not directly radiated to the capacitor housing chamber 72 and the capacitor 3 therein.

  That is, the heat generated by the operating semiconductor element 2 is generated by the heat radiation fin 6 provided above the wall portion 70 of the case 7 above the semiconductor element housing chamber 71 and the wall 70 of the case 7, and above the inclined wall 73. 6 and the heat radiating fin 6 provided above the wall portion 70 of the case 7 above the capacitor housing chamber 72 and radiated to the air flowing therethrough and discharged to the outside of the vehicle electronic control device 1. Be heated. On the other hand, the heat generated by the operating semiconductor element 2 is substantially shielded by the inclined wall 73 and is not directly radiated to the capacitor housing chamber 72 and the capacitor 3 therein.

Here, the inclined wall 73 has a configuration that extends between the base portion 74 and the top portion 75 at an inclination angle θ smaller than 90 °, which is an acute angle, on the capacitor housing chamber 72 side. The area of the portion of the radiating fin 6 provided above is increased, the contact area with the air flowing therethrough is increased, and the heat dissipation is improved. Furthermore, by the structure of the inclined wall 73, the heat insulating property is improved by moving the capacitor housing chamber 72 and the capacitor 3 therein from the semiconductor element 2 and the semiconductor element fixing portion 50.

(Modification)
In the present embodiment, various modifications are conceivable with respect to the manner of mounting the semiconductor element 2 as a heat source. Therefore, such a modification will be described in detail below with reference to FIG. In this modification, the same components as those described above are denoted by the same reference numerals, and the description thereof is simplified or omitted as appropriate.

  Fig.3 (a) is a partial rear view which shows the vehicle electronic control apparatus in the modification of this embodiment, FIG.3 (b) is BB sectional drawing of Fig.3 (a).

  As shown in FIG. 3, in the vehicle electronic control device 10 according to the present modification, the semiconductor element 8 is electrically connected to the circuit board 5 via the lead 80 and is located above the semiconductor element accommodation chamber 71. It is fixed to the lower surface of the wall portion 70 of the case 7 with a fastening member whose reference numeral is omitted via a heat radiating member 81. A portion of the wall portion 70 in which the semiconductor element 2 is mounted on the upper wall of the wall portion 70 of the case 7 above the semiconductor element accommodation chamber 71 is referred to as a semiconductor element fixing portion 90.

  Here, the inclined wall 73 mainly transfers heat transferred from the semiconductor element fixing portion 90 of the wall portion 70 of the case 7 to which heat generated by the semiconductor element 8 in operation is transferred. It becomes a heat transfer path to transfer heat to. A part of the heat received by the inclined wall 73 is transferred to the upper wall of the wall portion 70 of the case 7 above the capacitor housing chamber 72. In addition, the inclined wall 73 serves as a shielding member that shields the heat generated by the operating semiconductor element 8 from being radiated to the capacitor housing chamber 72 and the capacitor 3 therein.

  In the vehicular electronic control device 10 having the above configuration, when the semiconductor element 8 starts operating, the semiconductor element 8 generates heat.

  The heat thus generated is transferred from the semiconductor element 8 to the semiconductor element fixing portion 90 of the wall portion 70 of the case 7 above the semiconductor element accommodation chamber 71 through the semiconductor element accommodation chamber 71, and is received. While heat is transferred to the radiating fin 6 provided above, a part of the heat received in this way is transferred from the semiconductor element fixing portion 90 to the inclined wall 73 and is provided above the radiating fin. Heat is transferred to 6. In addition, the heat received from the semiconductor element 8 through the semiconductor element housing chamber 71 and received by the inclined wall 73 is transferred to the radiating fins 6 provided above the inclined wall 73. Further, the heat transferred to the inclined wall 73 and a part of the heat received by the inclined wall 73 are transferred to the upper wall of the wall portion 70 of the case 7 above the capacitor housing chamber 72 and above it. Heat is transferred to the radiating fin 6 provided. On the other hand, the heat generated by the operating semiconductor element 8 is substantially shielded by the inclined wall 73 and is not directly radiated to the capacitor housing chamber 72 and the capacitor 3 therein.

  In other words, the heat generated by the operating semiconductor element 8 is generated by the heat radiation fin 6 provided above the semiconductor element fixing part 90 of the wall part 70 of the case 7 above the semiconductor element accommodating chamber 71 and above the inclined wall 73. The heat radiation fin 6 provided on the wall 7 and the heat radiation fin 6 portion provided above the wall portion 70 of the case 7 above the capacitor housing chamber 72 are radiated to the air flowing therethrough to be electronically controlled for the vehicle. Heat is exhausted to the outside of the device 1. On the other hand, the heat generated by the operating semiconductor element 8 is substantially shielded by the inclined wall 73 and is not directly radiated to the capacitor housing chamber 72 and the capacitor 3 therein.

Here, the inclined wall 73 has a configuration that extends between the base portion 74 and the top portion 75 at an inclination angle θ smaller than 90 °, which is an acute angle, on the capacitor housing chamber 72 side. The area of the portion of the radiating fin 6 provided above is increased, the contact area with the air flowing therethrough is increased, and the heat dissipation is improved. Furthermore, with the configuration of the inclined wall 73, the heat insulating property is improved by moving the capacitor housing chamber 72 and the capacitor 3 therein from the semiconductor element 8 and the semiconductor element fixing portion 50.

  According to the above configuration, the substrate 5 to which the heat generating components 2, 8 and the tall component 3 are electrically connected, the metal case 7 for housing the substrate 5, and the heat generating component 2 inside the case 7, 8, a heat generating component housing chamber 71 for storing 8, heat generating component fixing portions 50 and 90 for fixing the heat generating components 2 and 8 inside or inside the case 7, and a tall component for storing the tall component 3 inside the case 7. In the vehicle electronic control device 1, 10 including the storage chamber 72 and the heat radiating fins 6 erected from the outer surface of the case 7, the tall component storage chamber 72 is located outside the heat generation component storage chamber 71. The case 7 has an inclined wall 73 that separates the heat generating component storage chamber 71 and the tall component storage chamber 72, and the inclined wall 73 has a top portion 75 extending from the heat generating component fixing portions 50, 90. By being tilted away The heat generated by the heat generating components 2, 8 can be reliably transmitted to the heat dissipating fins 6 provided corresponding to the inclined walls 73 and the heat dissipating fins 6 provided corresponding to the capacitor housing chamber 72. It is possible to reduce the thermal influence on the heat-weak component 3 such as a capacitor while sufficiently exhibiting the heat radiation capability of the heat radiation fins 6 disposed in the control devices 1 and 10.

  Further, the plate thickness t1 of the inclined wall 73 is set to be thicker than the plate thickness t2 of the general portion excluding the inclined wall 73 of the case 7, thereby reducing the thermal resistance of the inclined wall 73, thereby reducing the inclined wall 73. The heat generated by the heat generating components 2, 8 can be more reliably transmitted to the heat radiation fins 6 provided corresponding to the heat radiation fins 6 and the capacitor housing chambers 72, and the heat shielding of the inclined wall 73 is possible. The rate at which the heat generated by the heat generating components 2 and 8 is transmitted to the capacitor housing chamber 72 through the inclined wall 73 can be reduced, and the heat dissipating fins disposed in the vehicle electronic control devices 1 and 10 The thermal influence on the heat-weak component 3 such as a capacitor can be reduced while fully exhibiting the heat dissipation capability of 6.

  In the present invention, the type, arrangement, number, and the like of the members are not limited to the above-described embodiments, and the constituent elements thereof are appropriately replaced with those having the same operational effects, and the gist of the invention is not deviated. Of course, it can be appropriately changed within the range.

  As described above, in the present invention, for a vehicle capable of reducing the thermal influence on heat-weak parts such as a capacitor while sufficiently exerting the heat dissipating ability of the heat dissipating fins arranged in the vehicle electronic control device. An electronic control device can be provided, and it is expected that the electronic control device can be widely applied to an electronic control device used for a vehicle or the like because of its general-purpose universal character.

DESCRIPTION OF SYMBOLS 1, 10 ... Vehicle electronic control device 2, 8 ... Semiconductor element 3 ... Capacitor 4U, 4V, 4W ... Connection terminal 5 ... Circuit board 6 ... Radiation fin 7 ... Case 20, 30, 40, 80 ... Lead 70 ... Wall part DESCRIPTION OF SYMBOLS 50, 90 ... Semiconductor element fixing | fixed part 71 ... Semiconductor element accommodating chamber 72 ... Capacitor accommodating chamber 73 ... Inclined wall part 74 ... Base part 75 ... Top part 81 ... Heat dissipation member

Claims (2)

A substrate on which the heat generating component and the tall component are electrically connected;
A metal case for housing the substrate;
A heat generating component storage chamber for storing the heat generating component in the case;
A heat-generating component fixing portion that fixes the heat-generating component inside or inside the case;
A tall component storage chamber for storing the tall component in the case;
Radiating fins erected from the outer surface of the case;
In the vehicle electronic control device comprising:
The tall component storage chamber is expanded toward the outside of the case from the heat generating component storage chamber,
The case has an inclined wall that separates the heat-generating component storage chamber and the tall component storage chamber,
The vehicular electronic control device according to claim 1, wherein the inclined wall is inclined so that a top portion thereof is away from the heat generating component fixing portion.   2. The vehicle electronic control device according to claim 1, wherein a thickness of the inclined wall is larger than a thickness of a general portion of the case excluding the inclined wall.

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