JP2014187348A5 - - Google Patents
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- Publication number
- JP2014187348A5 JP2014187348A5 JP2013177027A JP2013177027A JP2014187348A5 JP 2014187348 A5 JP2014187348 A5 JP 2014187348A5 JP 2013177027 A JP2013177027 A JP 2013177027A JP 2013177027 A JP2013177027 A JP 2013177027A JP 2014187348 A5 JP2014187348 A5 JP 2014187348A5
- Authority
- JP
- Japan
- Prior art keywords
- load
- polishing
- less
- particularly limited
- limit value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013177027A JP6436517B2 (ja) | 2013-02-20 | 2013-08-28 | 研磨用組成物 |
| PCT/JP2014/052956 WO2014129328A1 (ja) | 2013-02-20 | 2014-02-07 | 研磨用組成物 |
| RU2015139807A RU2646938C2 (ru) | 2013-02-20 | 2014-02-07 | Полировальная композиция |
| CN201480009493.3A CN105027267A (zh) | 2013-02-20 | 2014-02-07 | 研磨用组合物 |
| KR1020157022114A KR102176147B1 (ko) | 2013-02-20 | 2014-02-07 | 연마용 조성물 |
| US14/768,998 US9879156B2 (en) | 2013-02-20 | 2014-02-07 | Polishing composition |
| TW103105100A TWI576420B (zh) | 2013-02-20 | 2014-02-17 | A polishing composition, a polishing method, and a method for producing a sapphire substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013031228 | 2013-02-20 | ||
| JP2013031228 | 2013-02-20 | ||
| JP2013177027A JP6436517B2 (ja) | 2013-02-20 | 2013-08-28 | 研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014187348A JP2014187348A (ja) | 2014-10-02 |
| JP2014187348A5 true JP2014187348A5 (cg-RX-API-DMAC7.html) | 2015-10-15 |
| JP6436517B2 JP6436517B2 (ja) | 2018-12-12 |
Family
ID=51391124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013177027A Active JP6436517B2 (ja) | 2013-02-20 | 2013-08-28 | 研磨用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9879156B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6436517B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102176147B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN105027267A (cg-RX-API-DMAC7.html) |
| RU (1) | RU2646938C2 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI576420B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2014129328A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6506913B2 (ja) * | 2014-03-31 | 2019-04-24 | ニッタ・ハース株式会社 | 研磨用組成物及び研磨方法 |
| US20160060487A1 (en) * | 2014-08-29 | 2016-03-03 | Cabot Microelectronics Corporation | Composition and method for polishing a sapphire surface |
| CN107075345B (zh) * | 2014-10-14 | 2019-03-12 | 花王株式会社 | 蓝宝石板用研磨液组合物 |
| JP6570382B2 (ja) * | 2015-09-09 | 2019-09-04 | デンカ株式会社 | 研磨用シリカ添加剤及びそれを用いた方法 |
| US9916985B2 (en) * | 2015-10-14 | 2018-03-13 | International Business Machines Corporation | Indium phosphide smoothing and chemical mechanical planarization processes |
| CN107011804A (zh) * | 2016-01-28 | 2017-08-04 | 浙江晶圣美纳米科技有限公司 | 一种蓝宝石化学机械抛光液 |
| CN110072966B (zh) * | 2016-12-22 | 2021-06-15 | 霓达杜邦股份有限公司 | 研磨用组合物 |
| RU2635132C1 (ru) * | 2017-02-20 | 2017-11-09 | Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") | Полировальная суспензия для сапфировых подложек |
| JP6864519B2 (ja) * | 2017-03-31 | 2021-04-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物、磁気ディスク基板の製造方法および磁気ディスクの研磨方法 |
| EP3792327B1 (en) * | 2019-09-11 | 2025-05-28 | Fujimi Incorporated | Polishing composition, polishing method and method for manufacturing semiconductor substrate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4132432B2 (ja) * | 1999-07-02 | 2008-08-13 | 日産化学工業株式会社 | 研磨用組成物 |
| WO2004053456A2 (en) * | 2002-12-09 | 2004-06-24 | Corning Incorporated | Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials |
| US20060196849A1 (en) | 2005-03-04 | 2006-09-07 | Kevin Moeggenborg | Composition and method for polishing a sapphire surface |
| JP2008044078A (ja) * | 2006-08-18 | 2008-02-28 | Sumitomo Metal Mining Co Ltd | サファイア基板の研磨方法 |
| EP2121242B1 (en) * | 2006-12-28 | 2012-02-15 | Saint-Gobain Ceramics & Plastics, Inc. | Method of grinding a sapphire substrate |
| CN101821353A (zh) | 2007-10-05 | 2010-09-01 | 圣戈本陶瓷及塑料股份有限公司 | 用复合浆料抛光蓝宝石 |
| WO2011021599A1 (ja) * | 2009-08-19 | 2011-02-24 | 日立化成工業株式会社 | Ｃｍｐ研磨液及び研磨方法 |
-
2013
- 2013-08-28 JP JP2013177027A patent/JP6436517B2/ja active Active
-
2014
- 2014-02-07 RU RU2015139807A patent/RU2646938C2/ru active
- 2014-02-07 CN CN201480009493.3A patent/CN105027267A/zh active Pending
- 2014-02-07 KR KR1020157022114A patent/KR102176147B1/ko active Active
- 2014-02-07 US US14/768,998 patent/US9879156B2/en active Active
- 2014-02-07 WO PCT/JP2014/052956 patent/WO2014129328A1/ja not_active Ceased
- 2014-02-17 TW TW103105100A patent/TWI576420B/zh active