JP2014167987A5 - - Google Patents

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Publication number
JP2014167987A5
JP2014167987A5 JP2013039377A JP2013039377A JP2014167987A5 JP 2014167987 A5 JP2014167987 A5 JP 2014167987A5 JP 2013039377 A JP2013039377 A JP 2013039377A JP 2013039377 A JP2013039377 A JP 2013039377A JP 2014167987 A5 JP2014167987 A5 JP 2014167987A5
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JP
Japan
Prior art keywords
wiring electrode
metal film
semiconductor substrate
connection conductor
interlayer connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013039377A
Other languages
English (en)
Japanese (ja)
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JP2014167987A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013039377A priority Critical patent/JP2014167987A/ja
Priority claimed from JP2013039377A external-priority patent/JP2014167987A/ja
Publication of JP2014167987A publication Critical patent/JP2014167987A/ja
Publication of JP2014167987A5 publication Critical patent/JP2014167987A5/ja
Pending legal-status Critical Current

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JP2013039377A 2013-02-28 2013-02-28 半導体装置 Pending JP2014167987A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013039377A JP2014167987A (ja) 2013-02-28 2013-02-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013039377A JP2014167987A (ja) 2013-02-28 2013-02-28 半導体装置

Publications (2)

Publication Number Publication Date
JP2014167987A JP2014167987A (ja) 2014-09-11
JP2014167987A5 true JP2014167987A5 (enrdf_load_stackoverflow) 2015-07-09

Family

ID=51617550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013039377A Pending JP2014167987A (ja) 2013-02-28 2013-02-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2014167987A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101933408B1 (ko) 2015-11-10 2018-12-28 삼성전기 주식회사 전자부품 패키지 및 이를 포함하는 전자기기
JP6668771B2 (ja) * 2016-01-18 2020-03-18 株式会社村田製作所 電子部品
KR102073294B1 (ko) 2016-09-29 2020-02-04 삼성전자주식회사 팬-아웃 반도체 패키지

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004193497A (ja) * 2002-12-13 2004-07-08 Nec Electronics Corp チップサイズパッケージおよびその製造方法

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