JP2014165397A - Image pickup device and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device which properly adjusts an image sensor in a height direction, and to provide an imaging apparatus.SOLUTION: An image pickup device includes: an image sensor 10; a substrate 20 on which the image sensor 10 is arranged; and wiring members 30 which are provided on the substrate 20 and have a predetermined height. The imaging sensor 10 is bonded contacting with the wiring members 30.

Description

  The present invention relates to an imaging element and an imaging apparatus that can be applied to a vehicle-mounted camera or the like.

  Conventional image sensors such as CMOS (Complementary Metal Oxide Semiconductor) are configured as an image sensor by adhering with a die bond resin and arranged on an interposer substrate, and the image sensor is mounted on an image sensor such as a camera. (For example, Patent Document 1).

JP 2010-062750 A

  FIG. 15 shows a cross-sectional view of a conventional image sensor 100. As shown in FIG. 15, in the conventional image sensor 100, the image sensor 110 is disposed on the interposer substrate 120 by being bonded with a die bond resin 150. The interposer substrate 120 includes a base material 121, a circuit pattern 122, and a solder resist layer 123. The image sensor 110 is connected (wire bonding) to a portion (bonding electrode) of the circuit pattern 122 on the interposer substrate 120 that is not covered with the solder resist layer 123 via a wire 140 and is electrically connected to the interposer substrate 120. Is done.

  Here, the conventional image sensor 110 is disposed on the interposer substrate 120 in contact with the die bond resin 150. The die bond resin 150 varies in thickness depending on the heat treatment during bonding. Furthermore, the thickness of the solder resist layer 123 of the interposer substrate 120 is not uniform. Therefore, in the conventional image sensor 100, the position of the image sensor 110 in the optical axis direction, that is, the height direction varies.

  Further, the thickness of the die bond resin 150 and the thickness of the solder resist layer 123 are not uniform, and the image sensor 110 and the interposer substrate 120 are not parallel to each other, and the height direction is distorted. When there is such a variation in position in the height direction, and the image sensor 110 is not focused on the image sensor 110, and a part of the photographed image becomes unclear, the image sensor 110 emits light from the lens. Cannot be received properly. Therefore, conventionally, with respect to the height direction, the position of the lens in the height direction is adjusted by back focus at the time of shooting or the like, that is, adjusted by driving the lens. In addition, the lens mounting angle is appropriately adjusted for each image sensor in accordance with the angle of the lens.

  However, since the method using the back focus needs to move the lens, it cannot be said to be an appropriate method in an imaging apparatus in which it is not preferable to provide a movable part, such as an in-vehicle camera. In addition, the conventional mounting method for turning is extremely complicated because it is necessary to appropriately adjust each image pickup device.

  Accordingly, an object of the present invention made in view of the above problems is to provide an imaging device and an imaging apparatus capable of appropriately adjusting (controlling) the height direction of an image sensor.

In order to solve the above-described problems, an image sensor according to the present invention includes:
An image sensor;
A substrate on which the image sensor is disposed;
A wiring member having a predetermined height provided on the substrate;
With
The image sensor is bonded while being in contact with the wiring member.

Moreover, the image sensor according to the present invention includes:
The wiring member has a plurality of members.

Moreover, the image sensor according to the present invention includes:
The plurality of members are three or more protruding wiring members.

Moreover, the image sensor according to the present invention includes:
The substrate has a solder resist layer,
The predetermined height is higher than the solder resist layer.

Moreover, the image sensor according to the present invention includes:
The wiring member includes a part of a circuit pattern formed on the substrate.

Moreover, the image sensor according to the present invention includes:
The wiring member includes a plating provided on a part of the circuit pattern.

Moreover, the image sensor according to the present invention includes:
The plating is copper.

Moreover, the image sensor according to the present invention includes:
The wiring member includes a stud bump provided on a part of the circuit pattern.

Moreover, the image sensor according to the present invention includes:
A part of the circuit pattern is not conductive with other circuit patterns.

Moreover, the image sensor according to the present invention includes:
The image sensor and the wiring member are electrically connected, and the wiring member is grounded.

In addition, an imaging apparatus according to the present invention includes:
An image sensor;
A substrate on which the image sensor is disposed;
A lens facing the image sensor;
A housing to which the lens is attached;
A wiring member having a predetermined height provided on the substrate;
With
In the housing, the image sensor is bonded in a state of being in contact with the wiring member.

  According to the imaging device and the imaging apparatus of the present invention, it is possible to appropriately adjust the height direction of the image sensor.

2 is a top view of the image sensor according to Embodiment 1. FIG. 2 is a cross-sectional view of the image sensor according to Embodiment 1. FIG. It is a top view of the interposer board | substrate before image sensor arrangement | positioning. It is sectional drawing of the interposer board | substrate before image sensor arrangement | positioning. It is sectional drawing which masked the interposer board | substrate. It is sectional drawing which plated the interposer board | substrate. It is sectional drawing which apply | coated the die bond resin to the interposer board | substrate. 2 is a mounting example of an image pickup apparatus on which the image pickup element of Embodiment 1 is mounted. 4 is a cross-sectional view of an image sensor according to Embodiment 2. FIG. It is the figure which formed the stud bump in the interposer substrate. It is the figure which fluttered the stud bump. It is sectional drawing which apply | coated the die bond resin to the interposer board | substrate. 10 is a cross-sectional view of an image sensor according to Modification Example 1. FIG. FIG. 10 is a top view of an image sensor according to Modification Example 2. It is sectional drawing of the conventional image pick-up element.

  Embodiments of the present invention will be described below.

(Embodiment 1)
FIG. 1 is a diagram showing a top view of an image sensor 1 according to Embodiment 1 of the present invention. For convenience of explanation, the left-right direction in FIG. 1 is the x-axis, and the up-down direction is the y-axis. The direction orthogonal to the xy plane is taken as the z axis. As shown in FIG. 1, the imaging device 1 according to the present invention includes an image sensor 10, an interposer substrate 20 (substrate 20), a supporting wiring member 30 (wiring member 30), and a wire 40. Since the supporting wiring member 30 is provided between the image sensor 10 and the interposer substrate 20, it is indicated by a broken line.

  The image sensor 10 is a light receiving sensor such as a CMOS image sensor, and receives light from a subject to be photographed by a photodiode arranged on a planar die and converts it into an electrical signal. Here, the image sensor 10 is not limited to a CMOS image sensor, and may be a CCD image sensor or any other light receiving sensor.

  The interposer substrate 20 is a substrate on which the image sensor 10 is disposed. The interposer substrate 20 includes a supporting wiring member 30 that supports the image sensor 10. FIG. 1 shows an example in which four supporting wiring members 30 are formed in a protruding shape. In this case, the image sensor 10 is supported at four points by the four supporting wiring members 30. Here, when the supporting wiring member 30 has a protruding shape, at least three supporting wiring members 30 are provided to support the image sensor 10 at three or more points. Since the plane is defined with three points, the planar image sensor 10 can be stably supported.

  The image sensor 10 and the circuit pattern on the interposer substrate 20 are wire-bonded by a wire 40 and electrically connected. As shown in FIG. 1, a plurality of wires 40 are provided to connect a plurality of terminals at each end of the image sensor 10 and a plurality of terminals on the interposer substrate. The wire 40 is preferably a wire made of gold (Au), but is not limited thereto.

  FIG. 2 is a cross-sectional view taken along line AA of the image sensor 1 of FIG. For convenience of explanation, the vertical direction in FIG. As shown in FIG. 2, the interposer substrate 20 includes a base material 21, a circuit pattern 22, a solder resist layer 23, and a supporting wiring member 30.

  The base material 21 is a planar insulator constituting the interposer substrate 20. A circuit pattern 22 is provided on the substrate 21. The circuit pattern 22 is preferably a pattern made of copper (Cu) and functions as a signal line of the image sensor 10. The solder resist layer 23 is an insulator layer provided so as to cover the base material 21 and the circuit pattern 22, and is provided for the purpose of preventing a short circuit between the circuit pattern 22 and various elements on the interposer substrate 20 and preventing dust. Of the circuit pattern 22, the bonding electrode 221 that is a contact point of the wire 40 is configured so that the solder resist layer 23 is not provided and the wire 40 can be connected to the circuit pattern 22.

  The supporting wiring member 30 includes a circuit pattern 31 and a plating 32. The circuit pattern 31 is a circuit pattern provided on the base material 21 of the interposer substrate 20 similarly to the circuit pattern 22, and is preferably a pattern made of copper (Cu). Unlike the circuit pattern 22, the circuit pattern 31 does not function as a pattern for an electrical signal with the image sensor 10, that is, a signal line. That is, the circuit pattern 31 does not conduct not only with the surface layer circuit pattern 22 of the interposer substrate 20 but also with the inner layer circuit pattern including through holes, and is in a floating state.

  The plating 32 is provided on the circuit pattern 31. As shown in FIG. 2, the height of the supporting wiring member 30 in the z-axis direction is higher than the total height of the circuit pattern 22 and the solder resist layer 23 in the z-axis direction, that is, the z-axis direction is higher than that of the solder resist layer 23. It has a high predetermined height in the direction. Since the height of the solder resist layer 23 (the total height in the z-axis direction of the circuit pattern 22 and the solder resist layer 23) is about 40 μm, the predetermined height is preferably about 42 μm. Preferably, the plating 32 is mainly composed of copper (Cu). This is because the plating 32 can be deposited at a predetermined height (film thickness) in a relatively short time if copper is used.

  As shown in FIG. 2, the image sensor 10 is disposed by being bonded to the interposer substrate 20 with a die bond resin 50. Here, the image sensor 10 contacts the supporting wiring member 30, and the supporting wiring member 30 positions the image sensor 10 in the height direction. Since the circuit pattern 31 and the plating 32 that constitute the supporting wiring member 30 can be configured by defining the length in the z-axis direction in units of microns, the height of the image sensor 10 (z-axis direction) can be increased. Positioning can be performed in microns.

  3 to 7 show manufacturing steps of the image sensor 1 according to the first embodiment of the present invention. FIG. 3 is a top view of the interposer substrate 20 before the image sensor 10 is disposed. As shown in FIG. 3, a portion other than the bonding electrode 221 and the circuit pattern 31 is covered with a solder resist layer 23 on the interposer substrate 20. Here, the bonding electrode 221 is not covered with the solder resist layer 23 for wire bonding with the wire 40. The circuit pattern 31 is not covered with the solder resist layer 23 in order to apply the plating 32.

  FIG. 4 is a cross-sectional view showing a BB cross section of FIG. The interposer substrate 20 before the image sensor 10 is disposed includes a circuit pattern 22 and a circuit pattern 31 having the same height as the circuit pattern on a base material 21. As described with reference to FIG. 3, the solder resist layer 23 covers portions other than the bonding electrode 221 and the circuit pattern 31.

  5 and 6 show a process of applying plating 32 to the interposer substrate 20 of FIG. As shown in FIG. 5, the bonding electrode 221 is first masked with a mask 60. The masking is performed to prevent the plating 32 from adhering to the fine pattern because the bonding electrode 221 has a very fine pattern. Subsequently, plating 32 is applied as shown in FIG. By applying the plating 32, the supporting wiring member 30 is brought to a predetermined height. Specifically, when the height (length in the z-axis direction) of the circuit pattern 31 is about 20 μm, the plating 32 is formed with a height (film thickness) of 22 μm. By doing so, the height of the supporting wiring member 30 can be adjusted to a predetermined height (for example, 42 μm).

  After the plating 32 is applied, a die bond resin 50 is applied onto the interposer substrate 20 as shown in FIG. Subsequently, after pressing the image sensor 10 from above the die bond resin 50 in FIG. 7 until it contacts the wiring member 30, the die bond resin 50 is cured by heat treatment, and the image sensor 10 is adhered and disposed on the interposer substrate 20, The imaging device 1 shown in FIG. 1 is completed.

  As described above, according to the imaging device 1 of the first embodiment, the die bonding resin 50 or the solder resist layer 23 is not uniform because the supporting wiring member 30 provided on the interposer substrate 20 positions in the height direction. The variation in the height direction due to the property can be suppressed, and the adjustment in the height direction of the image sensor 10 can be appropriately performed.

  FIG. 8 shows a mounting example of the imaging device 70 in which the imaging device 1 of the first embodiment is mounted. The imaging device 70 includes a first lens 71, a second lens 72, a third lens 73, a lens support member 74, an image sensor 1, a substrate 75, a substrate support member 76, and a housing 77.

  The first lens 71 to the third lens 73 are lenses for guiding light from the subject onto the image sensor 1. Here, FIG. 8 shows an example in which three lenses are provided, but the number of lenses is not limited to this, and may be one or more. The lens support member 74 supports the first lens 71 to the third lens 73. On the substrate 75, devices of various imaging devices 70 including the imaging device 1 are mounted. That is, the imaging device 1 is provided between the lens (the first lens 71 to the third lens 73) and the substrate 75, and the lens faces the image sensor 10. The substrate 75 is supported by the substrate support member 76. The first lens 71 to the third lens 73, the lens support member 74, the image sensor 1, the substrate 75, and the substrate support member 76 are provided in the housing 77. Here, since the image sensor 10 is positioned in the height direction of the image sensor 10 by the support wiring member 30, it is possible to eliminate or simplify the adjustment by the back focus and the adjustment of the tilt for each imaging device 70. Become.

(Embodiment 2)
The second embodiment of the present invention will be described below. FIG. 9 is a cross-sectional view showing the configuration of the image sensor 1b according to Embodiment 2 of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. The imaging element 1 according to the second embodiment is different from the configuration according to the first embodiment in that the supporting wiring member 30 is configured by a circuit pattern 31 and a stud bump 32b.

  The stud bump 32b is preferably made of gold (Au). 10 to 12 show the manufacturing process of the image sensor 1b according to the second embodiment of the present invention.

  10 and 11 show a process of applying the stud bump 32b on the interposer substrate 20 of FIG. As shown in FIG. 10, a stud bump 32b is first formed on a circuit pattern 31 by a stud bump device. Subsequently, as shown in FIG. 11, the top surface of each stud bump is pressed by a stud bump device to perform bump fluttering. By providing the stud bump 32b, the supporting wiring member 30 is adjusted to a predetermined height. Specifically, when the height (the length in the z-axis direction) of the circuit pattern 31 is about 20 μm, the stud bump 32 b is adjusted to a height of about 22 μm (the length in the z-axis direction).

  After providing the stud bump 32b, a die bond resin 50 is applied on the interposer substrate 20 as shown in FIG. Subsequently, the image sensor 10 is pressed from above the die bond resin 50 in FIG. 7 until it abuts against the wiring member 30, and then the die bond resin 50 is cured by heat treatment, and the image sensor 10 is adhered and disposed on the interposer substrate 20. 9 is completed.

  As described above, according to the imaging device 1b of the second embodiment, the die bonding resin 50 or the solder resist layer 23 is not uniform because the supporting wiring member 30 provided on the interposer substrate 20 positions in the height direction. The variation in the height direction due to the property can be suppressed, and the adjustment in the height direction of the image sensor 10 can be appropriately performed.

  In particular, since the height of the supporting wiring member 30 is adjusted by providing the stud bump 32b, a relatively large-scale facility for performing the plating process shown in the first embodiment is not required, and a small number of lots can be produced. This is useful when

(Modification 1)
FIG. 13 shows an example of an image sensor 1c according to Modification 1 of the present invention. In the first and second embodiments, the supporting wiring member 30 is composed of the circuit pattern 31 and the plating 32 or the stud bump 32b. However, in the modified example, the supporting wiring member 30 is composed only of the circuit pattern 31. Composed. Here, this configuration can be adopted when the circuit pattern 22 and the solder resist layer 23 do not exist on the surface of the interposer substrate 20 facing the image sensor 10.

(Modification 2)
FIG. 14 illustrates the image sensor 1d to the image sensor 1f according to the second modification of the present invention. In the above-described embodiment, the supporting wiring member 30 has a protruding shape, but in the second modification, the supporting wiring member 30 has a linear shape. Specifically, the supporting wiring member 30 from the image pickup device 1d to the image pickup device 1f has a U shape, a cross shape, and a V shape. With this configuration, the image sensor 10 can be supported even with the single supporting wiring member 30.

  As described above, in the embodiment, the case where the wiring member 30 is floating has been described as an example. However, in the case where it is desirable to install the back surface of the image sensor 10, the wiring member 30 is connected to the ground of the circuit pattern 31. You may comprise so that it may connect to a line.

  Although the present invention has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and corrections based on the present disclosure. Therefore, it should be noted that these variations and modifications are included in the scope of the present invention. For example, each element and each member can be rearranged so that there is no logical contradiction, and each element and each member can be combined into one or divided.

1, 1b, 1c, 1d, 1f Image sensor 10 Image sensor 20 Interposer substrate (substrate)
21 Substrate 22 Circuit pattern 221 Bonding electrode 23 Solder resist layer 30 Supporting wiring member (wiring member)
Reference Signs List 31 Circuit Pattern 32 Plating 32b Stud Bump 40 Wire 50 Die Bond Resin 60 Mask 70 Imaging Device 71 First Lens 72 Second Lens 73 Third Lens 74 Lens Support Member 75 Substrate 76 Substrate Support Member 77 Housing 100 Image Sensor 110 Image Sensor 120 Interposer substrate 121 Base material 122 Circuit pattern 123 Solder resist layer 140 Wire 150 Die bond resin

Claims (11)

An image sensor;
A substrate on which the image sensor is disposed;
A wiring member having a predetermined height provided on the substrate;
With
An image sensor, wherein the image sensor is bonded in contact with the wiring member.   The imaging element according to claim 1, wherein the wiring member has a plurality of members.   The imaging device according to claim 2, wherein the plurality of members are three or more protruding wiring members. The substrate has a solder resist layer,
4. The image sensor according to claim 1, wherein the predetermined height is higher than the solder resist layer. 5.   The imaging device according to claim 4, wherein the wiring member includes a part of a circuit pattern formed on the substrate.   The image pickup device according to claim 5, wherein the wiring member includes a plating provided on a part of the circuit pattern.   The imaging device according to claim 6, wherein the plating is copper.   The imaging device according to claim 5, wherein the wiring member includes a stud bump provided on a part of the circuit pattern.   The imaging device according to claim 1, wherein a part of the circuit pattern is not electrically connected to another circuit pattern.   The image sensor according to any one of claims 1 to 8, wherein the image sensor and the wiring member are electrically connected, and the wiring member is grounded. An image sensor;
A substrate on which the image sensor is disposed;
A lens facing the image sensor;
A housing to which the lens is attached;
A wiring member having a predetermined height provided on the substrate;
With
An image pickup apparatus, wherein the image sensor is bonded to the wiring member in the casing.

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