KR101973656B1

KR101973656B1 - Camera Module

Info

Publication number: KR101973656B1
Application number: KR1020120142242A
Authority: KR
Inventors: 한광준
Original assignee: 엘지이노텍 주식회사
Priority date: 2011-12-08
Filing date: 2012-12-07
Publication date: 2019-04-30
Also published as: KR20130085928A

Abstract

A camera module according to an embodiment of the present invention includes: a lens holder including an image sensor seating portion formed on a bottom surface and a lens support portion on which a plurality of lenses are installed; An image sensor mounted on the image sensor seat; And a plurality of electronic circuit pattern layers integrally formed on the bottom surface of the lens holder and electrically connected to the image sensor.

Description

Camera module {Camera Module}

The present invention relates to a camera module.

Generally, a digital camera module takes an image by using an image sensor such as a CCD or CMOS instead of a film.

A camera module using an image sensor is used in various fields such as a mobile device capable of taking pictures because of its small volume and excellent performance, a monitor camera, and a surveillance camera mounted on a car. In particular, camera modules used in mobile devices are becoming increasingly multifunctional, smaller, and lighter.

The present invention provides a camera module improved in structure to reduce the height of the camera module.

The electronic circuit pattern layer may further include a metal layer formed on the upper side by any one of coating and plating with a conductive material.

The electronic circuit pattern layer may have a terminal portion for external connection integrally formed thereon.

The electronic circuit pattern layer and the image sensor may be connected to each other by a flip-chip process so that a bump is interposed therebetween.

The infrared cut filter may be adhered and fixed with an adhesive material, and the adhesive material may be provided by any one of an ultraviolet curable epoxy resin and a thermosetting epoxy resin.

The lens holder may integrally include an electronic circuit pattern layer formed by patterning the non-circuit portion after metalizing the surface.

Further, an actuator may be provided on the upper side of the lens holder.

It is an object of the present invention to provide an image sensor in which an electronic circuit pattern layer is integrally formed on the surface of a lens holder for supporting a plurality of lenses without mounting a separate printed circuit board for mounting the image sensor, The ultra-thin camera module can be more easily configured.

1 and 2 are exploded perspective views showing a lens holder of a camera module according to an embodiment of the present invention,
Fig. 3 is a plan view of Fig. 2,
4 is a view showing a connection structure between a lens holder and an image sensor.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

1 and 2 are exploded perspective views showing a lens holder of a camera module according to an embodiment of the present invention, FIG. 3 is a plan view of FIG. 2, and FIG. 4 is a view showing a connection structure between a lens holder and an image sensor to be.

A camera module according to an embodiment of the present invention includes a lens holder 100 in which an image sensor mounting portion 10 and a lens supporting portion 20 are integrally formed and an electronic circuit pattern 10 formed integrally with the image sensor mounting portion 10, Layer (15). The present invention is characterized in that the image sensor 11 is directly mounted on the bottom surface of the lens holder 100 without a separate printed circuit board.

The lens holder 100 may be injection-molded using a generally used resin material. Depending on the method of forming the electronic circuit pattern layer 15, the injection method may be variously changed.

The image sensor 11 is directly mounted on the bottom surface of the image sensor mounting portion 10 and the window 12 is formed at a position corresponding to the image sensor 11 of the image sensor mounting portion 10.

An infrared cut-off filter 13 is installed on the upper surface of the image sensor mount 10 so as to cover the window 12. A control chip such as a driver module for controlling the camera module and a plurality of resistors Or they may be separately provided on a separate circuit board outside the camera module. It is also possible to form an infrared ray blocking coating on the lens surface without forming the infrared ray blocking filter as a separate member.

Preferably, the image sensor 11 is installed in a flip-chip process at a mounting position provided on the bottom surface of the image sensor seating portion 10. [ 3, a seating groove 14 on which the image sensor 11 can be mounted may be provided on the bottom surface of the image sensor seating unit 10. [

The infrared cut-off filter 13 is fixed to the upper surface of the image sensor seating portion 10 so as to cover the window 12, as described above. 1 and 2, the infrared cut-off filter 13 is formed to have an area larger than the area of the window 12.

The infrared cut filter 13 may be fixed by various methods. According to an embodiment of the present invention, the infrared cut filter 13 may be adhesively fixed with an ultraviolet curing adhesive material or a thermosetting adhesive material. At this time, the adhesive material may be formed of an epoxy material. Also, an adhesive tape or the like other than an adhesive material may be used as the adhesive method.

2 and 3, an electronic circuit pattern layer 15 for energizing the image sensor 11 is formed on the bottom surface of the image sensor mounting portion 10 and the surface of the mounting groove 14, And a terminal 16 connected to the electronic circuit pattern layer 15 may be further provided if necessary.

In addition, the electronic circuit pattern layer 15 may further include a metal layer formed on the upper side by coating or plating with a conductive material.

1, the electronic circuit pattern layer 15 is also formed on the outer circumferential surface of the lens support portion 20 so as to supply power to the actuator 30. The lens support portion 20, The protrusions 25 may be integrally formed. The protrusions 25 may be made of a resin material having insulation properties such as the lens support 20 so that a pair of the electronic circuit pattern layers 15 connected to the terminals can be prevented from being short-circuited.

The technique for forming the electronic circuit pattern layer 15 can be roughly divided into three techniques.

First, the first method is a patterning method using a dual molding. When the lens holder 100 composed of the image sensor mounting portion 10 and the lens supporting portion 20 is injection molded, the body of the lens holder 100 is configured And the portions where the electronic circuit pattern layer 15 is to be formed are injection-molded from synthetic resins of different materials. In this case, the image sensor mounting portion 10 and the lens supporting portion 20 constituting the body are made of an insulating material, and the bottom surface of the image sensor mounting portion 10, on which the electronic circuit pattern layer 15 is to be formed, Injection molding is carried out by using a synthetic resin or by injection molding using a synthetic resin which is easy to perform a metal plating operation on a portion where the electronic circuit pattern layer 15 is to be formed, and after injection molding the bottom surface of the image sensor seating portion 10, And the electronic circuit pattern layer 15 is completed by a subsequent process such as the following.

In the second method, the bottom surface of the image sensor mounting portion 10 is injection-molded so as to contain impurities reacting with light and heat, and a surface patterning such as a laser exposure is formed on the bottom surface of the injection- Through the operation, a wiring pattern is formed where the electronic circuit pattern layer 15 is to be formed.

The third method is a method of metalizing the entire bottom surface of the image sensor mounting portion 10 on which the electronic circuit pattern layer 15 is formed, and then etching and patterning the non-circuit portion.

When the image sensor 11 is mounted on the bottom surface of the image sensor mount 10 using any one of the techniques described above, the image sensor 11 may be mounted on a separate printed circuit board The height of the camera module can be reduced.

The Flip Chip process technology for connecting the image sensor 11 to the bottom surface of the image sensor seating unit 10 can be implemented by various materials and methods such as solder bump, tape-automated bonding, wire interconnection, , anisotropic conductive adhesive, metallurgy bump, micro spring, etc.).

Meanwhile, as an example of the flip chip process, when the image sensor 11 and the electronic circuit pattern layer 15 are connected to each other, they can be electrically connected via a bump 17. The bumps 17 may be formed of various materials such as gold (Au), copper (Cu), or a conductive resin mixed with a resin and a metal material.

The terminal 16 connected to the electronic circuit pattern layer 15 is for connecting the image sensor 11 to an external device and includes a flexible printed circuit board (FPCB) such as an ACF / Hot bar process, Or a structure that can be inserted into a socket.

Also, in order to miniaturize the camera module, image processing sensed by the image sensor 11 may be processed by an external device without being processed in the camera module.

The actuator 30 adjusts the distance between the focusing lens 31 and the image sensor 11 by moving the focusing lens 31 provided in the vicinity of the center. 1 and 4, the actuator 30 according to an embodiment of the present invention may be a disk-shaped actuator, a silicon actuator, a VCM (voice coil motor), a Piezo / Polymer lens , An optical diaphragm, a liquid crystal microlens, or the like may be used.

4, at least two connection terminals 32 are provided in the actuator 30 so as to be connected to the positive terminal and the ground terminal. The connection terminal 32 is connected to the electronic circuit May be connected to the pattern layer 23 by Ag epoxy, soldering or wire bonding, or any other electrically connectable connection is possible.

According to an embodiment of the present invention, although not shown, a total of four connection terminals 32 are provided at an interval of 90 degrees, and two of the four terminals are connected to the electronic circuit pattern layer 23 to be described later. This is because the shape of the actuator 30, which is manufactured in conformity with the shape of the focusing lens 31 generally formed in a disc shape at the time of designing, also has a ring shape surrounding the focusing lens 31 of the disc shape, Two connection terminals 32 of the four connection terminals 32 can be connected to the positive terminal and the ground terminal irrespective of the directionality of the terminal 30.

4, the connection terminal 32 may be formed on the bottom surface of the actuator 30, but it is not limited thereto. The connection terminal 32 may be formed on the side surface of the actuator 30, Or both side and bottom surfaces may be formed.

According to the present invention as described above, it is possible to directly attach the image sensor mounting portion 10, which is integrally formed with the lens supporting portion 20 provided with the plurality of lenses 21 (see Fig. 4) Since the image sensor 11 can be mounted, an ultra-thin camera module having a height lower than that of the conventional camera module can be more easily implemented.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10; An image sensor seating part 11; Image sensor
13; An infrared cut filter 15; Electronic circuit pattern layer
16; Terminal 17; Bump
20; Lens support 30; Actuator
100; Lens holder

Claims

A lens support;
An image sensor mounting part including an image sensor mounting groove formed on a bottom surface of the lens supporting part and integrally formed with the lens supporting part;
An image sensor disposed in the image sensor seating groove; And
And an electronic circuit pattern layer integrally formed on the outer circumferential surface of the lens supporting portion, the bottom surface of the image sensor mounting portion, and the image sensor mounting groove, and connected to the image sensor so as to be conductive.

The semiconductor device according to claim 1, wherein the electronic circuit pattern layer
And a metal layer formed on the upper side by any one of coating and plating with a conductive material.

The semiconductor device according to claim 1, wherein the electronic circuit pattern layer
And a terminal portion for external connection is integrally formed.

The method according to claim 1,
Wherein the electronic circuit pattern layer and the image sensor are connected to each other by a flip chip process so that a bump is interposed therebetween.

The method according to claim 1,
Further comprising an infrared cut filter disposed in a window formed on an upper portion of the image sensor seating portion,
And the infrared cut-off filter is adhered and fixed to the image sensor mounting portion with an adhesive material.

The method according to claim 5,
A camera module that is either an ultraviolet curable epoxy resin or a thermoset epoxy resin.

2. The image sensor according to claim 1,
And the electronic circuit pattern layer patterned by etching the non-circuit portion after metalizing the surface.

The method according to claim 1,
And an actuator is mounted on the lens supporting part.

A lens support;
An image sensor mounting part disposed below the lens supporting part and integrally formed with the lens supporting part;
An image sensor disposed in the image sensor seat; And
And an electronic circuit pattern layer integrally formed on an outer circumferential surface of the lens support portion and a lower surface of the image sensor seating portion and connected to the image sensor so as to be conductive,
Wherein the electronic circuit pattern layer includes a first electronic circuit pattern layer and a second electronic circuit pattern layer which are spaced apart from each other on an outer peripheral surface of the lens supporting portion,
Wherein the lens supporting portion includes a protrusion disposed between the first electronic circuit pattern layer and the second electronic circuit pattern layer and protruding outward from an outer circumferential surface of the lens supporting portion.

A lens support;
An image sensor mounting part including an image sensor mounting groove formed on a bottom surface of the lens supporting part and integrally formed with the lens supporting part;
An image sensor disposed in the image sensor seating groove; And
And an electronic circuit pattern layer formed integrally with the image sensor mounting groove and connected to the image sensor so as to be electrically connected to the external surface of the lens supporting portion,
Wherein the electronic circuit pattern layer includes a first electronic circuit pattern layer and a second electronic circuit pattern layer which are spaced apart from each other on an outer peripheral surface of the lens supporting portion,
Wherein the lens supporting portion includes a protrusion disposed between the first electronic circuit pattern layer and the second electronic circuit pattern layer and protruding outward from an outer circumferential surface of the lens supporting portion.