JP2014164867A - 保護素子及び電子機器 - Google Patents
保護素子及び電子機器 Download PDFInfo
- Publication number
- JP2014164867A JP2014164867A JP2013033268A JP2013033268A JP2014164867A JP 2014164867 A JP2014164867 A JP 2014164867A JP 2013033268 A JP2013033268 A JP 2013033268A JP 2013033268 A JP2013033268 A JP 2013033268A JP 2014164867 A JP2014164867 A JP 2014164867A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cover member
- filler
- attached
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000004020 conductor Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000000605 extraction Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 10
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 9
- 229910001416 lithium ion Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
Landscapes
- Fuses (AREA)
- Battery Mounting, Suspending (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013033268A JP2014164867A (ja) | 2013-02-22 | 2013-02-22 | 保護素子及び電子機器 |
KR1020157025556A KR20150121089A (ko) | 2013-02-22 | 2014-02-07 | 보호 소자 및 전자 기기 |
PCT/JP2014/052838 WO2014129316A1 (ja) | 2013-02-22 | 2014-02-07 | 保護素子及び電子機器 |
CN201480022797.3A CN105144334A (zh) | 2013-02-22 | 2014-02-07 | 保护元件及电子设备 |
TW103105807A TW201505064A (zh) | 2013-02-22 | 2014-02-21 | 保護元件及電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013033268A JP2014164867A (ja) | 2013-02-22 | 2013-02-22 | 保護素子及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014164867A true JP2014164867A (ja) | 2014-09-08 |
Family
ID=51391112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013033268A Pending JP2014164867A (ja) | 2013-02-22 | 2013-02-22 | 保護素子及び電子機器 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2014164867A (zh) |
KR (1) | KR20150121089A (zh) |
CN (1) | CN105144334A (zh) |
TW (1) | TW201505064A (zh) |
WO (1) | WO2014129316A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016088670A1 (ja) * | 2014-12-05 | 2016-06-09 | デクセリアルズ株式会社 | 加熱基板、保護素子および電子機器 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109659483B (zh) * | 2017-10-11 | 2021-08-03 | 宁德时代新能源科技股份有限公司 | 二次电池顶盖组件及二次电池 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163647A (ja) * | 1996-12-02 | 1998-06-19 | Tdk Corp | 電子部品の封止構造 |
JP2002270331A (ja) * | 2001-03-12 | 2002-09-20 | Kondo Denki:Kk | 面実装型サージ吸収素子、及びその製造方法 |
JP2009510708A (ja) * | 2005-10-03 | 2009-03-12 | リッテルフューズ,インコーポレイティド | 筐体を形成するキャビティをもったヒューズ |
JP2010003665A (ja) * | 2008-05-23 | 2010-01-07 | Sony Chemical & Information Device Corp | 保護素子及び二次電池装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201584389U (zh) * | 2009-06-26 | 2010-09-15 | 颜琼章 | 一种改良电阻保险丝装置 |
-
2013
- 2013-02-22 JP JP2013033268A patent/JP2014164867A/ja active Pending
-
2014
- 2014-02-07 WO PCT/JP2014/052838 patent/WO2014129316A1/ja active Application Filing
- 2014-02-07 CN CN201480022797.3A patent/CN105144334A/zh active Pending
- 2014-02-07 KR KR1020157025556A patent/KR20150121089A/ko not_active Application Discontinuation
- 2014-02-21 TW TW103105807A patent/TW201505064A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163647A (ja) * | 1996-12-02 | 1998-06-19 | Tdk Corp | 電子部品の封止構造 |
JP2002270331A (ja) * | 2001-03-12 | 2002-09-20 | Kondo Denki:Kk | 面実装型サージ吸収素子、及びその製造方法 |
JP2009510708A (ja) * | 2005-10-03 | 2009-03-12 | リッテルフューズ,インコーポレイティド | 筐体を形成するキャビティをもったヒューズ |
JP2010003665A (ja) * | 2008-05-23 | 2010-01-07 | Sony Chemical & Information Device Corp | 保護素子及び二次電池装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016088670A1 (ja) * | 2014-12-05 | 2016-06-09 | デクセリアルズ株式会社 | 加熱基板、保護素子および電子機器 |
JP2016110812A (ja) * | 2014-12-05 | 2016-06-20 | デクセリアルズ株式会社 | 加熱基板、保護素子および電子機器 |
CN107006076A (zh) * | 2014-12-05 | 2017-08-01 | 迪睿合株式会社 | 加热基板、保护元件及电子设备 |
KR20180132987A (ko) * | 2014-12-05 | 2018-12-12 | 데쿠세리아루즈 가부시키가이샤 | 가열 기판, 보호 소자 및 전자 기기 |
TWI710281B (zh) * | 2014-12-05 | 2020-11-11 | 日商迪睿合股份有限公司 | 加熱基板、保護元件及電子機器 |
CN107006076B (zh) * | 2014-12-05 | 2020-12-18 | 迪睿合株式会社 | 加热基板、保护元件及电子设备 |
KR102213688B1 (ko) | 2014-12-05 | 2021-02-08 | 데쿠세리아루즈 가부시키가이샤 | 가열 기판, 보호 소자 및 전자 기기 |
Also Published As
Publication number | Publication date |
---|---|
KR20150121089A (ko) | 2015-10-28 |
WO2014129316A1 (ja) | 2014-08-28 |
TW201505064A (zh) | 2015-02-01 |
CN105144334A (zh) | 2015-12-09 |
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Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20151111 |
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