JP2014154854A5 - - Google Patents

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Publication number
JP2014154854A5
JP2014154854A5 JP2013026156A JP2013026156A JP2014154854A5 JP 2014154854 A5 JP2014154854 A5 JP 2014154854A5 JP 2013026156 A JP2013026156 A JP 2013026156A JP 2013026156 A JP2013026156 A JP 2013026156A JP 2014154854 A5 JP2014154854 A5 JP 2014154854A5
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JP
Japan
Prior art keywords
module inspection
frame
inspection device
caster
move
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013026156A
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English (en)
Japanese (ja)
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JP2014154854A (ja
JP6101504B2 (ja
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Priority to JP2013026156A priority Critical patent/JP6101504B2/ja
Priority claimed from JP2013026156A external-priority patent/JP6101504B2/ja
Publication of JP2014154854A publication Critical patent/JP2014154854A/ja
Publication of JP2014154854A5 publication Critical patent/JP2014154854A5/ja
Application granted granted Critical
Publication of JP6101504B2 publication Critical patent/JP6101504B2/ja
Active legal-status Critical Current
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JP2013026156A 2013-02-14 2013-02-14 真空処理装置のモジュール検査装置 Active JP6101504B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013026156A JP6101504B2 (ja) 2013-02-14 2013-02-14 真空処理装置のモジュール検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013026156A JP6101504B2 (ja) 2013-02-14 2013-02-14 真空処理装置のモジュール検査装置

Publications (3)

Publication Number Publication Date
JP2014154854A JP2014154854A (ja) 2014-08-25
JP2014154854A5 true JP2014154854A5 (cg-RX-API-DMAC10.html) 2016-03-17
JP6101504B2 JP6101504B2 (ja) 2017-03-22

Family

ID=51576373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013026156A Active JP6101504B2 (ja) 2013-02-14 2013-02-14 真空処理装置のモジュール検査装置

Country Status (1)

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JP (1) JP6101504B2 (cg-RX-API-DMAC10.html)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283099A (ja) * 1994-04-04 1995-10-27 Kokusai Electric Co Ltd 半導体製造装置
JPH10242233A (ja) * 1997-02-26 1998-09-11 Hitachi Ltd 半導体製造方法
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
JP4256551B2 (ja) * 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
TW484170B (en) * 1999-11-30 2002-04-21 Applied Materials Inc Integrated modular processing platform
JP5025609B2 (ja) * 2003-09-04 2012-09-12 株式会社日立ハイテクノロジーズ 真空処理装置
US20080072820A1 (en) * 2006-06-30 2008-03-27 Applied Materials, Inc. Modular cvd epi 300mm reactor

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