JP2014152241A - Adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape usable as a dicing tape, capable of uniformly expanding in a machine direction and a transverse direction.SOLUTION: An adhesive tape includes an adhesive layer on one surface of a base material. A dynamic friction force against an SUS430BA plate measured at an outermost layer surface on an opposite side of the adhesive layer with regard to the base material is less than 10.0 N at temperature of 23°C and humidity of 50%.

Description

  The present invention relates to an adhesive tape.

  In semiconductor dicing, by dicing a semiconductor wafer on a dicing tape (adhesive tape), the semiconductor wafer is cut into chips (chips) to form chips, which are subsequently collected from the dicing tape. Used in later steps (for example, see Patent Document 1). As a method of collecting chips from the dicing tape, a bar called a pin or a needle is abutted from the side of the dicing tape where the chip is not mounted (so-called “pin push-up”), and then an adsorption treatment called a collet is performed. Chips are collected by adsorbing and separating chips from the dicing tape.

  Here, since the interval between chips immediately after dicing is extremely small such as several hundred μm at most, if the chip is taken from the dicing tape in this state, another chip (especially an adjacent chip) is used. ) And the chip will be damaged.

  Therefore, in semiconductor dicing, before collecting the chip from the dicing tape after dicing, in the state where the chip is mounted on the dicing tape, the dicing tape is expanded (stretched) to widen the interval between the chips. It is common practice to collect chips from the dicing tape.

  However, even with such a method, problems may occur during collection. For this reason, the further improvement at the time of dicing a semiconductor is calculated | required.

  A typical example of such a problem is that when a chip is adsorbed and separated by a collet from a dicing tape, it cannot be adsorbed and separated accurately.

  As a cause of the above problem, there is a possibility that the adhesive force between the dicing tape and the chip is too strong. However, even if the adhesive force between the dicing tape and the chip is weakened, the above problem is not solved.

JP 2005-019607 A

  The present inventor has made various studies on the cause of inadequate adsorption / separation when a chip is adsorbed / separated from a dicing tape with a collet. After focusing on the misalignment between the collet adsorption surface and the chip, and repeatedly investigating, the base material and the pedestal of the expanding device are stuck in full contact or in partial contact (blocking or sticking). It was found that the expansion did not proceed smoothly and a defect appeared. Based on this result, it was considered important that the dicing tape was sufficiently expanded and expanded uniformly in the vertical and horizontal directions. And in order to be able to expand the dicing tape sufficiently and to achieve uniform expansion in the vertical and horizontal directions, the surface on the back side of the dicing tape (the side opposite to the adhesive layer when viewed from the base material) It is considered that it is important that the friction between the pedestal and the base is smaller than a predetermined amount, and the dynamic friction force against the SUS430BA plate on the outermost layer surface opposite to the adhesive layer as viewed from the base material is strictly set to a predetermined level. The inventors came up with an adjustment and completed the present invention.

  That is, the subject of this invention is an adhesive tape which can be used as a dicing tape, Comprising: It is providing the adhesive tape which can be expanded uniformly in the vertical direction and a horizontal direction.

The adhesive tape of the present invention is
An adhesive tape comprising an adhesive layer on one side of a substrate,
The dynamic frictional force against the SUS430BA plate on the outermost layer surface opposite to the pressure-sensitive adhesive layer when viewed from the substrate is less than 10.0 N at a temperature of 23 ° C. and a humidity of 50%.

  In a preferred embodiment, the modulus at 150% tension in the MD direction of the pressure-sensitive adhesive tape is 10.0 N / 10 mm to 50.0 N / 10 mm at a temperature of 23 ° C. and a humidity of 50%, and the pressure-sensitive adhesive tape has a TD-direction modulus. The modulus at 150% tension is 10.0 N / 10 mm to 50.0 N / 10 mm at a temperature of 23 ° C. and a humidity of 50%.

  In a preferred embodiment, the ratio of the modulus at 150% tension in the MD direction of the adhesive tape to the modulus at 150% tension in the TD direction is 1.90 or less at a temperature of 23 ° C. and a humidity of 50%.

  In a preferred embodiment, the stress relaxation rate after 2 seconds from 150% tension in the MD direction of the pressure-sensitive adhesive tape is 25.0% or more at a temperature of 23 ° C. and a humidity of 50%, and 150% of the pressure-sensitive adhesive tape in the TD direction. The stress relaxation rate after 2 seconds from% tension is 25.0% or more at a temperature of 23 ° C. and a humidity of 50%.

  In a preferred embodiment, the ratio of the stress relaxation rate after 2 seconds from 150% tension in the TD direction of the pressure-sensitive adhesive tape to the stress relaxation rate after 2 seconds after 150% tension in the MD direction (TD direction stress relaxation rate / MD The directional stress relaxation rate is 0.70 to 1.30 at a temperature of 23 ° C. and a humidity of 50%.

  In preferable embodiment, arithmetic mean surface roughness Ra of the outermost layer surface on the opposite side to an adhesive layer seeing from the said base material is 50 nm or more.

  In preferable embodiment, the maximum elongation measured according to JIS-K-7127 (1999) of the said base material is 100% or more.

  In a preferred embodiment, the substrate is a plastic film.

  In a preferred embodiment, the plastic film contains at least one selected from polyvinyl chloride, polyolefin, and ethylene-vinyl acetate copolymer.

  In a preferred embodiment, a non-adhesive layer is provided on the surface of the substrate opposite to the adhesive layer.

  In a preferred embodiment, the non-adhesive layer is a mixed layer of silicone and (meth) acrylic polymer.

  In a preferred embodiment, the mixing ratio of the silicone and the (meth) acrylic polymer in the non-adhesive layer is silicone: (meth) acrylic polymer = 1: 50 to 50: 1 by weight.

  In a preferred embodiment, the non-adhesive layer has a phase separation structure.

  In preferable embodiment, the thickness of the said non-adhesion layer is 0.01 micrometer-10 micrometers.

  In a preferred embodiment, the pressure-sensitive adhesive layer contains at least one (meth) acrylic polymer.

  In a preferred embodiment, a release liner is provided on the surface of the pressure-sensitive adhesive layer.

  In a preferred embodiment, the pressure-sensitive adhesive tape of the present invention is used for semiconductor processing.

  In preferable embodiment, the adhesive tape of this invention is used for LED dicing use.

  ADVANTAGE OF THE INVENTION According to this invention, it is an adhesive tape which can be used as a dicing tape, Comprising: The adhesive tape which can be expanded uniformly in the vertical direction and a horizontal direction can be provided.

Schematic which shows the alignment state of the chip | tip after the expansion at the time of expanding uniformly in the vertical direction and a horizontal direction. Schematic which shows the alignment state of the chip | tip after an expansion at the time of expanding non-uniformly in the vertical direction and the horizontal direction. It is a schematic sectional drawing of the slipperiness measuring jig used for dynamic frictional force measurement. It is the schematic sectional drawing and schematic bottom view of the weight used for a dynamic friction force measurement. It is a schematic plan view of the adhesive tape (thing which wrote the reference line of the cross) used for expanding property measurement. It is the schematic plan view and schematic sectional drawing of the sample for an expandability evaluation used for an expandability measurement. It is a schematic sectional drawing which shows the mode of an expandability measurement. It is a photograph figure of SEM which shows the state of the surface side of the non-adhesion layer in the adhesive tape of this invention. It is a photograph figure of SEM which shows the state of the cross section side of the non-adhesion layer in the adhesive tape of this invention. It is a photograph figure of SEM which shows the state of the cross section side of the non-adhesion layer in the adhesive tape of this invention with description.

  The pressure-sensitive adhesive tape of the present invention includes a pressure-sensitive adhesive layer on one surface of a substrate.

  In the pressure-sensitive adhesive tape of the present invention, the dynamic frictional force against the SUS430BA plate on the outermost layer surface opposite to the pressure-sensitive adhesive layer when viewed from the substrate is preferably less than 10.0 N at a temperature of 23 ° C. and a humidity of 50%. Is 8.0 N or less, more preferably 6.0 N or less. The lower limit value of the dynamic friction force is preferably 1.0 N or more. In the pressure-sensitive adhesive tape of the present invention, by adjusting the dynamic friction force within the above range, as shown in FIG. 1, when the pressure-sensitive adhesive tape of the present invention is used as a dicing tape, a chip after dicing is used in semiconductor dicing. When the chip is mounted on the dicing tape and the dicing tape 200 is expanded (stretched) to widen the space between the chips 100 before the sample is taken from the dicing tape, the vertical and horizontal directions are uniform. Chips that can be expanded and are well aligned without misalignment of the chip 100 can be obtained. On the other hand, when the dynamic friction force is not adjusted within the above range, as shown in FIG. 2, when the pressure-sensitive adhesive tape of the present invention is used as a dicing tape, chips are collected from the dicing tape after dicing in semiconductor dicing. If the dicing tape 200 is expanded (stretched) to increase the distance between the chips 100 in a state where the chips are mounted on the dicing tape before the chip 100, the chips 100 cannot be expanded uniformly in the vertical and horizontal directions. For example, a pick-up failure may occur. Particularly, since the LED chip is small, the chip is liable to be displaced. When the dynamic friction force is 10.0 N or more, when the adhesive tape is expanded by the indentation method, the slippage between the indentation jig and the back of the tape is deteriorated, and a catch occurs, and the indentation jig contact portion In the worst case, there is a possibility that the adhesive tape may be broken at the non-contact portion. A method for measuring the dynamic friction force will be described later.

  In the pressure-sensitive adhesive tape of the present invention, the modulus at 150% tension in the MD direction is preferably 10.0 N / 10 mm to 50.0 N / 10 mm, more preferably 10.0 N / mm, at a temperature of 23 ° C. and a humidity of 50%. It is 10 mm-30.0 N / 10mm, More preferably, it is 10.0 N / 10 mm-20.0 N / 10 mm. In the pressure-sensitive adhesive tape of the present invention, the modulus at 150% tension in the MD direction can be expanded more uniformly in the vertical direction by adjusting the modulus within the above range at a temperature of 23 ° C. and a humidity of 50%. In the pressure-sensitive adhesive tape of the present invention, if the modulus at the time of 150% tension in the MD direction is too large at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is too hard to expand when the pressure-sensitive adhesive tape is expanded. There is a risk that a problem may occur that a load is applied to the equipment and a failure of the equipment is caused. In the pressure-sensitive adhesive tape of the present invention, if the modulus at 150% tension in the MD direction is too small at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is too soft, and the tape can be easily stretched by tape bonding work. As a result, the mechanical properties in the MD direction change, the MD direction elongation in the expanding process becomes too uneven, and a problem may occur in the pickup process. The modulus measurement method will be described later.

  In the adhesive tape of the present invention, the modulus at 150% tension in the TD direction is preferably 10.0 N / 10 mm to 50.0 N / 10 mm, more preferably 10.0 N / mm at a temperature of 23 ° C. and a humidity of 50%. It is 10 mm-30.0 N / 10mm, More preferably, it is 10.0 N / 10 mm-20.0 N / 10 mm. In the pressure-sensitive adhesive tape of the present invention, the modulus at 150% tension in the TD direction can be expanded more uniformly in the lateral direction by adjusting the modulus within the above range at a temperature of 23 ° C. and a humidity of 50%. In the pressure-sensitive adhesive tape of the present invention, when the modulus at 150% tension in the TD direction is too large at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is too hard to expand when the pressure-sensitive adhesive tape is expanded. There is a risk that a problem may occur that a load is applied to the equipment and a failure of the equipment is caused. Moreover, in the adhesive tape of the present invention, if the modulus at 150% tension in the TD direction is too small at a temperature of 23 ° C. and a humidity of 50%, the adhesive tape is too soft and the tape is easily stretched by tape bonding work or the like. As a result, the mechanical properties in the TD direction are changed, the elongation in the TD direction in the expanding process becomes too uneven, and there is a possibility that a problem occurs in the pickup process. The modulus measurement method will be described later.

  In the pressure-sensitive adhesive tape of the present invention, the ratio of the modulus at 150% tension in the MD direction to the modulus at 150% tension in the TD direction is preferably 1.90 or less at a temperature of 23 ° C. and a humidity of 50%. Preferably it is 1.80 or less, More preferably, it is 1.60 or less, Most preferably, it is 1.40 or less. The lower limit of the ratio is preferably 0.50 or more. In the pressure-sensitive adhesive tape of the present invention, the ratio of the modulus at 150% tension in the MD direction to the modulus at 150% tension in the TD direction is adjusted within the above range at a temperature of 23 ° C. and a humidity of 50%. Expands more uniformly in the direction and lateral direction. In the adhesive tape of the present invention, when the ratio of the modulus at 150% tension in the MD direction and the modulus at 150% tension in the TD direction is too large at a temperature of 23 ° C. and a humidity of 50%, the adhesive tape is expanded. In addition, the MD direction and the TD direction of the adhesive tape do not extend uniformly, and the chip arrangement may be disturbed, which may cause a problem that the yield of the chip pickup is lowered in the pickup process which is a subsequent process. In the pressure-sensitive adhesive tape of the present invention, if the ratio of the modulus at 150% tension in the MD direction to the modulus at 150% tension in the TD direction is too small at a temperature of 23 ° C. and a humidity of 50%, the MD direction of the pressure-sensitive adhesive tape Therefore, the TD direction does not extend uniformly, the chip arrangement is disturbed, and there is a possibility that the chip pickup yield is lowered in the pickup process which is a subsequent process.

  The pressure-sensitive adhesive tape of the present invention has a stress relaxation rate after 2 seconds from 150% tension in the MD direction at a temperature of 23 ° C. and a humidity of 50%, preferably 25.0% or more, more preferably 35.0% or more. More preferably, it is 40.0% or more, and particularly preferably 50.0% or more. The upper limit value of the stress relaxation rate is preferably 80.0% or less. In the pressure-sensitive adhesive tape of the present invention, the stress relaxation rate after 2 seconds from 150% tension in the MD direction can be expanded more uniformly in the vertical direction by adjusting the stress relaxation rate within the above range at a temperature of 23 ° C. and a humidity of 50%. In the pressure-sensitive adhesive tape of the present invention, when the stress relaxation rate after 2 seconds from 150% tension in the MD direction is too small at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is released when the pressure-sensitive adhesive tape is expanded after being expanded. May return to the state before being expanded, and there may be a problem that a sufficient distance between the chips cannot be obtained. In the pressure-sensitive adhesive tape of the present invention, when the stress relaxation rate after 2 seconds from 150% tension in the MD direction is too large at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is easily oriented in a bonding operation or the like, The mechanical properties in the MD direction change, the MD direction elongation in the expanding process becomes too uneven, and there is a possibility that a malfunction occurs in the pickup process. A method for measuring the stress relaxation rate will be described later.

  In the pressure-sensitive adhesive tape of the present invention, the stress relaxation rate after 2 seconds from 150% tension in the TD direction is preferably 25.0% or more, more preferably 35.0% or more at a temperature of 23 ° C. and a humidity of 50%. More preferably, it is 40.0% or more, and particularly preferably 50.0% or more. The upper limit value of the stress relaxation rate is preferably 80.0% or less. In the pressure-sensitive adhesive tape of the present invention, the stress relaxation rate after 2 seconds from 150% tension in the TD direction can be expanded more uniformly in the lateral direction by adjusting it within the above range at a temperature of 23 ° C. and a humidity of 50%. In the pressure-sensitive adhesive tape of the present invention, when the stress relaxation rate after 2 seconds from 150% tension in the TD direction is too small at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is released when the pressure-sensitive adhesive tape is expanded after being expanded. May return to the state before being expanded, and there may be a problem that a sufficient distance between the chips cannot be obtained. In the pressure-sensitive adhesive tape of the present invention, if the stress relaxation rate after 2 seconds from 150% tension in the TD direction is too large at a temperature of 23 ° C. and a humidity of 50%, the pressure-sensitive adhesive tape is easily oriented in a bonding operation or the like, The mechanical properties in the TD direction are changed, the elongation in the TD direction in the expanding process becomes too uneven, and there is a possibility that a problem occurs in the pickup process. A method for measuring the stress relaxation rate will be described later.

  The pressure-sensitive adhesive tape of the present invention has a ratio of stress relaxation rate after 2 seconds after 150% tension in the TD direction to stress relaxation rate after 2 seconds after 150% tension in the MD direction (TD direction stress relaxation rate / MD direction stress relaxation). Rate) at a temperature of 23 ° C. and a humidity of 50%, it is preferably 0.70 to 1.30, more preferably 0.80 to 1.20, and still more preferably 0.90 to 1.10. . In the pressure-sensitive adhesive tape of the present invention, the ratio of the stress relaxation rate after 2 seconds after 150% tension in the TD direction to the stress relaxation rate after 2 seconds after 150% tension in the MD direction (TD direction stress relaxation rate / MD direction stress relaxation) Rate) within the above range at a temperature of 23 ° C. and a humidity of 50%, it can be expanded uniformly in the vertical and horizontal directions. In the pressure-sensitive adhesive tape of the present invention, the ratio of the stress relaxation rate after 2 seconds after 150% tension in the TD direction to the stress relaxation rate after 2 seconds after 150% tension in the MD direction (TD direction stress relaxation rate / MD direction stress relaxation) Rate) is too large or too small at a temperature of 23 ° C. and a humidity of 50%, when the adhesive tape is expanded, the MD direction and the TD direction of the adhesive tape are not expanded uniformly, and the chip arrangement is disturbed. There is a possibility that a defect that the yield of the chip pickup is lowered in the pickup process which is a subsequent process.

  In the pressure-sensitive adhesive tape of the present invention, the upper limit of the arithmetic average surface roughness Ra of the outermost layer surface on the side opposite to the pressure-sensitive adhesive layer when viewed from the substrate is preferably 5 μm or less. In the pressure-sensitive adhesive tape of the present invention, the arithmetic average surface roughness Ra of the outermost layer surface on the side opposite to the pressure-sensitive adhesive layer as viewed from the base material can be expanded uniformly in the vertical direction and the horizontal direction by adjusting within the above range. . In the pressure-sensitive adhesive tape of the present invention, when the arithmetic average surface roughness Ra of the outermost layer surface opposite to the pressure-sensitive adhesive layer as viewed from the substrate is too small, when the pressure-sensitive adhesive tape is expanded by a pressing method, The back surface of the tape is in close contact with each other, causing a catch, and it is not possible to uniformly expand the pressing jig contact portion and the non-contact portion. In the worst case, the adhesive tape may be broken at the non-contact portion. In addition, since the lower limit of Ra of the outermost layer surface on the opposite side to the preferable pressure-sensitive adhesive layer can vary depending on the composition constituting the surface, details will be described later. In the pressure-sensitive adhesive tape of the present invention, when the arithmetic average surface roughness Ra on the surface of the outermost layer opposite to the pressure-sensitive adhesive layer as viewed from the substrate is too large, the unevenness on the back surface of the pressure-sensitive adhesive tape is too large. Due to the inflow, there is a possibility that a defect that cannot be fixed by vacuum suction during the dicing process may occur. A method for measuring the arithmetic average surface roughness Ra will be described later.

  The thickness of the pressure-sensitive adhesive tape of the present invention is preferably 20 μm to 120 μm, more preferably 40 μm to 120 μm, still more preferably 50 μm to 110 μm, and particularly preferably 60 μm to 110 μm. By adjusting the thickness of the pressure-sensitive adhesive tape of the present invention within the above range, the stress of the pressure-sensitive adhesive tape of the present invention with respect to expansion and pin push-up can be made more uniform in the tape surface. Moreover, when the thickness of the adhesive tape of this invention is too small, there exists a possibility that a handleability may worsen and there exists a possibility that a bonding operation | work may become difficult especially. When the thickness of the pressure-sensitive adhesive tape of the present invention is too large, the followability to deformation such as stretching may be deteriorated.

  As a method for measuring the thickness, for example, a method involving physical contact such as a micrometer, a micro caliper, or a dial gauge; measuring transmittance or reflectance of α-rays, X-rays, infrared rays, electromagnetic waves, etc. with respect to the measurement object A non-contact method; a method of cutting a measurement object at an arbitrary measurement location and observing with an optical microscope or an electron microscope; and the like, and a combination thereof may be employed.

<Base material>
The thickness of the substrate is preferably 10 μm or more and less than 120 μm, more preferably 30 μm to 120 μm, still more preferably 40 μm to 100 μm, and particularly preferably 50 μm to 100 μm. By adjusting the thickness of the pressure-sensitive adhesive tape of the present invention within the above range, the stress of the pressure-sensitive adhesive tape of the present invention with respect to expansion and pin push-up can be made more uniform in the tape surface. Moreover, when the thickness of a base material is too small, there exists a possibility that a handleability may worsen and there exists a possibility that a bonding operation | work may become difficult especially when an adhesive tape is comprised. If the thickness of the substrate is too large, the followability to deformation such as stretching may be deteriorated.

  The maximum elongation of the substrate measured according to JIS-K-7127 (1999) is preferably 100% or more, and more preferably 200% to 1000%. By using such a base material exhibiting the maximum elongation, the stress of the pressure-sensitive adhesive tape of the present invention with respect to expanding and pin push-up can be made more uniform within the tape surface. Moreover, by using the base material which shows such maximum elongation, moderate extensibility can be provided to the adhesive tape of this invention, for example, the followable | trackability to a to-be-adhered body can improve.

  As a base material, as long as the above characteristics are satisfied, any appropriate material can be selected as long as the effects of the present invention are not impaired. Such a substrate is preferably a plastic film.

  The plastic film can include any suitable resin material. As such a resin material, for example, polyvinyl chloride, polyolefin, ethylene-vinyl acetate copolymer, polyester, polyimide, polyamide, and the like are preferable, and more preferably, polyvinyl chloride, polyolefin, ethylene-acetic acid. A vinyl copolymer is mentioned, More preferably, a polyvinyl chloride is mentioned. Since polyvinyl chloride is excellent in stress relaxation properties, it can be suitably used particularly for an adhesive tape used for semiconductor processing such as LED dicing.

  As the content ratio of the resin material in the plastic film, any appropriate content ratio can be set according to the purpose and application. As such a content rate, it becomes like this. Preferably it is 50 to 100 weight%, More preferably, it is 60 to 100 weight%, More preferably, it is 70 to 100 weight%.

  The plastic film may contain a plasticizer. The content of the plasticizer in the plastic film is preferably 0.5% by weight to 50% by weight, more preferably 1.0% by weight to 40% by weight with respect to the resin material in the plastic film. is there. By including a plasticizer in the above-mentioned content ratio in the plastic film, the stress of the pressure-sensitive adhesive tape of the present invention with respect to expansion and pin push-up can be made more uniform in the tape surface. Moreover, the followability of the adhesive tape of this invention with respect to deformation | transformation of extending | stretching etc. becomes a more favorable thing by including a plasticizer in the said content rate in a plastic film.

  Examples of the plasticizer include phthalate ester-based, trimellitic ester-based (Dainippon Ink Co., Ltd., W-700, trimellitic trioctyl, etc.), adipate ester-based (manufactured by J-Plus, D620, dioctyl adipate, diisononyl adipate, etc.), phosphate esters (such as tricresyl phosphate), adipic acid esters, citrate esters (such as acetyl citrate tributyl), sebacic acid esters, aceleic acid esters, maleic acid esters Benzoic acid ester, polyether polyester, epoxy polyester (epoxidized soybean oil, epoxidized linseed oil, etc.), polyester (low molecular polyester comprising carboxylic acid and glycol, etc.) and the like. In the present invention, it is preferable to use an ester plasticizer. Only one type of plasticizer may be used, or two or more types may be used.

  The plastic film may contain any appropriate other component as long as the effects of the present invention are not impaired.

  The substrate can be produced by any appropriate production method as long as the effects of the present invention can be exhibited. Examples of such a production method include injection molding, extrusion molding, inflation molding, calendar molding, blow molding and the like. Among these, calender molding is preferable in that the effect of the present invention can be further expressed.

<Adhesive layer>
The thickness of the pressure-sensitive adhesive layer is preferably 1.0 μm to 30 μm, more preferably 1.0 μm to 20 μm, and still more preferably 3.0 μm to 15 μm. When the thickness of the pressure-sensitive adhesive layer is less than 1.0 μm, there is a possibility that sufficient adhesive force cannot be expressed. When the thickness of the pressure-sensitive adhesive layer is larger than 30 μm, the adhesive force becomes too large depending on the use, and the adherend may be crushed during peeling or the like.

  As the material for the pressure-sensitive adhesive layer, any appropriate pressure-sensitive adhesive can be adopted as long as the effects of the present invention are not impaired.

  Examples of the material for the pressure-sensitive adhesive layer include (meth) acrylic polymer; natural rubber; special natural rubber grafted with monomers such as methyl methacrylate; SBS, SBR, SEPS, SIS, SEBS, polybutene, polyisobutene, polyisobutylene, And synthetic rubbers such as butyl rubber. Among these, at least one (meth) acrylic polymer is preferable from the viewpoint that there is little adhesive residue on the adherend after peeling, high cohesiveness, and excellent transparency.

  When the pressure-sensitive adhesive layer contains a (meth) acrylic polymer, the content ratio of the (meth) acrylic polymer in the pressure-sensitive adhesive layer can be appropriately set according to the purpose.

  The said (meth) acrylic-type polymer is resin comprised from the monomer component which contains a (meth) acrylic-type monomer as a main monomer. The content ratio of the (meth) acrylic monomer in the monomer component constituting the (meth) acrylic polymer is preferably 50% by weight or more, more preferably 70% by weight to 100% by weight, still more preferably 80% by weight to It is 100% by weight, particularly preferably 95% by weight to 100% by weight. The monomer in the monomer component may be only one type or two or more types.

  As a (meth) acrylic-type monomer, Preferably, (meth) acrylic acid ester and (meth) acrylic acid are mentioned.

  Examples of the (meth) acrylic acid ester include (meth) acrylic acid alkyl esters having 1 to 30 carbon atoms (including cycloalkyl groups), hydroxyl group-containing (meth) acrylic acid esters, and the like. Only one (meth) acrylic acid ester may be used, or two or more may be used.

  Examples of the alkyl (meth) acrylate alkyl ester having 1 to 30 carbon atoms (including a cycloalkyl group) include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, Isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, (meth) acrylic Amyl acid, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, (meth) Nonyl acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, ( T) Isodecyl acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, (meta And (meth) acrylic acid alkyl esters having 1 to 30 carbon atoms (including cycloalkyl groups) such as nonadecyl acrylate, eicosyl (meth) acrylate, and lauryl (meth) acrylate. Among these (meth) acrylic acid esters, a (meth) acrylic acid alkyl ester of an alkyl group having 2 to 20 carbon atoms (including a cycloalkyl group) is preferable, and 4 to 18 carbon atoms are more preferable. (Meth) acrylic acid alkyl ester of an alkyl group (including a cycloalkyl group).

  Examples of the hydroxyl group-containing (meth) acrylic acid ester include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and the like.

  The monomer component constituting the (meth) acrylic polymer preferably contains at least one selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer in order to sufficiently develop the effect as an adhesive. More preferably, it is a carboxyl group-containing monomer. Moreover, the monomer component which comprises the said (meth) acrylic-type polymer may contain acrylonitrile in order to fully express the effect as an adhesive.

  Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and allyl alcohol. Only one type of hydroxyl group-containing monomer may be used, or two or more types may be used.

  Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, maleic acid, fumaric acid, and itaconic acid. Only one type of carboxyl group-containing monomer may be used, or two or more types may be used.

  When the monomer component constituting the (meth) acrylic polymer includes a hydroxyl group-containing monomer, the content ratio of the hydroxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer is preferably 0.1% by weight to It is 20% by weight, more preferably 0.1% by weight to 10% by weight. When the monomer component constituting the (meth) acrylic polymer includes a carboxyl group-containing monomer, the content ratio of the carboxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer is preferably 0.1 wt. % To 20% by weight, more preferably 0.1% to 10% by weight. Thus, when the monomer component constituting the (meth) acrylic polymer contains at least one selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer, when a crosslinking agent is used, A cross-linking reaction can be efficiently generated, and the effect as an adhesive can be sufficiently exhibited. Furthermore, the content ratio of the hydroxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer and the content ratio of the carboxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer are within the above range. By adjusting so that it may be settled in the inside, crushing of the adherend during the peeling operation can be effectively prevented. The content ratio of the hydroxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer and the content ratio of the carboxyl group-containing monomer in the monomer component constituting the (meth) acrylic polymer are more than the above range. When the amount is too large, the adhesive force becomes too large, and blocking may occur easily. Further, the adherend may be easily crushed during the peeling operation.

  The pressure-sensitive adhesive layer preferably contains a cross-linking agent. When the pressure-sensitive adhesive layer contains a crosslinking agent, the content ratio of the crosslinking agent in the pressure-sensitive adhesive layer can be appropriately set according to the purpose, but is preferably the main resin component (preferably, (meth) acrylic polymer) 100. It is 0.1 weight part-20 weight part with respect to a weight part. By keeping the content of the crosslinking agent in the pressure-sensitive adhesive layer within the above range, an appropriate crosslinking reaction can be caused, and the adherend can be effectively prevented from being broken during the peeling operation.

  Examples of the crosslinking agent include an epoxy crosslinking agent, an isocyanate crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt crosslinking agent, and a carbodiimide crosslinking. Agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents and the like. Among these crosslinking agents, melamine-based crosslinking agents, epoxy-based crosslinking agents, and isocyanate-based crosslinking agents are preferable because the effects of the present invention can be sufficiently expressed. Moreover, a crosslinking agent can be suitably selected as needed and may be only 1 type, and 2 or more types of mixed systems may be sufficient as it.

  The pressure-sensitive adhesive layer may contain a plasticizer. When the pressure-sensitive adhesive layer contains a plasticizer, the content ratio of the plasticizer in the pressure-sensitive adhesive layer can be appropriately set according to the purpose, but preferably the main resin component (preferably, (meth) acrylic polymer) 100 It is 0.1 weight part-70 weight part with respect to a weight part. By keeping the content of the plasticizer in the pressure-sensitive adhesive layer within the above range, the effect of the present invention can be expressed more effectively. If the content of the plasticizer in the pressure-sensitive adhesive layer is larger than 70 parts by weight with respect to 100 parts by weight of the main resin component (preferably a (meth) acrylic polymer), the pressure-sensitive adhesive layer becomes too flexible, There is a risk that adhesive residue and adherend contamination are likely to occur.

  Examples of the plasticizer include phthalate ester-based, trimellitic ester-based (Dainippon Ink Co., Ltd., W-700, trimellitic trioctyl, etc.), adipate ester-based (manufactured by J-Plus, D620, dioctyl adipate, diisononyl adipate, etc.), phosphate esters (such as tricresyl phosphate), adipic acid esters, citrate esters (such as acetyl citrate tributyl), sebacic acid esters, aceleic acid esters, maleic acid esters Benzoic acid ester, polyether polyester, epoxy polyester (epoxidized soybean oil, epoxidized linseed oil, etc.), polyester (low molecular polyester comprising carboxylic acid and glycol, etc.) and the like. In the present invention, it is preferable to use an ester plasticizer. Only one type of plasticizer may be used, or two or more types may be used.

  The pressure-sensitive adhesive layer may contain any appropriate catalyst in order to promote a crosslinking reaction or the like. When the pressure-sensitive adhesive layer contains a catalyst, the content ratio of the catalyst in the pressure-sensitive adhesive layer can be appropriately set according to the purpose, but is based on 100 parts by weight of the main resin component (preferably a (meth) acrylic polymer). 0.01 parts by weight to 10 parts by weight. By keeping the content ratio of the catalyst in the pressure-sensitive adhesive layer within the above range, the effect of the present invention can be expressed more effectively.

  Examples of such catalysts include tetraisopropyl titanate, tetra-n-butyl titanate, tin octylate, lead octylate, cobalt octylate, zinc octylate, calcium octylate, lead naphthenate, cobalt naphthenate, and dibutyltindi Organometallic compounds such as acetate, dibutyltin dioctate, dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin maleate; butylamine, dibutylamine, hexylamine, t-butylamine, ethylenediamine, isophoronediamine, imidazole, lithium hydroxide, potassium hydroxide, Basic compounds such as sodium methylate; p-toluenesulfonic acid, trichloroacetic acid, phosphoric acid, monoalkyl phosphoric acid, dialkyl phosphoric acid, phosphoric acid of β-hydroxyethyl acrylate Ester, monoalkyl phosphite, acidic compounds such as dialkyl phosphite; and the like. Only one type of catalyst may be used, or two or more types of catalysts may be used.

The pressure-sensitive adhesive layer preferably has an SP value of 9.0 (cal / cm ³ ) ^{0.5 to} 12.0 (cal / cm ³ ) ^{0.5 in} order to further manifest the effects of the present invention. And more preferably 9.5 (cal / cm ³ ) ^{0.5 to} 11.0 (cal / cm ³ ) ^0.5 . The SP value is a solubility parameter calculated by the Small formula. The SP value can be calculated by a method described in a known document (for example, Journal of Applied Chemistry, 3, 71, 1953., etc.).

  The pressure-sensitive adhesive layer may contain any appropriate additive as long as the effects of the present invention are not impaired. Examples of such additives include ultraviolet absorbers, fillers, anti-aging agents, tackifiers, pigments, dyes, and silane coupling agents.

  The pressure-sensitive adhesive tape of the present invention may have a release liner on the surface of the pressure-sensitive adhesive layer.

  Any appropriate separator can be adopted as the release liner. As such a release liner, for example, a base material having a release layer such as a plastic film or paper surface-treated with a release agent such as silicone-based, long-chain alkyl-based, fluorine-based, molybdenum sulfide; polytetrafluoroethylene, Low-adhesive substrate made of a fluoropolymer such as polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, chlorofluoroethylene / vinylidene fluoride copolymer; And a low-adhesive substrate made of a nonpolar polymer such as a resin (for example, polyethylene, polypropylene, etc.).

  As a method of providing the pressure-sensitive adhesive layer on the substrate, any appropriate means can be adopted as long as the effects of the present invention are not impaired. As such means, preferably, the pressure-sensitive adhesive layer is provided by applying a coating liquid for forming the pressure-sensitive adhesive layer on the substrate.

  As the coating method, any appropriate coating method can be adopted within a range not impairing the effects of the present invention. Examples of such a coating method include a reverse method, a direct method, and various methods combined with a metering roll. In order to fully exhibit the effects of the present invention, it is preferable to adjust the thickness variation of the coating layer in a wet state containing a solvent to within ± 20% in the width direction.

<Non-adhesive layer>
The pressure-sensitive adhesive tape of the present invention preferably has a pressure-sensitive adhesive layer on one side of the substrate, and a functional layer that reduces the dynamic frictional force on the surface of the substrate opposite to the pressure-sensitive adhesive layer. As the functional layer for reducing the dynamic frictional force, it is only necessary to form irregularities on the substrate. In addition to the method of processing the substrate using an embossing roll, the unevenness may be a method of forming the unevenness by scraping the surface of the substrate with a laser or a sand blaster. Here, the arithmetic average surface roughness Ra of the substrate surface is preferably 400 nm or more, and more preferably 700 nm or more. If the arithmetic average surface roughness Ra of the base material surface is smaller than this value, problems such as close contact or sticking between the stage of the expanding device and the base material may occur. In addition, the functional layer may be composed of powder, fine particles, or nanoparticles, and these function as a roller, or the surface of the base material is uneven, and the expander stage and the base material are in close contact with each other. Alternatively, the frictional force is reduced by preventing sticking. Here, the particles have an average particle diameter of preferably 10 nm or more, more preferably 50 nm or more, and further preferably 100 nm or more. Moreover, waxes and oils such as machine oil and silicone oil may be used. In this case, not only the effect of rollers and surface irregularities at the molecular level, but also the viscosity is deformed by the shear stress at the time of expansion, preventing the substrate from sticking to the stage or sticking, and reducing the frictional force. Reduce. These functional layers that reduce the dynamic friction force are provided by coating, coating, spraying, etc. when manufacturing the base material or adhesive, and are mixed together with resin pellets that are the raw material of the base material. Or a base material or an adhesive. In addition, as a functional layer that has adhesive tape characteristics required for semiconductor processing (such as cleanliness and thickness uniformity of the adhesive tape, etc.) and can be industrially mass-produced to reduce useful dynamic friction force, A functional layer made of a non-adhesive material (hereinafter sometimes referred to as a non-adhesive layer) will be described below.

  The composition of the non-adhesive layer is not particularly limited, and examples thereof include a silicone layer, a (meth) acrylic polymer layer, a mixed layer of a silicone layer and a (meth) acrylic polymer layer, ) A silicone layer in which an acrylic polymer is graft-polymerized. Among these, a mixed layer of silicone and (meth) acrylic polymer is preferable. By making the non-adhesive layer a mixed layer of silicone and (meth) acrylic polymer, the familiarity between the non-adhesive layer and the substrate (especially plastic film) is improved, and it is also a material that reduces the dynamic frictional force. Therefore, the pressure-sensitive adhesive tape of the present invention can be expanded uniformly in the vertical direction and the horizontal direction, and has good followability to deformation such as stretching.

  The surface of the non-adhesive layer made of such a material may have an uneven structure. This is because when the surface of the non-adhesive layer has a concavo-convex structure, it becomes easier to expand more uniformly in the vertical and horizontal directions. Moreover, it is possible to prevent the blocking phenomenon which may occur by manufacturing and storing the pressure-sensitive adhesive tape in a roll shape. Specifically, in the uneven structure, the arithmetic average surface roughness Ra of the non-adhesive layer is preferably 50 nm or more, more preferably 100 nm or more, and further preferably 200 nm or more. The upper limit value of the arithmetic average surface roughness Ra is preferably 5 μm or less. In the adhesive tape of the present invention, the arithmetic average surface roughness Ra of the non-adhesive layer can be expanded uniformly in the vertical direction and the horizontal direction by adjusting it within the above range. In the adhesive tape of the present invention, if the arithmetic average surface roughness Ra of the non-adhesive layer is too small, when the adhesive tape is expanded by the indentation method, the indentation jig and the back surface of the tape are in close contact with each other. The pushing jig contact portion and the non-contact portion cannot be expanded uniformly, and in the worst case, the adhesive tape may be broken at the non-contact portion. In the pressure-sensitive adhesive tape of the present invention, if the arithmetic average surface roughness Ra of the non-stick layer is too large, the unevenness on the back surface of the pressure-sensitive adhesive tape is too large, so that it cannot be fixed by vacuum suction during the dicing process due to air inflow from the uneven portions. There is a risk of malfunction. A method for measuring the arithmetic average surface roughness Ra will be described later.

  The non-adhesive layer has a glass transition temperature Tg by differential scanning calorimetry (DSC measurement) of preferably 20 ° C. or higher, more preferably 30 ° C. or higher, still more preferably 50 ° C. or higher, and particularly preferably 55. It is above ℃. Although the upper limit of the glass transition temperature Tg by differential scanning calorimetry of the non-adhesive layer is not particularly limited, it is preferably 200 ° C. or less, more preferably 170 ° C. or less, and still more preferably 150 from the viewpoint of handleability. ° C or lower, particularly preferably 130 ° C or lower, and most preferably 100 ° C or lower. If the glass transition temperature Tg by differential scanning calorimetry of the non-adhesive layer is within the above range, the hardness of the surface of the non-adhesive layer will be moderately high even at high temperatures, and thus the heat resistance will be high, and the adhesive of the present invention When dicing or the like is performed by adsorbing and fixing the tape to the fixing base with a negative pressure, it is possible to effectively suppress the occurrence of excessive adhesion due to heat generation of the base. In addition, the measuring method of the glass transition temperature Tg by the differential scanning calorimetry (DSC measurement) of a non-adhesion layer is mentioned later.

  When the non-adhesive layer contains a (meth) acrylic polymer, the (meth) acrylic polymer in the non-adhesive layer has a calculated Tg of preferably 10 ° C or higher, more preferably 20 ° C or higher, Preferably it is 30 degreeC or more, Most preferably, it is 45 degreeC or more. The upper limit of the calculated Tg of the (meth) acrylic polymer in the non-adhesive layer is not particularly limited, but is preferably 200 ° C. or lower, more preferably 150 ° C. or lower, and further preferably 100 ° C. or lower. When the calculated Tg of the (meth) acrylic polymer in the non-adhesive layer is within the above range, the heat resistance of the micro uneven structure on the surface of the non-adhesive layer is increased, and the adhesive tape of the present invention is fixed by negative pressure. When dicing or the like is performed by adsorbing and fixing to the pedestal, it is possible to effectively suppress over-adhesion due to heat generation of the pedestal.

In the present invention, the “calculated Tg” of a copolymer (such as a (meth) acrylic polymer in the non-adhesive layer) is a formula for calculating Fox with respect to Tg of a structural unit derived from a monomer constituting the copolymer. Is the calculated glass transition temperature obtained by The Fox formula is a glass transition temperature Tg (° C.) of a copolymer as shown below, and a glass transition temperature Tgi (° C.) of a homopolymer obtained by homopolymerizing each of the monomers constituting the copolymer. It is a relational expression. In the following Fox equation, Tg (° C.) is the glass transition temperature of the copolymer, Wi is the weight fraction of monomer i, and Tgi (° C.) is the glass transition temperature of the homopolymer of monomer i. Show.
1 / (273 + Tg) = Σ (Wi / (273 + Tgi))
In addition, as the glass transition temperature Tgi (° C.) of the homopolymer, specifically, “Poly
The values described in “mer Handbook 3rd Edition” (A WILEY-INTERSCIENCE PUBLICATION, 1989) can be used.

When the non-adhesive layer contains a (meth) acrylic polymer, the SP value of the (meth) acrylic polymer in the non-adhesive layer is preferably 9.0 (cal / cm ³ ) ^{0.5 to} 12.0. (Cal / cm ³ ) ^0.5 , more preferably 9.5 (cal / cm ³ ) ^{0.5 to} 11.5 (cal / cm ³ ) ^0.5 , and even more preferably 9.5 ( cal / cm ³ ) ^{0.5 to} 11.0 (cal / cm ³ ) ^0.5 . The SP value is a solubility parameter calculated by the Small formula. The SP value can be calculated by a method described in a known document (for example, Journal of Applied Chemistry, 3, 71, 1953., etc.).

  The non-adhesive layer preferably has a phase separation structure. When the non-adhesive layer has a phase separation structure, a fine uneven structure can be efficiently formed on the surface of the non-adhesive layer. This is probably because, for example, when the non-adhesive layer is a mixed layer of silicone and (meth) acrylic polymer, the mass transfer of silicone and (meth) acrylic polymer during phase separation structure formation It is estimated that unevenness is generated due to the difference. By forming this concavo-convex structure, in the pressure-sensitive adhesive tape of the present invention, it can be expanded uniformly in the vertical direction and the horizontal direction, and it is possible to suppress the occurrence of over-adhesion when performing adsorption fixation by negative pressure, and in a roll-like form Blocking can be effectively suppressed, and tearing or tearing when rewinding from a roll shape can be suppressed.

  The non-adhesive layer preferably includes a silicone-rich phase containing more silicone than the (meth) acrylic polymer and a (meth) acrylic polymer-rich phase containing more (meth) acrylic polymer than silicone. More specifically, the non-adhesive layer preferably includes a phase-separated structure in which the silicone-rich phase and the (meth) acrylic polymer-rich phase are independent from each other, and more preferably, the silicone-rich phase is an air interface. It exists on the side (opposite side of the substrate (particularly, plastic film)), and the (meth) acrylic polymer rich phase is present on the substrate (particularly plastic film) side. By having such a phase separation structure, blocking is effectively suppressed by the silicone-rich phase present on the air interface side, and the (meth) acrylic polymer-rich phase present on the substrate (particularly, plastic film) side. The familiarity between the non-adhesive layer and the substrate (particularly, the plastic film) is improved, and the deformation followability is improved. Such a phase separation structure can be formed by adjusting the mixing ratio of the silicone and the (meth) acrylic polymer in the non-adhesive layer as follows.

  The non-adhesive layer has a phase-separated structure, and as described above, a silicone-rich phase containing more silicone than (meth) acrylic polymer and a more (meth) acrylic polymer than silicone (meta) The inclusion of an acrylic polymer rich phase can be observed by any suitable method. As such an observation method, for example, the cross-section of the non-adhesive layer is measured using an electron microscope such as a transmission electron microscope (TEM), a scanning electron microscope (SEM), or a field emission scanning electron microscope (FE-SEM). There is a method of morphological observation. The two-layer separation structure can be read by the density of the morphological observation image. Observation is also made by observing changes in the content of silicon and carbon contained in the composition while changing the probe light depth from the non-adhesive layer air interface side to the inside by infrared absorption spectroscopy using the total reflection method. A method is also mentioned. In addition, a method of observing with an X-ray microanalyzer or X-ray photoelectron spectroscopy is also included. Moreover, you may observe combining these methods suitably.

  Phase of non-adhesive layer on the air interface side (on the opposite side of the substrate (especially plastic film)) and (meth) acrylic polymer rich phase on the substrate (especially plastic film) side In the case of having a separation structure, when the non-adhesive layer is adsorbed and fixed to the fixing base by negative pressure and the fixing base generates heat when dicing or the like, the surface structure of the phase separation structure is destroyed by the heat load due to the heat generation. In particular, it is possible that the surface structure of the phase separation structure in the convex part that is in contact with the fixing base that generates a lot of heat is destroyed, and the (meth) acrylic polymer-rich phase is exposed on the air interface side in the convex part. However, in the adhesive tape of the present invention, the glass transition temperature Tg by differential scanning calorimetry of the non-adhesive layer is preferably within the above range, so that the hardness of the convex portion subjected to a thermal load is moderately high, Therefore, heat resistance becomes high. For this reason, when adhering and fixing the adhesive tape of the present invention to the fixing pedestal with negative pressure to perform dicing or the like, it is possible to effectively suppress the occurrence of over-adhesion due to heat generation of the pedestal.

  When the non-adhesive layer is a mixed layer of silicone and (meth) acrylic polymer, the mixing ratio of silicone and (meth) acrylic polymer in the non-adhesive layer is weight ratio, preferably silicone: (meth) acrylic System polymer = 1: 50-50: 1, more preferably silicone: (meth) acrylic polymer = 1: 30-30: 1, and more preferably silicone: (meth) acrylic polymer = 1 : 10 to 10: 1, particularly preferably silicone: (meth) acrylic polymer = 1: 5 to 5: 1, and most preferably silicone: (meth) acrylic polymer = 1: 3 to 5 : 1. If the content ratio of silicone in the non-adhesive layer is too large, the chemical affinity with the back surface of the base material (particularly, the plastic film) is lowered, and there is a possibility that it is difficult to be familiar with the back surface of the base material (particularly, the plastic film). Moreover, when the content rate of the silicone in a non-adhesion layer is too large, when it is set as an adhesive tape, the followability with respect to deformation | transformation, such as extending | stretching, will worsen, and there exists a possibility that a non-adhesion layer may be crushed and cause a contamination. When the content ratio of the (meth) acrylic polymer in the non-adhesive layer is too large, the non-adhesive layer may act as an acrylic adhesive, and blocking may easily occur.

  Any appropriate silicone can be adopted as the silicone. As such silicones, for example, addition type silicones obtained by curing a alkenyl group-containing polydialkylsiloxane and polydialkylhydrogenpolysiloxane by an addition reaction using a platinum compound as a catalyst to form a peelable film, tin-based Examples include a condensation type silicone obtained by reacting a methylol group-containing polydialkylsiloxane and a polydialkylhydrogenpolysiloxane using a catalyst. Examples of the addition type silicone include “KS-776A” and “KS-839L” manufactured by Shin-Etsu Silicone. Examples of the condensation type silicone include, for example, “KS723A / B” manufactured by Shin-Etsu Silicone. In addition, when manufacturing silicone, you may use other crosslinking agents, a crosslinking accelerator, etc. suitably other than a platinum-type catalyst and a tin-type catalyst. The properties of silicone are classified into a type dissolved in an organic solvent such as toluene, an emulsion type obtained by emulsifying these, and a solventless type consisting only of silicone. In addition to addition-type silicone and condensation-type silicone, silicone / acrylic graft polymer, silicone / acrylic block polymer, and the like can be used. Examples of the silicone / acrylic graft polymer include Cymac GS-30, GS101, US-270, US-350, US-380 (above, manufactured by Toagosei Co., Ltd.). Examples of the silicone / acrylic block polymer include Modiper FS700, FS710, FS720, FS730, and FS770 (manufactured by NOF Corporation).

  Any appropriate (meth) acrylic polymer can be adopted as the (meth) acrylic polymer. In the present invention, “(meth) acryl” means “acryl and / or methacryl”.

  The (meth) acrylic polymer is a polymer composed of monomer components containing a (meth) acrylic monomer as a main monomer. The content ratio of the (meth) acrylic monomer in the monomer component constituting the (meth) acrylic polymer is preferably 50% by weight or more, more preferably 70% by weight to 100% by weight, and still more preferably 90% by weight to 100%. % By weight, particularly preferably 95% by weight to 100% by weight. The monomer in the monomer component may be only one type or two or more types.

  As a (meth) acrylic-type monomer, Preferably, (meth) acrylic acid ester and (meth) acrylic acid are mentioned.

  Examples of the (meth) acrylic acid ester include (meth) acrylic acid alkyl esters having 1 to 30 carbon atoms (including cycloalkyl groups), hydroxyl group-containing (meth) acrylic acid esters, and the like. Only one (meth) acrylic acid ester may be used, or two or more may be used.

  Examples of the alkyl (meth) acrylate alkyl ester having 1 to 30 carbon atoms (including a cycloalkyl group) include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, Isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, (meth) acrylic Amyl acid, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, (meth) Nonyl acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, ( T) Isodecyl acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, (meta And (meth) acrylic acid alkyl esters having 1 to 30 carbon atoms (including cycloalkyl groups) such as nonadecyl acrylate, eicosyl (meth) acrylate, and lauryl (meth) acrylate. Among these (meth) acrylic acid esters, a (meth) acrylic acid alkyl ester of an alkyl group having 2 to 20 carbon atoms (including a cycloalkyl group) is preferable, and 4 to 18 carbon atoms are more preferable. (Meth) acrylic acid alkyl ester of an alkyl group (including a cycloalkyl group).

  Examples of the hydroxyl group-containing (meth) acrylic acid ester include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and the like.

  The monomer component constituting the (meth) acrylic polymer may contain at least one selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer in order to sufficiently exhibit the effects of the present invention.

  Examples of the hydroxyl group-containing monomer include allyl alcohol. Only one type of hydroxyl group-containing monomer may be used, or two or more types may be used.

  Examples of the carboxyl group-containing monomer include carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, maleic acid, fumaric acid, itaconic acid, and the like. Only one type of carboxyl group-containing monomer may be used, or two or more types may be used.

  When the non-adhesive layer contains a (meth) acrylic polymer, the (meth) acrylic polymer in the non-adhesive layer is preferably such that the content ratio of the hydroxyl group-containing (meth) acrylic ester in the monomer component constituting it is The total amount of monomer components other than the hydroxyl group-containing (meth) acrylic acid ester is preferably 2% by weight to 30% by weight, more preferably 3% by weight to 25% by weight, and particularly preferably 5% by weight. % To 20% by weight. When the non-adhesive layer contains a (meth) acrylic polymer, the content ratio of the hydroxyl group-containing (meth) acrylic acid ester in the monomer component constituting the (meth) acrylic polymer in the non-adhesive layer is ) If the total amount of monomer components other than the acrylate ester is within the above range, a concavo-convex structure is more efficiently formed on the surface of the non-adhesive layer. By forming this concavo-convex structure, the adhesive tape of the present invention In addition, it can expand uniformly in the vertical and horizontal directions, and can further suppress the occurrence of over-adhesion when performing adsorption fixation by negative pressure, and can more effectively suppress blocking in a roll-like form. It is possible to further suppress tearing or tearing when rewinding from the form.

  When the non-adhesive layer contains a (meth) acrylic polymer, the (meth) acrylic polymer in the non-adhesive layer is preferably in a monomer component other than the hydroxyl group-containing (meth) acrylic acid ester in the monomer component constituting it. (Meth) acrylic acid and / or (meth) acrylic acid ester may be included. In this case, the content ratio of (meth) acrylic acid and (meth) acrylic acid ester is (meth) acrylic acid: (meth) acrylic acid ester by weight ratio, preferably 0: 100 to 20:80. More preferably, it is 0: 100-10: 90, More preferably, it is 0: 100-5: 95.

  If the content ratio of (meth) acrylic acid and (meth) acrylic acid ester is within the above range, a concavo-convex structure is more efficiently formed on the surface of the non-adhesive layer. In the pressure-sensitive adhesive tape, it can be expanded uniformly in the vertical direction and the horizontal direction, and can further suppress the occurrence of over-adhesion when performing adsorption fixation by negative pressure, and can more effectively suppress blocking in a roll-like form, It is possible to further suppress tearing or tearing when rewinding from the roll form.

  The (meth) acrylic polymer can be produced by any appropriate polymerization method.

  The non-adhesive layer may contain any appropriate additive as long as the effects of the present invention are not impaired. Examples of such additives include catalysts, ultraviolet absorbers, fillers, anti-aging agents, tackifiers, pigments, dyes, and silane coupling agents.

  The thickness of the non-adhesive layer is preferably 0.01 μm to 10 μm, more preferably 0.1 μm to 5 μm, and still more preferably 0.1 μm to 2 μm. When the thickness of the non-adhesive layer is less than 0.01 μm, blocking tends to occur. When the thickness of the non-adhesive layer is larger than 10 μm, the followability to deformation such as stretching may be deteriorated. If the thickness of the non-adhesive layer is less than 0.01 μm, the effects of the present invention may be difficult to be exhibited or the manufacture may be difficult.

  As a method for forming a non-adhesive layer on one side of a substrate (particularly, a plastic film), for example, a material of the non-adhesive layer is applied to one side of a base (particularly a plastic film) and dried. The method of forming a non-adhesion layer by is mentioned. Examples of the coating method include a method using a bar coater, a gravure coater, a spin coater, a roll coater, a knife coater, an applicator and the like.

  The pressure-sensitive adhesive tape of the present invention can be used for any appropriate application. The pressure-sensitive adhesive tape of the present invention is uniform in the vertical and horizontal directions by strictly adjusting the dynamic friction force against the SUS430BA plate on the surface of the outermost layer opposite to the pressure-sensitive adhesive layer when viewed from the base material to a predetermined level. For example, when the chip is adsorbed and separated by a collet from above the dicing tape, it can be adsorbed and separated accurately. Therefore, it can be suitably used for semiconductor processing using a semiconductor wafer made of a fragile material and having a fine and fine circuit pattern as an adherend. When the pressure-sensitive adhesive tape of the present invention is used for semiconductor processing, uniform expansion is possible, and stress strain accumulation does not occur. Therefore, it is possible to accurately follow and paste a fine and fine circuit pattern of a semiconductor wafer. Since the natural release of stress strain after bonding to the semiconductor wafer does not occur, the semiconductor wafer can be effectively prevented from being crushed. In particular, since a wafer used for an LED is made of a very fragile material such as gallium nitride, gallium arsenide, or silicon carbide, the adhesive tape of the present invention is used for dicing a wafer used for an LED (LED dicing) or the like. It is very suitable for.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples at all. Parts mean parts by weight. The amount of the reagent supplied in the solution is represented by the amount of solid content remaining after the solution is volatilized (solid content conversion amount).

<Dynamic friction force>
The pressure-sensitive adhesive tape was cut into a width of 100 mm and a length of 200 mm, and bonded so that air bubbles would not enter the metal surface 10 of the slipperiness measuring jig 300 as shown in FIG.
A weight 400 (weight 2.0 kg, bottom surface 52 mm x 63 mm, bottom surface material SUS430BA plate) as shown in FIG. 4 is placed on the back surface of the bonded adhesive tape, and a slip is measured by attaching a string to the hook portion 20. Through the pulley 30 of the tool 300, it was pulled 100 mm in a direction perpendicular to the metal surface 10 at a pulling speed of 0.3 m / min within 1 minute, and the frictional force at that time was measured. The dynamic friction force was an average value of the friction force after a tensile distance of 30 mm. In addition, the measurement was performed with “AUTOGRAPH AG-IS” manufactured by SHIMADZU.

<Modulus>
The modulus was measured according to JIS-K-7127 (1999) by cutting the adhesive tape into a width of 10 mm and a length of 150 mm, and at a temperature of 23 ° C. and a humidity of 50%. The force when the adhesive tape was stretched 150% was measured. The measurement was performed with “AUTOGRAPH AG-IS” manufactured by SHIMADZU.
In addition, the test produced the sample which made the longitudinal direction of the adhesive tape test piece MD or TD, and also measured the difference in MD and TD.
The modulus ratio was determined from the above measurement. Note that. When the value differs between MD and TD, the calculation is performed using a smaller value as the denominator. Specifically, if the modulus value is TD> MD or TD = MD, the modulus ratio is TD / MD, and if TD <MD, MD / TD is the modulus ratio.

<Stress relaxation rate>
The pressure-sensitive adhesive tape is cut into a width of 10 mm and a length of 150 mm. In an atmosphere with a temperature of 23 ° C. and a humidity of 50%, the adhesive tape is pulled at a speed of 1.0 m / min with a chuck distance of 50 mm, and is pulled when the pressure-sensitive adhesive tape is 150% extended Was held for 2 seconds, the stress (P1) immediately after 150% elongation and the stress (P2) after 2 seconds were measured, respectively, and the stress relaxation rate (L) was determined by the following equation. The measurement was performed with “AUTOGRAPH AG-IS” manufactured by SHIMADZU.
L = [(P1-P2) / P1] × 100 (%)
In addition, the test produced the sample which made the longitudinal direction of the adhesive tape test piece MD or TD, and also measured the difference in MD and TD. Then, (TD direction stress relaxation rate / MD direction stress relaxation rate) was defined as the stress relaxation rate ratio.

<Maximum elongation>
The maximum elongation was measured by an Instron type tensile tester (manufactured by Shimadzu Corporation, Autograph) according to JIS-K-7127 (1999). Specifically, after a sample having a width of 20 mm and a length of 100 mm was set at a distance between chucks of 50 mm, the sample was pulled at a pulling speed of 0.3 m / min, and the value at the time of breaking was measured.

<Elastic modulus>
The elastic modulus was measured with an Instron type tensile tester (manufactured by Shimadzu Corporation, Autograph) in accordance with JIS-K-7127 (1999). Specifically, after a sample having a width of 20 mm and a length of 100 mm was installed at a distance between chucks of 50 mm, the sample was pulled at a pulling speed of 0.3 m / min to obtain an initial elastic modulus. The initial elastic modulus was corrected in terms of the cross-sectional area of the sample by drawing a tangent line in the region of breaking elongation of 0 to 2% and extending the tangent line to a value of 100% elongation.

<Arithmetic mean surface roughness Ra>
Using a confocal laser microscope “LEXT4000” manufactured by OLYMPUS, measurement was performed in 3D mode with an objective lens 20 times. The observation range in the 3D mode was determined by setting the positions where the CF image (confocal image) becomes dark when the lens is moved up and down as the observation range Top and Bottom, respectively.
As the image capturing method in the 3D mode, image capturing was performed at a pitch of 0.2 μm by the Step method.
Arithmetic mean surface roughness Ra was measured by measuring Ra at an arbitrary place by analysis mode roughness analysis. In addition, the value was calculated | required by the average value of n = 5.

<Measurement of glass transition temperature Tg by differential scanning calorimetry (DSC measurement) of non-adhesive layer>
The non-adhesive layer was collected with a feather blade, and about 3 mg was enclosed in a pan for DSC solid measurement.
The bread was put into a highly sensitive differential scanning calorimeter Q2000 manufactured by TA Instruments, and the temperature was raised from 0 ° C. to 200 ° C. at a temperature rising rate of 2 ° C./min.
Moreover, it cooled on the same conditions and heated up further. The intersection of the measurement curve and the straight line connecting the midpoints of the extrapolation of the straight line portion below the second run transition region and the extrapolation of the straight line portion above the transition region was determined, and this was defined as the glass transition temperature Tg.

<Observation of non-adhesive layer>
(SEM observation)
After processing so that the cross section of the non-adhesive layer could be observed, the morphology was observed with a transmission electron microscope (SEM).
(Observation by infrared spectroscopic measurement by total reflection method (ATR-IR))
Two types of total reflection measurement prisms (ZnSe45 °, Ge45 °) are used to select the total reflection measurement method and change the analysis depth of the probe light using an infrared spectrophotometer (Perkinermer, Spectrum One). Then, ATR-IR measurement of the non-adhesive layer was performed.

<Expandability>
The adhesive tape was cut into a width of 100 mm and a length of 100 mm, and a cross reference line with a length of 30 mm coinciding with the flow in the MD direction and the TD direction was written at the center of the adhesive surface of the adhesive tape (FIG. 5). The adhesive tape 1000 was fixed to a ring-shaped jig 40 having an inner diameter of 76 mm and an outer diameter of 88 mm so that the cross reference line was at the center, and an expandability evaluation sample 500 was produced (FIG. 6). As shown in FIG. 7, from the tape back side of the expandable evaluation sample 500, a cylinder 50 having a diameter of 58 mm and a height of 110 mm was pressed 50 mm at a speed of 0.6 m / min, and the adhesive tape 1000 was stretched. At this time, a base 60 having a height of 60 mm was provided around the cylinder 50 in order to make the pushing distance constant. After stretching, the length of the cross-reference line written on the glue surface in the MD direction and the TD direction was measured with a caliper in a state where the adhesive tape was spread without wrinkles. Further, the expansion ratio in the MD direction / TD direction was also calculated. In addition, the measurement was performed with “AUTOGRAPH AG-IS” manufactured by SHIMADZU.
The part of the film to be expanded in the expanding process is a place where the cylinder 50 in FIG. That is, it is a portion on the upper surface of the column 50 of the adhesive tape 1000. This is because a chip is installed at that site and must be expanded to leave a gap. When the dynamic friction coefficient is large, a situation may occur in which only the portion of the adhesive tape 1000 that does not contact the upper surface of the cylinder 50 in FIG. 7 is expanded.
In addition, the film at the site to be expanded needs to be stretched uniformly, and the state of being expanded locally (or not expanded) can be an obstacle to solving the problem. Specifically, a figure in which two straight lines (reference lines) of arbitrary length are orthogonally crossed at the part where the film is to be expanded, and when this is expanded, each of the two straight lines expands. Stretch rate before and after (expanded reference line elongation (%) = (expanded reference line length / expanded reference line length) x 100) is extended so that each of the two straight lines is 120% or more. Preferably, it is 130% or more. If it is less than this value, there is not enough space between chips, and subsequent chip removal becomes difficult.
Also, if the extension is too different for each reference line, even if the distance between chips is widened, there is a possibility that chip position variation will occur and chip removal will still be difficult.
Specifically, when the length of each of the two straight lines is set to L1 and L2 after expansion, if L1> L2 or L1 = L2, the ratio of the two lengths (base line elongation after expansion) The ratio L1 / L2 is preferably 1.00 to 1.30 in order to perform the chip removal operation satisfactorily.
Therefore, “the adhesive tape is sufficiently expanded and uniformly expanded in the longitudinal direction and the lateral direction” can be said to be that the adhesive tape is deformed as described above at the site where the film is to be expanded.

<GPC measurement conditions>
Equipment used: HLC-8120GPC manufactured by TOSOH
Column used: TSKgel SuperHZM-H / HZ4000 / HZ3000 / HZ2000
Column size: 6.0 mm I.D. D. × 150mm
Eluent: THF
Flow rate: 0.6ml / min
Detector: RI
Column temperature: 40 ° C
Injection amount: 40 ° C
Sample concentration: 1.0 g / l
After the sample was dried, it was adjusted to a THF solution and allowed to stand overnight. This solution was filtered with a 0.45 μm membrane filter, and the filtrate was subjected to GPC measurement.

[Production Example 1]: Production of base material Soft poly (polyethylene chloride) containing 27 parts by weight of DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by J-Plass) with respect to 100 parts by weight of polyvinyl chloride having a polymerization degree P = 1050 A vinyl chloride film was formed by a calendar method. The thickness of the obtained soft polyvinyl chloride film is 70 μm, and the elastic modulus (MD) measured according to JIS-K-7127 (1999) is 250 MPa, the maximum measured according to JIS-K-7127 (1999). The elongation (MD) was 400%. Moreover, the surface roughness (arithmetic average surface roughness Ra) immediately after manufacture was 460 nm.

[Production Example 2]: Production of base material Soft poly (polyethylene chloride) containing 27 parts by weight of DOP plasticizer (bis (2-ethylhexyl phthalate), manufactured by J-Plass) with respect to 100 parts by weight of polyvinyl chloride having a polymerization degree P = 1050 A vinyl chloride film was formed by a calendar method. In addition, an embossing roll having 60 mats (arithmetic average surface roughness Ra: 6.05 μm, ten-point average surface roughness Rz: 33.74) is used immediately after the take-off roll, and an embossed surface (4B ) Was formed. The thickness of the obtained soft polyvinyl chloride film is 70 μm, and the elastic modulus (MD) measured according to JIS-K-7127 (1999) is 250 MPa, the maximum measured according to JIS-K-7127 (1999). The elongation (MD) was 400%. In addition, the surface roughness (arithmetic average surface roughness Ra) of the embossed surface (4B) immediately after manufacture was 700 nm.

[Example 1]
(Non-adhesive layer)
60 parts by weight of silicone resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 40 parts by weight of silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), acrylic copolymer (methyl methacrylate (MMA) / butyl acrylate (BA) / hydroxy 50 parts by weight of ethyl acrylate (HEA) = 70/30/10) and 10 parts by weight of a tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.) were mixed in a solution state to obtain a mixed solution (1A). The mixing ratio of the silicone and the (meth) acrylic polymer in the mixed solution (1A) was silicone: (meth) acrylic polymer = 2: 1 by weight.
The above mixed solution (1A) is applied to one side of the soft polyvinyl chloride film obtained in Production Example 1 and dried, and is non-adhesive having a thickness of 1.0 μm and an arithmetic average surface roughness Ra = 0.5 μm. Layer (1B) was formed.
Further, when the non-adhesive layer (1B) is observed with an SEM, as shown in FIGS. 8, 9, and 10, the composition is different between the air interface side and the plastic film side depending on the density of the morphology observation image. It can be confirmed that it contains a silicone-rich phase containing more silicone than the (meth) acrylic polymer and a (meth) acrylic polymer-rich phase containing more (meth) acrylic polymer than the silicone, The (meth) acrylic polymer rich phase has an independent phase separation structure, the silicone rich phase is present on the air interface side (opposite side of the plastic film), and the (meth) acrylic polymer rich phase is It was observed to be present on the plastic film side.
Furthermore, when the infrared spectroscopy measurement (ATR-IR) by a total reflection method was performed about the non-adhesion layer (1B), Si-CH with respect to the peak of 1725cm < ^-1 > vicinity derived from the carbonyl group in a (meth) acrylic-type polymer phase. As a result of measuring the absorbance ratio of the peak in the vicinity of 800 cm ⁻¹ derived from No. _3, it was found that the peak in the vicinity of 800 cm ⁻¹ becomes larger when a Ge45 ° prism is used than in ZnSe45 °. Therefore, it was found that the silicon content was higher on the air interface side than on the base material side.
It was also confirmed by FT-IR that the silicone-rich phase was present on the air interface side (opposite side of the plastic film) in the non-adhesive layer (1B). For measurement by FT-IR, “Spectrum One” manufactured by Perkinermer was used, and the air interface side was measured by the ATR method using two types of prisms (ZnSe 45 °, Ge45 °) having different analysis depth directions. The resulting chart was confirmed, the non-stick layer (meth) to the peak of ^{1720cm -1 -1730cm} -1 attributable to C = O derived from an acrylic polymer, Si-CH ₃ peak around 800 cm ^-1 from It was confirmed that the absorbance ratio was increased when a shallow Ge45 ° prism in the analysis depth direction was used. This proved that the concentration of silicone was higher on the air interface side.
Considering these observation results and the principle of minimizing the surface free energy, it was found that a two-layer structure having a silicone-rich phase on the air interface side was formed in the non-adhesive layer.
(Adhesive layer)
100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio) (weight average molecular weight = 800,000), melamine-based crosslinking Adhesive consisting of 10 parts by weight of an agent (butanol-modified melamine formaldehyde resin, “Super Becamine J-820-60N”, manufactured by Nippon Polyurethane) and 60 parts by weight of a DOP plasticizer (bis (2-ethylhexyl) phthalate, manufactured by J-Plus) A toluene solution of the agent was prepared.
After applying this adhesive solution to the surface opposite to the non-adhesive layer (1B) of the soft polyvinyl chloride film obtained in Production Example 1, the adhesive solution was dried at 130 ° C. for 90 seconds, and an adhesive layer having a thickness of 10 μm. (1C) was formed on the surface opposite to the non-adhesive layer (1B) of the soft polyvinyl chloride film.
(Adhesive tape)
As described above, a laminated structure of non-adhesive layer (1B) / soft polyvinyl chloride film / adhesive layer (1C) was constructed, and an adhesive tape (1) was produced.
The results are summarized in Table 1.

[Example 2]
(Non-adhesive layer)
60 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical), 40 parts by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical), 10 parts by weight of a tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical) It mixed in the solution state and the mixed solution (2A) was obtained.
The above mixed solution (2A) is applied to one side of the soft polyvinyl chloride film obtained in Production Example 1 and dried, and is non-adhesive having a thickness of 1.0 μm and an arithmetic average surface roughness Ra = 0.5 μm. Layer (2B) was formed.
(Adhesive layer)
100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio) (weight average molecular weight = 800,000), melamine-based crosslinking Adhesive consisting of 10 parts by weight of an agent (butanol-modified melamine formaldehyde resin, “Super Becamine J-820-60N”, manufactured by Nippon Polyurethane) and 60 parts by weight of a DOP plasticizer (bis (2-ethylhexyl) phthalate, manufactured by J-Plus) A toluene solution of the agent was prepared.
This pressure-sensitive adhesive solution was applied to the surface opposite to the non-adhesive layer (2B) of the soft polyvinyl chloride film obtained in Production Example 1, and then dried at 130 ° C. for 90 seconds to obtain a pressure-sensitive adhesive layer having a thickness of 10 μm. (2C) was formed on the surface opposite to the non-adhesive layer (2B) of the soft polyvinyl chloride film.
(Adhesive tape)
As described above, a laminated structure of non-adhesive layer (2B) / soft polyvinyl chloride film / adhesive layer (2C) was constructed, and an adhesive tape (2) was produced.
The results are summarized in Table 1.

Example 3
(Non-adhesive layer)
100 parts by weight of vinyl acetate-ethylene copolymer (Evaflex EV-450, manufactured by Mitsui DuPont Polychemical) and 50 parts by weight of a long-chain alkyl resin (Pyroyl 1010, manufactured by Yushi Kogyo Co., Ltd.) were mixed in a solution state. A mixed solution (3A) was obtained.
The above mixed solution (3A) is applied to one side of the soft polyvinyl chloride film obtained in Production Example 1 and dried, and is non-adhesive having a thickness of 1.0 μm and an arithmetic average surface roughness Ra = 0.5 μm. Layer (3B) was formed.
(Adhesive layer)
100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio) (weight average molecular weight = 800,000), melamine-based crosslinking Adhesive consisting of 10 parts by weight of an agent (butanol-modified melamine formaldehyde resin, “Super Becamine J-820-60N”, manufactured by Nippon Polyurethane) and 60 parts by weight of a DOP plasticizer (bis (2-ethylhexyl) phthalate, manufactured by J-Plus) A toluene solution of the agent was prepared.
After applying this adhesive solution to the surface opposite to the non-adhesive layer (3B) of the soft polyvinyl chloride film obtained in Production Example 1, the adhesive solution was dried at 130 ° C. for 90 seconds to have a thickness of 10 μm. (3C) was formed on the surface opposite to the non-adhesive layer (3B) of the soft polyvinyl chloride film.
(Adhesive tape)
As described above, a laminated structure of non-adhesive layer (3B) / soft polyvinyl chloride film / adhesive layer (3C) was constructed, and an adhesive tape (3) was produced.
The results are summarized in Table 1.

Example 4
(Adhesive layer)
100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio) (weight average molecular weight = 800,000), melamine-based crosslinking Adhesive consisting of 10 parts by weight of an agent (butanol-modified melamine formaldehyde resin, “Super Becamine J-820-60N”, manufactured by Nippon Polyurethane) and 60 parts by weight of a DOP plasticizer (bis (2-ethylhexyl) phthalate, manufactured by J-Plus) A toluene solution of the agent was prepared.
This pressure-sensitive adhesive solution was applied to the surface opposite to the embossed surface (4B) of the soft polyvinyl chloride film obtained in Production Example 2, and then dried at 130 ° C. for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 μm ( 4C) was formed on the surface opposite to the embossed surface (4B) of the soft polyvinyl chloride film.
(Adhesive tape)
Without providing a non-adhesive layer, a Si liner-treated PET liner with a thickness of 38 μm was applied as a release liner to the adhesive layer side, and a laminated structure of soft polyvinyl chloride film / adhesive layer (4C) / PET liner Was constructed to produce an adhesive tape (4). The arithmetic average surface roughness Ra of the non-adhesive layer was 700 nm.
The results are summarized in Table 1.

[Comparative Example 1]
(Adhesive layer)
100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio) (weight average molecular weight = 800,000), melamine-based crosslinking Adhesive consisting of 10 parts by weight of an agent (butanol-modified melamine formaldehyde resin, “Super Becamine J-820-60N”, manufactured by Nippon Polyurethane) and 60 parts by weight of a DOP plasticizer (bis (2-ethylhexyl) phthalate, manufactured by J-Plus) A toluene solution of the agent was prepared.
This adhesive solution was applied to one side of the soft polyvinyl chloride film obtained in Production Example 1, and then dried at 130 ° C. for 90 seconds to form an adhesive layer (5C) having a thickness of 10 μm.
(Adhesive tape)
Without providing a non-adhesive layer, a 38 μm thick PET liner treated with Si was applied to the adhesive layer side as a release liner, and a laminated structure of soft polyvinyl chloride film / adhesive layer (5C) / PET liner Was constructed to produce an adhesive tape (5). The arithmetic average surface roughness Ra of the layer opposite to the pressure-sensitive adhesive layer was 460 nm.
The results are summarized in Table 1.

  In each of Examples 1 to 4, the post-expansion baseline elongation (%) was 130 or more and the post-expansion baseline stretch ratio was less than 1.30. On the other hand, in Comparative Example 1, the baseline elongation after expansion (%) was 125 or less, although the baseline elongation ratio after expansion was less than 1.30. That is, since the adhesive tape part which should be expanded is not fully expanded, the expandability was judged to be poor. This is because the dynamic friction force on the back surface of the pressure-sensitive adhesive tape of Comparative Example 1 is large, and the top surface of the cylinder 50 in FIG.

  The pressure-sensitive adhesive tape of the present invention is uniform in the vertical and horizontal directions by strictly adjusting the dynamic friction force against the SUS430BA plate on the surface of the outermost layer opposite to the pressure-sensitive adhesive layer when viewed from the base material to a predetermined level. For example, when the chip is adsorbed and separated by a collet from above the dicing tape, it can be adsorbed and separated accurately. Therefore, it can be suitably used for semiconductor processing using a semiconductor wafer made of a fragile material and having a fine and fine circuit pattern as an adherend. When the pressure-sensitive adhesive tape of the present invention is used for semiconductor processing, uniform expansion is possible, and stress strain accumulation does not occur. Therefore, it is possible to accurately follow and paste a fine and fine circuit pattern of a semiconductor wafer. Since the natural release of stress strain after bonding to the semiconductor wafer does not occur, the semiconductor wafer can be effectively prevented from being crushed. In particular, since the wafer used for the LED is made of a very fragile material such as gallium nitride, gallium arsenide, or silicon carbide, the pressure-sensitive adhesive tape of the present invention is very suitable for LED dicing.

DESCRIPTION OF SYMBOLS 10 Metal surface 20 Hook part 30 Pulley 40 Ring-shaped jig | tool 50 Column 60 stand 100 Chip 200 Dicing tape 300 Sliding property measuring jig 400 Weight 500 Sample 1000 for expandability evaluation Adhesive tape

Claims (18)

An adhesive tape comprising an adhesive layer on one side of a substrate,
The dynamic friction force against the SUS430BA plate on the outermost layer surface opposite to the adhesive layer when viewed from the substrate is less than 10.0 N at a temperature of 23 ° C. and a humidity of 50%.
Adhesive tape.   The modulus at 150% tension in the MD direction of the adhesive tape is 10.0 N / 10 mm to 50.0 N / 10 mm at a temperature of 23 ° C. and a humidity of 50%, and the modulus at 150% tension in the TD direction of the adhesive tape. The pressure-sensitive adhesive tape according to claim 1, which is 10.0 N / 10 mm to 50.0 N / 10 mm at a temperature of 23 ° C. and a humidity of 50%.   The ratio of the modulus at 150% tension in the MD direction of the adhesive tape to the modulus at 150% tension in the TD direction is 1.90 or less at a temperature of 23 ° C and a humidity of 50%. Adhesive tape.   The stress relaxation rate after 2 seconds from 150% tension in the MD direction of the adhesive tape is 25.0% or more at a temperature of 23 ° C. and a humidity of 50%, and 2 seconds after the 150% tension in the TD direction of the adhesive tape. The pressure-sensitive adhesive tape according to any one of claims 1 to 3, wherein the stress relaxation rate is 25.0% or more at a temperature of 23 ° C and a humidity of 50%.   The ratio of the stress relaxation rate after 2 seconds from 150% tension in the TD direction of the adhesive tape and the stress relaxation rate after 2 seconds from 150% tension in the MD direction (TD direction stress relaxation rate / MD direction stress relaxation rate) is The pressure-sensitive adhesive tape according to any one of claims 1 to 4, which is 0.70 to 1.30 at a temperature of 23 ° C and a humidity of 50%.   The pressure-sensitive adhesive tape according to any one of claims 1 to 5, wherein the arithmetic average surface roughness Ra of the outermost layer surface opposite to the pressure-sensitive adhesive layer as viewed from the substrate is 50 nm or more.   The adhesive tape in any one of Claim 1-6 whose maximum elongation measured according to JIS-K-7127 (1999) of the said base material is 100% or more.   The pressure-sensitive adhesive tape according to any one of claims 1 to 7, wherein the substrate is a plastic film.   The pressure-sensitive adhesive tape according to claim 8, wherein the plastic film contains at least one selected from polyvinyl chloride, polyolefin, and ethylene-vinyl acetate copolymer.   The adhesive tape in any one of Claim 1-9 provided with a non-adhesion layer in the surface opposite to the said adhesive layer of the said base material.   The pressure-sensitive adhesive tape according to claim 10, wherein the non-adhesive layer is a mixed layer of silicone and a (meth) acrylic polymer.   The pressure-sensitive adhesive tape according to claim 11, wherein a mixing ratio of the silicone and the (meth) acrylic polymer in the non-adhesive layer is silicone: (meth) acrylic polymer = 1: 50 to 50: 1 by weight ratio. .   The pressure-sensitive adhesive tape according to any one of claims 10 to 12, wherein the non-stick layer has a phase separation structure.   The adhesive tape in any one of Claim 10-13 whose thickness of the said non-adhesion layer is 0.01 micrometer-10 micrometers.   The pressure-sensitive adhesive tape according to any one of claims 1 to 14, wherein the pressure-sensitive adhesive layer contains at least one (meth) acrylic polymer.   The adhesive tape in any one of Claim 1-15 provided with a peeling liner on the surface of the said adhesive layer.   The pressure-sensitive adhesive tape according to any one of claims 1 to 16, which is used for semiconductor processing.   The pressure-sensitive adhesive tape according to any one of claims 1 to 17, which is used for LED dicing.