KR20130041744A - Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape - Google Patents

Abstract

PURPOSE: A film for a pressure-sensitive adhesive tape is provided to effectively suppress the generation of roll-shaped blocking and to have excellent compatibility with non-adhesive film layer and a substrate film. CONSTITUTION: A film for a pressure-sensitive adhesive tape comprises a non-adhesive layer of which arithmetic mean surface roughness(Ra) is 0.1-miron, on one surface of a plastic film with a maximum elongation of 100% or more measured by JIS-K-7127. The peeling strength of the non-adhesive layer is 1.0 N/20mm or less. The non-adhesive layer comprises a mixed layer with a silicone and (meth)acrylic polymer. The thickness of the plastic film is 20-200 micron. The thickness of the non-adhesive layer is 0.01-10 micron. The adhesive tape comprises an adhesive layer on the opposite surface of the non-adhesive layer. [Reference numerals] (AA) Non-adhesive layer; (BB) Silicon enrich layer; (CC) (meth)acrylic polymer enrich layer;

Description

FILM FOR PRESSURE-SENSITIVE ADHESIVE TAPE AND PRESSURE-SENSITIVE ADHESIVE TAPE}

TECHNICAL FIELD This invention relates to the film for adhesive tapes, and an adhesive tape.

In the adhesive tape used for dicing of a semiconductor, in order to fix a wafer at the time of dicing, it is necessary to fix the surface of a tape to a base on the surface opposite to the wafer adhesion surface. In general, such fixing is performed under negative pressure by vacuum adsorption or the like.

When performing the fixing by the negative pressure, the adhesive tape may be in close contact with the base due to excessively negative pressure applied or melting of the adhesive tape due to heat generation during dicing. If such overdensity occurs, the handleability deteriorates when peeling the tape fixed to the base. For example, a problem arises in that a smooth flow of a semiconductor manufacturing process including dicing is suppressed.

In order to solve this problem of over-density adhesion, in the wafer surface protection tape formed of two layers, that is, the base film and the pressure-sensitive adhesive layer, the centerline surface roughness Ra on the opposite surface of the pressure-sensitive adhesive layer of the base film is controlled to a predetermined value. The technique was reported (Japanese Patent Application Laid-Open No. 2009-239124).

However, the base film of the adhesive tape used in the dicing of a semiconductor requires the extending | stretching (stretching) characteristic peculiar to a semiconductor manufacturing process, and a step tracking characteristic. That is, the base film of the adhesive tape used in the dicing of a semiconductor needs to be able to be extended | stretched favorably in an extending process, and needs to follow suitably the level | step difference of a semiconductor. As a base film which can meet such a request, the base film formed from a material with a large elongation rate is selected. However, the surface state of such a base film is easy to be influenced by temperature. For this reason, even when controlling center line surface roughness Ra of the surface of a base film to a predetermined value as reported in Unexamined-Japanese-Patent No. 2009-239124, it is made into predetermined value by the temperature change of a temperature or a process apparatus. Controlled centerline surface roughness (Ra) changes significantly, and the effect of the invention described in Japanese Patent Application Laid-Open No. 2009-239124 cannot be expressed.

In particular, in LED dicing from dicing of semiconductors, the semiconductor wafers used are composed of very brittle materials such as gallium nitride, gallium arsenide or silicon carbide. Therefore, in order to prevent breakage of the semiconductor wafer, the base film of the adhesive tape additionally requires high elongation (stretching) characteristics and step tracking characteristics. For this reason, the said problem becomes remarkable in the adhesive tape used for LED dicing.

Generally, the film has a smooth surface. When such a film is processed into a roll shape, a phenomenon occurs in which the film surfaces come into contact and adhere to each other, that is, blocking. In the roll in which blocking occurred, the disadvantage that the operation | work which rewinds a film becomes difficult may arise. In particular, a plasticizer is generally added to a large film having an elongation. In such a film, since a plasticizer precipitates on the film surface and a small gap can be filled between the film surfaces, the adverse effect by blocking becomes remarkable. In the case of carrying out the adhesion processing with the adhesive on the film surface, since the adhesive itself has adhesiveness, the adverse effect of blocking becomes more remarkable.

When rewinding the roll-shaped film in which blocking has occurred, an extra force for separating the film surfaces in close contact with each other is required. When such extra force is applied, deformation occurs, such as stretching of the film, or the force accumulates as stress deformation even when the film is not deformed. When the deformed film is applied to the adhesive tape for the above reasons, it is difficult to follow the adherend and bond the tape together. In addition, if the film in which the stress strain has accumulated is applied to the adhesive tape for the above reason, the stress strain may be spontaneously resolved after the tape is bonded to the adherend, and the adherend may be damaged.

When the adhesive tape is used for semiconductor processing, the semiconductor wafer as the adherend is brittle and easily brittle because it is made of a brittle material. For this reason, when the film deform | transformed for the above reason is applied to an adhesive tape, it is difficult to adhere | attach a tape following a fine and precise circuit pattern of a semiconductor wafer. In addition, when the film in which the stress strain has accumulated is applied to the adhesive tape for the above reason, the stress strain spontaneously resolves after bonding to the semiconductor wafer, and the semiconductor wafer is easily broken.

In particular, wafers used in LEDs are composed of very brittle materials such as gallium nitride, gallium arsenide or silicon carbide. For this reason, blocking prevention is very important in the adhesive tape used for LED dicing etc.

Two main prior arts are mentioned as an example of the prior art of blocking prevention.

One conventional technique includes applying a physical treatment such as an embossed finish to the back of a film (WO2009 / 028068A). However, this technique has a problem that the non-uniformity formed on the back side of the film has a stress concentration structure, and the film tears or breaks from the non-uniformity by the rewinding force when the film is rolled back into a roll shape.

Another conventional technique is to apply a silicone mold release agent to the back of a film (Japanese Patent Application Laid-open No. 2010-201836). However, this technique has a problem in that the silicone release agent has low chemical affinity with the film backing due to its surface tension, and thus poor compatibility with the film backing. In addition, when the film coated with a silicone release agent on the back is applied to an adhesive tape, when stretching is performed such as stretching on the adhesive tape, the layer treated with the silicone release agent cannot follow the stretching, so that the treated layer is broken and contaminated. Can cause problems. It should also be noted that techniques are known that include applying a crosslinkable silicone release agent in order to increase the chemical affinity with the film backing of the silicone release agent. However, crosslinkable silicones generally have very low elongation. Therefore, when the film coated with the crosslinking silicone release agent on the back is applied to the adhesive tape, when the stretching is performed such as stretching on the adhesive tape, the layer treated with the crosslinking silicone release agent cannot follow the stretching and cannot maintain the anchoring properties. there is a problem.

An object of the present invention is a film for pressure-sensitive adhesive tapes comprising a non-adhesive layer provided on a base film, it is possible to suppress the occurrence of over-density adhesion when fixing by adsorption under negative pressure, the non-adhesive layer on the base film By providing, the blocking of a film in a roll-shaped form is suppressed effectively, and it does not tear or break when a film rewinds from a roll-shaped form, and it is excellent in the compatibility of a non-adhesive layer and a base film, and it is suitable for deformation | transformation, such as extending | stretching. It is providing the film for adhesive tapes with which the followability | trackability is favorable. Another object of the present invention is to provide an adhesive tape including such a film for adhesive tape.

The film for adhesive tapes of this invention contains the non-adhesive layer whose arithmetic mean surface roughness (Ra) is 0.1 micrometer or more on one surface of the plastic film whose largest elongation measured according to JIS-K-7127 is 100% or more.

In a preferred embodiment, the non-tack test peel strength of the non-tack layer is less than 1.0 N / 20 mm.

In a preferred embodiment, the non-tacky layer comprises a mixed layer of silicone and (meth) acrylic polymer.

In a preferred embodiment, the mixing ratio "silicone: (meth) acrylic polymer" of silicone and (meth) acrylic polymer in the non-adhesive layer is 1:50 to 50: 1 by weight.

In a preferred embodiment, the non-adhesive layer comprises a silicone rich phase in which the content of silicone is greater than the content of the (meth) acrylic polymer, and a (meth) acryl polymer rich phase in which the content of the (meth) acrylic polymer is greater than the content of silicone. .

In a preferred embodiment, the thickness of the plastic film is 20 μm to 200 μm.

In a preferred embodiment, the release layer has a thickness of 0.01 μm to 10 μm.

In a preferred embodiment, the plastic film comprises polyvinylchloride.

In another embodiment of the present invention, an adhesive tape is provided. The adhesive tape of this invention contains an adhesive layer on the surface on the opposite side of the non adhesion layer of a plastic film in the film for adhesive tapes of this invention.

In a preferred embodiment, the pressure sensitive adhesive layer comprises a (meth) acrylic polymer.

In a preferred embodiment, the SP value of the pressure-sensitive adhesive layer is 9.0 (cal / cm ³ ) ^0.5 to 12.0 (cal / cm ³ ) ^0.5 .

In a preferred embodiment, the adhesive tape further comprises a release liner on the surface of the adhesive layer.

In a preferred embodiment, the adhesive tape of the present invention is used for semiconductor processing.

In a preferred embodiment, the semiconductor processing comprises LED dicing.

According to the present invention, it is a film for pressure-sensitive adhesive tapes comprising a non-adhesive layer provided on a base film, and it is possible to suppress the occurrence of over-density adhesion when fixing by adsorption under negative pressure, and the non-adhesive layer is placed on the base film By providing, effectively blocking of the film of a roll-shaped form is suppressed, it does not tear or break when a film rewinds from a roll-shaped form, it is excellent in the compatibility of a non-adhesive layer and a base film, and it is excellent in deformation | transformation, such as extending | stretching The film for adhesive tapes with favorable followability can be provided. Moreover, the adhesive tape containing such a film for adhesive tapes can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a TEM photograph which shows the state of the non adhesion layer of the film for adhesive tapes of this invention.

<< 1. Film for adhesive tape >>

The film for adhesive tapes of this invention contains a non-adhesive layer on one surface of a plastic film.

<1-1. Plastic Film>

The plastic film has a maximum elongation (MD) measured according to JIS-K-7127 of 100% or more, preferably 200% or more, and most preferably 300% or more. The upper limit of the maximum elongation (MD) is preferably 1,000% or less. Such plastic film may contain any suitable resin material. Such resin material is preferably, for example, polyvinylchloride, polyolefin, polyester, polyimide or polyamide, more preferably polyvinylchloride or polyolefin, even more preferably polyvinylchloride. Since polyvinyl chloride is excellent in stress relaxation property, it can use suitably for the film for adhesive tapes which can be used for the adhesive tape especially used for semiconductor processing, such as LED dicing.

The content of the resin material in the plastic film may be set to any suitable content depending on the purpose and use. Such content is, for example, preferably 50% by weight to 100% by weight, more preferably 60% by weight to 100% by weight, even more preferably 70% by weight to 100% by weight.

The plastic film may contain a plasticizer. The content of the plasticizer in the plastic film is preferably 0.5% by weight to 50% by weight, more preferably 1.0% by weight to 40% by weight relative to the resin material in the plastic film. By incorporating a plasticizer in the above-mentioned content in the plastic film, the followability to deformation such as stretching is further improved.

Examples of the plasticizer include phthalic acid ester plasticizers, trimellitic acid ester plasticizers (for example, DIC, W-700, trimellitic acid trioctyl), adipic ester plasticizers (for example, J-PLUS, D620, adipic dioctyl and adipic diisononyl), phosphate ester plasticizers (e.g. tricresyl phosphate), adipic acid esters, citric acid esters (e.g. tributyl acetyl citrate), seba Sinic acid esters, azelaic acid esters, maleic acid esters, benzoic acid esters, polyether polyesters, epoxy polyesters (e.g. epoxidized soybean oil and epoxidized linseed oil), and polyesters (e.g. Low molecular weight polyesters formed of glycol). In this invention, it is preferable to use ester plasticizer. Plasticizers can be used alone or in combination or in combination.

The plastic film may contain any suitable additional component as long as the effects of the present invention are not impaired.

The thickness of the plastic film is preferably 20 μm to 200 μm, more preferably 40 μm to 150 μm, even more preferably 50 μm to 100 μm. When the thickness of the plastic film is less than 20 μm, the handleability may deteriorate, and in particular, when the adhesive tape is formed of the film, the bonding operation of the tape may be difficult. The thickness of the plastic film is larger than 200 μm, and the followability to deformation such as stretching may deteriorate.

<1-2. Non-adhesive Layer>

The non-adhesive layer has an arithmetic mean surface roughness Ra of 0.1 µm or more, preferably 0.1 µm to 3.0 µm, more preferably 0.2 µm to 2.0 µm. By controlling the arithmetic mean surface roughness Ra of the non-adhesive layer within the above range, it is possible to suppress the occurrence of overdense adhesion when fixing by adsorption under negative pressure. In the present invention, the arithmetic mean surface roughness Ra of the non-adhesive layer is measured based on the method described below.

The non-adhesive layer preferably has a non-adhesion test peel strength of less than 1.0 N / 20 mm, more preferably less than 0.5 N / 20 mm, even more preferably less than 0.2 N / 20 mm. By controlling the non-adhesion test peel strength of the non-adhesive layer within the above range, it is possible to further suppress the occurrence of excessive density when fixing by adsorption under negative pressure. In the present invention, the non-adhesion test peel strength of the non-adhesive layer is measured based on the method described below.

The non-adhesive layer is preferably a mixed layer of silicone and a (meth) acrylic polymer. By using the mixed layer of silicone and a (meth) acrylic polymer as a non adhesion layer, the compatibility of a non adhesion layer and a plastic film improves. As a result, the film for adhesive tapes of this invention and the adhesive tape containing the said film become good track | trackability to deformation | transformation, such as extending | stretching, respectively.

The mixing ratio "silicone: (meth) acrylic polymer" of silicone and (meth) acrylic polymer in the non-adhesive layer is preferably 1:50 to 50: 1 by weight, more preferably 1:30 to 30: 1, and more. Preferably 1:10 to 10: 1, particularly preferably 1: 5 to 5: 1, most preferably 1: 3 to 5: 1. If the silicon content in the non-adhesive layer is too high, the chemical affinity with the back of the plastic film may be low, and the non-adhesive layer may have poor compatibility with the back of the plastic film. In addition, when the content of silicon in the non-adhesive layer is too high, when the non-adhesive layer is used for the film for pressure-sensitive adhesive tape or the pressure-sensitive adhesive tape containing the film, the following properties against deformation such as stretching are poor, and the non-adhesive layer is broken. May cause contamination. If the content of the (meth) acrylic polymer in the non-adhesive layer is too high, the non-adhesive layer can act as an acrylic adhesive, and blocking may easily occur.

The non-adhesive layer preferably comprises a silicon rich phase in which the content of silicone is higher than the content of the (meth) acrylic polymer, and a (meth) acrylic polymer rich phase in which the content of the (meth) acrylic polymer is higher than the content of silicone. More specifically, the non-adhesive layer preferably has a phase separation structure in which the silicon rich phase and the (meth) acrylic polymer rich phase are independent of each other, and more preferably the silicon rich phase has an air interface side (the opposite side of the plastic film). ) And the (meth) acrylic polymer rich phase is present on the plastic film side. By having such a phase-separated structure, blocking is effectively suppressed by the silicon rich phase present on the air interface side, and the compatibility of the non-adhesive layer and the plastic film by the (meth) acrylic polymer rich phase present on the plastic film side. It is improved to follow the deformation well. Such phase separation structure can be formed by adjusting the mixing ratio of silicone and (meth) acrylic polymer in the non-adhesive layer as described above.

Thanks to the presence of the phase separation structure as described above, the non-adhesive layer can preferably form a structure having a fine nonuniformity with an arithmetic mean surface roughness Ra of the surface of the non-adhesive layer of 0.1 μm or more. It is presumed that a nonuniformity is generated based on the difference in the mass mobility of the silicone and the (meth) acrylic polymer in the phase separation structure generation. By forming a structure having a non-uniformity, in the film for pressure-sensitive adhesive tape of the present invention, it is possible to suppress the occurrence of over-density adhesion when fixing by adsorption under negative pressure, effectively blocking the film in the form of a roll It can suppress and torn or break when rewinding from a roll-shaped form can be suppressed.

The non-tacky layer comprises a silicone rich phase in which the content of silicone is greater than the content of the (meth) acrylic polymer, and a (meth) acrylic polymer rich phase in which the content of the (meth) acrylic polymer is greater than the content of silicone, as described above. Can be observed by any suitable method. As such a method, for example, the shape observation method for a non-adhesive layer cross section using an electron microscope of a transmission electron microscope (TEM), a scanning electron microscope (SEM), or a field emission scanning electron microscope (FE-SEM). to be. The two-layer separation structure can be identified based on the shade of shape observation. In addition, an infrared absorption spectroscopy using a total reflection method also provides an observation method including monitoring a change in the content of silicon, carbon, and the like contained in the composition while varying the probe light depth inside the non-adhesive layer air interface side. . In addition, an observation method by X-ray microanalyzer or X-ray photoelectron spectroscopy is also provided. Moreover, it can observe suitably combining these methods suitably.

Arbitrary suitable silicone can be employ | adopted as silicone. Examples of such silicones include addition silicones obtained by curing an alkenyl group-containing polydialkylsiloxane and polydialkylhydrogenpolysiloxane by an addition reaction using a platinum-based compound as a catalyst to form a peelable coating film; And condensed silicones obtained by reacting a methylol group-containing polydialkylsiloxane with a polydialkylhydrogenpolysiloxane using a tin catalyst. Examples of the additional silicone include "KS-776A" and "KS-839L" manufactured by Shin-Etsu Silicone. Examples of the condensation type silicone include "KS723A / B" made by Shin-Etsu Silicone. In addition, other crosslinking agents, crosslinking accelerators and the like may be appropriately used as other components in addition to the platinum-based catalyst or the tin-based catalyst in the production of silicone. Also, silicone is classified into a type dissolved in an organic solvent such as toluene, an emulsion type emulsifying silicone and an organic solvent, a solventless type formed solely of silicon, and the like based on its properties. In addition to addition silicones or condensation silicones, silicone / acrylic graft polymers, silicone / acrylic block polymers and the like can also be used. Examples of silicone / acrylic graft polymers include Symac GS-30, GS101, US-270, US-350 and US-380, all of which are manufactured by TOAGOSEI CO., LTD. . Examples of silicone / acrylic block polymers include MODIPER FS700, FS710, FS720, FS730 and FS770 (all of which are manufactured by NOF Corporation above).

Arbitrary suitable (meth) acryl polymer can be employ | adopted as a (meth) acryl polymer. In the present invention, it should be noted that "(meth) acryl" means "acrylic and / or methacryl".

A (meth) acryl polymer is a polymer comprised from the monomer component which contains a (meth) acryl monomer as a main monomer. The content of the (meth) acryl monomer in the monomer components constituting the (meth) acryl polymer is preferably 50% by weight or more, more preferably 70% by weight to 100% by weight, still more preferably 90% by weight to 100% by weight. %, Especially preferably, it is 95 weight%-100 weight%. The monomers in the monomer components may be used alone or in combination or in combination.

The (meth) acrylic monomer is preferably (meth) acrylic acid ester or (meth) acrylic acid.

Examples of the (meth) acrylic acid ester include (meth) acrylic acid alkyl esters of alkyl groups having 1 to 30 carbon atoms (including cycloalkyl groups) and hydroxyl group-containing (meth) acrylic acid esters. The (meth) acrylic acid esters may be used alone or in combination or in combination.

Examples of (meth) acrylic acid alkyl esters of alkyl groups (including cycloalkyl groups) having 1 to 30 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, and (meth) Butyl acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate Heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, (meth Isodecyl acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, (meth) Acrylic furnace The decyl (meth) acrylate, and eicosyl (meth) acrylic acid referred to the carbon atoms such as lauryl 1-30 alkyl group (including cycloalkyl group), (meth) acrylic acid alkyl ester. Among these (meth) acrylic acid esters, (meth) acrylic acid alkyl esters of alkyl groups having 2 to 20 carbon atoms (including cycloalkyl groups) are preferable, and (meth) acrylic acid alkyl esters of alkyl groups having 4 to 18 carbon atoms (including cycloalkyl groups) Is more preferable.

Examples of the hydroxyl group-containing (meth) acrylic acid esters include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate. In particular, in this invention, the polymer obtained by copolymerizing a hydroxyl group containing (meth) acrylic acid ester is preferable as the (meth) acryl polymer which comprises a non-adhesive layer.

The monomer component constituting the (meth) acryl polymer may contain at least one selected from hydroxyl group-containing monomers and carboxyl group-containing monomers in order to sufficiently express the effects of the present invention.

The hydroxyl group containing monomer is, for example, allyl alcohol. The hydroxyl group containing monomers may be used alone or in combination or in combination.

Examples of the carboxyl group-containing monomers include carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, maleic acid, fumaric acid and itaconic acid. The carboxyl group-containing monomers may be used alone or in combination or in combination.

The (meth) acrylic polymer may be prepared by any suitable polymerization method.

The non-adhesive layer may contain any suitable additives so long as the effects of the present invention are not impaired. Examples of such additives include catalysts, UV absorbers, fillers, antioxidants, tackifiers, pigments, dyes and silane coupling agents.

The thickness of the non-adhesive layer is preferably 0.01 μm to 10 μm, more preferably 0.1 μm to 5 μm, even more preferably 0.1 μm to 2 μm. When the thickness of a non adhesion layer is less than 0.01 micrometer, blocking will become easy to generate | occur | produce. When the thickness of the non-adhesive layer is more than 10 µm, the followability to deformation such as stretching may deteriorate. When the thickness of the non-adhesive layer is less than 0.01 μm, the effects of the present invention can hardly be expressed and may be difficult to manufacture.

The method of forming the non-adhesive layer on one surface of the plastic film is a method including forming the non-adhesive layer by applying and drying the material of the non-adhesive layer on one surface of the plastic film, for example. The application method is, for example, a method including using a bar coater, a gravure coater, a spin coater, a roll coater, a knife coater, an applicator, or the like.

<< 2. Adhesive Tape >>

The adhesive tape of this invention contains an adhesive layer on the surface on the opposite side of the non adhesion layer of a plastic film in the film for adhesive tapes of this invention.

The thickness of the pressure-sensitive adhesive layer is preferably 1.0 µm to 30 µm, more preferably 1.0 µm to 20 µm, even more preferably 3.0 µm to 15 µm. When the thickness of an adhesive layer is less than 1.0 micrometer, sufficient adhesive force cannot be expressed. When the thickness of an adhesive layer exceeds 30 micrometers, in some uses, adhesive force may become large too much, and when it peels etc., an adherend may be damaged.

Arbitrary appropriate adhesives can be employ | adopted as a material of an adhesive layer, unless the effect of this invention is impaired.

Examples of the material of the pressure-sensitive adhesive layer include (meth) acrylic polymers; caoutchouc; Special natural rubbers grafted with monomers such as methyl methacrylate; And synthetic rubbers such as SBS, SBR, SEPS, SIS, SEBS, polybutene, polyisobutene, polyisobutylene or butyl rubber. Among them, a (meth) acryl polymer is preferable in view of less adhesive deposit on the adherend after peeling, high cohesiveness, and excellent transparency.

When an adhesive layer contains a (meth) acryl polymer, content of the (meth) acryl polymer in an adhesive layer can be suitably set according to the objective.

A (meth) acryl polymer is resin comprised from the monomer component which contains a (meth) acryl monomer as a main monomer. The content of the (meth) acryl monomer in the monomer components constituting the (meth) acryl polymer is preferably 50% by weight or more, more preferably 70% by weight to 100% by weight, even more preferably 90% by weight to 100% by weight. Especially preferably, they are 95 weight%-100 weight%. The monomers in the monomer components may be used alone or in combination or in combination.

The (meth) acrylic monomer is preferably (meth) acrylic acid ester or (meth) acrylic acid.

Examples of the (meth) acrylic acid esters include (meth) acrylic acid alkyl esters and hydroxyl group-containing (meth) acrylic acid esters of alkyl groups having 1 to 30 carbon atoms (including cycloalkyl groups). The (meth) acrylic acid esters may be used alone or in combination or in combination.

Examples of (meth) acrylic acid alkyl esters of alkyl groups (including cycloalkyl groups) having 1 to 30 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, and (meth) Butyl acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate Heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, (meth) acrylate, (meth) acrylate Isodecyl acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, (meth) Acrylic furnace And (meth) acrylic acid alkyl esters of alkyl groups having 1 to 30 carbon atoms (including cycloalkyl groups) such as nadecyl, acetic (meth) acrylate and lauryl (meth) acrylate. Among these (meth) acrylic acid esters, Preferably, they are (meth) acrylic-acid alkylester of the alkyl group (including cycloalkyl group) of 2-20 carbon atoms, More preferably, the alkyl group (including cycloalkyl group) of 4-18 carbon atoms is preferable. It is (meth) acrylic-acid alkylester of.

Examples of the hydroxyl group-containing (meth) acrylic acid esters include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

In order to fully express the effect of an adhesive, the monomer component which comprises a (meth) acryl polymer, Preferably, it contains at least 1 sort (s) chosen from a hydroxyl-group containing monomer and a carboxyl group-containing monomer, More preferably, it contains a carboxyl group It contains a monomer. In addition, the monomer component which comprises a (meth) acryl polymer may contain acrylonitrile in order to fully express the effect of an adhesive.

Examples of the hydroxyl group-containing monomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate and allyl alcohol. The hydroxyl group containing monomers may be used alone or in combination or in combination.

Examples of the carboxyl group-containing monomers include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, maleic acid, fumaric acid and itaconic acid. The carboxyl group-containing monomers may be used alone or in combination or in combination.

When the monomer component constituting the (meth) acrylic polymer contains a hydroxyl group-containing monomer, the content of the hydroxyl group-containing monomer in the monomer components constituting the (meth) acrylic polymer is preferably 0.1 to 20% by weight. More preferably, they are 0.1 weight%-10 weight%. When the monomer component constituting the (meth) acrylic polymer contains a carboxyl group-containing monomer, the content of the carboxyl group-containing monomer in the monomer components constituting the (meth) acrylic polymer is preferably 0.1 to 20% by weight, more preferably Is 0.1 wt% to 10 wt%. As described above, when the monomer component constituting the (meth) acryl polymer contains at least one selected from a hydroxyl group-containing monomer and a carboxyl group-containing monomer, a crosslinking reaction with the crosslinking agent can be efficiently performed when a crosslinking agent is used. And the effect of an adhesive can fully be expressed. Moreover, peeling operation by adjusting content of the hydroxyl-group containing monomer in the monomer component which comprises a (meth) acryl polymer, and content of the carboxyl group-containing monomer in the monomer component which comprises the said (meth) acryl polymer is accommodated in the said range. The damage of the adherend at the time can be prevented effectively. When the content of the hydroxyl group-containing monomer in the monomer components constituting the (meth) acrylic polymer and the content of the carboxyl group-containing monomer in the monomer components constituting the (meth) acrylic polymer are more than the above ranges, the adhesive force becomes too large, Blocking can easily occur, and the adherend can be easily broken during the peeling operation.

The pressure-sensitive adhesive layer preferably contains a crosslinking agent. When the pressure-sensitive adhesive layer contains a crosslinking agent, the content of the crosslinking agent in the pressure-sensitive adhesive layer can be appropriately set according to the purpose, but preferably 0.1 to 20% by weight based on the main resin component (preferably (meth) acrylic polymer). %to be. By controlling the content of the crosslinking agent in the pressure-sensitive adhesive layer within the above range, an appropriate crosslinking reaction can occur, and damage to the adherend during the peeling operation can be effectively prevented.

Examples of the crosslinking agent include epoxy crosslinkers, isocyanate crosslinkers, melamine crosslinkers, peroxide crosslinkers, metal alkoxide crosslinkers, metal chelate crosslinkers, metal salt crosslinkers, carbodiimide crosslinkers, oxazoline crosslinkers, aziridine crosslinkers and amines. A system crosslinking agent is mentioned. Among these crosslinking agents, a melamine crosslinking agent, an epoxy crosslinking agent and an isocyanate crosslinking agent are preferable from the viewpoint that the effects of the present invention can be sufficiently expressed. In addition, a crosslinking agent can be suitably selected as needed. The crosslinking agents may be used alone or as a mixed system.

The pressure-sensitive adhesive layer may contain a plasticizer. In the case where the pressure-sensitive adhesive layer contains a plasticizer, the content of the plasticizer in the pressure-sensitive adhesive layer can be appropriately set depending on the purpose, but is preferably 0.1% by weight to 50% by weight. Controlling the content of the plasticizer in the pressure-sensitive adhesive layer within the above range allows the effect of the present invention to be expressed more effectively. When the content of the plasticizer in the pressure-sensitive adhesive layer is more than 50% by weight, the pressure-sensitive adhesive layer may become excessively soft, and adhesive deposits or adherend contamination may easily occur.

Examples of the plasticizer include phthalic ester plasticizers, trimellitic ester plasticizers (e.g., W-700 and trimellitic acid trioctyl), and adipic ester plasticizers (e.g., J-PLUS, D620). , Adipic acid dioctyl, adipic acid diisononyl), phosphate ester plasticizers (e.g., tricresyl phosphate), adipic acid esters, citric acid esters (e.g. tributyl acetyl citrate, etc.), seba Sinic acid esters, azelaic acid esters, maleic acid esters, benzoic acid esters, polyether based polyesters, epoxy polyesters (e.g. epoxidized soybean oil, epoxidized linseed oil) and polyesters (e.g. carboxylic acids and glycols Low molecular weight polyester); In this invention, it is preferable to use ester plasticizer. Plasticizers can be used alone or in combination.

The pressure-sensitive adhesive layer may contain any suitable catalyst for promoting the crosslinking reaction and the like. When the pressure-sensitive adhesive layer contains a catalyst, the content of the catalyst in the pressure-sensitive adhesive layer can be appropriately set according to the purpose, but preferably 0.01 to 10% by weight. Controlling the content of the catalyst in the pressure-sensitive adhesive layer within the above range allows the effect of the present invention to be expressed more effectively.

Examples of such catalysts are tetraisopropyl titanate, tetra-n-butyl titanate, octylate tin, lead octylate, octylate cobalt, zinc octylate, calcium octylate, lead naphthenate, cobalt naphthenate, dibutyltin Organometallic compounds such as diacetate, dibutyltin dioctoate, dibutyltin dilaurate, dioctyltin, dilaurate and dibutyltin maleate; Basic compounds such as butylamine, dibutylamine, hexylamine, t-butylamine, ethylenediamine, isophoronediamine, imidazole, lithium hydroxide, potassium hydroxide and sodium methylate; acidic compounds such as p-toluenesulfonic acid, trichloracetic acid, phosphoric acid, monoalkylphosphoric acid, dialkylphosphoric acid, phosphate esters of β-hydroxyethyl acrylate, monoalkyl phosphorous acid and dialkyl phosphorous acid. The catalysts can be used alone or in combination.

In order for the pressure-sensitive adhesive layer to further express the effect of the present invention, its SP value is preferably 9.0 (cal / cm ³ ) ^0.5 to 12.0 (cal / cm ³ ) ^0.5 , more preferably 9.5 (cal / cm ³ ) ^0.5 To 11.0 (cal / cm ³ ) ^0.5 . SP is the solubility parameter calculated by Small's equation. SP values can be calculated according to methods known in the literature (eg, Journal of Applied Chemistry, 3, 71, 1953).

The pressure-sensitive adhesive layer may contain any suitable additive so long as the effects of the present invention are not impaired. Examples of such additives include UV absorbers, fillers, antioxidants, tackifiers, pigments, dyes and silane coupling agents.

The adhesive tape of this invention can contain a peeling liner on the surface of an adhesive layer.

Arbitrary appropriate separators can be employ | adopted as a peeling liner. Examples of such release liners include substrates having a non-adhesive layer, such as a plastic film or paper, surface treated with a silicone-based, long-chain alkyl-based or fluorine-based release agent, or a release agent such as molybdenum sulfide; Fluorine-based compounds such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylfluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer or chlorofluoroethylene-vinylidene fluoride copolymer Low adhesive substrates formed from polymers; And low adhesion substrates formed of nonpolar polymers such as olefinic resins (e.g., polyethylene or polypropylene).

The adhesive tape of this invention can be used for arbitrary suitable uses. The adhesive tape of this invention contains the film for adhesive tapes of this invention. Therefore, when the fixing by the adsorption under the negative pressure as described above, the occurrence of excessive adhesion can be suppressed, the blocking of the tape of the roll-shaped form is effectively suppressed, and torn or damaged when rewinding from the roll-shaped form In addition, the compatibility between the non-adhesive layer and the plastic film is excellent, and the followability to deformation such as stretching is good. Therefore, the tape can be suitably used for semiconductor processing using a semiconductor wafer composed of a brittle material and having a fine and precise circuit pattern as the adherend. When the adhesive tape of this invention is used for semiconductor processing, it can suppress that overdensity generate | occur | produces when fixing by adsorption under negative pressure, and can advance the semiconductor manufacturing process including dicing smoothly. Moreover, when the adhesive tape of this invention is used for semiconductor processing, accumulation of the film distortion and stress deformation which generate | occur | produce due to blocking conventionally do not generate | occur | produce. Therefore, it is possible to accurately follow and join the fine and precise circuit pattern of the semiconductor wafer. In addition, stress bonding does not spontaneously resolve after bonding to the semiconductor wafer, thereby effectively preventing the semiconductor wafer from being broken. In particular, wafers used in LEDs are composed of very brittle materials such as gallium nitride, gallium arsenide or silicon carbide. Therefore, the adhesive tape of this invention is suitable for LED dicing etc. well.

[Example]

Hereinafter, the present invention will be described in detail by way of examples. However, the present invention is by no means limited to these examples. The term "parts" means "parts by weight". In addition, the quantity of the reagent supplied as a solution is represented by the quantity (solid content equivalent) of the solid content which remains by volatilizing a solution.

<Maximum height>

The maximum elongation was measured by an Instron tensile tester (manufactured by Shimadzu Corporation, Autograph) according to JIS-K-7127. Specifically, after a sample having a width of 20 mm and a length of 100 mm was installed at a distance of 50 mm between chucks, the sample was pulled at a pulling speed of 0.3 m / min, and the value at break was measured.

<Elastic modulus>

Elastic modulus was measured according to JIS-K-7127.

<Observation of non-adhesive layer>

(Observation by TEM)

The cross section of the non-adhesive layer was processed so that it could be observed. The morphology was then observed on a transmission electron microscope (TEM).

(Observation by infrared spectroscopy (ATR-IR) using total reflection method)

The non-adhesive layer was ATR using an infrared spectrometer (Spectrum One, manufactured by PerkinElmer) to select the total reflection measurement method and change the analysis depth of the probe light using two kinds of total reflection measurement prisms (ZnSe45 ° and Ge45 °). -IR measurement.

Arithmetic Average Surface Roughness (Ra)

The measurement was performed in 3D mode using a 20-fold objective lens using a multifocal laser microscope "LEXT3000" manufactured by Olympus Corporation (OLYMPUS CORPORATION). The observation range in the 3D mode was determined by setting positions at which the CF image (multifocal image) was dark when the lens was moved up and down in the vertical direction to "Top" and "Bottom" of the observation range, respectively.

The image scanning method in the 3D mode performed image scanning at a 0.2 μm pitch in the “Step” mode.

The arithmetic mean surface roughness (Ra) was measured by measuring Ra at any place by roughness analysis in the analysis mode. Note that the roughness value was measured as an average value for n = 5.

<Adsorption test>

The tape was affixed on the slide glass of 20 mm (length) x 50 mm (width) so that the back side might become an outer side. The slide glass (tape plate, polished edge, size: 65 mm x 165 mm x 1.35 mm) serving as the adherend and the tape-attached slide glass in a 50 ° C environment was left for 10 minutes. Thereafter, the slide glass and the tape back surface were bonded to each other by one reciprocation in a 2-Kg roller, and left for 30 minutes in a 50 ° C environment. After standing, 0 ° peeling was performed at an instron type tensile tester (Autograph, manufactured by Shimadzu Corporation) at a tensile speed of 0.3 m / min. Peel strength at this point was measured and evaluated according to the following criteria:

○: peel strength less than 5 N; And

X: Peeling strength 5 N or more.

<Non-adhesion test peel strength>

With reference to JIS-Z-0237, the film for pressure-sensitive adhesive tape or the pressure-sensitive adhesive tape containing the adherend and the non-adhesive layer was kept for 1 hour or more under storage at 23 ° C. Thereafter, the surface of the non-adhesive layer was pressed to SUS430BA at a linear pressure of 8 Kg / m and a crimping rate of 0.3 m / min, and the peel strength after 30 minutes was measured at a tensile rate of 0.3 m / min and 180 ° peeling:

◎: less than 0.5N / 20mm;

○: 0.5 N / 20 mm or more and 1.0 N / 20 mm or less; And

X: 1.0 N / 20 mm or more.

<Blocking test>

The surface of the adhesive layer of the adhesive tape was crimped | bonded to linear pressure 8Kg / m and the crimping | compression-rate 0.3m / min to the outermost surface (back layer) on the opposite side to the adhesive layer of the same adhesive tape. After compression, it was stored at 50 ° C. for 48 hours. After storage, peeling was carried out by a 180 ° peeling test (according to JIS-Z-0237) at a tensile speed of 0.3 m / min (according to JIS-Z-0237), and the blocking (peel strength) of the surface of the pressure-sensitive adhesive layer and the back layer was measured. .

The evaluation was an integrated evaluation based on the measurement of the peel strength, the desorption of the back layer upon peeling, and the breakdown of the pressure-sensitive adhesive layer (adhesive deposits due to cohesive failure or anchorage failure).

The evaluation followed the following criteria:

(Double-circle): Peeling strength 1.0 N / 20 mm or less, Desorption | suction and breakage of an adhesive layer are not observed visually;

(Circle): Peeling strength less than 3.0 N / 20mm, Desorption and breakage of an adhesive layer are not visually observed; And

X: Peeling strength 3.0 N / 20 mm or more or desorption and destruction of an adhesive layer were observed visually.

<Adhesion confirmation test>

(Adhesion confirmation test A)

At a stretching rate of 0.3 m / min to 3 m / min, the film for pressure-sensitive adhesive tape or the pressure-sensitive adhesive tape was stretched at a stretching ratio of 200%, and at the time of stretching and after stretching, the outermost surface on the opposite side to the pressure-sensitive adhesive layer of the film for pressure-sensitive adhesive tape or pressure-sensitive adhesive tape (back) Desorption of the layer) was evaluated based on visual observation.

(Adhesion confirmation test B)

After stretching the film for adhesive tape or the adhesive tape in the same manner as in the ascertainment confirmation test A, 2-Kg roller (25 mm width) using "No. 31B" made by NITTO DENKO CORPORATION as a back treatment layer ) Was compressed by reciprocating once at a compression speed of 0.3 m / min. Thereafter, the mixture was stored at 23 ° C. × 50% RH for 1 minute, peeled at 90 ° at a peeling speed of 0.3 m / min to 3 m / min, and the desorption property of the back was evaluated based on visual observation.

(evaluation)

The above evaluation was judged comprehensively and the anchoring properties were evaluated according to the following criteria:

(Double-circle): Desorption of the back surface was not visually observed in both the anchoring test A and the anchoring test B;

○: Desorption of the back was not visually observed in the Adhesion Confirmation Test A, but slightly visually observed in the Adhesion Confirmation Test B (observed as a dot); And

X: Desorption of the back surface was visually observed in the anchorage confirmation test A, or visually observed in the anchorage confirmation test B.

Production Example 1 Preparation of Plastic Film

A soft polyvinyl chloride film containing 27 parts by weight of a DOP plasticizer (bis (2-ethylhexyl) phthalate, manufactured by J-PLUS) was prepared by the calender method with respect to 100 parts by weight of polyvinyl chloride having a polymerization degree P of 1,050. The thickness of the soft polyvinyl chloride film was 70 μm, the elastic modulus (MD) measured according to JIS-K-7127 was 250 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 was 400%. In addition, the surface roughness (arithmetic mean surface roughness (Ra)) of the film immediately after manufacture was 0.1 micrometer.

(Example 1)

60 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical, Co., Ltd.), 40 parts by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), an acrylic copolymer (methyl methacryl) 100 parts by weight of rate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10), 10 parts by weight of a tin catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.), methylhydrosiloxane 1.0 weight part of acid-based hardening accelerator X92-122 (made by Shin-Etsu Chemical Co., Ltd.) was mixed in the solution state. Thus, a mixed solution (1) was obtained. The mixing ratio "silicone: (meth) acrylic polymer" of the silicone and the (meth) acrylic polymer in the mixed solution (1) was 1: 1 by weight ratio.

The mixed solution 1 was applied to one surface of the flexible polyvinyl chloride film prepared in Preparation Example 1 and dried to form a non-adhesive layer having a thickness of 1.0 μm and an arithmetic mean surface roughness (Ra) of 0.3 μm.

Thus, the film 1 for adhesive tapes was obtained.

Table 1 shows various evaluation results.

Moreover, when observing a non-adhesive layer by TEM, as shown in FIG. 1, it discovered that the composition on the air interface side and the plastic film side differs based on the shade of the shape observation image. In addition, the non-adhesive layer includes a silicon rich phase in which the content of silicon is higher than that of the (meth) acrylic polymer, and a (meth) acrylic polymer rich phase in which the content of the (meth) acrylic polymer is higher than the content of silicon, The silicon rich phase and the (meth) acrylic polymer rich phase have independent phase separation structures, the silicon rich phase is present on the air interface side (the opposite side of the plastic film), and the (meth) acrylic polymer rich phase is present on the plastic film side. Was found.

In addition, non subjected to Infrared Spectroscopy (ATR-IR) using a wide law with respect to the adhesive layer, the (meth) acrylic polymer of the group derived from the vicinity of 1725cm ^-1 and a peak derived from Si-CH ₃ in 800cm ^-1 near the peak The absorbance ratio of was measured. As a result, it was found that the peak around 800 cm ⁻¹ is larger when the Ge45 ° prism is used than when the ZnSe45 ° prism is used. Therefore, it was found that the content of silicon at the air interface side is higher than at the base material side.

Considering these observations and the principle of minimizing surface free energy, it was found that a two-layer structure having a silicon rich phase on the air interface side was formed in the non-adhesive layer.

(Example 2)

100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) 85/15 / 2.5 (weight ratio), melamine-based crosslinking agent (butanol-modified melamine formaldehyde resin, "SUPER BECKAMINE J -820-60N ", Nippon Polyurethane Industry Co., Ltd. 1 weight part, DOP plasticizer (bis (2-ethylhexyl) phthalate, J-PLUS company) 60 weight part Toluene solution was prepared.

The pressure-sensitive adhesive solution was applied on the surface opposite to the non-adhesive layer of the adhesive tape film 1 obtained in Example 1, then dried at 130 ° C. for 90 seconds, and the pressure-sensitive adhesive layer having a thickness of 10 μm was not tacked on the soft polyvinyl chloride film. It was formed on the surface opposite the layer. SP value of the formed adhesive layer was 10.5.

In this way, the adhesive tape 2 was obtained.

Table 1 shows various evaluation results.

(Example 3)

Acrylic copolymer which contains ethyl acrylate (EA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) in 80/10/10 as an acrylic copolymer for non-adhesive layer formation in Example 2 A pressure-sensitive adhesive tape 3 was obtained in the same manner as in Example 2, except that 100 parts by weight was used.

The non-adhesive layer had a thickness of 1.0 μm and an arithmetic mean surface roughness (Ra) of 0.2 μm.

Table 1 shows various evaluation results.

(Example 4)

In Example 2, 60 weight part of silicone resins (KS-723A, Shin-Etsu Chemical Co., Ltd.), 40 weight part of silicone resins (KS-723B, Shin-Etsu Chemical Co., Ltd.), and acrylic copolymer (methylmethacryl) instead of the mixed solution (1). 50 parts by weight of rate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10), 10 parts by weight of a tin catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.), methylhydrosiloxane Mixed solution (4) obtained by mixing 1.0 parts by weight of an acid-based curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state (mixing ratio of silicone and (meth) acrylic polymer in mixed solution (4) "silicone: (meth) acrylic polymer" Was 2: 1 by weight ratio), except that the adhesive tape 4 was obtained in the same manner as in Example 2.

The non-adhesive layer had a thickness of 1.0 μm and an arithmetic mean surface roughness (Ra) of 0.5 μm.

Table 1 shows various evaluation results.

(Example 5)

In Example 4, the adhesive tape 5 was obtained in the same manner as in Example 4 except that the thickness of the non-adhesive layer was changed to 0.5 μm.

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.3 μm.

Table 1 shows various evaluation results.

(Example 6)

An adhesive tape 6 was obtained by attaching a 38 µm-thick PET liner treated with Si as a release liner to the pressure-sensitive adhesive layer of the adhesive tape 2 obtained in Example 2.

The non-adhesive layer had a thickness of 1.0 μm and an arithmetic mean surface roughness Ra of 0.3 μm.

Table 1 shows various evaluation results.

(Example 7)

In Example 2, instead of the mixed solution 1, 1.2 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 0.8 parts by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), an acrylic copolymer (methyl meta 100 parts by weight of methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10), 0.2 part by weight of tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.), methylhydro Mixed solution (7) obtained by mixing 0.02 parts by weight of siloxane curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state (mixing ratio of silicone and (meth) acrylic polymer in mixed solution (7) Was obtained in the same manner as in Example 2, except that "was 1:50 by weight ratio).

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.1 μm.

Table 1 shows various evaluation results.

(Example 8)

In Example 2, 60 weight part of silicone resins (KS-723A, Shin-Etsu Chemical Co., Ltd.), 40 weight part of silicone resins (KS-723B, Shin-Etsu Chemical Co., Ltd.) instead of the mixed solution 1, and acrylic copolymer (methyl meta) 2 parts by weight of methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10), 10 parts by weight of a tin catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.), methylhydro A mixed solution (8) obtained by mixing 1.0 parts by weight of siloxane curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state (mixing ratio of silicone and (meth) acrylic polymer in mixed solution (8) " Was obtained in the same manner as in Example 2, except that "was 50: 1 in the weight ratio).

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.1 μm.

Table 1 shows various evaluation results.

(Example 9)

100 parts by weight of an acrylic copolymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) 85/15 / 2.5 (weight ratio), melamine-based crosslinking agent (butanol-modified melamine formaldehyde resin, "SUPER BECKAMINE J Toluene solution of the pressure-sensitive adhesive containing 10 parts by weight of -820-60N "

The pressure-sensitive adhesive solution was applied on the surface opposite to the non-adhesive layer of the adhesive tape film 1 obtained in Example 1, then dried at 130 ° C. for 90 seconds, and the pressure-sensitive adhesive layer having a thickness of 10 μm was not tacked on the soft polyvinyl chloride film. It was formed on the surface opposite the layer. SP value of the formed adhesive layer was 10.5.

In this way, the adhesive tape 9 was obtained.

Table 2 shows various evaluation results.

(Example 10)

In Example 9, an acrylic copolymer containing ethyl acrylate (EA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) in an 80/10/10 ratio as an acrylic copolymer for forming a non-adhesive layer. The adhesive tape 10 was obtained in the same manner as in Example 9 except that 100 parts by weight of the coalescence were used.

The non-adhesive layer had a thickness of 1.0 μm and an arithmetic mean surface roughness (Ra) of 0.2 μm.

Table 2 shows various evaluation results.

(Example 11)

In Example 9, instead of the mixed solution 1, 60 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 40 parts by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), an acrylic copolymer (methyl meta 50 parts by weight of methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10, 10 parts by weight of tin-based catalyst (Cat-PS3, Shin-Etsu Chemical Co., Ltd.), methylhydro A mixed solution (4) obtained by mixing 1.0 parts by weight of siloxane curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state (mixing ratio of silicone and (meth) acrylic polymer in mixed solution (4) " Was used in the same manner as in Example 9, except that "was 2: 1 by weight ratio).

The non-adhesive layer had a thickness of 1.0 μm and an arithmetic mean surface roughness (Ra) of 0.5 μm.

Table 2 shows various evaluation results.

(Example 12)

In Example 11, the adhesive tape 12 was obtained in the same manner as in Example 11 except that the thickness of the non-adhesive layer was 0.5 μm.

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.3 μm.

Table 2 shows various evaluation results.

(Example 13)

An adhesive tape 13 was obtained by attaching a 38 μm-thick PET liner treated with Si as a release liner to the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape 9 obtained in Example 9.

The non-adhesive layer had a thickness of 1.0 μm and an arithmetic mean surface roughness Ra of 0.3 μm.

Table 2 shows various evaluation results.

(Example 14)

In Example 9, instead of the mixed solution 1, 1.2 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 0.8 part by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), an acrylic copolymer (methyl meta 100 parts by weight of methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10), 0.2 part by weight of tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.), methylhydro Mixed solution (7) obtained by mixing 0.02 parts by weight of siloxane curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state (mixing ratio of silicone and (meth) acrylic polymer in mixed solution (7) Was used in the same manner as in Example 9, except that "was 1:50 by weight ratio."

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.1 μm.

Table 2 shows various evaluation results.

(Example 15)

In Example 9, instead of the mixed solution 1, 60 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 40 parts by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), an acrylic copolymer (methyl meta 2 parts by weight of methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70/30/10), 10 parts by weight of a tin catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.), methylhydro A mixed solution (8) obtained by mixing 1.0 parts by weight of siloxane curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state (mixing ratio of silicone and (meth) acrylic polymer in mixed solution (8) " Was obtained in the same manner as in Example 9, except that "was 50: 1 in the weight ratio).

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.1 μm.

Table 2 shows various evaluation results.

(Comparative Example 1)

In Example 2, the adhesive tape C1 was obtained in the same manner as in Example 2 except that the non-adhesive layer was not formed.

Table 3 shows various evaluation results.

(Comparative Example 2)

In Example 2, instead of the mixed solution 1, 60 parts by weight of a silicone resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 40 parts by weight of a silicone resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), tin-based catalyst (Cat- PS3, manufactured by Shin-Etsu Chemical Co., Ltd., 10 parts by weight, and 1.0 parts by weight of methylhydrosiloxane curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) were used in the same manner as in Example 2, except that a mixed solution (C2) obtained by mixing the solution was used. An adhesive tape (C2) was obtained.

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness (Ra) of 0.08 μm.

Table 3 shows various evaluation results.

(Comparative Example 3)

Example 2 WHEREIN: A non-adhesive layer is an Example except an acryl copolymer (methyl methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA) = 70 / 30/10) The adhesive tape (C3) was obtained in the same manner as 2.

The non-adhesive layer had a thickness of 0.5 μm and an arithmetic mean surface roughness Ra of 0.05 μm.

Table 3 shows various evaluation results.

The adhesive tape of this invention contains the film for adhesive tapes of this invention. Therefore, as described above, it is possible to suppress the occurrence of over-density adhesion when fixing by adsorption under negative pressure, effectively suppressing the blocking of the tape in the form of a roll, and the tape from the roll-shaped form. It does not tear or break when rewinding, is excellent in compatibility between the non-adhesive layer and the plastic film, and has good trackability against deformation such as stretching. Therefore, the tape can be suitably used for semiconductor processing using a semiconductor wafer, which is composed of a brittle material and can have a fine and precise circuit pattern as the adherend. When the adhesive tape of this invention is used for semiconductor processing, it can suppress that overdensity generate | occur | produces when fixing by adsorption under negative pressure, and can advance a semiconductor manufacturing process including dicing smoothly. Moreover, when the adhesive tape of this invention is used for semiconductor processing, accumulation of the film distortion and stress deformation which generate | occur | produce due to blocking conventionally do not generate | occur | produce. Therefore, it is possible to accurately follow and join the fine and precise circuit pattern of the semiconductor wafer. In addition, after the tape is bonded to the semiconductor wafer, the stress deformation is not spontaneously resolved, thereby effectively preventing the semiconductor wafer from being broken. In particular, wafers used in LEDs are composed of very brittle materials such as gallium nitride, gallium arsenide or silicon carbide. Therefore, the adhesive tape of this invention is suitable for LED dicing etc. well.

Claims (14)

The film for adhesive tapes which contains the non adhesion layer whose arithmetic mean surface roughness (Ra) is 0.1 micrometer or more on one surface of the plastic film whose largest elongation measured according to JIS-K-7127 is 100% or more. The film for adhesive tapes of Claim 1 whose non adhesion test peeling strength of a non adhesion layer is less than 1.0 N / 20 mm. The film for adhesive tapes of Claim 1 in which a non adhesion layer contains the mixed layer of silicone and a (meth) acryl polymer. The adhesive tape film of Claim 3 whose mixing ratio "silicone: (meth) acryl polymer" of silicone and a (meth) acryl polymer in a non-adhesive layer is 1: 50-50: 1 by weight ratio. The non-adhesive layer according to claim 3, wherein the non-adhesive layer comprises a silicone rich phase having a content of silicon greater than that of the (meth) acrylic polymer, and a (meth) acrylic polymer rich phase having a content of the (meth) acrylic polymer greater than the content of the silicone. Film for adhesive tapes containing. The film for adhesive tapes of Claim 1 whose thickness of a plastic film is 20 micrometers-200 micrometers. The film for adhesive tapes of Claim 1 whose thickness of a non-adhesive layer is 0.01 micrometer-10 micrometers. The film for adhesive tape according to claim 1, wherein the plastic film comprises polyvinyl chloride. The adhesive tape containing an adhesive layer on the surface on the opposite side of the non adhesion layer of a plastic film in the film for adhesive tapes of any one of Claims 1-8. The adhesive tape of Claim 9 in which an adhesive layer contains a (meth) acryl polymer. Claim 9 or according to claim 10, SP value of the pressure-sensitive adhesive layer is 9.0 (cal / cm ^{3) 0.5} to 12.0 (cal / cm ^{3) 0.5} of the adhesive tape. The adhesive tape according to claim 9, further comprising a release liner on the surface of the adhesive layer. The adhesive tape of Claim 9 used for a semiconductor process. The adhesive tape according to claim 13, wherein the semiconductor processing comprises LED dicing.

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