JP2014127589A - Package for housing element and mounting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an element having excellent high frequency transmission characteristics, and to provide a mounting structure using that package for housing an element.SOLUTION: A package 2 for housing an element includes a substrate 4 having a mounting area of an element 3 on the upper surface, a frame 5 provided along the outer periphery of the mounting area on the substrate 4, and having a through hole T in a part thereof, an I/O terminal 6 provided in the through hole, and a flexible substrate 7 connected onto a first dielectric 61 on the outside of the frame 5, and connected electrically with a signal line. In the plan view, the flexible substrate 7 extends from above the first dielectric 61 to a position not overlapping the first dielectric 61 in a direction separating from the frame 5. Thickness in the vertical direction is large at a place overlapping the signal line, and small at a place not overlapping the signal line.

Description

  The present invention relates to an element storage package and a mounting structure.

2. Description of the Related Art Conventionally, an element storage package having an input / output terminal in which a signal line is formed on one main surface of a dielectric layer and a ground layer is formed on the other main surface of the dielectric layer is known (for example, Patent Document 1). reference). Further, a technique for directly connecting flexible printed circuits to input / output terminals is disclosed (for example, see Patent Document 2).

JP-A-8-227949 JP 2007-5636 A

  Currently, high-frequency waves such as microwaves and millimeter waves are used for signals transmitted through signal lines. In particular, it is difficult to control an electrical signal at a high frequency as compared with a low frequency, and how to transmit the electrical signal from the input / output terminal to the flexible substrate in a good state is a problem.

  An object of the present invention is to provide an element storage package having excellent high-frequency transmission characteristics, and a mounting structure using the element storage package.

  An element storage package according to an embodiment of the present invention includes a substrate having an element mounting region on an upper surface thereof, and a frame having a part of a through hole provided on the substrate along an outer periphery of the mounting region. And a first dielectric layer provided in the through hole and extending inside and outside the frame, and a signal line for electrically connecting the inside and outside of the frame formed on the first dielectric layer, And an input / output terminal having a first dielectric layer and a second dielectric layer provided on the signal line in a region that overlaps the frame when seen in a plan view, and the first dielectric outside the frame And a flexible substrate electrically connected to the signal line, the flexible substrate having the first dielectric in a direction away from the frame body from above the first dielectric layer in plan view. It extends to the position where it does not overlap with the body layer, up and down direction Greater at the location where the thickness overlaps with the signal line, and wherein the small at a position not overlapping with the signal line.

  A mounting structure according to an embodiment of the present invention includes the element storage package and an element mounted on the element storage package and electrically connected to the signal line.

  The present invention can provide an element storage package excellent in high-frequency transmission characteristics and a mounting structure using the element storage package.

It is an outline perspective view of the mounting structure concerning this embodiment. It is an outline perspective view of the mounting structure concerning this embodiment. It is a disassembled perspective view of the mounting structure which concerns on this embodiment, Comprising: The state which removed the flexible substrate is shown. It is a disassembled perspective view of the mounting structure concerning this embodiment. It is the general-view perspective view which showed a part of the element storage package which concerns on this embodiment. It is the general-view perspective view which showed a part of the element storage package which concerns on this embodiment. It is a top view of the package for element storage which concerns on this embodiment. It is a side view of the package for element storage concerning this embodiment. It is sectional drawing which shows the inside of the flexible substrate shown in FIG.

  Embodiments of an element storage package and a mounting structure according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the following embodiment.

<Configuration of mounting structure>
FIG. 1 is a schematic perspective view showing the mounting structure according to the present embodiment, and shows the front of the mounting structure. FIG. 2 is a schematic perspective view showing the mounting structure according to the present embodiment, and shows the rear of the mounting structure. FIG. 3 is a schematic perspective view of the mounting structure 1 according to the present embodiment, and shows a state in which the flexible substrate is removed from the input / output terminals. FIG. 4 is an exploded perspective view of the mounting structure 1 according to the present embodiment, and separately shows a substrate, a frame, an input / output terminal, a flexible substrate, and a lid. FIG. 5 is a schematic perspective view of a part of the element storage package according to the present embodiment, showing the front of the element storage package. FIG. 6 is a schematic perspective view of a part of the device housing package according to the present embodiment, and shows the rear of the device housing package. FIG. 7 is a plan view of an element storage package according to the present embodiment, and input / output terminals overlapping the flexible substrate are indicated by broken lines. FIG. 8 is a side view of the element storage package according to the present embodiment, and shows the positional relationship between the input / output terminals and the flexible substrate. FIG. 9 is a cross-sectional view showing the inside of the flexible substrate shown in FIG. 8, and shows various wirings formed on the flexible substrate. In addition, the dashed-dotted line of FIG. 9 has shown the side surface line of the input / output terminal.

  The mounting structure 1 and the element storage package 2 are used for electronic devices. The mounting structure 1 and the element storage package 2 are used particularly for a high-frequency circuit of an electronic device used at a high frequency such as a microwave or a millimeter wave.

  The mounting structure 1 includes an element storage package 2 and an element 3 mounted on the element storage package 2. The element 3 is, for example, a semiconductor element, an optical semiconductor element, an active element such as a transistor, a diode, or a thyristor, or a passive element such as a resistor or a capacitor. When a semiconductor element such as an IC or LSI is mounted, for example, silicon, germanium, gallium arsenide, gallium arsenide phosphorus, gallium nitride, or silicon carbide can be used as the semiconductor element. The element 3 may be mounted on a base provided in the element housing package 2. Further, a plurality or a plurality of types may be provided in the element storage package 2.

The element storage package 2 includes a substrate 4 having a mounting region R for the element 3 on the upper surface, a frame 5 provided on the substrate 4 along the outer periphery of the mounting region R, and a part having a through hole T, An input / output terminal 6 provided in the through-hole T and extending inside and outside the frame body 5 and a flexible substrate 7 outside the frame body 5 and connected to the input / output terminal 6 are provided. The input / output terminal 6 includes a first dielectric layer 61 extending in and out of the frame body 5, a signal line 62 that electrically connects the inside and outside of the frame body 5 formed on the first dielectric layer 61, and In addition, it has a first dielectric layer 61 and a second dielectric layer 63 provided on the signal line 62 in a region that overlaps the frame 5 when seen in a plan view. The flexible substrate 7 is connected to the first dielectric layer 61 outside the frame body 5 and is electrically connected to the signal line 62. The flexible substrate 7 extends from the top of the first dielectric layer 61 in a direction away from the frame body 5 to a position where it does not overlap the first dielectric layer 61 in plan view, and the thickness in the vertical direction is the signal line 62. Is large at a portion overlapping with the signal line 62 and small at a portion not overlapping with the signal line 62.

  The substrate 4 is a member formed in a square shape when viewed in plan. The substrate 4 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The substrate 4 has a function of improving heat conductivity and dissipating heat generated from the element 3 mounted in the mounting region R to the outside efficiently through the substrate 4. The thermal conductivity of the substrate 4 is set to 15 W / (m · K) or more and 450 W / (m · K) or less, for example.

  The substrate 4 is manufactured in a predetermined shape by using a conventionally known metal processing method such as rolling or punching for an ingot obtained by casting and solidifying a molten metal material into a mold. The length of one side of the substrate 4 is set to 3 mm or more and 50 mm or less, for example. Moreover, the thickness of the board | substrate 4 is set to 0.3 mm or more and 5 mm or less, for example.

  Further, a plating layer such as nickel or gold is formed on the surface of the substrate 4 by using an electroplating method or an electroless plating method in order to prevent oxidative corrosion or to easily braze the element 3 to the mounting region R. Has been. The mounting region R of the substrate 4 is a region that is not connected to the frame body 5 when the frame body 5 is connected to the upper surface of the substrate 4. In the present embodiment, the substrate 4 has a quadrangular shape, but is not limited to a quadrangular shape as long as the element 3 can be mounted, for example, a polygonal shape, an elliptical shape, or a combination of a plurality of members. The shape may be different.

  The frame body 5 is a member that is connected along the outer periphery of the mounting region R of the substrate 4 and protects the element 3 mounted on the mounting region R from the outside. In addition, the frame body 5 is formed with a through hole T in which a part of the side surface is provided with the input / output terminal 6. The through hole T is formed from the side surface of the frame body 5 to the lower surface of the frame body 5. The frame 5 is brazed to the substrate 4 via a brazing material. The brazing material is made of, for example, silver, copper, gold, aluminum, or magnesium, and may contain an additive such as nickel, cadmium, or phosphorus.

  The frame 5 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The frame 5 has a function of efficiently dissipating heat generated from the element 3 to the outside of the frame 5 in a state where the element 3 is mounted in the mounting region R. The thermal conductivity of the frame 5 is set to, for example, 15 W / (m · K) or more and 450 W / (m · K) or less.

  A light transmissive member 8 is provided on the side surface of the frame body 5 at a position opposite to the side surface of the frame body 5 on which the input / output terminal 6 of the frame body 5 is provided. The light transmissive member 8 can pass light from an external device into the frame 5. The light transmissive member 8 is made of, for example, a lens, plastic, glass, sapphire substrate, or the like. The mounting structure 1 can send and receive optical signals to and from an external device through the light transmissive member 8.

  On the frame body 5, a lid body 9 is provided in a state where the element 3 is mounted in the mounting region R. The lid body 9 has a function of sealing a space surrounded by the substrate 4 and the frame body 5. The lid body 9 is brazed onto the frame body 5 via a brazing material, for example. Note that the lid 9 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.

The input / output terminal 6 has a structure in which a plurality of dielectric layers (a first dielectric layer 61 and a second dielectric layer 63) are stacked. In a state where the input / output terminal 6 is provided in the through hole T of the frame body 5, a notch C cut from the upper surface of the input / output terminal 6 to the side surface of the input / output terminal 6 is provided in a region surrounded by the frame body 5. ing. As shown in FIG. 6, the notch C has a part of the input / output terminal 6 cut out so that a step is formed on the upper surface of the input / output terminal 6. In the region surrounded by the frame 5, a part of the signal line 62 extends from the outside of the frame 5. Further, in the region surrounded by the frame body 5, the signal line 62 is divided and formed on the step formed on the upper surface of the input / output terminal 6. And in the area | region enclosed by the frame 5, the distance between several signal track | lines 62 can be lengthened. If the comparison is made with the same number of the plurality of signal lines 62, it is better to form a plurality of signal lines separately on a plurality of layers than to form all signal lines on one layer. The distance between the plurality of signal lines can be increased.

  The signal line 62 has a function of transmitting a predetermined electrical signal. The signal line 62 is used as, for example, a microstrip line or a coplanar line. The signal line 62 is formed on the first dielectric layer 61. The signal line 62 extends from the inside of the frame 5 toward the outside of the frame 5 with the input / output terminals 6 provided on the frame 5. A plurality of signal lines 62 are provided, and each is arranged with a gap therebetween. The plurality of signal lines 62 are electrically insulated from each other. The signal line 62 is made of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, gold, aluminum, nickel, or chromium, a mixture thereof, or an alloy thereof. The line width of the signal line 62 is ¼ or less of the wavelength of the signal transmitted to the signal line 62, and is set to, for example, 0.05 mm or more and 0.5 mm or less.

  The first dielectric layer 61 and the second dielectric layer 63 are insulating materials, for example, inorganic materials such as aluminum oxide, aluminum nitride, or silicon nitride, or organic materials such as epoxy resin, polyimide resin, or ethylene resin. It is made of a material, a ceramic material such as alumina or mullite, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials. In addition, the thickness of the 1st dielectric material layer 61 and the 2nd dielectric material layer 63 is set to 0.1 mm or more and 1.0 mm or less, for example. The dielectric constant of the input / output terminal 6 is set to 4 or more and 10 or less, for example.

  The second dielectric layer 63 is provided on the first dielectric layer 61 and the signal line 62. The second dielectric layer 63 is provided on the first dielectric layer 61 and the signal line 62 in a region where the input / output terminal 6 is provided on the frame 5 and overlaps the frame 5 when seen in a plan view. The second dielectric layer 63 does not cover all of the first dielectric layer 61 and the signal line 62 and exposes the upper surfaces of the first dielectric layer 61 and the signal line 62 located outside the frame 5. The flexible substrate 7 is connected to the exposed first dielectric layer 61 of the input / output terminal 6.

  The flexible substrate 7 is a flexible and deformable substrate. The flexible substrate 7 is connected to the first dielectric layer 61 outside the frame 5 and electrically connected to the signal line 62. The flexible substrate 7 is plate-shaped and has a step b on the upper surface. As shown in FIG. 7, the flexible substrate 7 extends from the first dielectric layer 61 to a position that does not overlap the first dielectric layer 61 in a direction away from the frame 5 in plan view. As shown in FIG. 8, the flexible substrate 7 has a large portion where the vertical thickness overlaps with the signal line 62 and a small portion where it does not overlap with the signal line 62. As shown in FIG. 9, the flexible substrate 7 has a ground layer 71 formed on the upper surface, a flexible signal line 72 formed on the lower surface, and a via conductor 73 formed inside.

The flexible substrate 7 has a long side length of 5 mm to 30 mm and a short side length of 4 mm to 28 mm in plan view. The flexible substrate 7 has a thickness of 2.5 mm or more and 3.5 mm or less where the thickness in the vertical direction overlaps with the input / output terminal 6 when seen through the plane, and overlaps with the input / output terminal 6 when seen through the plane. The portion where the thickness is not thin is 0.
It is set to 5 mm or more and 1.5 mm or less. The step b is set to have a vertical length of, for example, 1 mm or more and 3 mm or less. The flexible substrate 7 is made of, for example, a liquid crystal polymer, polyimide, or cycloolefin polymer. The ground layer 71, the flexible signal line 72, or the via conductor 73 is made of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, gold, aluminum, nickel, or chromium, a mixture thereof, or an alloy thereof. Consists of.

  One end of the flexible substrate 7 on the frame body 5 side is in contact with the side surface of the second dielectric layer 63. The flexible substrate 7 can be easily positioned with respect to the input / output terminals 6 by bringing one side surface of the flexible substrate 7 into contact with the side surface of the second dielectric layer 63. The step b of the flexible substrate 7 is located at a position that does not overlap the input / output terminal 6 in a state where the flexible substrate 7 is connected to the input / output terminal 6. A portion where the thickness of the flexible substrate 7 is thick is formed, for example, as far as 0.1 mm or more and 5 mm or less away from the frame 5 with reference to one side surface of the first dielectric layer 61. By making the thickness of the flexible substrate 7 thicker than the one side surface of the first dielectric layer 61, the flexible substrate 7 in a portion that does not overlap the input / output terminal 6 is prevented from being easily bent. Can do. If there is a step b at a location where it overlaps with the input / output terminal 6 and the thickness of the flexible substrate 7 is thinned from the middle of the location where it overlaps with the input / output terminal 6, the flexible substrate 7 bends from one side of the input / output terminal 6. It is easy to start, and the risk of generating a gap between the lower surface of the flexible substrate 7 and the upper surface of the input / output terminal 6 is increased by using the corner of the upper end of one side of the input / output terminal 6 as an insulator. When a gap is generated, the flexible signal line 72 on the lower surface of the flexible substrate 7 is peeled off from the signal line 62, and an electrical connection failure occurs between the input / output terminal 6 and the flexible substrate 7. Therefore, by increasing the thickness of the flexible substrate 7 to a portion that protrudes beyond one side surface of the first dielectric layer 61, the electrical connection state between the input / output terminal 6 and the flexible substrate 7 is maintained well. can do.

  The ground layer 71 is formed on the upper surface of the flexible substrate 7. The ground layer 71 has a function of setting a common potential, for example, a ground potential. The ground layer 71 is formed on both the upper surface of the flexible substrate 7 and the portion where the thickness of the flexible substrate 7 is thick and the portion where the thickness of the flexible substrate 7 is thin. The ground layer 71 is formed with a gap from the side surface of the second dielectric layer 63. Since the signal line 62 is continuously formed on the first dielectric layer 61 over the frame body 5 and the outside of the frame body 5, in particular, an electric signal flowing through the signal line 62 is a high frequency such as a microwave or a millimeter wave. In this case, the second dielectric layer 63 located outside the frame body 5 may leak to the upper surface of the flexible substrate 7 through the side surface. If the ground layer 71 extends to the side surface of the second dielectric layer 63, the signal line 62 is electrically connected to the ground layer 71, and the mounting structure 1 and the element An electrical failure occurs in the storage package 2. Therefore, the ground layer 71 is formed to be spaced from the side surface of the second dielectric layer 63, so that the possibility that the signal line 62 is electrically connected to the ground layer 71 can be reduced. The occurrence of electrical problems in the structure 1 and the element storage package 2 can be suppressed.

  The flexible substrate 7 has no ground layer 71 formed on the edges of three sides of the four sides of the flexible substrate 7 in plan view. In the flexible substrate 7, a ground layer 71 is formed on the edge of the side located farthest from the frame body 5 among the four sides of the flexible substrate 7 in plan view. By forming the ground layer 71 up to the edge of the side located in front of the flexible substrate 7, the heat transferred from the input / output terminals 6 and the frame body 5 to the flexible substrate 7 is transferred from the ground layer 71 to the frame body 5. It can be made easier to convey in the direction away. As a result, it is possible to suppress the temperature of the flexible substrate 7 from continuing to rise, and it is possible to make the flexible substrate 7 difficult to peel from the input / output terminals 6 due to thermal deformation. And the possibility that a conduction failure may occur in the flexible substrate 7 can be reduced.

  The ground layer 71 includes a first ground layer 711 formed at a location where the flexible substrate 7 is thick, and a second ground layer 712 formed at a location where the flexible substrate 7 is thin. The second ground layer 712 is provided along the upper surface of the portion where the thickness of the flexible substrate 7 is thin, and is provided so as to extend to the portion overlapping the first ground layer 711. The second ground layer 712 is not formed from one end of the flexible substrate 7 to the other end. The second ground layer 712 has fewer portions that overlap the first dielectric layer 61 than portions that do not overlap the first dielectric layer 61. If the location where the second ground layer 712 overlaps the first dielectric layer 61 becomes large, the electrical signal flowing through the flexible signal line 72 in the region where the flexible substrate 7 and the first dielectric layer 61 overlap is first ground. The influence of the second ground layer 712 rather than the layer 711 is increased. For this reason, the electric signal flowing through the flexible signal line 72 is greatly affected by the second ground layer 712, and is not applied to a desired value. In view of this, the flexible substrate 7 reduces the number of places where the second ground layer 712 exists between the flexible signal line 72 and the first ground layer 711 at the place where the flexible substrate 7 overlaps the first dielectric layer 61. The electrical connection between the first ground layer 711 and the second ground layer 712 can be secured while securing the distance between the second ground layer 711 and the first ground layer 711. As a result, the signal characteristic of the flexible substrate 7 can be brought close to a predetermined characteristic impedance value.

  The first ground layer 711 and the second ground layer 712 are electrically connected via the via conductor 73. The first ground layer 711 and the second ground layer 712 are at the same potential. The via conductor 73 is provided in the flexible substrate 7 where it overlaps the first dielectric layer 61 in plan view. The via conductor 73 is connected to the upper surface of the second ground layer 712 that extends to a position overlapping the first dielectric layer 61.

  The flexible signal line 72 is continuously formed from one end to the other end of the lower surface of the flexible substrate 7. A plurality of flexible signal lines 72 are provided on the lower surface of the flexible substrate 7. Each of the plurality of flexible signal lines 72 is connected to correspond to the plurality of signal lines 62. The flexible signal line 72 and the signal line 62 are connected via solder, and both are electrically connected. The electric signal of the flexible signal line 72 can be transmitted to the element 3 through the signal line 62. The element 3 is electrically connected to the signal line 62 located in the frame 5 through wire bonding.

  The mounting structure 1 or the element storage package 2 according to this embodiment eliminates the need for so-called lead terminals by connecting the flexible substrate 7 directly to the input / output terminals 6. Since the lead terminal is not deformed flexibly as compared with the flexible substrate 7, the connection with the external electronic device is not flexible, and the connection method between the lead terminal and the electronic device is limited. That is, since the lead terminal does not deform so as to be bent, wire bonding or the like must be used between the lead terminal and the electronic device. On the other hand, in the mounting structure 1 or the element storage package 2 according to the present embodiment, the flexible substrate 7 is flexibly deformed by connecting the flexible substrate 7 directly to the input / output terminals 6, so The degree of freedom of the connection method is improved, and the electronic components can be connected in a more space-saving manner.

In the mounting structure 1 or the element housing package 2 according to this embodiment, a flexible substrate 7 having a step b on the upper surface is connected to an input / output terminal 6. If a flexible substrate having a top surface with no step b and a constant vertical thickness is connected to the input / output terminal, the change in the surrounding dielectric constant on the side surface of the input / output terminal changes from the dielectric constant of the dielectric layer to the air flow. It changes rapidly to the dielectric constant. For this reason, the electrical signal greatly deviates from the value of the predetermined characteristic impedance, and it is impossible to realize a mounting structure and an element storage package having desired electrical characteristics. Therefore, by using the flexible substrate 7 having the step b on the upper surface, the thickness of the flexible substrate 7 that overlaps the input / output terminal 6 and the thickness of the flexible substrate 7 that does not overlap the input / output terminal 6 are changed. The change in the dielectric constant around the side surface of the output terminal 6 can be adjusted. Then, the signal flowing through the signal line 62 can be made difficult to change rapidly due to the change in the surrounding dielectric constant, and the mounting structure 1 and the element housing package 2 having desired electrical characteristics can be realized. As a result, it is possible to provide an element storage package excellent in high-frequency transmission characteristics and a mounting structure using the element storage package.

  The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention.

<Method for manufacturing mounting structure>
Here, a manufacturing method of the mounting structure 1 shown in FIG. 1 will be described. First, each of the substrate 4, the frame body 5, and the lid body 9 is prepared. Each of the substrate 4, the frame 5, and the lid 9 is manufactured in a predetermined shape by using a metal processing method on a solidified ingot obtained by casting a molten metal material into a mold.

  Next, the input / output terminal 6 is prepared. Here, the method of manufacturing the input / output terminal 6 when the material of the first dielectric layer 61 and the second dielectric layer 63 is an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or the like. Will be described.

  Specifically, when the material of the first dielectric layer 61 and the second dielectric layer 63 is made of an aluminum oxide sintered body, first, the raw material powder such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide is used. An organic binder, a plasticizer or a solvent is added and mixed to form a slurry.

  For the input / output terminals 6, ceramic green sheets corresponding to the first dielectric layer 61 and the second dielectric layer 63 are prepared. The ceramic green sheet can be produced by molding a ceramic material in a mud shape into a predetermined shape. Next, a wiring pattern or a metallized pattern made of a metal paste coated with an organic solvent containing molybdenum or manganese is formed on the ceramic green sheet by using, for example, a screen printing method. The input / output terminal 6 can be manufactured by firing a laminate of a plurality of ceramic green sheets. Furthermore, the input / output terminals 6 can be connected to the substrate 4 and the frame 5 by using a brazing material in a metallized pattern serving as a bonding surface. Further, the prepared frame body 5 is connected to the side surface of the frame body 5 by fitting a light transmissive member through a brazing material.

  Next, the flexible substrate 7 is prepared. The flexible substrate 7 includes a plurality of sheets, and can be manufactured by connecting a plurality of sheets by applying heat to the plurality of sheets on which a predetermined wiring pattern is formed.

  Next, the prepared substrate 4, frame body 5, input / output terminal 6, and flexible substrate 7 are respectively connected to predetermined locations via a brazing material. For example, the flexible signal line 72 on the lower surface of the prepared flexible substrate 7 is connected to the signal line 62 formed on the upper surface of the input / output terminal 6 via a brazing material. In this way, the element storage package 2 can be manufactured. Finally, the mounting structure 1 can be manufactured by mounting the element 3 on the element storage package 2 via solder and providing the lid body 9 on the frame body 5.

DESCRIPTION OF SYMBOLS 1 Mounting structure 2 Element storage package 3 Element 4 Board | substrate 5 Frame 6 Input / output terminal 61 1st dielectric layer 62 Signal line 63 2nd dielectric layer 7 Flexible substrate 71 Ground layer 711 1st ground layer 712 2nd ground Layer 72 Flexible signal line 73 Via conductor 8 Light transmissive member 9 Lid R Mounting area T Through hole C Notch b Step

Claims (5)

A substrate having an element mounting region on the upper surface;
A frame having a through hole in part, provided along the outer periphery of the mounting region on the substrate;
A first dielectric layer provided in the through hole and extending in and out of the frame, a signal line for electrically connecting the inside and outside of the frame formed on the first dielectric layer, and a plane An input / output terminal having a second dielectric layer provided on the first dielectric layer and the signal line in a region that is seen through and overlaps the frame body;
A flexible substrate connected to the first dielectric layer outside the frame and electrically connected to the signal line;
The flexible substrate extends from above the first dielectric layer in a direction away from the frame in a plan view to a position that does not overlap the first dielectric layer, and the thickness in the vertical direction is the signal line. A package for storing elements, wherein the package is large at a portion overlapping with the signal line and small at a portion not overlapping with the signal line. The device storage package according to claim 1,
A package for storing elements, wherein a ground layer is formed on an upper surface of the flexible substrate, and a flexible signal line connected to the signal line is formed on a lower surface of the flexible substrate. The device storage package according to claim 1,
An element storage package, wherein a step is provided on a top surface of the flexible substrate so as not to overlap the input / output terminal. The element storage package according to claim 2,
One end of the flexible substrate on the frame body side is in contact with a side surface of the second dielectric layer, and the ground layer is formed with a gap from the side surface of the second dielectric layer. An element storage package. The element storage package according to any one of claims 1 to 4,
A mounting structure comprising an element mounted on the element storage package and electrically connected to the signal line.

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