JP2014125391A - Segmenting method, and segmenting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently segment a laminate plate.SOLUTION: A first scribe groove 11c having both ends 11d not reaching an outer peripheral edge 11e of a first substrate 11 is formed on a first face 11a of a first substrate 11. Also, a second scribe groove 12c is formed on a first face 12a of a second substrate 12. After the first and second scribe grooves 11c, 12c are formed, an a laminated substrate 10 is pressurized from the first face 11a of the first substrate 11, and the second substrate 12 is segmented along the second scribe groove 12c. Then, the laminated substrate 10 is pressurized from the first face 12a of the second substrate 12, and the first substrate 11 is segmented along the first scribe groove 11c.

Description

  The present invention relates to a cutting method and a cutting apparatus for dividing a laminated plate.

  The liquid crystal device is configured by a bonded substrate in which a first substrate and a second substrate are bonded together with a sealing material so that a liquid crystal layer is interposed (for example, Patent Document 1). This bonded substrate is first manufactured in a large format from the viewpoint of productivity, and is divided into a plurality of bonded substrates. This cutting method will be described in detail. First, a scribe groove is formed on the surface of the bonded substrate on the first substrate side, and then the bonded substrate is pressed and bent from the second substrate side to scribe the first substrate. Divide along the groove. Subsequently, a scribe groove is formed on the surface of the bonded substrate on the second substrate side. Next, the bonded substrate is pressed and bent from the first substrate side, and the second substrate is divided along the scribe groove.

JP2012-203235A

  In the above-described method, the first substrate of the bonded substrate is scribed and then divided, and then the second substrate of the bonded substrate is scribed and divided. As described above, the cutting method described above is poor in productivity because scribing and cutting are alternately repeated.

  The subject of this invention is dividing a laminated board efficiently.

  The cutting method according to the first aspect of the present invention is a cutting method for cutting a laminated board having a first substrate and a second substrate that are laminated so that each first surface faces outward, from the next step (a) ( d). Step (a) forms a first scribe groove having at least one end that does not reach the outer peripheral edge of the first substrate on the first surface of the first substrate. Step (b) forms a second scribe groove on the first surface of the second substrate. In step (c), after the execution of steps (a) and (b), the second board is bent by pressing the laminated board from the first surface of the first board and bending the laminated board around the second scribe groove. Is cut along the second scribe groove. In the step (d), after the execution of the step (c), the first board is squeezed from the first surface of the second board by pressing the laminated board and bending the laminated board around the first scribe groove. Divide along the groove.

  According to this method, first, scribe grooves are formed on both surfaces of the laminate by steps (a) and (b), and then the first substrate and the second substrate are formed by steps (c) and (d). Cut along the scribe grooves formed in each. As described above, since the scribing process and the dividing process can be collectively performed on the laminated board, the laminated board can be efficiently divided.

  By the way, when the scribe process and the dividing process are performed together, that is, when the first substrate and the second substrate are respectively divided after forming the scribe grooves on both surfaces of the laminate, one of the substrates follows the scribe groove. May not be accurately divided. For example, after forming scribe grooves on both sides of the laminate, first, the laminate is bent so that the second substrate is convex in order to divide the second substrate. Then, since the scribe groove is already formed in the first substrate, the first substrate may be divided in the process for dividing the second substrate. And since the surface in which the scribe groove | channel was formed becomes concave and the 1st board | substrate bends, possibility that it will not be divided along a scribe groove | channel is high.

  On the other hand, in the cutting method according to the first invention described above, at least one end of the first scribe groove formed in the first substrate does not reach the outer peripheral edge of the first substrate. For this reason, when performing the step (c) for dividing the second substrate, it is possible to prevent the first substrate from being divided even if the first surface of the first substrate is bent in a concave shape. it can.

  The dividing method according to the second invention is the dividing method according to the first invention, wherein both ends of the first scribe groove formed in step (a) do not reach the outer peripheral edge of the first substrate. In this method, it is possible to more reliably prevent the first substrate from being excessively divided when step (c) is executed.

  A dividing method according to a third invention is the dividing method according to the first or second invention, wherein both ends of the second scribe groove formed in step (b) extend to the outer peripheral edge of the second substrate. According to this method, the second substrate can be easily divided by step (c). That is, since it is not necessary to increase the pressing force for dividing the second substrate during step (c), it is possible to more reliably prevent the first substrate from being divided.

  A dividing method according to a fourth invention is the dividing method according to any one of the first to third inventions, wherein in step (a), the first substrate extends from the first scribe groove to a second surface facing the first surface. No cracks are formed.

  According to this method, since the first substrate has no crack formed on the second surface, the first substrate can be prevented from being divided even if the second substrate is bent so as to have a convex shape.

  The dividing method according to a fifth aspect is the dividing method according to any one of the first to fourth aspects, wherein at least one of the first scribe groove and the second scribe groove is formed by laser processing.

  A cutting apparatus according to a sixth aspect of the present invention is a cutting apparatus for cutting a laminated board having a first substrate and a second substrate that are laminated so that each first surface faces outward, and a first scribe groove forming portion; A second scribe groove forming part, a first dividing part, and a second dividing part are provided. The first scribe groove forming portion forms a first scribe groove having at least one end portion that does not reach the outer peripheral edge of the first substrate on the first surface of the first substrate. The second scribe groove forming portion forms a second scribe groove on the first surface of the second substrate. The first dividing portion presses the laminated plate in which the first and second scribe grooves are formed from the first surface of the first substrate, and bends the laminated plate around the second scribe groove to thereby form the second substrate. Is cut along the second scribe groove. The second dividing unit presses the laminated plate from which the second substrate is divided from the first surface of the second substrate, and deflects the laminated plate around the first scribe groove, thereby causing the first substrate to scribe the first substrate. Divide along the groove.

  According to this configuration, first, the scribe grooves are formed on both surfaces of the laminated plate by the first and second scribe groove forming portions, and then the first substrate and the second substrate are formed by the first and second dividing portions. Cut along the scribe grooves formed in each. As described above, since the scribing process and the dividing process can be collectively performed on the laminated board, the laminated board can be efficiently divided.

  Further, at least one end of the first scribe groove formed in the first substrate does not reach the outer peripheral edge of the first substrate. Therefore, when the second substrate is divided by the first dividing portion, even if the first surface of the first substrate is bent and bent, the first substrate can be prevented from being divided.

  According to the present invention, a laminated board can be divided efficiently.

The schematic block diagram of a parting apparatus. The top view of a 1st board | substrate. Side surface sectional drawing of a 1st board | substrate. The top view of a 2nd board | substrate. Side surface sectional drawing of a 2nd board | substrate. The figure which shows a mode that a 2nd board | substrate is parted. The figure which shows a mode that a 1st board | substrate is parted. The top view of the 1st board | substrate of the modification 1. FIG. The figure which shows a mode that the board | substrate of an Example and a comparative example is parted. The figure which shows a mode that the board | substrate of the reference examples 1 and 2 is parted.

  Hereinafter, embodiments of a cutting method and a cutting apparatus according to the present invention will be described with reference to the drawings.

[Laminated substrate]
First, a bonded substrate (an example of a laminated plate) that is an object to be divided will be described. As illustrated in FIG. 1, the bonded substrate 10 includes a first substrate 11 and a second substrate 12 that is bonded to the first substrate 11 via a seal member 13. For example, a liquid crystal layer is formed between the first substrate 11 and the second substrate 12, and the sealing member 13 surrounds the liquid crystal layer.

  The first substrate 11 has a first surface 11a and a second surface 11b facing the first surface 11a. In the first substrate 11, the first surface 11 a faces the outside (the upper side in FIG. 1), and the second surface 11 b faces the second substrate 12. The second substrate 12 has a first surface 12a and a second surface 12b facing the first surface 12a. In the second substrate 12, the first surface 12 a faces outward (the lower side in FIG. 1), and the second surface 12 b faces the first substrate 11. The “outside” means the upward direction in the first substrate 11 disposed on the upper side, and the downward direction in the second substrate 12 disposed on the lower side. That is, it means the direction opposite to the direction in which the mating substrate is positioned when stacked.

[Parting device]
Next, the cutting apparatus will be described. 1, 6, and 7, the cutting apparatus includes a table 20 on which the bonded substrate 10 is placed, a first scribe groove forming unit 30, a second scribe groove forming unit 40, and a first dividing unit. 50 (FIG. 6) and a second dividing portion 60 (FIG. 7).

  As shown in FIG. 1, the first scribe groove forming unit 30 forms the first scribe groove 11 c in the first surface 11 a of the first substrate 11. The first scribe groove forming unit 30 includes an irradiation unit 31 and a cooling unit 32, and moves in a direction in which the first scribe groove 11c is formed. The irradiation unit 31 includes a laser oscillator 31 a, a reflection mirror 31 b, and a condenser lens 31 c, and irradiates a laser beam toward the first substrate 11. The laser oscillator 31 a outputs a laser having a wavelength having absorption and transmission properties to the first substrate 11. The reflection mirror 31b guides the laser from the laser oscillator 31a to the table 20 side. The condensing lens 31c condenses the laser so that the focal point is located between the first surface 11a of the first substrate 11 or between the first surface 11a and the second surface 11b.

  The cooling unit 32 injects a coolant supplied from a coolant source (not shown) to the first surface 11a of the first substrate 11 through the nozzle 32a to form a cooling spot.

  The second scribe groove forming unit 40 forms the second scribe groove 12 c in the first surface 12 a of the second substrate 12. The second scribe groove forming unit 40 includes an irradiation unit 41 and a cooling unit 42. The irradiation unit 41 includes a laser oscillator 41a, a reflection mirror 41b, and a condenser lens 41c, and the cooling unit 42 includes a nozzle 42a. The second scribe groove forming portion 40 is different from the first scribe groove forming portion 30 described above only in that the object to be processed is not the first substrate 11 but the second substrate 12, and the other is the first scribe groove forming portion. Since it is the same structure as 30, the detailed description is abbreviate | omitted.

  As shown in FIG. 6, the first dividing unit 50 divides the second substrate 12 along the second scribe groove 12 c. The first dividing section 50 includes a roller 50a that rolls while pressing on the first surface 11a of the first substrate 11, and a cylinder (not shown) that pushes the roller 50a toward the bonded substrate 10 side.

  As shown in FIG. 7, the second dividing unit 60 divides the first substrate 11 along the first scribe groove 11c. This 2nd parting part 60 is the structure similar to the 1st parting part 50, and has the roller 60a and a cylinder (illustration omitted).

  In addition, although not shown here, the cutting device is provided with an initial crack forming means for forming an initial crack serving as a starting point of the scribe groove at the end of the bonded substrate 10 on the scanning start side. As an initial crack formation means, mechanical tools, such as an indenter or a cutter wheel, and a laser irradiation apparatus can be mentioned, for example. The laser irradiation apparatus forms an initial crack by laser ablation processing.

[Division method]
Next, a method for dividing the bonded substrate 10 will be described. First, the bonded substrate 10 is placed on the table 21. Then, using the initial crack forming means, initial cracks serving as the base points of the scribe grooves are formed at the end portions of the first surface 11 a of the first substrate 11 and the first surface 12 a of the second substrate 12.

  Next, as shown in FIG. 1, the irradiation unit 31 of the first scribe groove forming unit 30 irradiates the first substrate 11 with a laser. The condensing lens 31 positions the focal point of the laser between the first surface 11a of the first substrate 11 or between the first surface 11a and the second surface 11b. The cooling unit 32 of the first scribe groove forming unit 30 sprays the cooling medium through the cooling nozzle 32a simultaneously with the laser irradiation and into the region irradiated with the laser.

  Here, since a laser having a wavelength that has absorption and transmission properties with respect to the first substrate 11 is used as the laser, the surface and the inside of the first substrate 11 are heated by the laser irradiation. On the other hand, since the cooling medium is jetted into the laser irradiation region and cooled, a temperature gradient is generated inside the substrate, a tensile stress is generated on the surface of the first substrate, and a compressive stress is generated inside. Thereby, a crack occurs in the first substrate 11.

  By scanning the laser spot and the cooling spot as described above along the division line, the first substrate 11 is cracked along the division line, and the first scribe groove 11c as shown in FIGS. Is formed. Here, by adjusting the position where the initial crack is formed, and by not scanning the laser spot and the cooling spot to the outer peripheral edge 11e of the first substrate 11, both ends 11d of the first scribe groove 11c are the first substrate. 11 does not reach the outer peripheral edge 11e. For this reason, the space | interval d is formed between the both ends 11d of the 1st scribe groove | channel 11c, and the outer periphery 11e. The distance d is preferably about 2 mm to 10 mm, and more preferably about 3 mm to 5 mm.

  The first scribe grooves 11c are so-called half cuts that are formed from the first surface 11a of the first substrate 11 and do not reach the second surface 11b. Although the depth of the 1st scribe groove | channel 11 is not specifically limited, For example, it can be set as about 10% or more and 20% or less of the thickness of the 1st board | substrate 11. FIG. Further, the first substrate 11 is not formed with a crack extending from the first scribe groove 11c to the second surface 11b.

  Next, the second scribe groove 12 c is similarly formed on the second substrate 12 by the second scribe groove forming unit 40. As shown in FIGS. 4 and 5, the second scribe groove 12c has both ends extending to the outer peripheral edge 12e of the second substrate 12, and a crack 12f extending from the second scribe groove 12c to the second surface 12b is formed. However, the rest is the same as the first scribe groove 11c.

  Next, as shown in FIG. 6, the first dividing unit 50 divides the second substrate 12 along the second scribe grooves 12 c. Specifically, the roller 50a pushed into the bonded substrate 10 side by the cylinder rolls on the first surface 11a of the first substrate 11 while pressing the bonded substrate 10 from the first substrate 11 side. The roller 50 a rolls on the first surface 11 a of the first substrate 11 along a line corresponding to the second scribe groove 12 c of the second substrate 12. As a result, the bonded substrate 10 is bent in a convex shape downward about the second scribe groove 12c. As a result, the second substrate 12 is divided along the second scribe groove 12c. In addition, the pressing amount of the roller 50a in this process is not particularly limited, but 0.1 mm or more and 1.0 mm so that only the second substrate 12 can be divided without dividing the first substrate 11. The following is preferable. Note that the pushing amount is an amount by which the roller is pushed toward the bonded substrate 10, and a state in which the roller simply touches the bonded substrate 10 without pressing it is defined as 0 mm.

  Next, as shown in FIG. 7, the second dividing unit 60 divides the first substrate 11 along the first scribe groove 11c. Specifically, the roller 60a pushed into the bonded substrate 10 side by the cylinder rolls on the first surface 12a of the second substrate 12 while pressing the bonded substrate 10 from the second substrate 12 side. The roller rolls on the first surface 12 a of the second substrate 12 along a line corresponding to the first scribe groove 11 c of the first substrate 11. As a result, the bonded substrate 10 is convex upward with the first scribe groove 11c as the center. As a result, the first substrate 11 is divided along the first scribe groove 11c. As described above, the bonded substrate 10 is divided along the first scribe groove 11c and the second scribe groove 12c. In the present embodiment, the first scribe groove 11c and the second scribe groove 12c are formed at corresponding positions.

[Feature]
(1) According to the cutting method according to the above-described embodiment, first, the scribe grooves 11c and 12c are formed on the both surfaces 11a and 12a of the bonded substrate 10, and then the first substrate 11 and the second substrate 12 are formed. Are cut along the scribe grooves 11c and 12c formed respectively. In this way, since the scribe process and the dividing process can be performed together on the bonded substrate, the bonded substrate 10 can be efficiently divided.

  (2) At least one end 11 d of the first scribe groove 11 c formed in the first substrate 11 does not reach the outer peripheral edge 11 e of the first substrate 11. Therefore, when the second substrate 12 is divided, the first substrate 11 can be prevented from being divided even if the first surface 11a of the first substrate 11 is bent and bent.

  (3) Since both ends of the second scribe groove 12c extend to the outer peripheral edge 12e of the second substrate 12, the second substrate 12 can be easily divided. Therefore, since it is not necessary to increase the pressing force for dividing the second substrate 12, it is possible to more reliably prevent the first substrate 11 from being divided when the second substrate 12 is divided.

  (4) Since the first substrate 11 is not formed with a crack extending from the first scribe groove 11c to the second surface 11b opposed to the first surface 11a, the second surface side 11b is convex when the second substrate 12 is divided. Even if it bends to form a shape, the first substrate 11 can be prevented from being divided.

[Modification]
As mentioned above, although embodiment of this invention was described, this invention is not limited to these, A various change is possible unless it deviates from the meaning of this invention.

Modification 1
One end of the first scribe groove 11c formed in the first substrate 11 may reach the outer peripheral edge 11e of the first substrate 11 as shown in FIG.

Modification 2
In the above embodiment, the second substrate 12 has both ends of the second scribe groove 12 c extending to the outer peripheral edge 12 e of the second substrate 12, but one end or both ends reach the outer peripheral edge 12 e of the second substrate 12. It does not have to be.

Modification 3
Moreover, in the said embodiment, although a scribe groove | channel is formed by laser processing, the formation method of a scribe groove | channel is not specifically limited to this. For example, the scribe groove may be formed by a mechanical tool such as a cutting cutter.

Modification 4
In the above embodiment, when the scribe groove is formed in the bonded substrate 10 or when the bonded substrate 10 is divided, the first and second scribe groove forming portions 30 and 40 or the first and second divided portions 50 and 60 are provided. Although it moves, it is not limited to this in particular. For example, the cutting device further includes a table moving mechanism, and the table moving mechanism moves only the table 20 while the first and second scribe groove forming portions 30 and 40 and the first and second dividing portions 50 and 60 are stopped. It can also be made. Still further, the first and second scribe groove forming portions 30 and 40, the first and second dividing portions 50 and 60, and the table 20 are all moved to form a scribe groove in the bonded substrate 10. Alternatively, the bonded substrate 10 can be divided.

Modification 5
The second scribe groove forming part 40 can be omitted. In this case, the first scribe groove forming part 30 forms the second scribe groove 12c. Moreover, the 2nd parting part 60 can also be abbreviate | omitted. In this case, the first substrate 11 is divided by the first dividing unit 50.

  The present invention will be described more specifically with reference to the following examples and comparative examples. In addition, this invention is not limited to the following Example.

  As a target substrate, a substrate 1 which is soda glass having a thickness of 0.5 mm was used. A scribe groove 1 c having a depth of 120 μm and having both ends not reaching the outer peripheral edge of the substrate 1 was formed on the substrate 1 of the example. The distance d between both ends of the scribe groove 1c and the outer peripheral edge of the substrate 1 was 4 mm. A scribe groove 1c having the same depth was formed on the substrate 1 of the comparative example by the same method as the substrate 1 of the example, but both ends of the scribe groove 1c were extended to the outer peripheral edge of the substrate 1.

  And as shown in FIG. 9, the roller 50a was rolled along the scribe groove | channel 1c on the surface 1a in which the scribe groove | channel 1 of each board | substrate 1 was formed. Table 1 shows the results of visually confirming whether or not each substrate 1 was divided by changing the pressing amount of the roller 50a for each substrate 1 at this time. In Table 1, “◯” means that the substrate 1 is not divided, and “x” means that the substrate 1 is divided.

  As shown in Table 1, the substrate 1 of the example was not divided even when the indentation amount was 1.0 mm. On the other hand, the substrate 1 of the comparative example was divided at an indentation amount of 0.1 mm. And the board | substrate 1 of the comparative example was not parting along the scribe groove | channel 1c in all the pushing amounts. That is, the substrate 1 of the comparative example was cut at a line that was not a line to be cut.

  Further, the substrate 1 having the same configuration as that of the above example was used as reference example 1, and the substrate 1 having the same configuration as that of the above comparative example was used as reference example 2. And as shown in FIG. 10, the roller 50a was rolled along the scribe groove | channel 1c on the surface 1b facing the surface 1a in which the scribe groove | channel 1 of each board | substrate 1 was formed. Table 2 shows the results of visually confirming whether or not each substrate 1 was divided by changing the pressing amount of the roller 50a for each substrate 1. In Table 2, “◯” means that the substrate 1 is completely divided, and “x” means that the substrate 1 is not completely divided, that is, only a part of the substrate 1 is divided. Means that. The substrate 1 of Reference Example 1 requires a push amount of 0.3 mm in order to be completely divided along the scribe groove 1c, whereas the substrate 1 of Reference Example 2 has a push amount of 0.1 mm. If it exists, it turns out that it cuts completely along the scribe groove | channel 1c.

10 Bonded substrate (laminate)
DESCRIPTION OF SYMBOLS 11 1st board | substrate 12 2nd board | substrate 11a, 12a 1st surface 11b, 12b 2nd surface 11c, 12c Scribe groove | channel 11d End part 11e, 12e Outer periphery 30 1st scribe groove formation part 40 2nd scribe groove formation part 50 1st Dividing part 60 Second dividing part

Claims (6)

A dividing method for dividing a laminated board having a first substrate and a second substrate laminated so that each first surface faces outward,
(A) forming, on the first surface of the first substrate, a first scribe groove having at least one end that does not reach the outer periphery of the first substrate;
(B) forming a second scribe groove on the first surface of the second substrate;
(C) After performing the steps (a) and (b), by pressing the laminate from the first surface of the first substrate and bending the laminate around the second scribe groove, Dividing the second substrate along the second scribe groove;
(D) After the execution of the step (c), by pressing the laminated plate from the first surface of the second substrate and bending the laminated plate around the first scribe groove, the first substrate Cutting along the first scribe groove;
Including cutting method.   2. The cutting method according to claim 1, wherein both ends of the first scribe groove formed in the step (a) do not reach the outer peripheral edge of the first substrate.   The cutting method according to claim 1 or 2, wherein both ends of the second scribe groove formed in the step (b) extend to the outer peripheral edge of the second substrate.   4. The cutting method according to claim 1, wherein in the step (a), the first substrate is not formed with a crack extending from the first scribe groove to a second surface facing the first surface. 5.   The cutting method according to any one of claims 1 to 4, wherein at least one of the first scribe groove and the second scribe groove is formed by laser processing. A cutting apparatus for cutting a laminated plate having a first substrate and a second substrate laminated such that each first surface faces outward,
A first scribe groove forming portion for forming a first scribe groove having at least one end portion that does not reach an outer peripheral edge of the first substrate on the first surface of the first substrate;
A second scribe groove forming portion for forming a second scribe groove on the first surface of the second substrate;
The second and second scribe grooves are formed by pressing the laminated board from the first surface of the first substrate and bending the laminated board around the second scribe groove. A first dividing portion for dividing the substrate along the second scribe groove;
By pressing the laminated plate from which the second substrate has been divided from the first surface of the second substrate and bending the laminated plate around the first scribe groove, the first substrate is moved to the first substrate. A second dividing portion that divides along one scribe groove;
A cutting apparatus comprising:

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