JP2014115190A - Testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a testing device capable of preventing point contact between a terminal and a contact part, and also preventing flaws on the terminal.SOLUTION: A testing device of the present invention includes: a first contact part 10 that has a first convex-curved surface 10c and is formed of a conductive material; a second contact part 14 that has a second convex-curved surface 14c which is provided so as to oppose to the first convex-curved surface 10c, and that is formed of a conductive material; and a moving apparatus that moves the first contact part 10 and the second contact part 14 so as to sandwich a terminal 102a of a semiconductor device 102 between the first convex-curved surface 10c and the second convex-curved surface 14c.

Description

  The present invention relates to a test apparatus used for testing electrical characteristics of a semiconductor device.

  Patent Document 1 discloses a method of electrically connecting a terminal and a metal member with a terminal (battery electrode) sandwiched between two contact portions.

  Patent Document 2 discloses an IC socket having two contact portions. This IC socket is one in which a terminal of a semiconductor device is press-fitted between two contact portions to elastically deform one of the two contact portions. When the press-fitting is completed, the contact portion is sufficiently elastically deformed, and the contact between the contact portion and the terminal is ensured by the elastic force of the contact portion.

JP 2002-190328 A JP-A-62-48787

  The technique disclosed in Patent Document 1 has a problem that the terminal and the contact portion are in point contact when the angle of the terminal of the semiconductor device is deviated from a predetermined angle. When the terminal and the contact portion are in point contact, there is a problem that electric discharge occurs or the terminal is scratched.

  In the technique disclosed in Patent Document 2, there is a problem that the terminal and the contact portion are rubbed when the terminal is press-fitted, so that the terminal is damaged.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a test apparatus capable of preventing point contact between a terminal and a contact portion and scratching of the terminal.

  The test apparatus according to the invention of the present application has a first convex curved surface, a first contact portion made of a conductive material, and a second convex curved surface provided so as to face the first convex curved surface. A second contact portion made of a conductive material, and a moving instrument for moving the first contact portion and the second contact portion so that the first convex curved surface and the second convex curved surface sandwich the terminal of the semiconductor device. And.

  According to the present invention, since the terminal is sandwiched between the first convex curved surface of the first contact portion and the second convex curved surface of the second contact portion, the point contact between the terminal and the first contact portion, or the terminal and the second contact portion, and It is possible to prevent scratches on the terminals.

It is sectional drawing of the testing apparatus which concerns on Embodiment 1 of this invention. It is a top view which shows the connection of each components. It is sectional drawing which shows the test method of the semiconductor device using the test apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows having pinched | interposed the terminal between the 1st contact part and the 2nd contact part. It is an enlarged view of a 1st contact part, a 2nd contact part, a terminal, and a stage. It is a front view of the 1st contact part and the 2nd contact part concerning Embodiment 2 of the present invention. It is a perspective view of the 1st contact part which concerns on Embodiment 3 of this invention, a 2nd contact part, and the main surface of a stage. It is a front view which shows having pinched the terminal with the 1st roller and the 2nd roller. It is a perspective view which shows replacement | exchange of a 1st roller.

  A test apparatus according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view of a test apparatus according to Embodiment 1 of the present invention. This test apparatus measures the electrical characteristics of the semiconductor device via the first contact portion 10 and the second contact portion 14 with the first contact portion 10 and the second contact portion 14 sandwiching the terminal of the semiconductor device. is there.

  The first contact portion 10 is made of a conductive material. A screw hole 10 a is formed in the first contact portion 10. The screw hole 10a is a part used for electrical connection with the outside. A through hole 10 b is formed in the first contact portion 10. The through hole 10b is a hole that penetrates the first contact portion 10 in the z direction. A shaft 12 is provided in the through hole 10b. The first contact portion 10 can be rotated around the shaft 12.

  The first contact portion 10 is formed with a first convex curved surface 10c. The first convex curved surface 10c has a semicircular cross section. A concave portion 10d is formed on the opposite side of the first contact portion 10 to the first convex curved surface 10c.

  Since the second contact portion 14 is formed of the same shape and material as the first contact portion 10, the description is simplified. The screw hole 14a is a part used for electrical connection with the outside. A shaft 16 is provided in the through hole 14b. As a result, the second contact portion 14 can rotate around the shaft 16. A second convex curved surface 14c is formed on the second contact portion 14 so as to face the first convex curved surface 10c. The second convex curved surface 14c has a semicircular cross section. A concave portion 14d is formed on the second contact portion 14 on the opposite side of the second convex curved surface 14c.

  Next, a moving instrument that moves the first contact portion 10 will be described. The first contact portion 10 is fixed to the movable block 20 via the shaft 12. The movable block 20 has a recess 20a. A first spring 22 is accommodated in the recess 20 a and the recess 10 d of the first contact portion 10. That is, the first spring 22 has a direction of the second convex curved surface 14c between the back side of the portion where the first convex curved surface 10c of the first contact portion 10 is formed and the movable block 20 which is a part of the moving device. It is arranged so as to expand and contract.

  The movable block 20 is in contact with the slide roller 24. The slide roller 24 is in contact with the member 30 at the lower side and is in contact with the inclined surface 34a of the member 34 at the upper side. The member 30 and the member 34 are connected via the elastic member 32. When the telescopic member 32 contracts and the member 30 and the member 34 approach, the slide roller 24 slides in the positive x direction along the slope 34a. As a result, the movable block 20 and the first contact portion 10 move in the x positive direction.

  A contact block 36 is fixed to the member 30. The contact block 36 extends downward (y negative direction) from the first contact portion 10 and the second contact portion 14.

  Since the moving instrument on the second contact portion 14 side is the same as the moving instrument on the first contact portion 10 side, the description is simplified. A second spring 28 is accommodated in the recess 26 a of the movable block 26 and the recess 14 d of the second contact portion 14. The second spring 28 extends and contracts in the direction of the first convex curved surface 10c between the back side of the portion where the second convex curved surface 14c of the second contact portion 14 is formed and the movable block 26 which is a part of the moving device. It is arranged to do.

  The movable block 26 is in contact with the slide roller 40. The slide roller 40 is in contact with the member 50 at the lower side and is in contact with the inclined surface 54a of the member 54 at the upper side. The member 50 and the member 54 are connected via the elastic member 52. A member 38 is fixed on the members 54 and 34. A contact block 56 is fixed to the member 50. The contact block 56 extends downward (y negative direction) from the first contact portion 10 and the second contact portion 14.

  By the way, the current flows through the first contact portion 10 and the second contact portion 14 when measuring the electrical characteristics of the semiconductor device. Therefore, it is preferable that a component that may come into contact with the first contact portion 10 or the second contact portion 14 is formed of an insulating material. For example, the shafts 12 and 16 must be formed of an insulating material.

  FIG. 2 is a plan view showing the connection of the components. A plurality of first contact portions 10 are formed, and the shaft 12 penetrates all the first contact portions 10. A plurality of second contact portions 14 are formed, and the shaft 16 penetrates all the second contact portions 14. The movable block 20 and the movable block 26 are connected by a shaft 70. Accordingly, the first contact portion 10 and the second contact portion 14 can be easily disassembled and replaced if necessary by removing the shaft 70 and then removing the shafts 12 and 16.

  FIG. 3 is a cross-sectional view showing a semiconductor device test method using the test apparatus according to the first embodiment of the present invention. First, the semiconductor device 102 is placed on the main surface 100 a of the stage 100. The semiconductor device 102 is a resin-encapsulated semiconductor device having a terminal 102a extending to the outside. Of the surfaces of the terminals 102a, the surface facing the direction opposite to the resin is the first surface 102b, and the surface facing the resin direction is the second surface 102c.

  When inspecting the semiconductor device 102, the control unit 104 is prepared in the vicinity of the test device. The control unit 104 is a part that tests the electrical characteristics of the semiconductor device 102 by applying voltage and current to the semiconductor device 102 via the first contact unit 10 and the second contact unit 14. The control unit 104 is connected to the first contact unit 10 and the second contact unit 14 by inserting connection components 104a and 104b into the screw hole 10a and the screw hole 14a, respectively.

  As can be seen from FIG. 3, the distance from the first convex curved surface 10c to the main surface 100a is different from the distance from the second convex curved surface 14c to the main surface 100a. More specifically, the distance from the first convex curved surface 14c to the main surface 100a is shorter than the distance from the second convex curved surface 14c to the main surface 100a. Further, the distance between the first contact part 10 and the second contact part 14 (referred to as the inter-contact distance) before the inspection is assumed to be x1.

  After completing the preparation so far, the first contact portion 10 and the second contact portion 14 are brought into contact with the terminal 102a. FIG. 4 is a cross-sectional view showing that the terminal is sandwiched between the first contact portion and the second contact portion. In a state where the contact blocks 36 and 56 are in contact with the main surface 100a, the elastic members 32 and 52 contract when the member 38 of the moving device is pressed in the direction of the white arrow (the negative y direction). Specifically, the distance between the member 30 and the member 34 and the distance between the member 50 and the member 54 are y2 shorter than y1 in FIG.

  As the telescopic members 32 and 52 contract, the slide rollers 24 and 40 move in the direction of the black arrow along the inclined surfaces 34a and 54a, respectively. Then, the distance between the movable block 20 and the movable block 26 is reduced, and the distance between the contacts becomes x2 which is smaller than x1. Thus, the second convex curved surface 14c is applied to the second surface 102c while the first convex curved surface 10c is applied to the first surface 102b. This contact pressure is properly maintained by the first spring 22 and the second spring 28.

  Next, the electrical characteristics of the semiconductor device 102 are tested. Specifically, the control unit 104 applies voltage and current to the terminal 102 a through the second contact unit 14. Further, the control unit 104 detects the voltage of the terminal 102 a through the first contact unit 10. After the test is completed, the member 38 of the moving instrument is lifted upward (y positive direction), and the distance between the contacts is increased to separate the first contact portion 10 and the second contact portion 14 from the terminal 102a.

  According to the test apparatus according to Embodiment 1 of the present invention, the first convex curved surface 10c and the second convex curved surface 14c are brought into contact with the terminal 102a, so the terminal 102a and the contact portion (the first contact portion 10 and the second contact portion 14). Point contact) and scratches on the terminal 102a can be prevented. In addition, since the first contact portion 10 and the second contact portion 14 according to Embodiment 1 of the present invention are each formed from a single component, the electrical resistance is lower than when formed from a plurality of components. Therefore, a test in which a large current of several thousand A and a high voltage of 1000 V or more are applied to the semiconductor device 102 is possible. Note that, when a test is performed by applying a large current and a high voltage to the semiconductor device 102, if the contact portion is in point contact with the terminal, discharge is likely to occur. However, according to the present invention, since point contact can be avoided, discharge can be prevented.

  As described above, the distance from the first convex curved surface 10c to the main surface 100a is shorter than the distance from the second convex curved surface 14c to the main surface 100a. The significance of this will be described with reference to FIG. FIG. 5 is an enlarged view of the first contact portion, the second contact portion, the terminal, and the stage. A line segment 1 connecting the vertex of the first convex curved surface 10c and the vertex of the second convex curved surface 14c forms an angle θ1 with the x axis. A line segment 2 extending in the major axis direction of the terminal 102a forms an angle θ2 with the y axis. Line segment 1 and line segment 2 are orthogonal.

  Therefore, the first contact portion 10 and the second contact portion 14 are in contact with part of the front and back of the terminal 102a. As a result, the voltage / current application point and the detection point when measuring the electrical characteristics of the semiconductor device are the same, and a highly accurate test is possible.

  By the way, although a terminal is manufactured so that it may extend in a certain specific direction, it may shift in the range of about 0-4 ° from the specific direction due to manufacturing variation. Therefore, in the first embodiment of the present invention, the central value of the variation of the angle of the terminal 102a is grasped in advance, and the first contact portion 10 and the second contact are set so that the line segment 1 is orthogonal to the line segment 2 at the center value. The position of the part 14 was adjusted. Specifically, the distance from the first convex curved surface 10c to the main surface 100a is made shorter than the distance from the second convex curved surface 14c to the main surface 100a.

  When the terminal angle deviates from the variation center value, it is impossible to accurately contact the front and back of a part of the terminal. However, since the first convex curved surface 10c and the second convex curved surface 14c are applied to the terminal, point contact is made. Can be avoided.

  The cross-sectional shapes of the first convex curved surface 10c and the second convex curved surface 14c are not limited to a semicircular shape. The curvature of the convex curved surface may be set as appropriate. In addition, the moving device that moves the first contact portion 10 and the second contact portion 14 includes the first contact portion 10 and the second contact so that the terminal 102a of the semiconductor device is sandwiched between the first convex curved surface 10c and the second convex curved surface 14c. If it moves the part 14, it will not specifically limit. Note that these modifications can also be applied to test apparatuses according to the following embodiments.

Embodiment 2. FIG.
Since the test apparatus according to the second embodiment of the present invention has a lot in common with the first embodiment, the difference from the first embodiment will be mainly described. FIG. 6 is a front view of the first contact portion and the second contact portion according to Embodiment 2 of the present invention.

  The first contact part 200 has a screw hole 200a, a through hole 200b, and a recess 200d. These are formed in the first main body 202A. The first contact portion 200 further includes a first leaf spring 200c that functions as a first convex curved surface, with one end and the other end fixed to the first main body portion 200A. The first leaf spring 200c is fixed to the first main body 200A by, for example, screwing.

  The second contact portion 202 has a screw hole 202a, a through hole 202b, and a recess 202d. These are formed in the second main body 202A. The second contact portion 202 further includes a second leaf spring 202c that functions as a second convex curved surface, with one end and the other end fixed to the second main body portion 202A. The second leaf spring 202c is fixed to the second main body 202A by, for example, screwing.

  According to the first contact portion 200 and the second contact portion 202 according to the second embodiment of the present invention, the contact pressure is uniform without being affected by the terminal angle due to the expansion and contraction of the first leaf spring 200c and the second leaf spring 202c. Can be realized. Further, when the first leaf spring 200c and the second leaf spring 202c are bent when being brought into contact with the terminal, the contact area between the terminal and the contact portion can be increased.

  The connection between the first main body 200A and the first leaf spring 200c is particularly a screw if the first main body 200A and the first leaf spring 200c are electrically connected and the first leaf spring 200c is bent against the terminal. It is not limited to stopping. The connection between the second main body 202A and the second leaf spring 202c is the same. The material of the first leaf spring 200c and the second leaf spring 202c is preferably a metal, but is not particularly limited as long as it is a conductive material.

Embodiment 3 FIG.
Since the test apparatus according to the third embodiment of the present invention has a lot in common with the first embodiment, differences from the first embodiment will be mainly described. FIG. 7 is a perspective view of main surfaces of the first contact portion, the second contact portion, and the stage according to Embodiment 3 of the present invention.

  The first contact part 300 has a screw hole 300a, a through hole 300b, and a recess. These are formed in the first main body 300A. A first shaft 300e parallel to the main surface 100a of the stage is attached to the first main body 300A. The first shaft 300e is inserted into the first through hole 300c ′ of the first roller 300c. The first through hole 300c ′ is a hole that penetrates between the upper surface and the lower surface of the first roller 300c formed in a columnar shape. Thus, the first roller 300c can rotate around the first shaft 300e while being in contact with the first shaft 300e. The first contact part 300 including the first shaft 300e and the first roller 300c is formed of a conductive material.

  The second contact portion 302 has a screw hole 302a, a through hole 302b, and a recess 302d. These are formed in the second main body 302A. A second shaft 302e parallel to the main surface 100a of the stage is attached to the second main body 302A. The second shaft 302e is inserted into the second through hole 302c ′ of the second roller 302c. The second through hole 302c ′ is a hole that penetrates between the upper surface and the lower surface of the second roller 302c formed in a columnar shape. Thus, the second roller 302 can rotate around the second shaft 302e while being in contact with the second shaft 302e. The second contact portion 302 including the second shaft 302e and the second roller 302c is made of a conductive material.

  When testing the electrical characteristics of the semiconductor device, the curved surface of the first roller 300c and the curved surface of the second roller 302c are applied to the terminals. FIG. 8 is a front view showing that the terminal is sandwiched between the first roller and the second roller. The curved surface of the first roller 300c corresponds to the first convex curved surface, and the curved surface of the second roller 302c corresponds to the second convex curved surface. If the relative position between the first contact portion 300 and the terminal 102a changes when the first roller 300c and the terminal 102a are in contact, the first roller 300c rotates to avoid damage to the terminal 102a. The second roller 302c has the same function.

  FIG. 9 is a perspective view showing replacement of the first roller. When the first roller 300c is consumed, the first roller 300c is removed from the first shaft 300e, and a new first roller is inserted into the first shaft 300e. Therefore, the part replacement cost can be reduced as compared with the case where the entire first contact unit 300 is replaced. The same applies to the second roller 302c.

  The shape of the first roller 300c and the attachment method of the first roller 300c are not particularly limited. That is, the first roller 300c is not particularly limited as long as it is attached to the first main body 300A so as to be rotatable and forms a first convex curved surface. Similarly, the second roller 302c is not particularly limited as long as it is attached to the second main body 302A so as to be rotatable and forms a second convex curved surface. Note that the features of the embodiments described so far may be combined as appropriate.

  10 first contact portion, 10a, 14a screw hole, 10b, 14b first through hole, 10c first convex curved surface, 14c second convex curved surface, 10d, 14d concave portion, 12, 16, 70 shaft, 20, 26 movable block, 20a, 26a Recess, 22 First spring, 24, 40 Slide roller, 28 Second spring, 32, 52 Stretch member, 34a, 54a Slope, 36, 56 Contact block, 100 Stage, 100a Main surface, 102 Semiconductor device, 102a Terminal 102b first surface 102c second surface 104 control unit 200 first contact unit 200A first body unit 200c first leaf spring 202 second contact unit 202A second body unit 202c second plate Spring, 300 1st contact part, 300c 1st roller, 302 2nd contact part, 302c 2nd roller

Claims (7)

A first contact portion having a first convex curved surface and formed of a conductive material;
A second contact portion having a second convex curved surface provided so as to face the first convex curved surface and formed of a conductive material;
A test apparatus comprising: a moving instrument configured to move the first contact portion and the second contact portion so as to sandwich a terminal of the semiconductor device between the first convex curved surface and the second convex curved surface.   The test apparatus according to claim 1, wherein the first convex curved surface and the second convex curved surface have a semicircular cross section. The first contact portion includes a first body portion, and a first leaf spring that functions as the first convex curved surface, one end and the other end being fixed to the first body portion,
The second contact portion includes a second main body portion, and a second leaf spring that functions as the second convex curved surface, one end and the other end being fixed to the second main body portion. The test apparatus according to 1. The first contact portion includes a first main body portion and a first roller that is attached to the first main body portion so as to be rotatable and forms the first convex curved surface,
The said 2nd contact part has a 2nd main body part and the 2nd roller attached to the said 2nd main body part so that it can rotate and forms the said 2nd convex curve. The test apparatus described in 1. A stage having a main surface on which a semiconductor device having terminals is placed;
The first contact portion includes a first axis parallel to the main surface,
The second contact portion includes a second axis parallel to the main surface;
The first roller has a first through-hole penetrating between an upper surface and a lower surface, the first shaft is inserted into the first through-hole, and the first roller is centered on the first shaft while being in contact with the first shaft. It can be rotated,
The second roller has a second through-hole penetrating between an upper surface and a lower surface, the second shaft is inserted into the second through-hole, and the second roller is centered on the second shaft while being in contact with the second shaft. The test apparatus according to claim 4, wherein the test apparatus is rotatable. A stage having a main surface on which a semiconductor device having terminals is placed;
5. The test apparatus according to claim 1, wherein a distance from the first convex curved surface to the main surface is different from a distance from the second convex curved surface to the main surface. 6. A first spring arranged to expand and contract in the direction of the second convex curved surface between the back side of the portion where the first convex curved surface of the first contact portion is formed and the moving device;
A second spring disposed so as to expand and contract in the direction of the first convex curved surface between the back side of the portion of the second contact portion where the second convex curved surface is formed and the moving device; The test apparatus according to claim 1, wherein:

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