JP2014107577A - Resonator device and signal processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance heat dissipation from a dielectric coaxial resonator and a coupling member with a simple configuration.SOLUTION: A signal processor 11 includes a resonator device 1 and a housing 13. The resonator device 1 includes a PCB board 5, a dielectric coaxial resonator 2A, a coupling member 4, and a connection terminal 3A. The coupling member 4 constitutes an impedance element electrically connected to the dielectric coaxial resonator 2A. The connection terminal 3A is inserted into a through hole of the dielectric coaxial resonator 2A, and a first end 31 of the connection terminal 3A projects to the front side of the dielectric coaxial resonator 2A and is joined to the coupling member 4, and a second end 32 of the connection terminal 3A projects to the rear side of the dielectric coaxial resonator 2A. The housing 13 is in contact with the second end 32 of the connection terminal 3A. The connection terminal 3A has higher thermal conductivity than the PCB board 5.

Description

  The present invention relates to a resonator device in which a dielectric coaxial resonator is provided on a substrate to constitute a filter circuit, an oscillation circuit, and the like, and a signal processing device in which the resonator device is housed in a casing.

  Conventionally, a resonator device having a module structure in which a dielectric coaxial resonator is provided on a substrate to constitute a filter circuit, an oscillation circuit, or the like has been used (see, for example, Patent Documents 1 to 3). When the resonator device is used in a signal processing device such as a base station of a wireless communication system, high power of several watts to several tens of watts may be applied. When a large amount of power is applied to the resonator device, a large amount of heat is generated in the dielectric coaxial resonator, electrode and solder deterioration around the dielectric coaxial resonator, dielectric block damage, dielectric coaxial resonator In some cases, the Q value may decrease.

  Therefore, Patent Document 1 describes a configuration in which the through hole of the dielectric coaxial resonator is filled with an inner conductor to improve the heat dissipation of the dielectric coaxial resonator. Further, Patent Document 2 describes a configuration in which a water cooling tube is provided in a through hole of a dielectric coaxial resonator to improve heat dissipation of the dielectric coaxial resonator. Further, Patent Document 3 describes a configuration in which a cover provided with heat radiation fins is attached to a dielectric coaxial resonator to improve the heat dissipation of the dielectric coaxial resonator.

JP 05-90811 A Japanese Utility Model Publication No. 06-62608 Japanese Utility Model Publication No. 2008-2111309

  In the configuration of Patent Document 1, even if the heat dissipation of the dielectric coaxial resonator itself can be improved, if the thermal conductivity of the substrate on which the dielectric coaxial resonator is mounted is low, sufficient heat dissipation cannot be performed and heat is generated. The accompanying problem could not be avoided. In particular, when a dielectric coaxial resonator is mounted on a PCB substrate having low thermal conductivity, heat transfer through the PCB substrate is very small, and it is difficult to dissipate heat from the dielectric coaxial resonator.

  In the configuration of Patent Document 2, additional parts for water cooling are required, and it is difficult to reduce costs, reduce size, and facilitate mounting.

  In the configuration of Patent Document 3, if the ventilation around the dielectric coaxial resonator is not sufficient, the ambient temperature of the dielectric coaxial resonator becomes high, so that high heat dissipation by the heat radiating fins can be maintained. was difficult. In addition, the manufacturing cost, size, and weight of the resonator device are increased by the amount of the cover provided with the heat dissipating fins. In addition, depending on the bonding state between the cover and the dielectric coaxial resonator, the dielectric There has been a problem that the high-frequency characteristics (for example, attenuation characteristics) of the coaxial resonators fluctuate.

  In a resonator device, in order to realize coupling between dielectric coaxial resonators and coupling between the dielectric coaxial resonator and an input / output terminal, a coupling element (coupling member such as a capacitor or an inductor) is mounted on a mounting substrate. ) May be implemented. In this case, when a power of several watts to several tens of watts is applied to the resonator device, heat generation increases not only in the dielectric coaxial resonator but also in the coupling element. Therefore, even if the heat dissipation of the dielectric coaxial resonator can be improved with the configurations as in References 1 to 3, the heat dissipation of the coupling element cannot be improved, and the electrodes and solder around the coupling element cannot be improved. Deterioration, damage to the coupling element, etc. may occur.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a resonator device and a signal processing device that can improve heat dissipation from a dielectric coaxial resonator and a coupling element (coupling member) with a simple configuration and have improved reliability. It is in.

  The signal processing device according to the present invention houses a frequency circuit in a housing, and includes a substrate, a dielectric coaxial resonator, a coupling member, a connection terminal, and a housing. The resonator device according to the present invention includes a substrate, a dielectric coaxial resonator, a coupling member, and a connection terminal. Or the resonator apparatus of this invention is equipped with the board | substrate, the dielectric coaxial resonator, the coupling member, the connection terminal, and the housing | casing. A dielectric coaxial resonator is a component of a frequency circuit in a signal processing device, and is provided with an outer conductor on the outer surface except the front surface of the dielectric block, and with an inner conductor in a through hole of the dielectric block. The coupling member constitutes an impedance element connected to the inner conductor of the dielectric coaxial resonator. The substrate has a dielectric coaxial resonator and a coupling member mounted on the top surface. The connection terminal is inserted into the through hole of the dielectric block, the first end projects to the front side of the dielectric block and contacts the coupling member, and the second end projects to the rear side of the dielectric block. It is in contact with the body and has higher thermal conductivity than the substrate.

  With the above configuration, heat transfer from the dielectric coaxial resonator and the coupling member to the housing occurs via the connection terminal in contact with the housing, and the heat dissipation of the dielectric coaxial resonator and the coupling member can be improved. The second end of the connection terminal that comes into contact with the housing protrudes from the back surface of the dielectric block on which the outer conductor is provided. Therefore, even if the connection terminal is brought into contact with the housing, the characteristics of the dielectric coaxial resonator deteriorate. Hardly occurs.

  The above-mentioned connection terminal is preferably configured in a rod shape. Thereby, the heat conductivity from the 1st end of a connection terminal to a 2nd end improves, and heat dissipation can be improved more.

  The signal processing device and the resonator device described above include a buffer material having fluidity and higher thermal conductivity than the substrate of the resonator device, and the second end of the connection terminal is covered with the buffer material. Is preferred. As a result, even if there is variation in the mounting position of the resonator device or the connection terminal, or even if the flatness on the contact surface is low, the connection terminal and the housing are reliably in contact with each other via the cushioning material. Heat transfer efficiency between the housing and the housing.

  The second end of the connection terminal described above may go straight to the back side of the dielectric block, bend to the bottom side of the dielectric block, or bend to the top side of the dielectric block. The casing exterior plate located on the back side or top side of the dielectric block has a longer heat transfer path from the resonator device, and therefore has a lower temperature than the casing exterior plate located on the bottom side of the dielectric block. It is easy to become. Therefore, the heat dissipation can be further enhanced by configuring the outer terminals so that the second ends of the connection terminals are in contact with them. On the other hand, if the connection terminal is configured to come into contact with the exterior plate of the housing located on the bottom side of the dielectric block, the arrangement restrictions within the housing of the resonator device are relaxed, and the degree of freedom in design is improved.

The signal processing device and the resonator device described above include a plurality of dielectric coaxial resonators and a plurality of connection terminals attached to each of the dielectric coaxial resonators, and at least one of the plurality of connection terminals. Except for this, it is preferable that the second end of the connection terminal protrudes toward the back side of the dielectric block and is in contact with the housing.
For example, heat is easily trapped in the dielectric coaxial resonator disposed in the middle, and effective heat dissipation is achieved by projecting the connection terminal attached to the dielectric coaxial resonator to the back side for heat transfer. Can be achieved. In addition, depending on the circuit configuration, only a specific impedance element composed of the coupling member may become high temperature, so the connection terminal connected to the impedance element protrudes to the back side of the dielectric coaxial resonator. Effective heat radiation can also be achieved by conducting heat transfer.

  The dielectric coaxial resonator described above is provided such that a partial region of the bottom surface is exposed from the substrate, and the protrusion protruding from the housing into the internal space is in contact with the bottom surface of the dielectric coaxial resonator exposed from the substrate. Preferably. In this configuration, since the protrusion of the housing is in direct contact with the outer conductor of the dielectric coaxial resonator, direct heat transfer from the dielectric coaxial resonator to the housing occurs via the protrusion. The heat dissipation from the body coaxial resonator can be further enhanced.

  According to the present invention, the connection terminal for electrically connecting the dielectric coaxial resonator and the coupling member protrudes from the through hole of the dielectric coaxial resonator to the back side and comes into contact with the housing. Thus, heat transfer from the dielectric coaxial resonator and the coupling member to the housing occurs, and heat dissipation can be improved. Even in such a case, the second end of the connection terminal to be brought into contact with the housing protrudes from the back surface of the dielectric block provided with the outer conductor, so that the characteristic variation of the dielectric coaxial resonator hardly occurs. . Therefore, the reliability of the resonator device and the signal processing device can be improved with a simple configuration.

It is the disassembled perspective view and top view which show the resonator apparatus which concerns on the 1st Embodiment of this invention. 1 is an equivalent circuit diagram showing a resonator device according to a first embodiment of the present invention. It is sectional drawing which shows the principal part of the signal processing apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the principal part of the top view which shows the resonator apparatus which concerns on the 2nd Embodiment of this invention, and a signal processing apparatus. It is sectional drawing which shows the principal part of the signal processing apparatus which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the principal part of the signal processing apparatus which concerns on the 4th Embodiment of this invention. It is sectional drawing which shows the principal part of the signal processing apparatus which concerns on the 5th Embodiment of this invention. It is a top view which shows the resonator apparatus which concerns on the 6th Embodiment of this invention. It is a figure explaining the emitted-heat amount of the impedance element in a specific circuit structural example. It is sectional drawing which shows the principal part of the top view which shows the resonator apparatus which concerns on the 7th Embodiment of this invention, and a signal processing apparatus. It is sectional drawing which shows the principal part of the signal processing apparatus which concerns on the 8th Embodiment of this invention. It is sectional drawing which shows the principal part of the top view and signal processing apparatus which show the resonator apparatus which concerns on the 9th Embodiment of this invention.

  Hereinafter, the signal processing device according to the present invention is a base station or a relay station used in a mobile communication system, and the resonator device according to the present invention is a resonator device used in a frequency circuit of a base station or a relay station. An example will be described. Note that the signal processing device according to the present invention may be a signal processing device that is used other than a base station or a relay station, a mobile communication terminal, or a mobile communication system.

<< First Embodiment >>
FIG. 1A is an exploded perspective view showing the resonator device according to the first embodiment. FIG. 1B is a plan view showing the resonator device according to the first embodiment.
The resonator device 1 according to the first embodiment includes a plurality of dielectric coaxial resonators 2A, 2B, 2C, connection terminals 3A, 3B, 3C, a coupling member 4, and a PCB substrate 5.

Each of the dielectric coaxial resonators 2 </ b> A to 2 </ b> C includes a dielectric block 21, an outer conductor 22, and an inner conductor 23. The dielectric block 21 is made of a dielectric material and is a hexahedron having a front surface, a back surface, a top surface, a bottom surface, a right side surface, and a left side surface, and is provided with through-holes 24 that open to the front surface and the back surface. More specifically, the dielectric block 21 is made of LTCC (low temperature co-sintered ceramics), has a square shape on the front and the back, and has a long side between the front and the back. Outer conductor 22 is provided on the entire outer surface of dielectric block 21 on each of the five surfaces except the front surface. The inner conductor 23 is provided on the inner surface of the through hole 24. The dielectric coaxial resonators 2A to 2C are arranged so that the dielectric coaxial resonator 2C is sandwiched between the dielectric coaxial resonator 2A and the dielectric coaxial resonator 2B.
Here, the outer conductor 22 is not provided on the front surface of the dielectric block 21 but the outer conductor 22 is provided on the rear surface, and the inner conductor 23 is short-circuited with respect to the outer conductor 22 and is open at one end. Accordingly, the dielectric coaxial resonators 2A to 2C are configured as quarter wavelength resonators.

  The connection terminal 3A is attached to the dielectric coaxial resonator 2A. The connection terminal 3B is attached to the dielectric coaxial resonator 2B. The connection terminal 3C is attached to the dielectric coaxial resonator 2C. The connection terminals 3 </ b> A to 3 </ b> C are made of a material such as copper or aluminum, and each has a circular cross-sectional shape. The connection terminals 3 </ b> A to 3 </ b> C are inserted into the through holes 24 of the dielectric block 21 and are provided inside the through holes 24. Soldered to the conductor 23. The connection terminals 3 </ b> A to 3 </ b> C have a first end 31 and a second end 32, the first end 31 protrudes from the through hole 24 to the front side of the dielectric block 21, and the second end 32 extends through the connection terminal 3 </ b> A to 3 </ b> C. Projecting from the hole 24 to the back side of the dielectric block 21.

The coupling member 4 includes a dielectric plate 41, top surface electrodes 42A, 42B, and 42C, and bottom surface electrodes 43A and 43B. The dielectric plate 41 is made of LTCC, glass epoxy, or the like, and is a flat plate whose top surface and bottom surface are rectangular. The top surface electrodes 42A to 42C are arranged in the longitudinal direction on the top surface of the dielectric plate 41, and the top surface electrode 42C is sandwiched between the top surface electrode 42A and the top surface electrode 42B. In the top electrode 42A, the connection terminal 3A is attached by using a joining method such as soldering. In the top electrode 42B, the connection terminal 3B is attached by using a joining method such as soldering. In the top electrode 42C, the connection terminal 3C is attached by using a joining method such as soldering.
The bottom electrodes 43A and 43B are provided on the bottom surface of the dielectric plate 41. The bottom electrode 43 </ b> A and the top electrode 42 </ b> A are provided so that their partial regions face each other with the dielectric plate 41 interposed therebetween. Further, the bottom electrode 43B and the top electrode 42B are provided so that their partial regions face each other with the dielectric plate 41 therebetween. For this reason, the bottom electrodes 43A and 43B and the top electrodes 42A and 42B are capacitively coupled.

  The PCB substrate 5 includes a plate portion 51, connection electrodes 52 </ b> A and 52 </ b> B, and a ground electrode 53. The plate portion 51 is a substantially square flat plate made of glass epoxy or the like. The connection electrode 52A is provided from the top surface of the plate portion 51 to the bottom surface via the left side surface. The connection electrode 52B is provided from the upper surface of the plate portion 51 to the lower surface via the right side surface. The ground electrode 53 is provided from the top surface of the plate portion 51 to the bottom surface via the back surface.

  The coupling member 4 is attached to the top surface side of the connection electrodes 52A and 52B. The connection electrode 52A is joined to the bottom electrode 43A of the coupling member 4 using a joining method such as soldering. The connection electrode 52B is joined to the bottom electrode 43B of the coupling member 4 by using a joining method such as soldering. Dielectric coaxial resonators 2A to 2C are attached to the top surface side of ground electrode 53, and outer conductors 22 of dielectric coaxial resonators 2A to 2C are bonded using a bonding method such as soldering. . Although not shown, the ground electrode 53 is provided on the bottom surface side of the plate portion 51 so as to face the coupling member 4 and the dielectric coaxial resonators 2A to 2C.

  The dielectric coaxial resonators 2 </ b> A to 2 </ b> C are arranged so that the back end portions protrude from the PCB substrate 5 in the back direction. That is, when the resonator device 1 is viewed from the bottom surface side, the end portions on the back surface side of the dielectric coaxial resonators 2 </ b> A to 2 </ b> C are exposed from the PCB substrate 5.

  FIG. 2 is an equivalent circuit diagram of the resonator device 1.

  The dielectric coaxial resonator 2A constitutes a quarter-wave resonator at the input / output stage, and the open end is coupled to the external connection terminal formed by the connection electrode 52A via the capacitance Ce. The dielectric coaxial resonator 2B also constitutes a quarter wavelength resonator at the input / output stage, and the open end is coupled to the external connection terminal formed by the connection electrode 52B via the capacitance Ce. Yes. The electrostatic capacitance Ce is configured by the top surface electrodes 42 </ b> A and 42 </ b> B and the bottom surface electrodes 43 </ b> A and 43 </ b> B facing each other through the dielectric plate 41 in the coupling member 4.

  The open ends of the 1/4 wavelength resonator of the input / output stage formed by the dielectric coaxial resonators 2A and 2B and the 1/4 wavelength resonator of the intermediate stage formed by the dielectric coaxial resonator 2C are electrostatic at the open ends. It couple | bonds via the capacity | capacitance Ck. The capacitance Ck is configured by the top surface electrodes 42 </ b> A and 42 </ b> B and the top surface electrode 42 </ b> C adjacent to each other in the coupling member 4.

  The open ends of the quarter-wave resonators formed by the dielectric coaxial resonators 2A to 2C are grounded via a capacitance Cs. The capacitance Cs is configured by the top surface electrodes 42A to 42C facing the ground electrode 53 formed on the bottom surface of the PCB substrate 5 through the dielectric plate 41 and the PCB substrate 5 in the coupling member 4. Has been.

  As described above, the coupling member 4 constitutes the capacitances Ce, Ck, and Cs as impedance elements that are electrically connected to the dielectric coaxial resonators 2A to 2C. The resonator device 1 includes a three-stage quarter-wave resonator that is capacitively coupled to each other and an external connection terminal that is capacitively coupled to the resonator of the input / output stage, and includes a band-pass filter circuit (BPF circuit). ). The resonator device 1 may have another circuit configuration as long as the resonator device 1 includes a dielectric coaxial resonator. For example, resonators having different numbers of stages may be provided. Further, a band rejection filter (BEF), a high-pass filter (HPF), a low-pass filter (LPF), an oscillation circuit, or the like may be used.

  FIG. 3 is a cross-sectional view showing the main configuration of the signal processing apparatus according to the first embodiment.

  The signal processing device 11 includes the resonator device 1 described above, a mounting substrate 12, and a housing 13. The mounting board 12 has a flat plate shape, and a communication circuit is configured by mounting a plurality of elements and modules including the resonator device 1 on the top surface. The housing 13 is a box-shaped aluminum housing having an internal space (not shown in its entirety), and various modules such as a mounting substrate 12 on which the resonator device 1 is mounted and a power supply module (not shown). Is housed inside. The housing 13 is preferably made of a material having a higher thermal conductivity than the PCB substrate 5 of the resonator device 1.

  The housing 13 includes a bottom side exterior plate 14, a protrusion 15, and a back side exterior plate 16. The bottom surface side exterior plate 14 has a flat plate shape, is located on the bottom surface side of the resonator device 1, and constitutes one surface of the housing 13. The rear side exterior plate 16 has a flat plate shape, is located on the back side of the resonator device 1, and constitutes one surface of the housing 13. The bottom surface side exterior plate 14 and the back surface side exterior plate 16 face the internal space and the external space of the housing 13, respectively. The protrusion 15 protrudes from the bottom surface side exterior plate 14 into the internal space of the housing 13.

The resonator device 1 is mounted on the mounting substrate 12 in a state where the resonator device 1 is disposed at the top end of the mounting substrate 12. The side surface on the back surface side of the PCB substrate 5 overlapping the dielectric coaxial resonators 2A to 2C and the side surface on the back surface side of the mounting substrate 12 are aligned so as to be flush with each other. Therefore, the dielectric coaxial resonators 2 </ b> A to 2 </ b> C are exposed from the mounting substrate 12 when the mounting substrate 12 on which the resonator device 1 is mounted is viewed from the bottom surface side.
The mounting substrate 12 is attached to the bottom surface side exterior plate 14 of the housing 13 using bolts and nuts (not shown). In this state, the second ends 32 of the connection terminals 3 </ b> A to 3 </ b> C of the resonator device 1 are configured to be in contact with the backside exterior plate 16. That is, the second ends 32 of the connection terminals 3 </ b> A to 3 </ b> C come from the dielectric coaxial resonators 2 </ b> A to 2 </ b> C so as to contact the back side exterior plate 16 with the mounting substrate 12 attached to the bottom side exterior plate 14. Projection length is set. Therefore, the dielectric coaxial resonators 2A to 2C and the coupling member 4 are encased by heat transfer via the connection terminals 3A to 3C made of copper, aluminum or the like having a higher thermal conductivity than the PCB substrate 5. Heat dissipation to the body 13 is performed.

  Further, the protruding portion 15 is provided so that the protruding portion 15 contacts the bottom surface of the dielectric coaxial resonators 2A to 2C in the resonator device 1 in a state where the mounting substrate 12 is attached to the bottom surface side exterior plate 14. ing. That is, the position and height of the protrusion 15 are set so that the protrusion 15 contacts the bottom surface of the dielectric coaxial resonators 2 </ b> A to 2 </ b> C with the mounting substrate 12 attached to the bottom surface side exterior plate 14. Therefore, heat is transferred from the dielectric coaxial resonators 2A to 2C to the housing 13 by heat transfer through the protrusions 15 made of aluminum or the like having a higher thermal conductivity than the PCB substrate 5. .

  The signal processing device 11 having such a configuration has the connection terminals 3A to 3C and the protrusions 15 having good thermal conductivity even when high power of several W (watts) to several tens W is applied to the resonator device 1. The heat is transferred from the coupling member 4 and the dielectric coaxial resonators 2A to 2C to the housing 13 by heat transfer via. Since the housing 13 has a large heat capacity and surface area and is in contact with the outside air, the heat dissipation is extremely high, and the coupling member 4 and the dielectric coaxial resonators 2 </ b> A to 2 </ b> C are not easily heated. Therefore, according to the signal processing device 11 having such a configuration, it is difficult for the dielectric coaxial resonators 2A to 2C to be damaged due to heat, the Q value to be lowered, and the coupling member 4 to be damaged due to heat. The reliability and performance stability of the device 11 and the resonator device 1 are improved.

  Further, here, the connection terminals 3A to 3C and the protrusion 15 are made of a conductive material, and the connection terminals 3A to 3C and the protrusion 15 are directly connected to the outer conductor 22 of the dielectric coaxial resonators 2A to 2C. Therefore, when the housing 13 functions as the ground of the signal processing device 11, the outer conductor 22 is grounded via the connection terminals 3 </ b> A to 3 </ b> C and the protrusion 15. Thereby, the earthing property of the outer conductor 22 in the dielectric coaxial resonators 2A to 2C is improved, and improvement in characteristics such as an increase in attenuation can be realized. However, from the viewpoint of improving the heat dissipation of the dielectric coaxial resonators 2A to 2C, conduction through the connection terminals 3A to 3C and the protrusions 15 is not necessarily required, so the connection terminals 3A to 3C and the outer conductor 22 A non-conductive film or the like may be formed on the contact surface of the protrusion 15 or the contact surface of the protrusion 15 and the outer conductor 22.

  The resonator device 1 and the signal processing device 11 are not limited to the specific configuration described above, and may have another specific configuration within the scope of the configuration described in the claims. For example, a case surrounding only the resonator device 1 is provided, and an opening for exposing the bottom surfaces of the dielectric coaxial resonators 2A to 2C and an opening for allowing the connection terminals 3A to 3C to pass through are provided in the case. Also good. Moreover, you may comprise so that the 2nd end of connecting terminal 3A-3C may contact the case surrounding only the resonator apparatus 1, and it contacts the bottom face of the dielectric coaxial resonators 2A-2C to the case. You may comprise so that the projection part to perform may be provided.

<< Second Embodiment >>
FIG. 4A is a plan view showing a resonator device according to the second embodiment. FIG. 4B is a cross-sectional view showing the main configuration of the signal processing apparatus according to the second embodiment.

  A resonator device 61 according to the second embodiment includes dielectric coaxial resonators 2A, 2B, and 2C, connection terminals 3A, 3B, and 3C, a coupling member 4, and a PCB substrate 62. The PCB substrate 62 includes a plate portion 63, connection electrodes 52 </ b> A and 52 </ b> B, and a ground electrode 53. A signal processing device 64 according to the second embodiment includes a resonator device 61, a mounting substrate 12, and a housing 65. The dielectric coaxial resonators 2A, 2B, and 2C, the connection terminals 3A, 3B, and 3C, the coupling member 4, the connection electrodes 52A and 52B, the ground electrode 53, and the mounting substrate 12 are the same as those in the first embodiment. The configuration is the same as that shown.

  The casing 65 includes the bottom side exterior plate 14 and the back side exterior plate 16 similar to the configuration shown in the first embodiment, but omits the configuration of the protrusions. Further, the plate portion 63 is configured by extending the dimensions to the back side from the first embodiment so that the dielectric coaxial resonators 2A to 2C are not exposed to the bottom side. With respect to the plate portion 63, the dielectric coaxial resonators 2A to 2C are arranged so as to entirely overlap the plate portion 63 from the front end portion to the back end portion.

  In the signal processing device 64 of the present embodiment, direct heat transfer from the resonator device 61 to the housing 65 is realized only by the connection terminals 3A to 3C. As described above, the signal processing device and the resonator device according to the present invention may be configured without the protrusions.

<< Third Embodiment >>
FIG. 5 is a cross-sectional view showing a main configuration of a signal processing apparatus according to the third embodiment.

  The signal processing device 71 according to the third embodiment includes a buffer material 72 in addition to the resonator device 61 and the housing 65 described in the second embodiment. The cushioning material 72 is disposed on the contact surface between the second end 32 of the connection terminals 3A to 3C and the backside exterior plate 16 to reliably contact the connection terminals 3A to 3C and the backside exterior plate 16. is there. As the buffer material 72, for example, it is desirable to use a material such as silicon grease that has better thermal conductivity and higher fluidity than the PCB substrate 62. By providing such a buffer material 72, in the signal processing device 71, the heat transfer efficiency from the coupling member 4 and the dielectric coaxial resonators 2A to 2C to the housing 65 can be further increased.

  The buffer material 72 may be provided in addition to the configuration shown in the first embodiment, in addition to the configuration shown in the second embodiment. Regardless of the configuration, providing the cushioning material on the contact surface between the connection terminal and the housing makes it possible to achieve more reliable contact and improve heat transfer efficiency.

  Further, the buffer material 72 may or may not have conductivity. However, if the buffer material 72 has conductivity, the grounding performance of the dielectric coaxial resonator can be improved. Can be planned.

<< Fourth Embodiment >>
FIG. 6 is a cross-sectional view showing a main configuration of a signal processing apparatus according to the fourth embodiment.

  A signal processing device 81 according to the fourth embodiment includes a resonator device 82, a mounting substrate 12, and a housing 65. The resonator device 82 includes dielectric coaxial resonators 2A, 2B, 2C, connection terminals 83A to 83C, a coupling member 4, and a PCB substrate 62. The mounting substrate 12, the housing 65, the dielectric coaxial resonators 2A, 2B, and 2C, the coupling member 4, and the PCB substrate 62 have the same configuration as that shown in the second embodiment.

  The connection terminals 83A to 83C have a first end 84 and a second end 85. The first end 84 projects to the front side of the dielectric coaxial resonators 2A to 2C, and the second end 85 is a dielectric. The body coaxial resonators 2 </ b> A to 2 </ b> C protrude toward the back side and are bent toward the bottom side. The resonator device 82 is mounted on the mounting board 12 so that the second ends 85 of the connection terminals 83 </ b> A to 83 </ b> C are in contact with the bottom side exterior board 14, and the mounting board 12 is attached to the bottom side exterior board 14 of the housing 65. It is attached. Therefore, heat is transmitted from the dielectric coaxial resonators 2A to 2C and the coupling member 4 to the housing 65 by heat transfer via the connection terminals 83A to 83C.

  In addition, since the resonator apparatus 82 is attached, the bottom surface side exterior plate 14 with which the connection terminals 83A to 83C are in contact is likely to be hotter than the back surface side exterior plate 16, and from the viewpoint of heat dissipation, the first As in the third embodiment, it is preferable to bring the connection terminal into contact with the backside exterior plate 16. However, when the connection terminal is brought into contact with the backside exterior plate 16, the resonator device needs to be brought close to the backside exterior plate 16, but the connection terminal is connected to the bottom side exterior plate 14 as in the present embodiment. In the case of contact, since there is no such arrangement restriction, a high degree of design freedom can be realized.

<< Fifth Embodiment >>
FIG. 7 is a cross-sectional view showing a main configuration of a signal processing apparatus according to the fifth embodiment.

  A signal processing device 91 according to the fifth embodiment includes a resonator device 92, a mounting substrate 12, and a housing 96. The resonator device 92 includes dielectric coaxial resonators 2A, 2B, and 2C, connection terminals 93A, 93B, and 93C, a coupling member 4, and a PCB substrate 62. The housing 96 includes a bottom surface side exterior plate 14 and a top surface side exterior plate 97. The mounting substrate 12, the dielectric coaxial resonators 2A, 2B, and 2C, the coupling member 4, the PCB substrate 62, and the bottom surface side exterior plate 14 are the same as those shown in the second embodiment. .

  The connection terminals 93A to 93C have a first end 94 and a second end 95. The first end 94 projects to the front side of the dielectric coaxial resonators 2A to 2C, and the second end 95 is a dielectric. Projecting to the back side of the body coaxial resonators 2A to 2C, it is bent to the top surface side. The resonator device 92 is mounted on the top surface of the mounting substrate 12 so that the second ends 95 of the connection terminals 93 </ b> A to 93 </ b> C are in contact with the top surface side exterior plate 97. It is attached to the exterior plate 14. Therefore, heat is transmitted from the dielectric coaxial resonators 2A to 2C and the coupling member 4 to the housing 96 by heat transfer via the connection terminals 93A to 93C.

  In addition, the top surface side exterior plate 97 with which the connection terminals 93A to 93C are in contact does not easily reach a high temperature due to a long heat conduction path from the resonator device 82, and from the viewpoint of heat dissipation, the first to fourth. As in this embodiment, the present embodiment is preferable to bringing the connection terminal into contact with the backside exterior plate 16 and the bottom side exterior plate 14.

<< Sixth Embodiment >>
FIG. 8 is a plan view showing a resonator device according to the sixth embodiment.

  A resonator device 101 according to the sixth embodiment includes dielectric coaxial resonators 2A, 2B, and 2C, connection terminals 103A, 103B, and 3C, a coupling member 4, and a PCB substrate 62. Similarly to the connection terminal 3C, the connection terminals 103A and 103B have first ends protruding on the front side of the dielectric coaxial resonators 2A and 2B, but unlike the connection terminals 3C, the dielectric coaxial resonators 2A and 2B. The second end does not protrude from the back side. That is, the connection terminals 103A and 103B have the same configuration as the conventional one, and only the connection terminal 3C has a structure used for the heat transfer application of the present invention.

  When the calorific value of each of the dielectric coaxial resonators 2A, 2B, 2C is equal, the dielectric coaxial resonator located in the middle compared to the heat radiation amount from the dielectric coaxial resonators 2A, 2B located outside to the surrounding atmosphere The amount of heat radiated from 2C to the surrounding atmosphere is small, and the dielectric coaxial resonator 2C is likely to accumulate heat. Therefore, in the present embodiment, the connection terminal 3C having the structure of the present invention is attached only to the dielectric coaxial resonator 2C located in the middle to improve the heat dissipation from the dielectric coaxial resonator 2C where heat is likely to be trapped. ing.

  Note that, depending on the circuit configuration of the resonator device, the amount of heat generated in the impedance element connected to each dielectric coaxial resonator varies. That is, the amount of heat generated varies depending on the portion of the coupling member 4. Therefore, only the connection terminal connected to the impedance element having a large calorific value may have the structure of the present invention.

  FIG. 9 is a diagram illustrating a relationship between a circuit configuration example of the resonator device and a heat generation amount for each impedance element. In the circuit configuration shown in FIG. 9A, five dielectric coaxial resonators 109A to 109E and seven capacitances C1 to C7 are provided. In this circuit configuration, as shown in FIG. 9B, the calorific values in the capacitances C1 to C7 are different from each other, and the calorific value in the capacitance C7 may be the largest. In such a case, the connection terminal attached to the through hole of the dielectric coaxial resonator 109E connected to the capacitance C7 is connected to the structure of the present invention, that is, the second end on the back side of the dielectric coaxial resonator 109E. By adopting a structure that protrudes and contacts the housing, it is possible to realize effective heat dissipation from the coupling member.

<< Seventh Embodiment >>
FIG. 10A is a plan view showing a resonator device according to the seventh embodiment. FIG. 10B is a cross-sectional view showing the main configuration of the signal processing apparatus according to the seventh embodiment.

  A resonator device 111 according to the seventh embodiment includes dielectric coaxial resonators 2A, 2B, and 2C, connection terminals 3A, 3B, and 3C, a coupling member 4, and a PCB substrate 112. The signal processing device 115 includes a resonator device 111, a mounting substrate 116, and a housing 13. The dielectric coaxial resonators 2A, 2B, and 2C, the connection terminals 3A, 3B, and 3C, the coupling member 4, and the housing 13 have the same configurations as those shown in the first embodiment.

  The PCB substrate 112 includes a hole-shaped opening 114 that opens to the top and bottom surfaces. The opening 114 exposes a partial region of the lower surface of the dielectric coaxial resonators 2 </ b> A to 2 </ b> C from the PCB substrate 112. Similarly to the resonator device 111, the mounting substrate 116 is also formed with a hole-like opening that exposes a partial region of the lower surface of the dielectric coaxial resonators 2 </ b> A to 2 </ b> C from the mounting substrate 116. The housing 13 includes a protrusion 15 that protrudes from the bottom surface side exterior plate 14, and the protrusion 15 is inserted into the opening of the PCB substrate 112 and the mounting substrate 116, and the dielectric coaxial resonators 2 </ b> A to 2 </ b> C. It is in contact with a part of the bottom surface.

  In the resonator device 111 having such a configuration, the position of the center of gravity between the front surface and the back surface is on the PCB substrate 112. Therefore, as compared with the configuration in which the dielectric coaxial resonator protrudes from the end surface of the rectangular PCB plate to the back side as in the first embodiment, the stability of the PCB substrate 112 when mounting the resonator device 111 is improved. And the workability in the mounting work becomes better. Further, in the resonator device 111, the contact with the ground electrode of the PCB substrate 112 occurs not only at the front side end portions of the dielectric coaxial resonators 2A to 2C but also at the back side end portions, so that the dielectric coaxial resonator 2A The contact area between the outer conductor of ˜2C and the ground electrode can be increased, and the contact resistance is reduced. In addition, variations in the ground potential in the outer conductors of the dielectric coaxial resonators 2A to 2C are reduced, and better grounding performance can be realized.

<< Eighth Embodiment >>
FIG. 11 is a cross-sectional view showing a main configuration of a signal processing device according to the eighth embodiment.

  A signal processing device 121 according to the eighth embodiment includes a buffer material 122 in addition to the resonator device 111 and the housing 13 described in the seventh embodiment. The buffer material 122 is disposed on the contact surface between the dielectric coaxial resonators 2A to 2C and the protruding portion 15, and reliably contacts the dielectric coaxial resonators 2A to 2C and the protruding portion 15. As the buffer material 122, for example, it is desirable to use a material having better thermal conductivity and higher fluidity than the PCB substrate 112, such as silicon grease. By providing such a buffer material 122, in the signal processing device 121, the heat transfer efficiency from the dielectric coaxial resonators 2 </ b> A to 2 </ b> C to the housing 13 can be further increased.

<< Ninth Embodiment >>
FIG. 12A is a plan view showing a resonator device according to the ninth embodiment. FIG. 12B is a cross-sectional view showing the main configuration of the signal processing apparatus according to the ninth embodiment.

  The signal processing device 131 according to the ninth embodiment includes a cover member 132 in addition to the resonator device 111 and the housing 13 shown in the seventh embodiment. The cover material 132 is a cylindrical aluminum member provided so as to bundle the dielectric coaxial resonators 2A to 2C. Further, the cover member 132 is provided between the resonator device 111 and the protrusion 15 of the housing 13 and is in contact with the protrusion 15.

As described above, when the cover member 132 is provided in the resonator device 111, heat radiation from the dielectric coaxial resonators 2A to 2C to the surrounding atmosphere can be increased, and better heat dissipation can be realized. Further, the cover member 132 can reduce variations in ground potential in the outer conductors of the dielectric coaxial resonators 2A to 2C, and has an effect of improving the ground performance.
In addition, since the projection 15 is brought into contact with the cover material 132, the projection height of the projection 15 can be reduced by the thickness of the cover material 132. In other words, when the protrusion height of the protrusion 15 is smaller than the thickness of the mounting substrate, the cover material 132 is provided as a member for adjusting the thickness, so that the dielectric coaxial resonators 2A to 2C It is possible to realize heat dissipation via the protrusion 15.

DESCRIPTION OF SYMBOLS 1,61,82,92,101,111 ... Resonator apparatus 2A, 2B, 2C ... Dielectric coaxial resonator 21 ... Dielectric block 22 ... Outer conductor 23 ... Inner conductor 24 ... Through-hole 3A, 3B, 3C, 83A , 83B, 83C, 93A, 93B, 93C ... connection terminals 31, 84, 94 ... first end 32, 85, 95 ... second end 4 ... coupling member 41 ... dielectric plates 42A, 42B, 42C ... top electrode 43A. , 43B ... Bottom electrodes 5, 62, 112 ... PCB substrates 51, 63 ... Plate portions 52A, 52B ... Connection electrodes 53 ... Ground electrodes 11, 64, 71, 81, 91, 115, 121, 131 ... Signal processing device 12, 116 ... Mounting boards 13, 65, 96 ... Case 14 ... Bottom side exterior plate 15 ... Protrusions 16 ... Back side exterior plates 72, 122 ... Buffer material 97 ... Top side exterior plate 114 ... Opening portion 132 ... Cover material

Claims (17)

A signal processing device containing a frequency circuit in a housing,
A dielectric coaxial resonator that is a component of the frequency circuit, includes an outer conductor on an outer surface excluding the front surface of the dielectric block, and an inner conductor in a through hole of the dielectric block;
A coupling member constituting an impedance element connected to the inner conductor;
A substrate on which the dielectric coaxial resonator and the coupling member are mounted on the top surface;
The housing is inserted into the through hole of the dielectric block, the first end protrudes to the front side of the dielectric block and contacts the coupling member, and the second end protrudes to the back side of the dielectric block. A connection terminal having a higher thermal conductivity than the substrate;
A signal processing apparatus comprising:   The signal processing apparatus according to claim 1, wherein the connection terminal is configured in a bar shape. Comprising a cushioning material having fluidity and higher thermal conductivity than the substrate;
The signal processing device according to claim 1, wherein a second end of the connection terminal is covered with the buffer material.   The signal processing device according to claim 1, wherein a second end of the connection terminal goes straight to the back side of the dielectric block.   The signal processing device according to claim 1, wherein a second end of the connection terminal is bent toward a bottom surface side of the dielectric block.   The signal processing device according to claim 1, wherein a second end of the connection terminal is bent toward a top surface side of the dielectric block. A plurality of the dielectric coaxial resonators, and a plurality of connection terminals attached to each of the dielectric coaxial resonators,
The connection terminal according to claim 1, wherein at least one of the plurality of connection terminals, excluding at least one, has a second end of the connection terminal protruding toward the back side of the dielectric block and in contact with the housing. The signal processing apparatus as described. In the dielectric coaxial resonator, a partial region of the bottom surface is exposed from the substrate,
The protrusion part which protrudes from the said housing | casing to the internal space of the said housing | casing is provided so that the bottom face of the said dielectric coaxial resonator exposed from the said board | substrate may be contact | connected. Signal processing device. A dielectric coaxial resonator in which an outer conductor is provided on an outer surface excluding the front surface of the dielectric block, and an inner conductor is provided in a through hole of the dielectric block;
A coupling member constituting an impedance element connected to the inner conductor;
A substrate on which the dielectric coaxial resonator and the coupling member are mounted on the top surface;
A housing for accommodating the dielectric coaxial resonator in an internal space;
The housing is inserted into the through hole of the dielectric block, the first end protrudes to the front side of the dielectric block and contacts the coupling member, and the second end protrudes to the back side of the dielectric block. A connection terminal having a higher thermal conductivity than the substrate;
A resonator device comprising: A dielectric coaxial resonator in which an outer conductor is provided on an outer surface excluding the front surface of the dielectric block, and an inner conductor is provided in a through hole of the dielectric block;
A coupling member constituting an impedance element connected to the inner conductor;
A substrate on which the dielectric coaxial resonator and the coupling member are mounted on the top surface;
Inserted into the through-hole of the dielectric block, the first end projects to the front side of the dielectric block and contacts the coupling member, the second end projects to the back side of the dielectric block, A connection terminal having higher thermal conductivity than the substrate;
A resonator device comprising:   The resonator device according to claim 9 or 10, wherein the connection terminal is formed in a rod shape. Comprising a cushioning material having fluidity and higher thermal conductivity than the substrate;
The resonator device according to claim 9, wherein a second end of the connection terminal is covered with the buffer material.   The resonator device according to claim 9, wherein a second end of the connection terminal goes straight to the back side of the dielectric block.   The resonator device according to claim 9, wherein a second end of the connection terminal is bent toward a bottom surface side of the dielectric block.   The resonator device according to claim 9, wherein a second end of the connection terminal is bent toward a top surface side of the dielectric block. A plurality of the dielectric coaxial resonators, and a plurality of connection terminals attached to each of the dielectric coaxial resonators,
The resonator device according to any one of claims 9 to 15, wherein a second end of the connection terminal protrudes to a back side of the dielectric block except at least one of the plurality of connection terminals.   The resonator device according to claim 9, wherein a part of a bottom surface of the dielectric coaxial resonator is exposed from the substrate.

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