JP2014107551A - 太陽電池用基板の表面処理方法 - Google Patents
太陽電池用基板の表面処理方法 Download PDFInfo
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- 238000001020 plasma etching Methods 0.000 claims abstract description 30
- 238000001039 wet etching Methods 0.000 claims abstract description 29
- 230000008569 process Effects 0.000 claims description 55
- 230000031700 light absorption Effects 0.000 abstract description 9
- 230000003287 optical effect Effects 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 13
- 238000002310 reflectometry Methods 0.000 description 12
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 241000208140 Acer Species 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000010849 ion bombardment Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
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- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- 239000003245 coal Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 238000007429 general method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
【解決手段】本発明の太陽電池用基板の表面処理方法によれば、太陽電池用基板に対して第1湿式エッチング工程、反応性イオンエッチング工程、および第2湿式エッチング工程を遂行して基板表面にピラミッド構造を形成する。このようなピラミッド構造は光反射率を低くすることによって太陽電池の光吸収効率を向上させるのに寄与する。本発明によれば結晶の種類および方向性に関係なく擬似単結晶基板に対して効果的に表面処理を行うことによって、太陽電池の効率を向上させることができる。
【選択図】図6
Description
太陽電池用基板に対して第1湿式エッチングを遂行する段階と、
反応性イオンエッチング(reactive ion etching)を遂行する段階と、
第2湿式エッチングを遂行する段階と、を含む。
実施例1
3族元素の不純物がドーピングされたp−タイプ擬似単結晶基板(MLM wafer、Grade B)を準備した。基板に対してHF:HNO3:H2Oを1:3:2体積比で含む溶液に温度7℃で1分30秒間浸漬して第1湿式エッチングを遂行することによって、切断ダメージ除去と第1テクスチャリングを同時に行った。前記第1テクスチャリングによって表面から3〜5μmの深さでエッチングが行われた。
反応性イオンエッチング工程を行わないことを除いて、実施例1と同様な方法で太陽電池を製造した。
表面処理結果評価
図4は実施例1で反応性イオンエッチング工程まで遂行した後の基板の表面を、走査電子顕微鏡を用いて70,000倍に拡大して撮影した写真である。
実施例1および比較例1で製造した太陽電池の電気的性能をASTM G−173−03によりAM1.5太陽条件下で中国に所在するハンファソーラーワン社(Hanwha Solarone limited、HSOL)のソーラーテスター(solar tester)、H.a.l.m cetis PV−productsを用いて測定し、その結果を下記表1に示した。
Claims (9)
- 太陽電池用基板に対して第1湿式エッチングを遂行する段階と、
反応性イオンエッチング(reactive ion etching)を遂行する段階と、
第2湿式エッチングを遂行する段階と、を含む太陽電池用基板の表面処理方法。 - 前記第1湿式エッチングによって切断ダメージ除去(saw damage removal)および第1テクスチャリング(texturing)が同時に遂行されることを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
- 前記第1湿式エッチングは、HF:HNO3:H2Oを1:2乃至4:1乃至3の体積比で含む溶液を用いて遂行することを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
- 前記反応性イオンエッチングによって第2テクスチャリングを行って前記基板の表面にピラミッド構造を形成することを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
- 前記反応性イオンエッチングは、Cl2、SF6、およびO2を含むガスを用いて遂行することを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
- 前記ピラミッド構造の幅(width)に対する高さ(height)の比(height/width)は0.75〜1.1であることを特徴とする請求項4に記載の太陽電池用基板の表面処理方法。
- 前記第2湿式エッチング工程は、HF:HNO3:H2Oを1:13乃至17:15乃至19の体積比で含む溶液を用いて遂行することを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
- 前記第2湿式エッチング工程は、20〜30℃の温度で10秒乃至60秒間遂行することを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
- 前記太陽電池用基板は、単結晶基板、単結晶と多結晶の領域が混ざった基板、および多結晶基板からなる群より選択される1種の擬似単結晶基板であることを特徴とする請求項1に記載の太陽電池用基板の表面処理方法。
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KR1020120137310A KR101431730B1 (ko) | 2012-11-29 | 2012-11-29 | 태양전지용 기판의 표면처리 방법 |
KR10-2012-0137310 | 2012-11-29 |
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JP2014107551A true JP2014107551A (ja) | 2014-06-09 |
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Cited By (1)
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CN113257931A (zh) * | 2021-05-12 | 2021-08-13 | 苏州大学 | 全角度陷光晶硅太阳能电池绒面的制备方法 |
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KR102255578B1 (ko) * | 2019-08-14 | 2021-05-24 | 고려대학교 산학협력단 | Kerfless 방식으로 제작된 실리콘 웨이퍼의 습식 이단계 표면조직화 방법 |
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JP2005150614A (ja) * | 2003-11-19 | 2005-06-09 | Sharp Corp | 太陽電池及びその製造方法 |
WO2012028728A2 (de) * | 2010-09-03 | 2012-03-08 | Schott Solar Ag | Verfahren zum nasschemischen rückätzen eines emitters einer solarzelle |
JP2012164961A (ja) * | 2011-02-08 | 2012-08-30 | Samsung Sdi Co Ltd | 太陽電池およびその製造方法 |
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CN101478013A (zh) * | 2008-12-30 | 2009-07-08 | 无锡尚德太阳能电力有限公司 | 一种反应离子刻蚀制备太阳电池硅片绒面的方法以及用该方法制造的太阳电池 |
CN101800264B (zh) * | 2010-02-20 | 2012-01-18 | 山东力诺太阳能电力股份有限公司 | 一种晶体硅太阳能电池干法刻蚀制绒工艺 |
KR20120037121A (ko) * | 2010-10-11 | 2012-04-19 | 엘지전자 주식회사 | 태양 전지의 제조 방법 |
CN102623546A (zh) * | 2011-01-30 | 2012-08-01 | 无锡尚德太阳能电力有限公司 | 一种硅片制绒方法和用所述方法制造的太阳电池 |
KR101779057B1 (ko) * | 2011-03-18 | 2017-09-18 | 주성엔지니어링(주) | 기판형 태양전지 및 그 제조방법 |
CN102185035B (zh) * | 2011-05-04 | 2013-03-06 | 山东力诺太阳能电力股份有限公司 | 一种二次制绒法制备晶体硅太阳能电池的工艺 |
CN102468371A (zh) * | 2011-12-15 | 2012-05-23 | 江苏腾晖电力科技有限公司 | 准单晶硅片的制绒方法 |
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JP2005150614A (ja) * | 2003-11-19 | 2005-06-09 | Sharp Corp | 太陽電池及びその製造方法 |
WO2012028728A2 (de) * | 2010-09-03 | 2012-03-08 | Schott Solar Ag | Verfahren zum nasschemischen rückätzen eines emitters einer solarzelle |
JP2012164961A (ja) * | 2011-02-08 | 2012-08-30 | Samsung Sdi Co Ltd | 太陽電池およびその製造方法 |
Cited By (1)
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CN113257931A (zh) * | 2021-05-12 | 2021-08-13 | 苏州大学 | 全角度陷光晶硅太阳能电池绒面的制备方法 |
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JP5745598B2 (ja) | 2015-07-08 |
CN103849937B (zh) | 2016-08-17 |
KR101431730B1 (ko) | 2014-08-26 |
KR20140075026A (ko) | 2014-06-19 |
CN103849937A (zh) | 2014-06-11 |
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