JP2014107490A - Package for storing electronic element and electronic device - Google Patents

Package for storing electronic element and electronic device Download PDF

Info

Publication number
JP2014107490A
JP2014107490A JP2012261181A JP2012261181A JP2014107490A JP 2014107490 A JP2014107490 A JP 2014107490A JP 2012261181 A JP2012261181 A JP 2012261181A JP 2012261181 A JP2012261181 A JP 2012261181A JP 2014107490 A JP2014107490 A JP 2014107490A
Authority
JP
Japan
Prior art keywords
base
electronic element
frame
thermal expansion
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012261181A
Other languages
Japanese (ja)
Other versions
JP6122284B2 (en
Inventor
Kenji Suetsugu
健児 末次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2012261181A priority Critical patent/JP6122284B2/en
Publication of JP2014107490A publication Critical patent/JP2014107490A/en
Application granted granted Critical
Publication of JP6122284B2 publication Critical patent/JP6122284B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce deformation caused by heat generated during the operation.SOLUTION: A package 1 for storing an electronic element includes: a base substance 11 including a cavity part 11e in which an electronic element 2 is stored; an electrode 14 disposed at a center region on a lower surface of the base substance 11; a lid 12 which is joined to an upper surface of the base substance 11 so as to cover the cavity part 11e; and a frame like member 13 which is joined to a peripheral region of the lower surface of the base substance 11. The base substance 11 has a first heat expansion coefficient. The lid 12 has a second heat expansion coefficient larger than the first heat expansion coefficient. The frame like member 13 has a third heat expansion coefficient larger than the first heat expansion coefficient.

Description

本発明は、例えば撮像装置等に用いられる電子素子収納用パッケージ等に関するものである。   The present invention relates to an electronic element storage package used in, for example, an imaging apparatus.

例えば撮像装置等の電子装置に用いられるパッケージ（以下、電子素子収納用パッケージともいう）は、例えばセラミック材料から成る基体と、例えばガラス材料から成り基体に接合される蓋体とを含んでいる。また、電子素子収容用パッケージは、基体の下面の中央領域に配置された複数の電極をさらに含んでいる。電子装置において、例えば撮像素子等の電子素子は、基体上に実装されており、蓋体によって覆われている。電子装置は、複数の電極に付けられた半田等から成る複数の外部端子を含んでいる。電子装置は、複数の外部端子によって実装基板に固定される。   For example, a package used for an electronic device such as an imaging device (hereinafter also referred to as an electronic element storage package) includes a base made of, for example, a ceramic material and a lid made of, for example, a glass material and bonded to the base. The electronic element housing package further includes a plurality of electrodes arranged in a central region on the lower surface of the base. In an electronic device, for example, an electronic element such as an imaging element is mounted on a base and is covered with a lid. The electronic device includes a plurality of external terminals made of solder or the like attached to a plurality of electrodes. The electronic device is fixed to the mounting substrate by a plurality of external terminals.

特開2010-238888号公報JP 2010-238888

例えば電子装置の動作時において、電子素子収納用パッケージの基体および蓋体が、電子素子の発熱によって膨張する場合がある。この場合において、例えばセラミック材料から成る基体と例えばガラスから成る蓋体との熱膨張率の差によって、電子素子収納用パッケージが変形する可能性がある。電子素子収納用パッケージが変形すると、複数の外部端子による実装構造において欠陥が生じて、電子装置の動作特性に影響が生じる可能性がある。   For example, during operation of the electronic device, the base and lid of the electronic element storage package may expand due to heat generated by the electronic element. In this case, the electronic element storage package may be deformed due to a difference in thermal expansion coefficient between the base made of, for example, a ceramic material and the lid made of, for example, glass. When the electronic element storage package is deformed, a defect may occur in a mounting structure using a plurality of external terminals, which may affect the operating characteristics of the electronic device.

本発明の一つの態様による電子素子収納用パッケージは、電子素子が収納されるキャビティ部を含んでいる基体と、基体の下面の中央領域に配置された電極と、キャビティ部を覆うように基体の上面に接合される蓋体と、基体の下面のうち周囲領域に接合された枠状部材とを含んでいる。基体は、第１の熱膨張係数を有しており、蓋体は、第１の熱膨張係数よりも大きい第２の熱膨張係数を有しており、枠状部材は、第１の熱膨張係数よりも大きい第３の熱膨張係数を有している。   An electronic element storage package according to an aspect of the present invention includes a base including a cavity portion in which an electronic element is stored, an electrode disposed in a central region on a lower surface of the base, and a base so as to cover the cavity portion. A lid body joined to the upper surface and a frame-like member joined to the surrounding region of the lower surface of the base are included. The base body has a first thermal expansion coefficient, the lid body has a second thermal expansion coefficient larger than the first thermal expansion coefficient, and the frame-shaped member has the first thermal expansion coefficient. The third coefficient of thermal expansion is greater than the coefficient.

本発明の一つの態様による電子素子収納用パッケージにおいて、基体が第１の熱膨張係数を有しており、基体の上面に接合される蓋体が第１の熱膨張係数よりも大きい第２の熱膨張係数を有しており、基体の下面に接合された枠状部材が第１の熱膨張係数よりも大きい第３の熱膨張係数を有していることによって、本発明の一つの態様による電子素子収納用パッケージは、高さ方向における熱膨張係数のバランスの偏りが低減されており、例えば動作時において電子素子が発熱した場合にも、変形量が低減されており、実装構造における欠陥が低減されて動作特性が向上された電子装置を実現することができる。   In the electronic element housing package according to one aspect of the present invention, the base has a first thermal expansion coefficient, and the lid bonded to the upper surface of the base has a second thermal expansion coefficient larger than the first thermal expansion coefficient. According to one aspect of the present invention, the frame-shaped member having a thermal expansion coefficient and having a third thermal expansion coefficient larger than the first thermal expansion coefficient is bonded to the lower surface of the base. The package for storing electronic elements has a reduced balance of thermal expansion coefficients in the height direction.For example, even when the electronic elements generate heat during operation, the amount of deformation is reduced, and defects in the mounting structure are eliminated. It is possible to realize an electronic device that is reduced and has improved operating characteristics.

本発明の実施形態における電子装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic device in embodiment of this invention. （ａ）は図１に示された電子装置において蓋体等を省略した構造を示す平面図であり、（ｂ）は（ａ）に示された電子装置において外部端子を省略した構造を示す下面図である。(A) is a top view which shows the structure which a lid etc. were abbreviate | omitted in the electronic device shown by FIG. 1, (b) is the lower surface which shows the structure which abbreviate | omitted the external terminal in the electronic device shown by (a). FIG. （ａ）は図１に示された電子装置における基体等を示す縦断面図であり、（ｂ）は（ａ）に示された基体等の下面図である。(A) is a longitudinal cross-sectional view which shows the base | substrate etc. in the electronic device shown by FIG. 1, (b) is a bottom view of the base | substrate etc. which were shown by (a). 図１に示された電子装置における枠状部材を示す斜視図である。It is a perspective view which shows the frame-shaped member in the electronic device shown by FIG. （ａ）および（ｂ）は図１に示された電子装置における基体および枠状部材の構造を示す縦断面図である。(A) And (b) is a longitudinal cross-sectional view which shows the structure of the base | substrate and frame-shaped member in the electronic apparatus shown by FIG. 図４に示された枠状部材の他の構造例を示す斜視図である。It is a perspective view which shows the other structural example of the frame-shaped member shown by FIG. 図２（ｂ）に示された構造の他の例を示す下面図である。It is a bottom view which shows the other example of the structure shown by FIG.2 (b).

以下、本発明の実施形態における電子装置について図面を参照して説明する。   Hereinafter, an electronic device according to an embodiment of the present invention will be described with reference to the drawings.

図１および図２に示されているように、本発明の実施形態における電子装置は、電子素子収納用パッケージ１と、電子素子収納用パッケージ１に実装された電子素子２とを含んでいる。また、電子装置は、電子素子収納用パッケージ１の下面に設けられた複数の外部端子３をさらに含んでいる。本実施形態における電子装置は、例えば撮像装置である。   As shown in FIGS. 1 and 2, the electronic device according to the embodiment of the present invention includes an electronic element storage package 1 and an electronic element 2 mounted on the electronic element storage package 1. The electronic device further includes a plurality of external terminals 3 provided on the lower surface of the electronic element housing package 1. The electronic device in this embodiment is an imaging device, for example.

電子素子収納用パッケージ１は、基体11と、基体11の上面に接合された蓋体12と、基体11の下面に接合された枠状部材13とを含んでいる。電子素子収納用パッケージ１は、基体11の下面の中央領域に配置された複数の電極14をさらに含んでいる。   The electronic element storage package 1 includes a base body 11, a lid body 12 joined to the upper surface of the base body 11, and a frame-like member 13 joined to the lower surface of the base body 11. The electronic element storage package 1 further includes a plurality of electrodes 14 disposed in the central region of the lower surface of the base 11.

基体11は、例えばセラミック材料から成り、その材料例は、酸化アルミニウム（アルミナ：Ａｌ２Ｏ３）質焼結体，窒化アルミニウム（ＡｌＮ）質焼結体等である。 The substrate 11 is made of, for example, a ceramic material, and examples of the material include an aluminum oxide (alumina: Al 2 O 3 ) sintered body, an aluminum nitride (AlN) sintered body, and the like.

基体11の熱膨張係数（以下、第１の熱膨張係数ともいう）は、基体11が例えば酸化アルミニウムから成る場合であれば約7.2×10−６／℃である。基体11が例えば窒化アルミニ
ウムから成る場合であれば、基体11の熱膨張係数は約4.6×10−６／℃である。 The thermal expansion coefficient (hereinafter also referred to as the first thermal expansion coefficient) of the substrate 11 is about 7.2 × 10 −6 / ° C. when the substrate 11 is made of, for example, aluminum oxide. If the substrate 11 is made of aluminum nitride, for example, the coefficient of thermal expansion of the substrate 11 is about 4.6 × 10 −6 / ° C.

図３（ａ）に示されているように、基体11は、底基体部11ａと枠基体部11ｂとを含んでおり、基体11がセラミック材料から成る場合、底基体部11ａおよび枠基体部11ｂは、例えば焼成によって一体的に形成されているものである。また、基体11のキャビティ部11ｅは、底基体部11ａおよび枠基体部11ｂによって規定される空間のことである。   As shown in FIG. 3A, the base 11 includes a bottom base 11a and a frame base 11b. When the base 11 is made of a ceramic material, the bottom base 11a and the frame base 11b. Are formed integrally by firing, for example. The cavity portion 11e of the base 11 is a space defined by the bottom base portion 11a and the frame base portion 11b.

底基体部11ａは、平面視において矩形状を有する平板状の部分である。底基体部11ａの上面が電子素子２の搭載領域を有しており、搭載領域は、例えば底基体部11ａの上面の中央領域に位置している。   The bottom base portion 11a is a flat plate-like portion having a rectangular shape in plan view. The upper surface of the bottom base portion 11a has a mounting region for the electronic element 2, and the mounting region is located, for example, in the central region of the top surface of the bottom base portion 11a.

枠基体部11ｂは、例えば底基体部11ａの平面形状に対応した形状および寸法を有しており、底基体部11ａの搭載領域に対応した開口部を有している。枠基体部11ｂは、枠状部材13との位置決め用の複数の凹部11ｄを有しており、複数の凹部11ｄは、平面的に配置されている。   The frame base portion 11b has, for example, a shape and dimensions corresponding to the planar shape of the bottom base portion 11a, and has an opening corresponding to the mounting region of the bottom base portion 11a. The frame base portion 11b has a plurality of recesses 11d for positioning with the frame-shaped member 13, and the plurality of recesses 11d are arranged in a plane.

ここで“平面的に配置”とは、図３（ｂ）に示されているように、少なくとも３つ以上の凹部11ｄが仮想のｘｙ平面方向に二次元に配置されていることをいう。例示的には、複数の凹部11ｄは、底基体部11ａの下面の各辺に配置されている。図３（ｂ）に示された例においては、複数の凹部11ｄは、底基体部11ａの下面の中心部を基準に、仮想のｘ軸方向に2個および仮想のｙ軸方向に２個の合計４個設けられている。   Here, “planarly arranged” means that at least three or more concave portions 11d are two-dimensionally arranged in the virtual xy plane direction as shown in FIG. Illustratively, the plurality of recesses 11d are arranged on each side of the bottom surface of the bottom base portion 11a. In the example shown in FIG. 3B, the plurality of recesses 11d are two in the imaginary x-axis direction and two in the imaginary y-axis direction with reference to the central portion of the lower surface of the bottom base portion 11a. A total of four are provided.

複数の凹部11ｄのそれぞれは、底基体部11ａの下面の中心部を基準とする放射状の直線に沿って延びる形状を有している。複数の凹部11ｄのそれぞれは、例えば図示されている
ように直線形状を有している。 Each of the plurality of concave portions 11d has a shape extending along a radial straight line with the center portion of the lower surface of the bottom base portion 11a as a reference. Each of the plurality of recesses 11d has, for example, a linear shape as illustrated.

なお、“凹部”とは、枠基体部11ｂの下面から上面へ向かって凹んでいる部分であり、図示されているように下面視において枠基体部11ｂの下面の縁に接するように内壁が部分的に存在しないものに加えて、縁から離れて配置されており全周にわたって内壁が存在するものも含まれる。   The “concave portion” is a portion that is recessed from the lower surface to the upper surface of the frame base portion 11b, and the inner wall is a portion that touches the edge of the lower surface of the frame base portion 11b in the bottom view as shown In addition to those that do not exist, those that are arranged away from the edge and have an inner wall around the entire circumference are also included.

基体11が例えば酸化アルミニウム質焼結体から成る場合であれば、まずアルミナ（Ａｌ２Ｏ３）またはシリカ（ＳｉＯ２），カルシア（ＣａＯ），マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤，溶媒を添加混合して泥漿状とし、これを周知のドクターブレード法またはカレンダーロール法等によりシート状に成形してセラミックグリーンシート（以下、グリーンシートともいう）を得る。その後、グリーンシートを所定形状に打ち抜き加工するとともに必要に応じて複数枚積層し、これを約1,600℃の温度で焼成することに
より製作される。基体11が酸化アルミニウム質焼結体からなる場合は、機械強度が高いために基体に反りが発生し難く、また適度な熱伝導率を持っているので、撮像素子から発生する熱を外部に放散し易い物となり、機械強度と熱伝導率またコストも手ごろな物となり好ましい。 If the substrate 11 is made of, for example, an aluminum oxide sintered body, first, an organic solvent suitable for the raw material powder such as alumina (Al 2 O 3 ) or silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc. , A solvent is added and mixed to form a slurry, and this is formed into a sheet by a known doctor blade method or calendar roll method to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of sheets are laminated as necessary, and the green sheet is fired at a temperature of about 1,600 ° C. When the base 11 is made of an aluminum oxide sintered body, the mechanical strength is high, so that the base is unlikely to warp and has an appropriate thermal conductivity, so heat generated from the image sensor is dissipated to the outside. This is preferable because the mechanical strength, thermal conductivity, and cost are reasonable.

蓋体12は、例えばガラス接合材または樹脂接着剤等の接合材によって基体11の上面に接合されており、電子素子２を覆っているとともに基体11のキャビティ部11ｅを封止している。接合材が樹脂接着剤である場合には、封止時に加わる熱を150℃程度以下に抑えるこ
とができるために、電子素子２が撮像素子である場合に撮像素子上に配置された有機物からなるカラーフィルタにダメージを与えず画像の質の向上が得られる。 The lid 12 is bonded to the upper surface of the substrate 11 by a bonding material such as a glass bonding material or a resin adhesive, for example, covers the electronic element 2 and seals the cavity portion 11e of the substrate 11. When the bonding material is a resin adhesive, heat applied at the time of sealing can be suppressed to about 150 ° C. or lower, and therefore, when the electronic element 2 is an image sensor, the electronic material 2 is made of an organic substance disposed on the image sensor. The image quality can be improved without damaging the color filter.

電子装置が例えば撮像装置である場合には、蓋体12は、透光性を有する材料から成り、その材料例としては、ガラスまたは水晶等がある。蓋体12の基体の熱膨張係数（以下、第２の熱膨張係数ともいう）は、蓋体12がガラスから成る場合、約8.5×10−６／℃である
。蓋体12の基体が水晶から成る場合、蓋体12の基体の熱膨張係数は、約11×10−６／℃である。 When the electronic device is, for example, an imaging device, the lid 12 is made of a material having translucency, and examples of the material include glass or quartz. The thermal expansion coefficient (hereinafter also referred to as the second thermal expansion coefficient) of the base body of the lid body 12 is about 8.5 × 10 −6 / ° C. when the lid body 12 is made of glass. When the base body of the lid body 12 is made of quartz, the thermal expansion coefficient of the base body of the lid body 12 is about 11 × 10 −6 / ° C.

蓋体12が水晶から成る場合には、撮像光学系中のローパスフィルターとして通常３枚使用される水晶中の１枚としての機能も同時に持たせることができるので、ローパスフィルターと蓋体12を合わせた構成から、蓋体としての品数を減らすことができるので、コスト低下や厚みを薄くできるので好ましい。   When the lid 12 is made of quartz, it can also function as one of the three crystals normally used as a low-pass filter in the imaging optical system, so the low-pass filter and lid 12 are combined. Since the number of articles as the lid can be reduced, the cost can be reduced and the thickness can be reduced.

なお、蓋体12は、透光性を有する基体の表面に設けられた例えば誘電体多層膜等の光学膜を有するものであってもよい。光学膜の例としては、特定の波長領域の光（例えば赤外光等）を反射して遮断するものである。ここで、蓋体12が基体の表面に設けられた光学膜を有する場合、蓋体12の基体の熱膨張係数（すなわち第２の熱膨張係数）とは、光学膜を含む蓋体12全体の熱膨張係数のことをいう。   The lid 12 may have an optical film such as a dielectric multilayer film provided on the surface of a light-transmitting substrate. As an example of the optical film, light in a specific wavelength region (for example, infrared light) is reflected and blocked. Here, when the lid body 12 has an optical film provided on the surface of the base body, the thermal expansion coefficient of the base body of the lid body 12 (that is, the second thermal expansion coefficient) is the entire lid body 12 including the optical film. It refers to the thermal expansion coefficient.

枠状部材13は、例えば樹脂接着剤またはろう材等の接合材によって基体11の下面に接合されている。枠状部材13は、基体11の下面のうち複数の電極14が配置されている中央領域を囲む周囲領域において接合されている。枠状部材13は、例えば金属材料から成り、基体11の複数の電極14に対応した開口部を有している。接合材が樹脂接着剤である場合には、封止時に加わる熱を150℃程度以下に抑えることができるために、基体11と枠状部材13の
熱膨張係数の違いによる基体11の反り変形が小さくなり、電子素子２が撮像素子である場合に画像の質の向上が得られる。 The frame-like member 13 is bonded to the lower surface of the base 11 by a bonding material such as a resin adhesive or a brazing material. The frame-like member 13 is joined in a peripheral region surrounding a central region where the plurality of electrodes 14 are disposed on the lower surface of the base 11. The frame-like member 13 is made of, for example, a metal material and has openings corresponding to the plurality of electrodes 14 of the base 11. When the bonding material is a resin adhesive, the heat applied at the time of sealing can be suppressed to about 150 ° C. or less, so that the warping deformation of the base 11 due to the difference in thermal expansion coefficient between the base 11 and the frame-like member 13 occurs. When the electronic element 2 is an imaging element, the image quality is improved.

枠状部材13が金属材料から成る場合、その材料例は、ＳＵＳ410または50アロイ等であ
る。枠状部材13の熱膨張係数（以下、第３の熱膨張係数ともいう）は、枠状部材13がＳＵＳ410から成る場合、約11×10−６／℃である。また、枠状部材13が50アロイから成る場
合は、枠状部材13の熱膨張係数は、約9.8×10−６／℃である。 When the frame member 13 is made of a metal material, an example of the material is SUS410 or 50 alloy. When the frame member 13 is made of SUS410, the thermal expansion coefficient of the frame member 13 (hereinafter also referred to as a third thermal expansion coefficient) is about 11 × 10 −6 / ° C. When the frame-shaped member 13 is made of 50 alloy, the thermal expansion coefficient of the frame-shaped member 13 is about 9.8 × 10 −6 / ° C.

枠状部材13は、図２（ｂ）および図４に示されているように、基体11の複数の凹部11ｄに対応する複数の凸部13ａ１および13ａ２を有している。複数の凸部13ａ１および13ａ２は、エッチング、プレス加工等によって形成される。 As shown in FIGS. 2B and 4, the frame-shaped member 13 has a plurality of convex portions 13 a 1 and 13 a 2 corresponding to the plurality of concave portions 11 d of the base 11. The plurality of convex portions 13a 1 and 13a 2 are formed by etching, pressing, or the like.

図２（ｂ）に示された例において、矩形状の枠状部材13は、２つの辺において基体11に接合されており、他の２つの辺においては基体11に接合されていない。このように枠状部材13が部分的に基体11に接合されて部分的に接合されていない構造であれば、例えば枠状部材13が実装基板５に接合される場合に、実装基板５と電子素子収納用パッケージ１との熱膨張量の違いよる応力を枠状部材13において吸収することができる。なお、その場合には、枠状部材13の基体11に接合された辺と実装基板５に接合された辺とが異なる方がよい。   In the example shown in FIG. 2B, the rectangular frame-shaped member 13 is joined to the base 11 at two sides, and is not joined to the base 11 at the other two sides. Thus, if the frame-like member 13 is partially joined to the base body 11 and is not partly joined, for example, when the frame-like member 13 is joined to the mounting substrate 5, the mounting substrate 5 and the electronic The frame member 13 can absorb the stress due to the difference in thermal expansion from the element storage package 1. In this case, it is preferable that the side bonded to the base 11 of the frame-shaped member 13 and the side bonded to the mounting substrate 5 are different.

なお、図７に示されているように、図２（ｂ）に示された構造の他の例としては、矩形状の枠状部材13の全辺において基体11に接合されているものがある。このように、全辺において接合されていると、例えば電子素子収納用パッケージにねじれ等の変形が生じにくいものとし得る。   As shown in FIG. 7, as another example of the structure shown in FIG. 2B, there is one in which the rectangular frame member 13 is bonded to the base body 11 on all sides. . As described above, when all the sides are joined, for example, deformation such as torsion may hardly occur in the electronic element storage package.

複数の凸部13ａ１および13ａ２のうち凸部13ａ１は、枠状部材13の開口部の基体11に重ならない辺に対応して設けられており、基体11に重なる位置まで開口部の内側に向かって平面方向に延びているとともに、基体11の下面に向かって垂直方向（すわなち、上方）に延びている。また、複数の凸部13ａ１および13ａ２のうち凸部13ａ２は、枠状部材13の開口部の基体11に重なる辺に対応して設けられており、基体11の下面に向かって垂直方向（すわなち、上方）に延びている。図５（ａ）および（ｂ）に示されているように、複数の凸部13ａ１および13ａ２は、基体11の下面に接するように設けられている。 Of the plurality of convex portions 13a 1 and 13a 2 , the convex portion 13a 1 is provided corresponding to the side of the opening of the frame-like member 13 that does not overlap the base 11, and the inner side of the opening reaches the position where it overlaps the base 11. Toward the lower surface of the base body 11 and in the vertical direction (ie, upward). Of the plurality of protrusions 13 a 1 and 13 a 2 , the protrusion 13 a 2 is provided corresponding to the side of the opening of the frame-shaped member 13 that overlaps the base 11, and is perpendicular to the lower surface of the base 11. (That is, upward). As shown in FIGS. 5A and 5B, the plurality of convex portions 13 a 1 and 13 a 2 are provided in contact with the lower surface of the base 11.

本実施形態における電子素子収納用パッケージ１において、基体11が第１の熱膨張係数（例えば、基体11が酸化アルミニウムから成る場合であれば約7.2×10−６／℃）を有し
ており、基体11の上面に接合される蓋体12が第１の熱膨張係数よりも大きい第２の熱膨張係数（例えば、蓋体12が水晶から成る場合であれば約11×10−６／℃）を有しており、基体11の下面に接合された枠状部材13が第１の熱膨張係数よりも大きい第３の熱膨張係数（例えば、枠状部材13がＳＵＳ410から成る場合であれば約11×10−６／℃）を有している
。本実施形態における電子素子収納用パッケージ１は、このような構成を有していることによって、高さ方向における熱膨張係数のバランスの偏りが低減されており、例えば動作時において電子素子２が発熱した場合にも、変形量が低減されており、実装構造における欠陥が低減されて動作特性が向上された電子装置を実現することができる。 In the electronic device housing package 1 in the present embodiment, the base 11 has a first thermal expansion coefficient (for example, about 7.2 × 10 −6 / ° C. when the base 11 is made of aluminum oxide), A second thermal expansion coefficient that is larger than the first thermal expansion coefficient of the lid body 12 bonded to the upper surface of the substrate 11 (for example, about 11 × 10 −6 / ° C. when the lid body 12 is made of crystal). And the frame member 13 joined to the lower surface of the substrate 11 has a third coefficient of thermal expansion larger than the first coefficient of thermal expansion (for example, if the frame member 13 is made of SUS410, about 11 × 10 −6 / ° C.). The electronic element storage package 1 according to the present embodiment has such a configuration, so that the bias in the balance of the thermal expansion coefficient in the height direction is reduced. For example, the electronic element 2 generates heat during operation. Even in this case, the amount of deformation is reduced, and defects in the mounting structure can be reduced to realize an electronic device with improved operating characteristics.

すなわち、仮に、電子素子収納用パッケージが基体よりも大きな熱膨張係数を有する枠状部材を含んでいない場合には、蓋体が基体に比べて熱膨張量が大きいために、電子素子収納用パッケージが反る等の変形が生じてしまう可能性があるが、本実施形態の電子素子収納用パッケージ１が基体11よりも大きな熱膨張係数を有する枠状部材13を含んでいることによって、基体11の上面および下面に加わる力の差が低減されており、電子素子収納用パッケージが反る等の変形が生じてしまう可能性が低減されている。したがって、本実施形態における電子装置は、実装構造における欠陥が低減されて動作特性に関して向上されている。   That is, if the electronic element storage package does not include a frame-like member having a larger thermal expansion coefficient than the base body, the lid body has a larger thermal expansion amount than the base body. The electronic element housing package 1 of the present embodiment includes the frame-like member 13 having a larger thermal expansion coefficient than that of the base body 11. The difference in force applied to the upper surface and the lower surface is reduced, and the possibility of deformation such as warpage of the electronic element storage package is reduced. Therefore, the electronic device according to the present embodiment has improved operational characteristics with reduced defects in the mounting structure.

また、本実施形態の電子素子収納用パッケージ１において、平面視において、枠状部材
13の複数の凸部13ａ１および13ａ２が平面的に配置されており、枠状部材13が、基体11に対して複数の凸部13ａ１および13ａ２によって位置決めされている場合には、枠状部材13に対する基体11の平面位置のばらつきを低減させることができる。したがって、本実施形態の電子素子収納用パッケージ１は、実装基板５に対する電子素子２の平面位置のばらつきを低減させた電子モジュールを実現することができる。なお、電子素子２が撮像素子である場合には、電子素子（すなわち撮像素子）２の平面位置のばらつきが低減されており、画像の質の向上が図られる。 Further, in the electronic device housing package 1 of the present embodiment, the frame-like member in plan view
When the plurality of 13 convex portions 13 a 1 and 13 a 2 are arranged in a plane and the frame-like member 13 is positioned with respect to the base 11 by the plurality of convex portions 13 a 1 and 13 a 2 , the frame Variation in the planar position of the base 11 with respect to the shaped member 13 can be reduced. Therefore, the electronic element storage package 1 of the present embodiment can realize an electronic module in which the variation in the planar position of the electronic element 2 with respect to the mounting substrate 5 is reduced. In the case where the electronic element 2 is an image sensor, the variation in the planar position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved.

また、本実施形態の電子素子収納用パッケージ１において、枠状部材13が、実装基板５に対する平面方向における位置決め手段（例えば、図２等に示された孔部13ｃ）を有している場合には、その位置決め手段（例えば孔部13ｃ）と実装基板５の位置決め手段（例えば、図１に示された凸部５ａ）とによって平面位置を決めるように電子装置を実装すれば、実装基板５に対する電子素子２の平面位置のばらつきを低減させることができる。したがって、本実施形態の電子素子収納用パッケージ１は、実装基板５に対する電子素子２の平面位置のばらつきを低減させた電子モジュールを実現することができる。なお、電子素子２が撮像素子である場合には、電子素子（すなわち撮像素子）２の平面位置のばらつきが低減されており、画像の質の向上が図られる。   In the electronic element housing package 1 of the present embodiment, when the frame-like member 13 has positioning means (for example, the hole 13c shown in FIG. 2 and the like) in the plane direction with respect to the mounting substrate 5. If the electronic device is mounted so that the plane position is determined by the positioning means (for example, the hole portion 13c) and the positioning means (for example, the convex portion 5a shown in FIG. 1) of the mounting substrate 5, Variations in the planar position of the electronic element 2 can be reduced. Therefore, the electronic element storage package 1 of the present embodiment can realize an electronic module in which the variation in the planar position of the electronic element 2 with respect to the mounting substrate 5 is reduced. In the case where the electronic element 2 is an image sensor, the variation in the planar position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved.

また、本実施形態の電子素子収納用パッケージ１において、枠状部材13が基体11の下面に接している凸部13ａ１および13ａ２を有していることによって、図５（ｂ）に示されているように、枠状部材13が接合材15によって基体11に接合される場合においても、接合材15の量の違いによる枠状部材13に対する基体11の高さ位置のばらつきを低減させることができる。したがって、本実施形態の電子素子収納用パッケージ１は、実装基板５に対する電子素子２の高さ位置のばらつきを低減させた電子モジュールを実現することができる。なお、電子素子２が撮像素子である場合には、電子素子（すなわち撮像素子）２の高さ位置のばらつきが低減されており、画像の質の向上が図られる。 In the electronic device storage package 1 of the present embodiment, the frame member 13 by having a projecting portion 13a 1 and 13a 2 to have contact with the lower surface of the base 11, shown in FIG. 5 (b) As described above, even when the frame-shaped member 13 is bonded to the base body 11 by the bonding material 15, it is possible to reduce the variation in the height position of the base body 11 with respect to the frame-shaped member 13 due to the difference in the amount of the bonding material 15. it can. Therefore, the electronic element storage package 1 of the present embodiment can realize an electronic module in which variation in the height position of the electronic element 2 with respect to the mounting substrate 5 is reduced. In the case where the electronic element 2 is an image sensor, variation in the height position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved.

なお、図６に示されているように、本実施形態の電子素子収納用パッケージ１において、枠状部材13が下方に延びた脚部13ｂを有している場合には、その脚部13ｂの下端が実装基板５の上面に接するように電子装置を実装すれば、実装基板５に対する電子素子２の高さ位置のばらつきを低減させることができる。したがって、本実施形態の電子素子収納用パッケージ１は、実装基板５に対する電子素子２の高さ位置のばらつきを低減させた電子モジュールを実現することができる。なお、電子素子２が撮像素子である場合には、電子素子（すなわち撮像素子）２の高さ位置のばらつきが低減されており、画像の質の向上が図られる。   As shown in FIG. 6, in the electronic element housing package 1 of the present embodiment, when the frame-like member 13 has a leg portion 13b extending downward, the leg portion 13b If the electronic device is mounted such that the lower end is in contact with the upper surface of the mounting substrate 5, variations in the height position of the electronic element 2 with respect to the mounting substrate 5 can be reduced. Therefore, the electronic element storage package 1 of the present embodiment can realize an electronic module in which variation in the height position of the electronic element 2 with respect to the mounting substrate 5 is reduced. In the case where the electronic element 2 is an image sensor, variation in the height position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved.

また、図１に示されているように、枠状部材13を接合材６によって実装基板５に接合しておくと、実装基板５と電子素子収納用パッケージ１との熱膨張係数の違いによる応力が接合材６にも分散されて、外部端子３に応力が集中して実装構造に欠陥が生じる可能性が低減される。   As shown in FIG. 1, if the frame-like member 13 is bonded to the mounting substrate 5 with the bonding material 6, the stress due to the difference in thermal expansion coefficient between the mounting substrate 5 and the electronic element housing package 1. Is also dispersed in the bonding material 6, and the possibility that stress is concentrated on the external terminal 3 to cause a defect in the mounting structure is reduced.

１ 電子素子収納用パッケージ
11 基体
12 蓋体
13 枠状部材
14 電極
２ 電子素子
３ 外部端子
５ 実装基板 1 Electronic device storage package
11 Substrate
12 Lid
13 Frame member
14 Electrode 2 Electronic element 3 External terminal 5 Mounting substrate

Claims (5)

電子素子が収納されるキャビティ部を含んでおり、第１の熱膨張係数を有する基体と、前記基体の下面の中央領域に設けられた電極と、
前記第１の熱膨張係数よりも大きい第２の熱膨張係数を有しており、前記キャビティ部を封止するように前記基体の上面に接合される蓋体と、
前記基体の前記下面の周囲領域に接合されており、前記第１の熱膨張係数よりも大きい第３の熱膨張係数を有する枠状部材とを備えていることを特徴とする電子素子収納用パッケージ。 Including a cavity portion in which an electronic element is accommodated, a base having a first thermal expansion coefficient, and an electrode provided in a central region of the lower surface of the base;
A lid that has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion and is bonded to the upper surface of the base so as to seal the cavity;
An electronic element housing package comprising: a frame-like member joined to a peripheral region of the lower surface of the base body and having a third thermal expansion coefficient larger than the first thermal expansion coefficient . 前記枠状部材が、前記基体の前記下面に接している複数の凸部を有していることを特徴とする請求項１に記載の電子素子収納用パッケージ。   2. The electronic element storage package according to claim 1, wherein the frame-shaped member has a plurality of convex portions in contact with the lower surface of the base body. 平面視において、前記複数の凸部が平面的に配置されており、
前記枠状部材が、前記基体に対して前記複数の凸部によって位置決めされていることを特徴とする請求項２に記載の電子素子収納用パッケージ。 In the plan view, the plurality of convex portions are arranged in a plane,
The electronic element storage package according to claim 2, wherein the frame-shaped member is positioned by the plurality of convex portions with respect to the base body. 前記枠状部材が、下方に延びた脚部を有していることを特徴とする請求項１乃至請求項３のいずれかに記載の電子素子収納用パッケージ。   4. The electronic element storage package according to claim 1, wherein the frame-shaped member has a leg portion extending downward. 5. 請求項１に記載された電子素子収納用パッケージと、
該電子素子収納用パッケージの前記に収容された電子素子とを備えていることを特徴とする電子装置。 An electronic element storage package according to claim 1;
An electronic device comprising: the electronic device housed in the electronic device housing package.
JP2012261181A 2012-11-29 2012-11-29 Electronic element storage package and electronic device Expired - Fee Related JP6122284B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012261181A JP6122284B2 (en) 2012-11-29 2012-11-29 Electronic element storage package and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012261181A JP6122284B2 (en) 2012-11-29 2012-11-29 Electronic element storage package and electronic device

Publications (2)

Publication Number Publication Date
JP2014107490A true JP2014107490A (en) 2014-06-09
JP6122284B2 JP6122284B2 (en) 2017-04-26

Family

ID=51028701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012261181A Expired - Fee Related JP6122284B2 (en) 2012-11-29 2012-11-29 Electronic element storage package and electronic device

Country Status (1)

Country Link
JP (1) JP6122284B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3261416A1 (en) * 2016-06-22 2017-12-27 Jtekt Corporation Semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897319A (en) * 1994-09-29 1996-04-12 Toshiba Corp Electronic-part package
JPH08204060A (en) * 1995-01-24 1996-08-09 Toshiba Corp Semiconductor device
JPH0922954A (en) * 1995-07-04 1997-01-21 Toyota Autom Loom Works Ltd Semiconductor device
JP2000022017A (en) * 1998-07-03 2000-01-21 Kyocera Corp Ceramic wiring substrate and package structure thereof
JP2005072421A (en) * 2003-08-27 2005-03-17 Kyocera Corp Package for housing electronic component and electronic device
JP2007324852A (en) * 2006-05-31 2007-12-13 Kyocera Kinseki Corp Crystal resonator and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897319A (en) * 1994-09-29 1996-04-12 Toshiba Corp Electronic-part package
JPH08204060A (en) * 1995-01-24 1996-08-09 Toshiba Corp Semiconductor device
JPH0922954A (en) * 1995-07-04 1997-01-21 Toyota Autom Loom Works Ltd Semiconductor device
JP2000022017A (en) * 1998-07-03 2000-01-21 Kyocera Corp Ceramic wiring substrate and package structure thereof
JP2005072421A (en) * 2003-08-27 2005-03-17 Kyocera Corp Package for housing electronic component and electronic device
JP2007324852A (en) * 2006-05-31 2007-12-13 Kyocera Kinseki Corp Crystal resonator and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3261416A1 (en) * 2016-06-22 2017-12-27 Jtekt Corporation Semiconductor device
JP2017228659A (en) * 2016-06-22 2017-12-28 株式会社ジェイテクト Semiconductor device
CN107527872A (en) * 2016-06-22 2017-12-29 株式会社捷太格特 Semiconductor device
US10211135B2 (en) 2016-06-22 2019-02-19 Jtekt Corporation Semiconductor device

Also Published As

Publication number Publication date
JP6122284B2 (en) 2017-04-26

Similar Documents

Publication Publication Date Title
JP2007287967A (en) Electronic-component apparatus
US7978016B2 (en) Crystal oscillator
JP5743075B2 (en) Optical sensor and optical sensor manufacturing method
JP2010251702A (en) Electronic component, package and infrared sensor
JP6208447B2 (en) Electronic element storage package and electronic device
JP2006269841A (en) Solid-state imaging device
WO2013077199A1 (en) Package for housing electronic component, and electronic apparatus
TWI581566B (en) Crystal Oscillator
JP2014082348A (en) Package for storing optical element, optical filter device, optical module, and electronic apparatus
JP6122284B2 (en) Electronic element storage package and electronic device
JP2015046562A (en) Package for storing electronic element and electronic device
JP2008235864A (en) Electronic device
JP2008252836A (en) Piezoelectric oscillator
JP6573515B2 (en) Ceramic substrate
JP5905727B2 (en) Device mounting parts and electronic devices
JP2005244350A (en) Package for containing piezoelectric vibrator and piezoelectric device
JP6510338B2 (en) Lid for optical device and optical device
JP7033974B2 (en) Ceramic circuit boards, packages and electronics
JP6677547B2 (en) Electronic component storage package, electronic device and electronic module
JP2015012077A (en) Electronic component housing package, and electronic device
JP2007134493A (en) Semiconductor element package
JP7554285B2 (en) Packages and ceramic substrates
JP2014049562A (en) Package for housing electronic element, and electronic device
JP7369091B2 (en) Optical device lids, optical device packages, and optical devices
JP2010177600A (en) Optical device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150515

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160617

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160628

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160805

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170307

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170331

R150 Certificate of patent or registration of utility model

Ref document number: 6122284

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees