JP2014107459A - Semiconductor chip pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor chip pickup device which can be successfully detached from an adhesive sheet without causing damages on a semiconductor chip attached to the adhesive sheet.SOLUTION: A semiconductor chip pickup device for detaching a semiconductor chip attached to an adhesive sheet from the adhesive sheet comprises: a support part including a stage which adheres tightly to a surface of the adhesive sheet on the opposite side to a surface where the semiconductor chip is attached and has support surfaces for supporting the semiconductor chip in contact with the adhesive sheet, and a suction surface having a plurality of suction holes for sucking the adhesive sheet, in which the support surfaces of the support part form surfaces projecting from the suction surface. The support surface includes a jaw which moves on a diagonal line of the semiconductor chip for pushing up the adhesive sheet by moving on a diagonal line of the semiconductor chip and a groove where the jaw moves. The support surfaces are arranged along the diagonal lines of the semiconductor chip and each has a predetermined width.

Description

  The present invention relates to a semiconductor chip pickup device for removing a semiconductor chip attached to an adhesive sheet from the adhesive sheet.

  The semiconductor wafer is cut (diced) in a lattice shape in a state of being attached to an adhesive sheet. The cut pieces are attached to the semiconductor chip mounting process as semiconductor chips in a state of being stuck to the adhesive sheet. In the mounting process, first, in order to peel off the semiconductor chip from the adhesive sheet, a pick-up method for adsorbing the semiconductor chip and peeling it from the adhesive sheet is performed (Patent Document 1). Also, there is one that picks up a semiconductor chip from a pressure-sensitive adhesive sheet with a nail and holds it with a suction nozzle (Patent Document 2).

JP 2001-118862 A JP-A-2005-197368

  On the other hand, thinning of a semiconductor chip is progressing, and it is required to remove a thinned semiconductor chip from an adhesive sheet without applying excessive stress to the thinned semiconductor chip that is likely to be chipped or cracked.

  Accordingly, an object of the present invention is to provide a pickup device for a semiconductor chip that can be reliably removed from the adhesive sheet without damaging the semiconductor chip attached to the adhesive sheet.

In order to solve the above-mentioned problem, the invention described in claim 1
A semiconductor chip pickup device for removing a semiconductor chip attached to an adhesive sheet from the adhesive sheet,
A stage that is in close contact with the surface of the pressure-sensitive adhesive sheet that is opposite to the surface on which the semiconductor chip is attached has a support portion that has a support surface that supports the semiconductor chip in contact with the pressure-sensitive adhesive sheet, and a plurality of pressure-sensitive adhesive sheets A suction surface having a suction hole,
The support surface of the support portion forms a surface protruding from the suction surface, and the support surface is provided with a claw for moving on the diagonal line of the semiconductor chip and pushing up the adhesive sheet, and a groove for moving the claw. A pickup device for a semiconductor chip in which a support surface is arranged with a predetermined width along the line.

  When removing the semiconductor chip from the adhesive sheet, the claws move on the diagonal line of the semiconductor chip inward from the corner of the semiconductor chip. As the nail moves, the adhesive sheet and the semiconductor chip are peeled off from the corners. The semiconductor chip is supported by the support surface of the support portion with a predetermined width along the moving direction of the claw, and the outer frame of the support portion is recessed and becomes a suction surface. Due to such a configuration, an edge parallel to the operation direction of the nail is formed by the outer frame of the support portion, and the peeling direction of the adhesive sheet is close to a right angle with the operation direction of the nail. Therefore, the stress acting when peeling from the pressure-sensitive adhesive sheet becomes almost uniform when the nail moves, so that peeling becomes easy, and the semiconductor chip can be reliably removed without damaging the semiconductor chip.

It is a side view of a pickup device. It is a top view of a suction surface. It is an enlarged plan view of a chip support area. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a side view explaining the operation | movement which removes a semiconductor chip from an adhesive sheet. It is a top view explaining the relationship between the moving direction of the nail | claw of a chip | tip support area | region, a support part, and a hollow part.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a pickup device 1 of the present invention. In FIG. 1, the left-right direction is the X-axis, the front-rear direction is the Y-axis, the axis orthogonal to the XY plane composed of the X-axis and the Y-axis is the Z-axis (vertical direction), and the circumference of the Z-axis is the θ-axis.

  The pickup device 1 is composed of a housing 2, a claw 3, and a suction surface 4. The housing 2 has a substantially cylindrical hollow shape, and is provided with a mechanism for projecting and horizontally moving the claw 3 therein. The suction surface 4 is located in the upper part of the housing 2 and supports the adhesive sheet 11 to which the semiconductor chip 10 is attached from below.

  FIG. 2 shows a plan view of the suction surface 4. The suction surface 4 is provided with a plurality of suction holes 15. Each suction hole 15 is a substantially circular hole and operates as a vacuum suction hole when the inside of the housing 2 is evacuated. In the central portion of the suction surface 4, a chip support region 5 that instructs the semiconductor chip 10 via the adhesive sheet 11 is provided. The chip support area 5 is an area that is about 0.5 mm inside the outline of the semiconductor chip 10. The chip support region 5 includes a groove 6 in which the claw 3 moves, an adsorption groove 7 that adsorbs the adhesive sheet 11, a support part 8 that supports the semiconductor chip 10 via the adhesive sheet 11, a recess part 9, and a central claw It is composed of a use hole 16. FIG. 3 is an enlarged plan view of the chip support region 5. A portion indicated by a dotted line means the outer shape of the semiconductor chip 10 supported via the adhesive sheet 11.

  The grooves 6 are provided in two rows from the four corners along the diagonal line of the chip support region 5. The claw 3 moves along the groove 6 from the four corners of the chip support region 5 toward the center. The groove 6 has four corners as start points and a center portion as an end point. A plurality of suction grooves 7 are provided along each side of the chip support region 5. Since the groove 6 is provided on the diagonal line, the length of the suction groove 7 becomes shorter toward the center of the chip support region 5. The suction groove 7 communicates with the inside of the housing 2 and operates as a vacuum suction groove by evacuation inside the housing 2 described above. The support portion 8 has a predetermined width from the groove 6 and extends from each side of the chip support region 5 to the center. A region surrounded by a line connecting the outer frame line 8a of the adjacent support portion 8 and the corner of the adjacent semiconductor chip 10 is referred to as a recess portion 9, and is a region recessed by about 0.1 mm compared to the support portion 8. . The height of the recess 9 and the suction surface 4 are the same height. Accordingly, the support surface 8b of the support portion 8 is formed higher than the suction surface 4 by a thickness of about 0.1 mm. The support surface 8 b forms a surface protruding from the suction surface 4.

  The operation | movement which removes the semiconductor chip 10 from the adhesive sheet 11 is demonstrated using FIGS. FIG. 4 is a diagram in which the semiconductor chip 10, the adhesive sheet 11, the housing 2, the claws 3 and the suction surface 4 are referred to from the X-axis direction (side surface side). Hereinafter, the reference directions in FIGS.

  First, as shown in FIG. 4, the pickup device 1 is disposed below the target semiconductor chip 10. The pressure-sensitive adhesive sheet 11 and the support surface 8b of the support portion 8 are in contact with each other. Since the suction surface 4 is 0.1 mm lower than the support surface 8b, it does not come into contact with the adhesive sheet 11.

  Next, as shown in FIG. 5, the inside of the housing 2 is sucked with a vacuum pump (not shown) to suck the suction surface 4 and the adhesive sheet 11. Since the chip support region 5 is formed 0.5 mm inside the outer shape of the semiconductor chip 10, the adhesive sheet 11 attached to the outer periphery of the semiconductor chip 10 is affected by the step between the support surface 8 b and the suction surface 4. And peel off.

  Next, as shown in FIG. 6, the claw 3 is projected from the lower side toward the center of the semiconductor chip 10. The corner 10a of the semiconductor chip 10 bends and begins to peel from the adhesive sheet 11.

  Next, as shown in FIG. 7, the claw 3 is moved inside the semiconductor chip 10 along the groove 5. As the nail 3 moves, the peeling area 12 between the semiconductor chip 10 and the adhesive sheet 11 increases.

  Next, as shown in FIG. 8, the claw 3 moves to the center of the semiconductor chip 10.

  Next, as shown in FIG. 9, the central claw 3a arranged at the central portion of the semiconductor chip 10 is raised.

  Next, as shown in FIG. 10, the central claw 3a is raised, and the semiconductor chip 10 peeled off from the adhesive sheet 11 is attracted to the collet 17 to complete the pickup operation.

  FIG. 11 shows the relationship between the movement direction of the claw 3 in the chip support region 5 and the support portion 8 and the recess portion 9. For the sake of explanation, the suction groove 7 is not shown. As shown in FIG. 11, the claw 3 moves along the groove 6 from the corner 10a in the direction of the arrow 20a. Since the hollow portion 9 is lower than the chip support portion 8, when the claw 3 moves inward from the corner portion 10 a of the semiconductor chip 10, a trigger for peeling the semiconductor chip 10 from the adhesive sheet 11 is created. The support portion 8 is formed with a predetermined width, and the outer frame line 8 a is positioned in parallel with the moving direction of the claw 3. Therefore, the peeling direction 20b of the adhesive sheet 11 is close to a right angle with the moving direction of the claw 3. In such a case, it is considered that the peeling stress acting on the pressure-sensitive adhesive sheet 11 and the semiconductor chip 10 becomes substantially uniform as the claw 3 moves. Since the peeling stress is uniform, peeling can be easily performed without damaging the semiconductor chip 10 during the peeling.

DESCRIPTION OF SYMBOLS 1 Pickup apparatus 2 Case 3 Claw 3a Central nail 4 Suction surface 5 Chip support area 6 Groove 7 Suction groove 8 Support part 8b Support surface 9 Recessed part 10 Semiconductor chip 11 Adhesive sheet 12 Peel area 15 Suction hole 16 Central nail hole 17 Collet 8a Outer frame line 10a Corner part 10b Line 20a Movement direction of nail 20b Peeling direction

Claims (1)

A semiconductor chip pickup device for removing a semiconductor chip attached to an adhesive sheet from the adhesive sheet,
A stage that is in close contact with the surface of the pressure-sensitive adhesive sheet that is opposite to the surface on which the semiconductor chip is attached has a support portion that has a support surface that supports the semiconductor chip in contact with the pressure-sensitive adhesive sheet, and a plurality of pressure-sensitive adhesive sheets A suction surface having a suction hole,
The support surface of the support portion forms a surface protruding from the suction surface, and the support surface is provided with a claw for moving on the diagonal line of the semiconductor chip and pushing up the adhesive sheet, and a groove for moving the claw. A semiconductor chip pick-up device in which a support surface is arranged with a predetermined width along the surface.

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