JP2014096400A5 - - Google Patents

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Publication number
JP2014096400A5
JP2014096400A5 JP2012245316A JP2012245316A JP2014096400A5 JP 2014096400 A5 JP2014096400 A5 JP 2014096400A5 JP 2012245316 A JP2012245316 A JP 2012245316A JP 2012245316 A JP2012245316 A JP 2012245316A JP 2014096400 A5 JP2014096400 A5 JP 2014096400A5
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Japan
Prior art keywords
flux
workpiece
simulation method
processing
scattering
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JP2012245316A
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English (en)
Japanese (ja)
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JP5974840B2 (ja
JP2014096400A (ja
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Priority to JP2012245316A priority Critical patent/JP5974840B2/ja
Priority claimed from JP2012245316A external-priority patent/JP5974840B2/ja
Priority to CN201310507750.3A priority patent/CN103809462A/zh
Priority to US14/067,538 priority patent/US9881104B2/en
Publication of JP2014096400A publication Critical patent/JP2014096400A/ja
Publication of JP2014096400A5 publication Critical patent/JP2014096400A5/ja
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JP2012245316A 2012-11-07 2012-11-07 シミュレーション方法、シミュレーションプログラム、シミュレータ、加工装置、半導体装置の製造方法 Active JP5974840B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012245316A JP5974840B2 (ja) 2012-11-07 2012-11-07 シミュレーション方法、シミュレーションプログラム、シミュレータ、加工装置、半導体装置の製造方法
CN201310507750.3A CN103809462A (zh) 2012-11-07 2013-10-24 模拟方法及程序、模拟器、加工设备和制造半导体装置的方法
US14/067,538 US9881104B2 (en) 2012-11-07 2013-10-30 Simulating shape of a workpiece based on a flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012245316A JP5974840B2 (ja) 2012-11-07 2012-11-07 シミュレーション方法、シミュレーションプログラム、シミュレータ、加工装置、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2014096400A JP2014096400A (ja) 2014-05-22
JP2014096400A5 true JP2014096400A5 (enExample) 2015-11-12
JP5974840B2 JP5974840B2 (ja) 2016-08-23

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JP2012245316A Active JP5974840B2 (ja) 2012-11-07 2012-11-07 シミュレーション方法、シミュレーションプログラム、シミュレータ、加工装置、半導体装置の製造方法

Country Status (3)

Country Link
US (1) US9881104B2 (enExample)
JP (1) JP5974840B2 (enExample)
CN (1) CN103809462A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5685762B2 (ja) * 2011-03-07 2015-03-18 みずほ情報総研株式会社 プラズマ加工形状シミュレーション装置及びプログラム
US20170062286A1 (en) 2015-09-01 2017-03-02 Kabushiki Kaisha Toshiba Semiconductor manufacturing method and semiconductor manufacturing apparatus
US10599789B2 (en) * 2015-11-25 2020-03-24 Synopsys, Inc. Topography simulation of etching and/or deposition on a physical structure
US10197908B2 (en) * 2016-06-21 2019-02-05 Lam Research Corporation Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
JP2018067677A (ja) * 2016-10-21 2018-04-26 ソニーセミコンダクタソリューションズ株式会社 ダメージ予測方法、プログラム、および半導体加工システム
CN108663990B (zh) * 2018-04-16 2019-11-22 华中科技大学 一种基于两级体素化模型的多轴加工干涉检测与处理方法
CN108932922B (zh) * 2018-07-03 2021-05-14 京东方科技集团股份有限公司 一种修复能力测试装置及方法
US10677586B2 (en) * 2018-07-27 2020-06-09 Kla-Tencor Corporation Phase revealing optical and X-ray semiconductor metrology
US11610297B2 (en) * 2019-12-02 2023-03-21 Kla Corporation Tomography based semiconductor measurements using simplified models

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888240B1 (ja) * 1998-03-26 1999-05-10 日本電気株式会社 スパッタ形状シミュレーション方法
JP2002050553A (ja) 2000-07-31 2002-02-15 Toshiba Corp 形状シミュレーション方法および形状シミュレーションを行うプログラムを記憶したコンピュータ読み取り可能な記憶媒体
US9037445B2 (en) * 2007-07-10 2015-05-19 University of Pittsburgh—of the Commonwealth System of Higher Education Flux balance analysis with molecular crowding
JP5087386B2 (ja) * 2007-12-18 2012-12-05 オリンパス株式会社 顕微鏡
JP5428450B2 (ja) * 2009-03-30 2014-02-26 ソニー株式会社 イオン照射ダメージの予測方法とイオン照射ダメージのシミュレータ、およびイオン照射装置とイオン照射方法
EP2515168B1 (en) * 2011-03-23 2021-01-20 ASML Netherlands B.V. Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures

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