JP2014086609A - Semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem in a semiconductor device manufacturing method in the past using a transfer mold method that when the number of cavities is increased, a clamp pressure of an encapsulation mold decreases to produce poor molded appearance caused by resin leakage and when a mold clamping pressure of the encapsulation mold is increased, it becomes necessary to use a large-sized press device thereby to increase cost of a manufacturing device.SOLUTION: In a semiconductor device manufacturing method, a plurality of semiconductor chips are resin encapsulated by providing a first plunger unit 12 and a second plunger unit 14, which join a plurality of plungers 4 provided corresponding to a plurality of pots 16 and performing resin injection by the first plunger unit 12 and resin injection by the second plunger unit with a time difference.

Description

  The present invention relates to a method for manufacturing a semiconductor device, and in particular, can be suitably used for a resin sealing method for a semiconductor device using a transfer mold method.

  Japanese Patent Laid-Open No. 8-323799 discloses a method for individually controlling the molding pressure and the injection speed of an injection resin into each cavity in a multibot in the resin sealing of a semiconductor device in which a semiconductor chip is resin-sealed using a transfer molding method. (Patent Document 1).

JP-A-8-323799

In the method of manufacturing a semiconductor device disclosed in Patent Document 1, when the number of cavities that can be sealed by a single resin injection is increased in order to increase production efficiency, the clamping surface pressure of the sealing mold is lowered, and the resin mole causes A molding appearance defect occurs. As a countermeasure, it is conceivable to increase the clamping pressure of the sealing mold, but it is necessary to use a large press device, which increases the price of the manufacturing apparatus and the manufacturing price of the semiconductor device.
Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

  Of the means for solving the problems disclosed in the present application, the outline of typical ones will be briefly described as follows.

  According to one embodiment, a first plunger unit that connects a plurality of plungers provided corresponding to a plurality of pots, a second plunger unit, resin injection by the first plunger unit, By performing resin injection by the second plunger unit with a time difference, a plurality of semiconductor chips are sealed with resin.

  According to one embodiment, it is possible to obtain a method of manufacturing a semiconductor device by a transfer molding method that can increase the number of cavities that can be sealed without increasing the mold clamping pressure.

3 is a plan view of a lower mold for resin sealing according to Embodiment 1. FIG. It is sectional drawing of the metal mold | die for resin sealing along the AA 'line of FIG. It is sectional drawing of the metal mold | die for resin sealing along the BB 'line of FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. It is a top view of the lower mold | type of FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. It is a top view of the lower mold | type of FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. It is a top view of the lower mold | type of FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. It is a top view of the lower mold | type of FIG. 6 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the first embodiment. FIG. 6 is an operation time chart of a process of the semiconductor device manufacturing method according to the first embodiment. 6 is a cross-sectional view of a resin sealing mold according to Embodiment 2. FIG. 6 is a cross-sectional view of a resin sealing mold according to Embodiment 2. FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. It is a top view of the lower mold | type of FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. It is a top view of the lower mold | type of FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. It is a top view of the lower mold | type of FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. It is a top view of the lower mold | type of FIG. 11 is a cross-sectional view illustrating a process of the semiconductor device manufacturing method according to the second embodiment. FIG. 6 is an operation time chart of a process of the semiconductor device manufacturing method according to the second embodiment.

Hereinafter, embodiments will be described in detail with reference to the drawings.
In the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other, and one is related to some or all of the other, such as modifications, application examples, detailed explanations, and supplementary explanations. In the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), the number is not limited to the specific number, and may be greater than or equal to the specific number. . However, the case where it is clearly specified and the case where it is clearly limited to a specific number in principle is excluded.

  Furthermore, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Similarly, in the following embodiments, references to shapes, positional relationships, and the like of components and the like include those that are substantially similar or similar to the shapes and the like. However, this excludes the case where it is clearly indicated and the case where it is not clearly apparent in principle. The same applies to the above numbers and the like (including the number, numerical value, quantity, range, etc.).

  Note that components having the same function are denoted by the same or related reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted in principle. In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

<Embodiment 1>
FIG. 1 is a plan view of a lower mold for resin sealing used for resin sealing by a transfer molding method according to the first embodiment. As shown in the figure, the lower mold 3 has a rectangular plane. A plurality of pots 16 are provided in a row along the long side of the rectangular shape, and the plurality of pots 16 extend across the middle of the short side of the rectangular shape on the extended line of the row of the provided pots. The pot rows are arranged. As can be seen from FIG. 1, the plurality of pots 16 are a first pot 16-1, a second pot 16-2, a third pot 16-3, a fourth pot 16-4, and a fifth pot 16. -5, 6th pot 16-6, consisting of 6 pots. A runner 17 extends from each of the plurality of pots 16 and is connected to the plurality of cavities 7. Two strip-shaped lead frames 5 are provided on the surface of the lower mold 3 so as to cover the plurality of cavities 7.

  FIG. 2 is a cross-sectional view of the resin sealing mold including the upper mold 2 corresponding to A? A 'in FIG. As can be seen from the figure, the upper mold 2 and the lower mold 3 form a plurality of cavities 7. The third pot 16-3 is located in the middle of the plurality of cavities. Further, a third plunger 4-3 corresponding to the third pot 16-3 and a first plunger unit 13 connected thereto are described. The first plunger unit 13 can be raised in the direction of arrow 13. Further, as will be described later, a second plunger unit 14 connected to a plunger different from the third plunger 4-3 is located below the first plunger unit 13. The second plunger unit 14 can also be raised in the direction of the arrow 15. 8 indicates the pressure applied by the clamping press.

  Next, FIG. 3 is a cross-sectional view of the resin sealing mold along the line BB ′ in FIG. 2 (in the lower mold, the BB ′ cross section in FIG. 1). As shown in the figure, a plurality of plungers 4 corresponding to the plurality of pots 16-1 to 16-6, that is, first plunger 4-1 to sixth plunger 4-6 are provided. And the 1st plunger 4-1, the 3rd plunger 4-3, and the 5th plunger 4-5 are connected by the 1st plunger unit 12, and they can move up and down integrally. The second plunger 4-2, the fourth plunger 4-4 and the sixth plunger 4-6 are connected by the second plunger unit 14 so that they can move up and down integrally.

  In the present embodiment, the first plunger unit 12 and the second plunger unit 14 described above perform the dividing operation based on the time difference between the plurality of plungers, thereby injecting resin into the plurality of cavities via the plurality of pots 16. Is performed in a divided manner.

  Next, a resin sealing method by a transfer molding method using the resin sealing mold shown in FIGS. 1 to 3 will be described with reference to FIGS.

  (1-1) First, as shown in FIG. 4, so-called mold opening is performed to open the upper mold 2 and the lower mold 3 of the resin sealing mold. FIG. 4 is a cross-sectional view of the resin sealing mold, which is a cross-section taken along the line BB ′ of FIG. The lower die 3 is also a BB ′ cross section of FIG. As can be seen from FIG. 4, the first, third, and fifth plungers connected to the first plunger unit 12 are positioned above the other second, fourth, and sixth plungers connected to the second plunger unit 14. It has become a state. The upper mold 2 and the lower mold 3 are heated in advance with a heater (not shown).

  (1-2) Next, two strip-shaped lead frames 5 are installed on the surface of the lower mold 3 in this mold open state. As shown in FIG. 5, the lead frame 5 is installed so as to cover the cavity 7 in a region excluding a portion where a plurality of pots are arranged. FIG. 5 is a plan view of the lower mold 3. A plurality of semiconductor chips are mounted on the lead frame 5 and wire-bonded (not shown).

  (1-3) Next, as shown in FIG. 6, a resin tablet 6 made of an epoxy resin or the like is put on each plunger (all plungers) 4. Since the lead frame 5 is not visible in the cross section of FIG. 6, it is not shown in the cross section of FIG. FIG. 7 is a plan view of the lower mold 3 of FIG. In this state, the resin tablet 6 is given heat from the lower mold 3.

  (1-4) Then, as shown in FIG. 8, the lower mold 3 is raised 10 in the direction of the upper mold 2 and clamped. FIG. 9 is a cross-sectional view of a state in which the upper mold 2 and the lower mold 3 are clamped together. As shown in the figure, the resin tablet 6 put on the first, third, and fifth plungers connected to the first plunger unit 12 is connected to the second plunger unit 14. 4. It is located above the resin tablet 6 put on the sixth plunger. By this clamping, the resin tablet 6 is melted by applying heat from the upper mold 2 and the lower mold 3.

  (1-5) Next, as shown in FIG. 10, the first plunger unit 12 is raised in the direction of the arrow 13, and the molten resin tablet 6 is moved from the runner 17 through the pot 16 to one of the cavities 7. Inject into the partial cavity 7. That is, the resin tablet 6 is injected from the runner 17 into the cavity 7 through the pot 16 in a resin state heated and melted by the upper mold 2 and the lower mold 3. The plan view of FIG. 11 shows the state where the resin is injected. In the same figure, the part indicated by the vertical straight line is the part where the resin is injected. The mold cures the injected resin for a predetermined time while maintaining the mold clamping pressure with the mold being clamped (holding pressure curing).

  (1-6) Next, as shown in FIG. 12, the second plunger unit 14 is raised in the direction of the arrow 15 to leave the remaining second plunger 4-2, fourth plunger 4-4, and sixth plunger. The resin tablet 6 that has been charged and melted into each of 4-6 is injected from the runner 17 to the other portions of the plurality of cavities 7. That is, the resin tablet 6 is injected from the runner 17 into the cavity 7 through the pot 16 in a resin state heated and melted by the upper mold 2 and the lower mold 3. FIG. 13 is a plan view showing this state, in which resin is injected into all the cavities 7, and the injected resin is cured for a predetermined time while maintaining the clamping pressure in the clamping state (holding pressure curing).

  (1-7) Next, as shown in FIG. 14, the lower die 3 is lowered 11 to a predetermined position to open the die, and a semiconductor chip (not shown) sealed with resin is taken out together with the lead frame 5. Thereby, the resin sealing of the semiconductor device is completed.

  FIG. 15 shows an operation time chart of the resin sealing method of the semiconductor device using the transfer molding method of the first embodiment. As shown in the figure, the resin tablet 6 is loaded in a state where the mold having the first plunger unit 12 and the second plunger unit 14 having different lower origins is opened, that is, in the state shown in FIG. 7), the lower mold 3 is raised and clamped together with the upper mold 2 (FIG. 9), and after the mold clamping, the first plunger unit 12 is lifted and connected to the first plunger 4 −1, the third plunger 4-3 and the fifth plunger 4-5 are raised. Thereby, resin is inject | poured into a some cavity via the 1st pot 16-1, the 3rd pot 16-3, and the 5th pot 16-5 corresponding to them (FIG. 11). Then, the mold clamping pressure is maintained while the upper mold 2 and the lower mold 3 are clamped, and the injected resin is cured for a predetermined time (pressure-holding curing).

  And the 2nd plunger 4-2, the 4th plunger 4-4, and the 6th plunger 4-6 which raise the 2nd plunger unit 14 in the state of the above-mentioned pressure retention hardening and are connected to this also raise. The resin is injected into the plurality of cavities 7 through the second pot 16-2, the fourth pot 16-4, and the sixth pot 16-6 corresponding to them (FIGS. 12 and 13). Then, the mold clamping pressure is maintained while the upper mold 2 and the lower mold 3 are clamped, and the injected resin is cured for a predetermined time (pressure-holding curing).

  Thereafter, the lower mold 3 is lowered and the mold is opened. The first plunger unit 12 and the second plunger unit 14 are also returned to the lower origin.

  Here, the necessary mold clamping pressure is represented by “(resin injection area (number of cavities) + resin clamp area) × injection pressure per unit area”. In the first embodiment, resin injection with the first plunger unit (first time) and resin injection with the second plunger unit (second time) are divided into two times, and the resin is injected with a time difference. ing. The clamp area of the resin stopper and the injection pressure per unit area in each are the same. However, since the resin injection area per time is halved, the necessary clamping pressure is ½ of the pressure required in the conventional method. In other words, even if the number of cavities to be sealed by resin injection is increased in order to increase production efficiency, it is not necessary to increase the clamping pressure of the sealing mold (half required in the past), and a large press device is used. There is no need to do.

  According to the semiconductor device manufacturing method as described above, the number of cavities that can be sealed can be increased without increasing the mold clamping pressure. The production efficiency can be improved without using the press device.

<Embodiment 2>
In this embodiment, the resin sealing mold shown in FIGS. 1 to 3 of the first embodiment is used.

  (2-1) First, as shown in FIGS. 16 and 17, the second plunger unit 14 is lifted 15 and the second plunger 4-2 and the fourth plunger connected thereto are connected to the mold. 4-4, the sixth plunger 4-6, the first plunger 4-1, the third plunger 4-3, the fifth plunger 4-5 connected to the first plunger unit 12 at the upper position of each It should be the same position as each upper position. The upper mold 2 and the lower mold 3 are heated in advance with a heater (not shown).

  (2-2) Next, as shown in FIG. 18, the resin sealing mold is opened, and a lead frame 5 (not shown) on which a semiconductor chip is mounted and wire-bonded is placed on the upper surface of the lower mold 3. Install. The lead frame 5 is not shown in the cross section of FIG. FIG. 19 is a plan view of the lower mold 3 in this state. As can be seen from the figure, the lead frame 5 is two strip-shaped lead frames 5 and is installed so as to cover the cavity 7 in a region other than the place where the plurality of pots 16 are arranged.

  (2-3) As shown in FIG. 20, a plurality of resin tablets 6 made of, for example, epoxy resin having different curing times are put into the plurality of pots 16 and a plurality of plungers 4 (4- 1, 4-2, 4-3, 4-4, 4-5, 4-6) A plurality of resin tablets 6 having different curing times are mounted on the respective upper portions. The resin tablet 6 is composed of a resin tablet 6-1 having a fast curing time and a resin tablet 6-2 having a slow curing time. The resin tablet 6-1 having a fast curing time is mounted on the upper portions of the first plunger 4-1, the third plunger 4-3, and the fifth plunger 4-5 connected to the first plunger unit 12, respectively. The Further, the resin tablet 6-2 having a slow curing time is placed on the upper part of each of the second plunger 4-2, the fourth plunger 4-4, and the sixth plunger 4-6 connected to the second plunger unit 14. Installed. FIG. 21 is a plan view of the lower mold 3 with the two types of resin tablets 6 (6-1, 6-2) inserted therein. In this state, the resin tablet 6 is given heat from the lower mold 3.

  (2-4) The lower mold 3 is raised 10 as shown in FIG. 22, and the upper mold 2 and the lower mold 3 are clamped as shown in FIG. The lead frame 5 is clamped by this clamping. Since the lead frame 5 is not provided in the cross section of FIG. At this stage, the resin tablet 6 (6-1, 6-2) is melted by applying heat from the upper mold 2 and the lower mold 3. And as shown in the figure, the 1st plunger unit 12 and the 2nd plunger unit 14 are raised 13 and 15 simultaneously. At this time, the first plunger unit 12 is raised under the condition that the amount of increase per unit time is larger than that of the second plunger unit 14.

  (2-5) And, as shown in FIG. 24, first, due to the difference in the amount of increase, first plunger 4-1 connected to first plunger unit 12, third plunger 4-3, A molten resin tablet 6-1 (molten resin) mounted on the upper part of each of the fifth plungers 4-5 is placed in the first pot 16-1, the third pot 16-3, and the fifth pot 16-5. Injection is performed from the runner 17 to some of the cavities 7-1 through the three pots. Since the rising amount per unit time of the second plunger unit 14 is smaller than that of the first plunger unit 12, the resin injection into the remaining other cavities 7-2 due to the rising of the second plunger unit 14 is as follows. This is slower than the resin injection by the first plunger unit 12.

FIG. 25 is a plan view of the lower mold 3 in this state. A portion indicated by a vertical straight line in the figure is a portion where molten resin is injected. As shown in the figure, the molten resin tablet 6-1 (molten resin) having a fast curing time is sufficiently injected into the first cavity 7-1, while the molten resin tablet 6 having a slow curing time is used. -2 (molten resin) is still insufficiently injected into the second cavity 7-2, and the mold is injected into the cavity 7-1 while maintaining the clamping pressure while the mold is still clamped. The cured resin is cured for a predetermined time (holding pressure curing).

  (2-6) Next, as shown in FIG. 26, the second plunger unit 14 is raised 15 to a predetermined position, and the resin tablet 6-2 having a slow curing time is placed in the second pot 16-2 and the fourth pot. 16-4 and the sixth pot 16-6 are respectively injected from the runner 17 into the remaining cavities 7-2 of the plurality of cavities 7. FIG. 27 is a plan view of the lower mold 3 in this state. A portion indicated by a vertical straight line in the figure is a portion where molten resin is injected. As shown in the figure, the resin is sufficiently injected into the insufficiently injected cavity 7-2 shown in FIG. 25, and the resin injection into all the cavities 7 (7-1, 7-2) is completed. To do. Here, the 2nd plunger unit 14 which inject | pours the resin tablet 6-2 with slow curing time raises slowly according to the injection | pouring pressure holding hardening of the resin tablet 6-1 with early curing time, and performs resin injection | pouring. The mold is cured for a predetermined time while maintaining the mold clamping pressure with the mold being clamped (holding pressure curing).

  (2-7) Next, as shown in FIG. 28, the lower mold 3 is lowered 11 to a predetermined position to open the mold, and a semiconductor chip (not shown) sealed with resin is taken out together with the lead frame 5. This completes the resin sealing of the semiconductor device.

  FIG. 29 shows an operation time chart of the resin sealing method of the semiconductor device using the transfer molding method of the second embodiment.

  As shown in the figure, first, the first plunger 4-1, the third plunger 4-3, the fifth plunger 4-5, the second plunger 4-2, the fourth plunger 4-4, The upper position of each of the plungers 4-6 is set to the same position (FIG. 17). Then, the mold is opened (FIG. 18). Then, in this opened state, resin tablets 6-1 and 6-2 having different curing times are put in (FIG. 20). Then, the lower mold 3 is raised and clamped together with the upper mold 2 (FIG. 23). After the mold is clamped, the first plunger unit 12 and the second plunger unit 14 having different rising amounts per unit time are raised. Since the first plunger unit 12 has a larger amount of increase per unit time than the second plunger unit 14, the first resin tablet 6-1 (molten resin) having a fast curing time has a second curing time that is slow. Prior to the resin tablet 6-2 (molten resin), it is injected into the first cavity 7-1 which is a part of the cavity 7 (FIGS. 24 and 25). The mold is cured for a predetermined time while maintaining the mold clamping pressure with the mold being clamped (holding pressure curing).

  And at the time of the said holding pressure hardening, the 2nd plunger unit 12 raises to predetermined | prescribed height. Thereby, the 2nd resin tablet 6-2 (molten resin) with a late hardening time is inject | poured into several other 2nd cavity 7-2 (FIG. 26, FIG. 27). The mold clamping pressure is maintained while the upper mold 2 and the lower mold 3 of the mold are clamped, and the injected resin is cured for a predetermined time (pressure-holding curing).

  Thereafter, the lower mold 3 is lowered to open the mold (FIG. 28), and the first plunger unit 12 and the second plunger unit 14 are also returned to the lower origin.

  In the second embodiment, the first plunger unit 12 is increased in the amount of increase per unit time than the amount of increase in the second plunger unit 14 per unit time. Even if 12 and the second plunger unit 14 are raised at the same time, the resin can be injected into the cavity 7 in two stages. Moreover, since the injected resin uses the first resin tablet 6-1 with a fast curing time and the second resin tablet 6-2 with a slow curing time, even if there is a difference in arrival time to the cavity 7, That is, even if the arrival time from the pot 16 of the second resin tablet 6-2 to the cavity 7 is longer than that of the first resin tablet 6-1, it does not harden in the middle and is sufficiently transferred to the cavity 7-2. Injected

  Also in the second embodiment, the necessary clamping pressure is “(resin injection area (number of cavities) + clamp area of resin stopper) × injection pressure per unit area” as described in the first embodiment. It is represented by Therefore, since the resin injection area per one time is halved, the necessary clamping pressure is ½ of the pressure required in the conventional method. In other words, even if the number of cavities to be sealed by resin injection is increased in order to increase production efficiency, it is not necessary to increase the clamping pressure of the sealing mold (half required in the past), and a large press device is used. There is no need to do.

  According to the semiconductor device manufacturing method as described above, the number of cavities that can be sealed can be increased without increasing the mold clamping pressure. The production efficiency can be improved without using the press device.

As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.
For example, the positional relationship between the upper mold 2 and the lower mold 3 may be reversed. Further, the mold clamping may lower the upper mold 2, and the mold opening may raise the upper mold 2.

1: mold clamping press 1a: mold clamping press upper mold 1b: mold clamping press lower mold 2: sealing mold upper mold 3: sealing mold lower mold 4: plunger 4-1: first plunger 4- 2: Second plunger 4-3: Third plunger 4-4: Fourth plunger 4-5: Fifth plunger 4-6: Sixth plunger 5: Lead frame 6: Resin tablet 6-1 1st resin tablet 6-2: 2nd resin tablet 7: Cavity 7-1: 1st cavity 7-2: 2nd cavity 8: Pressurizing force 9: Ascending direction of plunger unit 10: Under clamping press Die ascending direction 11: Clamping press lower die descending direction 12: First plunger unit 13: First plunger unit ascending direction 14: Second plunger unit 15: Ascending direction of second plunger unit 16: pot 6-1: The first pot 16-2: second pot 16-3: 3 Pot 16-4: 4 Pot 16-5: 5 Pot 16-6: 6 Pot 17: runner

Claims (6)

The first mold of a resin sealing mold having first and second molds, a plurality of pots formed in a row, and a plurality of cavities connected to the plurality of pots via runners The mold has a plurality of plungers corresponding to the plurality of pots, a part of the plurality of plungers is connected to a first plunger unit, and the other part of the plurality of plungers is connected to a second plunger unit, A first step of injecting resin into a part of the plurality of cavities through a part of the plurality of pots by the first plunger unit;
A second step of injecting resin into the other parts of the plurality of cavities through the other parts of the plurality of pots by the second plunger unit;
And a third step of resin-sealing a plurality of semiconductor chips by holding the mold into which the resin has been injected for a predetermined time to advance the curing of the resin.   A first step of injecting resin into one part of the plurality of cavities and a second step of injecting resin into the other part of the plurality of cavities include a first mold and a second mold of the resin sealing mold. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the method is performed in a state in which the metal mold is clamped.   2. The semiconductor device according to claim 1, wherein the first step of injecting resin into one part of the plurality of cavities starts the resin injection before the second step of injecting resin into the other part of the plurality of cavities. Manufacturing method.   2. The resin sealing of a semiconductor device according to claim 1, wherein a part of the plurality of plungers connected to the first plunger unit and the other part of the plurality of plungers connected to the second plunger unit are alternately arranged. Method.   Resin injected into a part of the plurality of cavities through a part of the plurality of pots by the first plunger unit, and the plurality of parts through the other part of the plurality of pots by the second plunger unit. The resin sealing method for a semiconductor device according to claim 1, wherein the resin injected into the other part of the cavity has a different curing time.   The resin sealing method for a semiconductor device according to claim 1, wherein the resin is an epoxy resin.