JP2014082362A5 - - Google Patents

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Publication number
JP2014082362A5
JP2014082362A5 JP2012229799A JP2012229799A JP2014082362A5 JP 2014082362 A5 JP2014082362 A5 JP 2014082362A5 JP 2012229799 A JP2012229799 A JP 2012229799A JP 2012229799 A JP2012229799 A JP 2012229799A JP 2014082362 A5 JP2014082362 A5 JP 2014082362A5
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JP
Japan
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solder
recess
preparing
manufacturing
members
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JP2012229799A
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English (en)
Japanese (ja)
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JP5889160B2 (ja
JP2014082362A (ja
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Publication of JP2014082362A5 publication Critical patent/JP2014082362A5/ja
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JP2012229799A 2012-10-17 2012-10-17 電子機器の製造方法 Active JP5889160B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012229799A JP5889160B2 (ja) 2012-10-17 2012-10-17 電子機器の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012229799A JP5889160B2 (ja) 2012-10-17 2012-10-17 電子機器の製造方法

Publications (3)

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JP2014082362A JP2014082362A (ja) 2014-05-08
JP2014082362A5 true JP2014082362A5 (https=) 2014-11-20
JP5889160B2 JP5889160B2 (ja) 2016-03-22

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JP2012229799A Active JP5889160B2 (ja) 2012-10-17 2012-10-17 電子機器の製造方法

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JP (1) JP5889160B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL
JP7831484B2 (ja) * 2021-06-30 2026-03-17 株式会社レゾナック はんだバンプ形成方法
WO2023277085A1 (ja) * 2021-06-30 2023-01-05 昭和電工マテリアルズ株式会社 はんだバンプ形成用部材
CN119340211A (zh) * 2024-12-18 2025-01-21 广州先艺电子科技有限公司 一种在陶瓷管壳上预置金锡焊料的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04321230A (ja) * 1990-12-04 1992-11-11 Nec Corp 半田供給方法
JPH09199504A (ja) * 1996-01-18 1997-07-31 Nec Corp 半田供給方法
JP3401391B2 (ja) * 1996-04-16 2003-04-28 日本特殊陶業株式会社 半田バンプを有する基板の製造方法
JP4811655B2 (ja) * 2006-07-05 2011-11-09 日立金属株式会社 異径ボール搭載用治具及び異径ボール搭載方法
JP2012049207A (ja) * 2010-08-25 2012-03-08 Ulvac Seimaku Kk バンプ形成方法

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