JP2014082362A5 - - Google Patents
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- JP2014082362A5 JP2014082362A5 JP2012229799A JP2012229799A JP2014082362A5 JP 2014082362 A5 JP2014082362 A5 JP 2014082362A5 JP 2012229799 A JP2012229799 A JP 2012229799A JP 2012229799 A JP2012229799 A JP 2012229799A JP 2014082362 A5 JP2014082362 A5 JP 2014082362A5
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- Prior art keywords
- solder
- recess
- preparing
- manufacturing
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- 229910000679 solder Inorganic materials 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012229799A JP5889160B2 (ja) | 2012-10-17 | 2012-10-17 | 電子機器の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012229799A JP5889160B2 (ja) | 2012-10-17 | 2012-10-17 | 電子機器の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014082362A JP2014082362A (ja) | 2014-05-08 |
| JP2014082362A5 true JP2014082362A5 (cg-RX-API-DMAC7.html) | 2014-11-20 |
| JP5889160B2 JP5889160B2 (ja) | 2016-03-22 |
Family
ID=50786282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012229799A Active JP5889160B2 (ja) | 2012-10-17 | 2012-10-17 | 電子機器の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5889160B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4084051A4 (en) * | 2019-12-27 | 2023-08-02 | Resonac Corporation | SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL |
| JP7831484B2 (ja) * | 2021-06-30 | 2026-03-17 | 株式会社レゾナック | はんだバンプ形成方法 |
| WO2023277085A1 (ja) * | 2021-06-30 | 2023-01-05 | 昭和電工マテリアルズ株式会社 | はんだバンプ形成用部材 |
| CN119340211A (zh) * | 2024-12-18 | 2025-01-21 | 广州先艺电子科技有限公司 | 一种在陶瓷管壳上预置金锡焊料的方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04321230A (ja) * | 1990-12-04 | 1992-11-11 | Nec Corp | 半田供給方法 |
| JPH09199504A (ja) * | 1996-01-18 | 1997-07-31 | Nec Corp | 半田供給方法 |
| JP3401391B2 (ja) * | 1996-04-16 | 2003-04-28 | 日本特殊陶業株式会社 | 半田バンプを有する基板の製造方法 |
| JP4811655B2 (ja) * | 2006-07-05 | 2011-11-09 | 日立金属株式会社 | 異径ボール搭載用治具及び異径ボール搭載方法 |
| JP2012049207A (ja) * | 2010-08-25 | 2012-03-08 | Ulvac Seimaku Kk | バンプ形成方法 |
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2012
- 2012-10-17 JP JP2012229799A patent/JP5889160B2/ja active Active