JP2014060463A - チップ抵抗器およびその製造方法 - Google Patents
チップ抵抗器およびその製造方法 Download PDFInfo
- Publication number
- JP2014060463A JP2014060463A JP2014000940A JP2014000940A JP2014060463A JP 2014060463 A JP2014060463 A JP 2014060463A JP 2014000940 A JP2014000940 A JP 2014000940A JP 2014000940 A JP2014000940 A JP 2014000940A JP 2014060463 A JP2014060463 A JP 2014060463A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrodes
- pair
- chip resistor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 3
- 239000012779 reinforcing material Substances 0.000 claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 230000001681 protective effect Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014000940A JP2014060463A (ja) | 2008-05-14 | 2014-01-07 | チップ抵抗器およびその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008126942 | 2008-05-14 | ||
| JP2008126942 | 2008-05-14 | ||
| JP2014000940A JP2014060463A (ja) | 2008-05-14 | 2014-01-07 | チップ抵抗器およびその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008209615A Division JP2009302494A (ja) | 2008-05-14 | 2008-08-18 | チップ抵抗器およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014060463A true JP2014060463A (ja) | 2014-04-03 |
| JP2014060463A5 JP2014060463A5 (https=) | 2014-05-15 |
Family
ID=50616593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014000940A Pending JP2014060463A (ja) | 2008-05-14 | 2014-01-07 | チップ抵抗器およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2014060463A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101769871B1 (ko) * | 2014-10-17 | 2017-08-21 | 랄렉 일렉트로닉 코포레이션 | 저항기의 제조 방법 및 저항기 |
| CN108538527A (zh) * | 2018-06-19 | 2018-09-14 | 常德思高技术有限公司 | 一种片式电阻器及其制造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57158946A (en) * | 1981-03-25 | 1982-09-30 | Nitto Electric Ind Co | Method of producing metal core laminated board with electric resistance material layer |
| JPS62257702A (ja) * | 1986-04-30 | 1987-11-10 | イビデン株式会社 | 配線基板の製造方法 |
| JPH07192902A (ja) * | 1993-11-19 | 1995-07-28 | Isabellenhuette Heusler Gmbh Kg | Smd構造の抵抗器、その製造方法及びこの抵抗器を取り付けたプリント回路板 |
| JP2001351801A (ja) * | 2000-06-05 | 2001-12-21 | Rohm Co Ltd | チップ抵抗器 |
| JP2006332413A (ja) * | 2005-05-27 | 2006-12-07 | Rohm Co Ltd | チップ抵抗器およびその製造方法 |
| JP2007036012A (ja) * | 2005-07-28 | 2007-02-08 | Rohm Co Ltd | 大電力用チップ抵抗器 |
-
2014
- 2014-01-07 JP JP2014000940A patent/JP2014060463A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57158946A (en) * | 1981-03-25 | 1982-09-30 | Nitto Electric Ind Co | Method of producing metal core laminated board with electric resistance material layer |
| JPS62257702A (ja) * | 1986-04-30 | 1987-11-10 | イビデン株式会社 | 配線基板の製造方法 |
| JPH07192902A (ja) * | 1993-11-19 | 1995-07-28 | Isabellenhuette Heusler Gmbh Kg | Smd構造の抵抗器、その製造方法及びこの抵抗器を取り付けたプリント回路板 |
| JP2001351801A (ja) * | 2000-06-05 | 2001-12-21 | Rohm Co Ltd | チップ抵抗器 |
| JP2006332413A (ja) * | 2005-05-27 | 2006-12-07 | Rohm Co Ltd | チップ抵抗器およびその製造方法 |
| JP2007036012A (ja) * | 2005-07-28 | 2007-02-08 | Rohm Co Ltd | 大電力用チップ抵抗器 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101769871B1 (ko) * | 2014-10-17 | 2017-08-21 | 랄렉 일렉트로닉 코포레이션 | 저항기의 제조 방법 및 저항기 |
| CN108538527A (zh) * | 2018-06-19 | 2018-09-14 | 常德思高技术有限公司 | 一种片式电阻器及其制造方法 |
| CN108538527B (zh) * | 2018-06-19 | 2024-01-26 | 常德思高技术有限公司 | 一种片式电阻器及其制造方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009302494A (ja) | チップ抵抗器およびその製造方法 | |
| JP5256544B2 (ja) | 抵抗器 | |
| JP2016152301A (ja) | チップ抵抗器およびその製造方法 | |
| US10102948B2 (en) | Chip resistor and method for making the same | |
| KR20150087429A (ko) | 레이저 공정을 이용한 에스엠디 및 관통-홀 퓨즈의 제조능력 | |
| WO2009005108A1 (ja) | 抵抗器 | |
| TWI497535B (zh) | 具有軟性材料層之微電阻元件及其製造方法 | |
| WO2004093101A1 (ja) | チップ抵抗器およびその製造方法 | |
| US9514867B2 (en) | Chip resistor and method for making the same | |
| JP4012029B2 (ja) | 金属板抵抗器およびその製造方法 | |
| JP4632358B2 (ja) | チップ型ヒューズ | |
| WO2009104279A1 (ja) | チップヒューズ及びその製造方法 | |
| JP2014060463A (ja) | チップ抵抗器およびその製造方法 | |
| JP6120629B2 (ja) | チップ抵抗器、およびチップ抵抗器の製造方法 | |
| JP5464829B2 (ja) | チップ抵抗器およびその製造方法 | |
| CN102903467B (zh) | 具有软性材料层的微电阻元件及其制造方法 | |
| US20180096758A1 (en) | Chip resistor and mounting structure thereof | |
| JP2009272476A (ja) | チップ抵抗器およびその製造方法 | |
| JP2006310277A (ja) | チップ型ヒューズ | |
| JP6899246B2 (ja) | 電子部品 | |
| JP7461441B2 (ja) | 抵抗器 | |
| WO2020230713A1 (ja) | 抵抗器 | |
| JP6923615B2 (ja) | 抵抗器の製造方法 | |
| JP6732996B2 (ja) | チップ抵抗器 | |
| JP2017163165A (ja) | チップ抵抗器、およびチップ抵抗器の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140206 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140219 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20141024 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141118 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150512 |