JP2014054753A - Die for insert-forming, injection molding method and resin molded article formed by the die - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die for insert-forming capable of reducing a load on a wire cable.SOLUTION: A die for insert-forming 1 comprises: a first space 100 for filling a resin around a conductor 4 of a wire cable 3 and a covering part 5; a second space 200 which has a cross-sectional area smaller than that of the first space 100 and fills a resin around the covering part 5; and support parts 30 and 31 for supporting the covering part 5. The resin is prevented from being leaked out from a gap between the support parts 30 and 31 and the wire cable 3 by setting the cross-sectional area and length of the second space 200 so that a molten resin 8 is stopped to flow in the middle of the second space 200. Thus, a pressing force of the support parts to the wire cable can be reduced.

Description

  The present invention relates to an insert mold used for a resin mold of a wire cable, an injection molding method using the mold, and a resin molded product formed using the mold.

2. Description of the Related Art Conventionally, a connection portion between a lead wire of an electronic component and a wire cable is insert-molded and protected with a thermosetting resin.
When performing injection molding, if the molten resin leaks from the gap between the mold and the wire cable, the resin may harden and burrs may occur.
In order to prevent this, it is conceivable to hold the wire cable with a mold at a pressure higher than the pressure of the molten resin. However, in this case, a wire cable is used in which the covering portion is not easily deformed by the pressure applied from the mold and the heat of the mold.
On the other hand, when adopting a wire cable in which the covering portion is easily deformed by pressure and heat, a protective component such as a heat-shrinkable tube or heat-resistant tape is used before injection molding as in the method described in Patent Document 1. It is conceivable to protect the wire cable.

JP 2001-2338397 A

However, when the method of Patent Document 1 is used, a process for protecting the wire cable with a protective component is required, which complicates the manufacturing process. And the manufacturing cost becomes high by the increase in the number of parts. In addition, when pressure is indirectly applied to the wire cable from the mold via the protective component, the covering portion of the wire cable may be damaged.
The present invention has been made in view of the above problems, and provides an insert molding die, an injection molding method, and a resin molded product formed by the die, which can reduce the burden on a wire cable. With the goal.

According to the present invention, the mold for insert molding fills the periphery of the covering portion with the first space in which the resin and the covering portion of the wire cable are filled with the resin, and the cross-sectional area is smaller than that of the first space. A second space and a support portion that supports the covering portion are provided.
Thus, during injection molding, the resin leaks from the gap between the support portion and the wire cable by setting the cross-sectional area and length of the second space so that the molten resin stops flowing in the middle of the second space. Generation | occurrence | production of a burr | flash can be suppressed without taking out.
Moreover, since the molten resin stops flowing in the middle of the second space during injection molding, it is possible to reduce the pressing force of the support portion against the wire cable. Therefore, the burden on the wire cable due to the pressing force of the insert molding die and the burden on the wire cable due to the heat transmitted from the die to the wire cable can be reduced.
Furthermore, since the support portion supports the covering portion so that the covering portion of the wire cable is located in the center of the second space, it is possible to provide resin on the entire circumference of the covering portion. Therefore, by using this insert molding die, it is possible to prevent peeling of the resin provided around the covering portion.
Moreover, since the protective component which protects a wire cable is not used like the method of the said patent document 1, a manufacturing process can be simplified and manufacturing cost can be reduced.
In addition, the 1st metal mold | die part which has 1st space, the 2nd metal mold | die part which has 2nd space, and a support part may be comprised integrally, or may be comprised separately.

According to the present invention, in the injection molding method using the insert molding die, the pressure of the molten resin supplied from the gate to the first space, the resin viscosity, or the curing time of the molten resin is adjusted, and the second space is filled. The length or thickness of the resin is set.
Thereby, the length or thickness of the resin provided around the covering portion of the wire cable can be controlled.

  Furthermore, the present invention can also be understood as a resin molded product formed by the above injection molding method.

Sectional drawing of the metal mold | die for insert molding by 1st Embodiment of this invention. Explanatory drawing of the injection molding method using the metal mold | die for insert molding by 1st Embodiment. Explanatory drawing of the injection molding method using the metal mold | die for insert molding by 1st Embodiment. Sectional drawing of the resin molded product by the metal mold | die for insert molding by 1st Embodiment. Sectional drawing of the metal mold | die for insert molding by 2nd Embodiment of this invention. Explanatory drawing of the injection molding method using the metal mold | die for insert molding by 2nd Embodiment. Explanatory drawing of the injection molding method using the metal mold | die for insert molding by 2nd Embodiment. Explanatory drawing of the injection molding method using the metal mold | die for insert molding by 2nd Embodiment. The graph which shows the relationship between the heating time by a thermosetting resin, and resin viscosity. The graph which shows the relationship between the heating time by a thermoplastic resin, and resin viscosity. Sectional drawing of the metal mold | die for insert molding by 3rd Embodiment of this invention. Sectional drawing of the metal mold | die for insert molding by 4th Embodiment of this invention.

Hereinafter, a rotating electrical machine according to an embodiment of the present invention will be described with reference to the drawings.
(First embodiment)
The insert molding die and the like according to the first embodiment of the present invention are shown in FIGS. 1 to 3, and the resin molded product molded thereby is shown in FIG.
The insert molding die 1 according to the present embodiment is used for insert molding of a connecting portion between a lead wire 2 of an electronic component and a conductor 4 of a wire cable 3 and a covering portion 5 of the wire cable 3 with a thermosetting resin. It is done. In all the drawings, the main body of the electronic component is omitted.

As shown in FIG. 1, the insert molding die 1 includes an upper die 6 and a lower die 7. The upper mold 6 includes an upper first mold part 10, an upper second mold part 20, and an upper support part 30, and the lower mold 7 includes a lower first mold part 11, a lower second mold part 21, and The lower support part 31 is comprised. Hereinafter, the upper first mold part 10 and the lower first mold part 11 are simply referred to as first mold parts 10 and 11, and the upper second mold part 20 and the lower second mold part 21 are simply referred to as second molds. The mold parts 20 and 21 are referred to, and the upper support part 30 and the lower support part 31 are simply referred to as support parts 30 and 31.
1 to 3, the boundaries between the first mold parts 10 and 11 and the second mold parts 20 and 21 and the boundaries between the second mold parts 20 and 21 and the support parts 30 and 31 are conceptually illustrated. Although shown with a dashed-dotted line, the 1st metal mold | die parts 10 and 11, the 2nd metal mold | die parts 20 and 21, and the support parts 30 and 31 may be comprised integrally, or may be comprised separately.

The first mold parts 10 and 11 have a first space 100. The first space 100 can accommodate the lead wire 2 and the wire cable 3 of the electronic component to be inserted, and can fill resin around them. The first mold parts 10 and 11 are provided with a gate 13 for filling the first space 100 with molten resin at the time of injection molding.
The second mold parts 20 and 21 have a second space 200. The second space 200 has a smaller cross-sectional area than the first space 100 and communicates with the first space 100. The second space 200 can accommodate the covering portion 5 of the wire cable 3 to be inserted, and can fill the periphery of the covering portion 5 with resin.
The second space 200 is set to have a cross-sectional area and a length that allow the molten resin to stop flowing in the middle of the second space 200 at the time of injection molding based on the following formula 1.

但し、Ｌは、第２空間２００に充填される樹脂の長さ（ｍｍ）。（以下、第２空間２００に充填された樹脂を「オーバーフロー部」といい、その樹脂の長さを「オーバーフロー長」という）
ｈは、オーバーフロー部の肉厚（ｍｍ）。
Ｐは、第１空間１００の溶融樹脂の圧力（Ｐａ）。
μは、第２空間２００を流れる溶融樹脂の粘度（Ｐａ・ｓ）。
ｔは、第１空間１００に充填された溶融樹脂が第２空間２００に流れ始めてから、第２空間２００でその溶融樹脂が硬化するまでの時間（ｓ）。

However, L is the length (mm) of the resin with which the second space 200 is filled. (Hereinafter, the resin filled in the second space 200 is referred to as “overflow portion”, and the length of the resin is referred to as “overflow length”)
h is the thickness (mm) of the overflow part.
P is the pressure (Pa) of the molten resin in the first space 100.
μ is the viscosity (Pa · s) of the molten resin flowing in the second space 200.
t is a time (s) from when the molten resin filled in the first space 100 starts to flow into the second space 200 until the molten resin is cured in the second space 200.

By using Equation 1 above, it is possible to control the thickness h and the overflow length L of the overflow portion (see FIG. 3).
For example, the thickness h of the overflow portion is 0.01 mm, the pressure P of the molten resin in the first space 100 is 5000 Pa, the viscosity μ of the molten resin flowing through the second space 200 is 10 Pa · s, and the first space 100 is filled. When the time t from when the molten resin starts to flow into the second space 200 until the molten resin hardens in the second space 200 is 3 s, the overflow length L is 3.5 mm.
In that case, the second mold parts 20 and 21 set the distance between the inner wall of the second space 200 and the covering of the wire cable 3 to 0.01 mm, and the total length of the second space 200 to 3.5 mm. Set longer.

  The support portions 30 and 31 are provided on the opposite side of the second space 200 from the first space 100. The support portions 30 and 31 support the covering portion 5 so that the wire cable 3 is positioned at the center of the second space 200 without pressing the wire cable 3. Thereby, in the second space 200, the space 200 is formed on the entire circumference of the covering portion 5 of the wire cable 3.

Next, an injection molding method using the above-described insert molding die 1 will be described.
First, the upper mold 6 and the lower mold 7 are opened, and the lead wire 2 and the wire cable 3 of the electronic component are installed therebetween. A connection portion between the lead wire 2 and the conductive wire and a portion where the conductive wire protrudes from the covering portion 5 of the wire cable 3 are located in the first space 100. At this time, the lead wire 2 of the electronic component and the conducting wire of the wire cable 3 are connected by soldering or welding.
The first mold may be configured to accommodate the main body of the electronic component in the first space 100 together with the lead wire 2 of the electronic component.
The covering portion 5 of the wire cable 3 is located in the first space 100 and the second space 200.

  Next, as shown in FIG. 2, the upper mold 6 and the lower mold 7 are closed, and the resin 8 heated and melted by an injection unit (not shown) is transferred from the gate 13 of the first mold parts 10 and 11 to the first space 100. Injection injection. The molten resin 8 is a thermosetting resin, specifically an epoxy resin. The upper mold 6 and the lower mold 7 are heated to a temperature (for example, 170 ° C.) suitable for injection molding of the thermosetting resin used by a heating device (not shown).

As shown in FIG. 3, the molten resin 8 filled in the first space 100 flows into the second space 200. The molten resin 8 that has flowed into the second space 200 stops flowing in the second space 200 due to its flow resistance.
In the injection molding, the pressure P of the molten resin 8 supplied from the gate 13 to the first space 100, the resin viscosity μ, and the curing time t of the molten resin 8 are adjusted. Thereby, the length of the resin filled in the second space 200, that is, the overflow length L is set.
The upper and lower molds 6 and 7 hold pressure while maintaining the set temperature until the resin curing time t elapses. After the curing time t has elapsed, the upper mold 6 and the lower mold 7 are opened.

  Then, the resin molded product taken out from the mold is shown in FIG. An overflow portion 9 extending from the resin main body portion 50 of the resin molded product and covering the covering portion 5 of the wire cable 3 is provided on the entire circumference of the covering portion 5 of the wire cable 3 and is fixed to the covering portion 5 by the adhesive force of the epoxy resin. Has been.

The first embodiment has the following operational effects.
(1) In the first embodiment, the insert molding die 1 includes a first space 100, a second space 200, and support portions 30 and 31. At the time of injection molding, the support portions 30 and 31 and the wire cable 3 are set by setting the cross-sectional area and length of the second space 200 so that the molten resin 8 stops flowing in the middle of the second space 200 due to flow resistance. The occurrence of burrs can be suppressed without the resin leaking from the gap.

(2) In the first embodiment, at the time of injection molding, since the molten resin 8 stops flowing in the middle of the second space 200, it is possible to reduce the pressing force of the support portions 30 and 31 against the wire cable 3. is there. Therefore, the burden on the wire cable 3 due to the pressing force of the support portions 30 and 31 of the insert molding die 1 and the burden on the wire cable 3 due to the heat transmitted from the support portions 30 and 31 to the wire cable 3 can be reduced. .
(3) In the first embodiment, the support portions 30 and 31 support the covering portion 5 so that the covering portion 5 of the wire cable 3 is located in the center of the second space 200. Therefore, since the overflow part 9 is provided in the perimeter of the coating | coated part 5, peeling of the overflow part 9 can be prevented.

(4) In the first embodiment, in the injection molding method, the pressure P, the resin viscosity μ, or the curing time t of the molten resin 8 supplied from the gate 13 to the first space 100 is adjusted.
Thereby, the thickness h or the overflow length L of the overflow part 9 can be controlled.
(5) In the first embodiment, the resin used for injection molding is a thermosetting resin.
In the injection molding of a thermosetting resin in which a mold is heated to cure the resin, the insert molding mold 1 has a burden on the wire cable 3 due to the heat of the mold and a burden on the wire cable 3 due to the pressing force of the mold. It is suitable for reducing.

(6) In the first embodiment, the thermosetting resin is an epoxy resin.
Due to the high adhesiveness of the epoxy resin, the overflow portion 9 can be prevented from peeling off from the covering portion 5.

(Second Embodiment)
An insert molding die according to a second embodiment of the present invention is shown in FIGS. Moreover, the graph which shows the relationship between the heating time by a thermosetting resin and resin viscosity is shown in FIG. 9, and the graph which shows the relationship between the heating time by a thermoplastic resin and resin viscosity is shown in FIG.
In the following embodiments, the same reference numerals are given to substantially the same configurations as those in the first embodiment described above, and the description thereof is omitted.
Hereinafter, in FIG. 5 to FIG. 8 and FIG. 11, the boundary between the second mold part 20, 21 and the support part 30, 31 is conceptually shown by a one-dot chain line, but these may be configured integrally. Alternatively, it may be configured separately.

In the second embodiment, as shown in FIG. 5, the second mold parts 20 and 21 are made of a material having a higher thermal conductivity than the first mold parts 10 and 11. Examples of the material having high thermal conductivity include copper and aluminum.
Furthermore, in 2nd Embodiment, the cooling means which can cool the 2nd metal mold | die parts 20 and 21 is provided. The cooling means is, for example, a cooling device 40 that causes a cooling liquid to flow through a liquid flow path (not shown) provided in the second mold parts 20 and 21.
Alternatively, the cooling means includes, for example, the first heating device 41 that heats the first mold parts 10 and 11 and the second heating device 42 that heats the second mold parts 20 and 21. It is to reduce only the heating temperature.

An injection molding method using the insert molding die of the second embodiment will be described.
First, the upper mold 6 and the lower mold 7 are opened, and the lead wire 2 and the wire cable 3 of the electronic component are installed therebetween, and then the upper mold 6 and the lower mold 7 are closed.
Next, as shown in FIG. 6, the resin heated and melted by an injection unit (not shown) is injected and injected into the first space 100 from the gate 13 of the first mold parts 10 and 11. At this time, the upper mold 6 and the lower mold 7 are heated by the first heating device 41 and the second heating device 42 to a temperature suitable for injection molding of the thermosetting resin used.

As shown in FIG. 7, the molten resin 8 filled in the first space 100 flows into the second space 200. At this time, the second mold parts 20, 21 have higher heat dissipation than the first mold parts 10, 11, the operation of the cooling device 40, or the temperature setting of the second heating device 42, so The temperature is set lower than that of the mold parts 10 and 11.
Therefore, the viscosity μ of the molten resin 8 flowing through the second space 200 increases at the position indicated by the alternate long and short dash line α in FIG.
Thereby, as shown in FIG. 8, the molten resin 8 flowing through the second space 200 stops at a predetermined overflow length L due to flow resistance.
The upper and lower molds 6 and 7 hold pressure while maintaining the set temperature until the resin curing time t elapses. After the curing time t has elapsed, the upper mold 6 and the lower mold 7 are opened, and the resin molded product is taken out.

Here, the behavior of the resin when the thermosetting resin is rapidly cooled or rapidly heated will be described.
In FIG. 9, as indicated by a solid line A, the thermosetting resin is heated at a constant temperature (for example, 170 ° C.) from time t0 to time t1. Then, after time t1, the case where the resin is continuously heated at the same temperature is indicated by a broken line B, after time t1, the case where the resin is rapidly heated is indicated by an alternate long and short dash line C, and after time t1, the resin is rapidly cooled. This is indicated by a solid line D.

When the thermosetting resin is heated at a constant temperature (for example, 170 ° C.) from time t0 to time t1, the resin viscosity gradually decreases as shown by the solid line A.
Subsequently, when the resin continues to be heated at the same temperature (for example, 170 ° C.) after time t1, the resin viscosity gradually increases as shown by the broken line B, and the resin is cured at time t4. That is, the curing time when the thermosetting resin is heated at a constant temperature is shown from time t0 to time t4.

  On the other hand, when the resin is heated at a constant temperature (for example, 170 ° C.) from time t0 to time t1 and then rapidly heated after time t1, the viscosity once decreases and then increases again as shown by the alternate long and short dash line C. Thus, the resin is cured at time t3.

On the other hand, when the resin is heated from time t0 to time t1 at a constant temperature (for example, 170 ° C.) and rapidly cooled after time t1 (for example, 100 ° C.), the viscosity increases rapidly as indicated by the solid line D, and time t2 The resin hardens.
Therefore, in the injection molding using a thermosetting resin, the curing time (t0-t3) when the resin is rapidly heated in the middle of the curing time (t0-t4) when the resin is continuously heated at a constant temperature. ) Is shorter. Furthermore, the curing time (t0-t2) when the resin is quenched in the middle is shorter than the curing time (t0-t4) when the resin is heated rapidly.

Next, the behavior of the resin when the thermoplastic resin is rapidly cooled or rapidly heated will be described.
In FIG. 10, as indicated by the solid line E, the thermosetting resin is heated at a constant temperature from time t0 to time t10. Then, after time t10, the case of continuing to heat the resin at the same temperature is indicated by a broken line F, after time t10, the case of rapidly heating the resin is indicated by a dashed line G, and after time t10, the resin is rapidly cooled. The solid line H shows it.

When the thermosetting resin is heated at a constant temperature (for example, 170 ° C.) from time t0 to time t10, the resin viscosity gradually decreases as shown by the solid line A.
Subsequently, when the resin is continuously heated at the same temperature after time t10, as shown by the broken line F, the resin viscosity does not change and remains in a molten state.

On the other hand, when the resin is heated at a constant temperature from time t0 to time t10 and rapidly heated after time t10, the viscosity decreases and remains in a molten state as indicated by a one-dot chain line G.
On the other hand, when the resin is heated at a constant temperature from time t0 to time t10 and rapidly cooled after time t10, as shown by a solid line H, the viscosity rapidly increases and the resin is cured at time t11.
Therefore, in injection molding using a thermoplastic resin, it is possible to cure in a short time by quenching the resin.

In the second embodiment, the following effects are obtained.
(1) In 2nd Embodiment, the cooling means which can cool the 2nd metal mold | die parts 20 and 21 is provided.
Thereby, the viscosity of the molten resin 8 flowing through the second space 200 can be increased during injection molding. Therefore, the flow resistance of the molten resin 8 is increased, and the flow of the molten resin 8 can be reliably stopped in the second space 200.
For example, in the case of an epoxy resin, by lowering the temperature by about 50 ° C. from the molding temperature, the resin viscosity becomes about 10 times, and the overflow length L can be made about 1/3.
(2) In the second embodiment, the second mold parts 20 and 21 are formed of a material having a higher thermal conductivity than the first mold parts 10 and 11. Thereby, the heat dissipation of the 2nd metal mold | die parts 20 and 21 can be improved, and the cooling efficiency of the 2nd metal mold | die parts 20 and 21 can be improved.
(3) In 2nd Embodiment, the 2nd metal mold | die parts 20 and 21 are cooled at the time of injection molding. Thereby, the viscosity of the molten resin 8 flowing through the second space 200 can be increased, and the overflow length L can be controlled. Therefore, the length of the second space 200 can be shortened, and the insert molding die can be miniaturized. Further, the overflow length L can be shortened to prevent the overflow portion from peeling off.

(Third embodiment)
An insert molding die according to a third embodiment of the present invention is shown in FIG.
In the third embodiment, a heat shield part 43 is provided between the first mold parts 10 and 11 and the second mold parts 20 and 21. The heat shield part 43 is formed of a material having a lower thermal conductivity than the first mold parts 10 and 11 and the second mold parts 20 and 21, and the first mold parts 10 and 11 and the second mold part 20. , 21 to suppress heat conduction.
Thereby, since it becomes possible to give a temperature gradient to the first mold parts 10 and 11 and the second mold parts 20 and 21, the first mold parts 10 and 11 can be changed without lowering the temperature. Only the temperature of the two mold parts 20 and 21 can be lowered. Therefore, at the time of injection molding, the viscosity of the molten resin 8 flowing through the second space 200 can be increased, and the flow of the molten resin 8 can be reliably stopped in the middle of the second space 200. Therefore, the overflow length L can be controlled.

(Fourth embodiment)
An insert molding die according to a fourth embodiment of the present invention is shown in FIG.
In the fourth embodiment, a heat transport member and a cooling fan 44 are provided.
One end of the heat transport member is attached to the second mold parts 20 and 21 and the other end is exposed to the outside air. The heat transport member is, for example, a heat pipe 45. Further, the heat transport member may be, for example, a rod-shaped member formed from a metal having high thermal conductivity.
As indicated by arrow X, the cooling fan 44 blows air toward the heat pipe 45 to create an air flow around the heat transport member.

The heat pipe 45 is provided with a wick 47 having a capillary structure on the inner wall of a hollow case 46, and the inside of the wick 47 is a cavity 48. The inside of the case 46 of the heat pipe 45 contains hydraulic fluid (not shown).
In the heat pipe 45, when the hydraulic fluid on the second mold part 20, 21 side absorbs heat and evaporates, the vapor passes through the cavity 48 and is opposite to the second mold part 20, 21 of the heat pipe 45. Move to. Therefore, the vapor cooled by the wind of the cooling fan 44 aggregates into a liquid, travels through the wick 47, and moves again to the second mold part 20, 21 side. Thereby, the heat of the 2nd metallic mold parts 20 and 21 is radiated by heat pipe 45, and the 2nd metallic mold parts 20 and 21 are cooled.

  In the fourth embodiment, a heat pipe 45 is provided in the second mold parts 20 and 21, and a cooling fan 44 that creates an air flow around the heat pipe 45 is provided. Thereby, the heat dissipation of the 2nd metal mold | die parts 20 and 21 can be improved, and the cooling efficiency of the 2nd metal mold | die parts 20 and 21 can be improved. Therefore, the overflow length L can be reliably controlled.

(Other embodiments)
In the above-described embodiment, an insert molding die used for injection molding using a thermosetting resin has been described. On the other hand, in another embodiment, the insert molding die may be used for injection molding using a thermoplastic resin.
In the embodiment described above, an epoxy resin is used as the thermosetting resin. On the other hand, in other embodiments, various resins such as phenol resin, urea resin, or silicon resin may be used as the thermosetting resin.
As mentioned above, this invention is not limited to the said embodiment, In the range which does not deviate from the meaning of invention, it can implement with a various form.

DESCRIPTION OF SYMBOLS 1 ... Mold for insert molding 3 ... Wire cable 4 ... Conductor 5 ... Cover part 10, 11 ... 1st mold part 20, 21 ... 2nd mold part 30, 31 ... support part 100 ... 1st space 200 ... 2nd space

Claims (12)

In the insert molding die (1) for resin-molding the wire cable (3),
A first mold part (10, 11) having a first space (100) capable of being filled with resin around the conductor (4) and the covering part (5) of the wire cable;
A second mold part (20) having a second space (200) communicating with the first space and having a smaller cross-sectional area than the first space and capable of being filled with resin around the covering part. 21) and
A support portion (30, 31) provided on the opposite side of the second space to the first space and supporting the covering portion so that the covering portion of the wire cable is located in the center of the second space; A mold for insert molding, comprising:   The second space of the second mold part is set to have a cross-sectional area and a length that allow the molten resin (8) to stop flowing in the middle of the second space during injection molding. The mold for insert molding according to claim 1.   The insert molding die according to claim 1 or 2, wherein the resin used for the injection molding is a thermosetting resin.   The mold for insert molding according to claim 3, wherein the thermosetting resin is an epoxy resin.   The insert molding die according to any one of claims 1 to 4, further comprising cooling means (40, 42) capable of cooling the second mold part.   The insert mold according to claim 5, wherein the second mold part is made of a material having a higher thermal conductivity than the first mold part.   The insert molding die according to claim 5 or 6, further comprising a heat shield portion (43) between the first die portion and the second die portion.   The mold for insert molding according to any one of claims 5 to 7, wherein a heat transport member (45) is provided in the second mold part.   The mold for insert molding according to claim 8, further comprising a cooling fan (44) for creating a flow of air around the heat transport member. In the injection molding method using the mold for insert molding according to any one of claims 1 to 9,
The pressure (P), the resin viscosity (μ), or the curing time (t) of the molten resin supplied to the first space from the gate provided in the first mold part is adjusted, and the second space is adjusted. An injection molding method characterized by setting a length (L) or a wall thickness (h) of a resin filled in the container.   The injection molding method according to claim 10, wherein the second mold part is cooled and the length of the resin filled in the second space is adjusted. In the resin molded product formed by the mold for insert molding according to any one of claims 1 to 9,
The wire cable;
A resin body (50) for molding the conductor and the covering of the wire cable;
An overflow portion (9) extending from the resin main body portion and covering the periphery of the covering portion of the wire cable.

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