JP2014048090A5 - - Google Patents

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Publication number
JP2014048090A5
JP2014048090A5 JP2012189631A JP2012189631A JP2014048090A5 JP 2014048090 A5 JP2014048090 A5 JP 2014048090A5 JP 2012189631 A JP2012189631 A JP 2012189631A JP 2012189631 A JP2012189631 A JP 2012189631A JP 2014048090 A5 JP2014048090 A5 JP 2014048090A5
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JP
Japan
Prior art keywords
circuit
substrate
sensor element
electronic module
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012189631A
Other languages
English (en)
Japanese (ja)
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JP2014048090A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012189631A priority Critical patent/JP2014048090A/ja
Priority claimed from JP2012189631A external-priority patent/JP2014048090A/ja
Priority to US14/013,772 priority patent/US20140063753A1/en
Publication of JP2014048090A publication Critical patent/JP2014048090A/ja
Publication of JP2014048090A5 publication Critical patent/JP2014048090A5/ja
Withdrawn legal-status Critical Current

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JP2012189631A 2012-08-30 2012-08-30 電子モジュール、電子機器、及び移動体 Withdrawn JP2014048090A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012189631A JP2014048090A (ja) 2012-08-30 2012-08-30 電子モジュール、電子機器、及び移動体
US14/013,772 US20140063753A1 (en) 2012-08-30 2013-08-29 Electronic module, electronic device, and mobile unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012189631A JP2014048090A (ja) 2012-08-30 2012-08-30 電子モジュール、電子機器、及び移動体

Publications (2)

Publication Number Publication Date
JP2014048090A JP2014048090A (ja) 2014-03-17
JP2014048090A5 true JP2014048090A5 (enExample) 2015-10-08

Family

ID=50187315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012189631A Withdrawn JP2014048090A (ja) 2012-08-30 2012-08-30 電子モジュール、電子機器、及び移動体

Country Status (2)

Country Link
US (1) US20140063753A1 (enExample)
JP (1) JP2014048090A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9730340B1 (en) * 2014-09-30 2017-08-08 Apple Inc. Electronic device with array of rotationally mounted components
US10187977B2 (en) 2015-06-29 2019-01-22 Microsoft Technology Licensing, Llc Head mounted computing device, adhesive joint system and method
US10869393B2 (en) * 2015-06-29 2020-12-15 Microsoft Technology Licensing, Llc Pedestal mounting of sensor system
JP6926568B2 (ja) 2017-03-24 2021-08-25 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
WO2019021936A1 (ja) * 2017-07-28 2019-01-31 京セラ株式会社 センサ素子

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079973B2 (ja) * 1990-11-07 1995-02-01 三菱電機株式会社 半導体集積回路装置
JPH07306047A (ja) * 1994-05-10 1995-11-21 Murata Mfg Co Ltd 多軸検出型振動ジャイロ
DE10134620A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Mehraxiales Inertialsensorsystem und Verfahren zu seiner Herstellung
JP3926202B2 (ja) * 2002-05-14 2007-06-06 アルプス電気株式会社 検出装置
US6918297B2 (en) * 2003-02-28 2005-07-19 Honeywell International, Inc. Miniature 3-dimensional package for MEMS sensors
US7040922B2 (en) * 2003-06-05 2006-05-09 Analog Devices, Inc. Multi-surface mounting member and electronic device
JP4539155B2 (ja) * 2003-10-03 2010-09-08 パナソニック電工株式会社 センサシステムの製造方法
US7370530B2 (en) * 2004-09-01 2008-05-13 Honeywell International Inc. Package for MEMS devices
SE528404C2 (sv) * 2004-10-20 2006-11-07 Imego Ab Sensorarrangemang
JP2006308543A (ja) * 2005-03-31 2006-11-09 Fujitsu Media Device Kk 角速度センサ
EP1872087A4 (en) * 2005-04-19 2012-10-17 Jaymart Sensors Llc MINIATURED INERTIA MEASURING UNIT AND ASSOCIATED PROCEDURES
EP1880205A1 (en) * 2005-05-10 2008-01-23 Sensata Technologies Holland B.V. Sensor module package
US7467552B2 (en) * 2005-11-10 2008-12-23 Honeywell International Inc. Miniature package for translation of sensor sense axis
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
US20090283891A1 (en) * 2006-04-07 2009-11-19 Koninklijke Philips Electronics N.V. Elastically deformable integrated-circuit device
US20090056446A1 (en) * 2007-09-05 2009-03-05 Cluff Charles A Multiple-axis sensor package and method of assembly
US8100010B2 (en) * 2008-04-14 2012-01-24 Honeywell International Inc. Method and system for forming an electronic assembly having inertial sensors mounted thereto
US8037754B2 (en) * 2008-06-12 2011-10-18 Rosemount Aerospace Inc. Integrated inertial measurement system and methods of constructing the same
US8194409B2 (en) * 2009-11-09 2012-06-05 Tyco Electronics Corporation Guide frame for a pluggable module
CN102121829B (zh) * 2010-08-09 2013-06-12 汪滔 一种微型惯性测量系统
JP5845672B2 (ja) * 2011-07-13 2016-01-20 セイコーエプソン株式会社 センサーデバイスおよび電子機器

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