JP2013222772A5 - - Google Patents

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Publication number
JP2013222772A5
JP2013222772A5 JP2012092386A JP2012092386A JP2013222772A5 JP 2013222772 A5 JP2013222772 A5 JP 2013222772A5 JP 2012092386 A JP2012092386 A JP 2012092386A JP 2012092386 A JP2012092386 A JP 2012092386A JP 2013222772 A5 JP2013222772 A5 JP 2013222772A5
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JP
Japan
Prior art keywords
image sensor
frame
package according
substrate
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012092386A
Other languages
English (en)
Japanese (ja)
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JP2013222772A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012092386A priority Critical patent/JP2013222772A/ja
Priority claimed from JP2012092386A external-priority patent/JP2013222772A/ja
Publication of JP2013222772A publication Critical patent/JP2013222772A/ja
Publication of JP2013222772A5 publication Critical patent/JP2013222772A5/ja
Pending legal-status Critical Current

Links

JP2012092386A 2012-04-13 2012-04-13 撮像素子パッケージおよび撮像装置 Pending JP2013222772A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012092386A JP2013222772A (ja) 2012-04-13 2012-04-13 撮像素子パッケージおよび撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012092386A JP2013222772A (ja) 2012-04-13 2012-04-13 撮像素子パッケージおよび撮像装置

Publications (2)

Publication Number Publication Date
JP2013222772A JP2013222772A (ja) 2013-10-28
JP2013222772A5 true JP2013222772A5 (enExample) 2015-03-19

Family

ID=49593558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012092386A Pending JP2013222772A (ja) 2012-04-13 2012-04-13 撮像素子パッケージおよび撮像装置

Country Status (1)

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JP (1) JP2013222772A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5904957B2 (ja) * 2013-02-28 2016-04-20 キヤノン株式会社 電子部品および電子機器。
US10580811B2 (en) * 2015-11-24 2020-03-03 Sony Corporation Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus
JP2021093429A (ja) 2019-12-09 2021-06-17 ソニーセミコンダクタソリューションズ株式会社 撮像素子パッケージおよび撮像素子パッケージの製造方法
JP7505207B2 (ja) 2020-03-04 2024-06-25 株式会社サタケ 固体撮像素子の取付け構造、撮像装置、固体撮像素子の取付け方法及び撮像装置の製造方法
JP7611654B2 (ja) 2020-06-23 2025-01-10 キヤノン株式会社 電子機器
CN118039583A (zh) * 2022-11-03 2024-05-14 三赢科技（深圳）有限公司 封装模组

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08237554A (ja) * 1995-02-28 1996-09-13 Canon Inc 撮像装置
JP2004173031A (ja) * 2002-11-21 2004-06-17 Iwate Toshiba Electronics Co Ltd イメージセンサモジュール
JP2007147729A (ja) * 2005-11-24 2007-06-14 Alps Electric Co Ltd カメラモジュール
JP2008245244A (ja) * 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP2009232159A (ja) * 2008-03-24 2009-10-08 Nikon Corp 固体撮像装置及びカメラ、並びにそれらの製造方法
JP5550380B2 (ja) * 2010-02-25 2014-07-16 キヤノン株式会社 固体撮像装置及び撮像装置

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