JP2014038967A - Method of manufacturing lead frame assembly for light-emitting diode - Google Patents
Method of manufacturing lead frame assembly for light-emitting diode Download PDFInfo
- Publication number
- JP2014038967A JP2014038967A JP2012181179A JP2012181179A JP2014038967A JP 2014038967 A JP2014038967 A JP 2014038967A JP 2012181179 A JP2012181179 A JP 2012181179A JP 2012181179 A JP2012181179 A JP 2012181179A JP 2014038967 A JP2014038967 A JP 2014038967A
- Authority
- JP
- Japan
- Prior art keywords
- electrode piece
- lead frame
- metal
- manufacturing
- frame assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
本発明は発光ダイオードに係わり、特に発光ダイオードのリードフレームアセンブリーの製造方法に係わる。 The present invention relates to a light emitting diode, and more particularly, to a method for manufacturing a lead frame assembly of a light emitting diode.
昨今において発光ダイオードはさまざまな電子装置、電器製品または照明器具等の製品に広く用いられており、かつ発光ダイオードの製造は高輝度、多色光および優れた放熱効果を有する技術の開発および改善へシフトするため、発光ダイオードの製造原価が高くなりつつある。発光ダイオード製造原価は前記要素により向上されるほか、発光ダイオードの製造良品率の直接影響を受ける。 In recent years, light-emitting diodes are widely used in various electronic devices, electrical appliances or lighting products, and the production of light-emitting diodes has shifted to the development and improvement of technologies with high brightness, multicolor light and excellent heat dissipation effect Therefore, the manufacturing cost of the light emitting diode is increasing. The manufacturing cost of the light emitting diode is improved by the above factors, and is directly influenced by the production rate of the light emitting diode.
従来の発光ダイオードは製造の時にまず金属板材を用意し、プレスまたはエッチングにより金属板材をリードフレームアセンブリーに加工すると金属外枠が形成され、該金属外枠は連結部を介して複数の金属リードフレームに連結されており、該金属リードフレームは正極片および負極片を備えており、また複数の該金属リードフレームには熱硬化性プラスチックを用いてゴム台座が成形されており、該ゴム台座が製造完成後に、該ゴム台座の中空機能エリアの中で外部に露出した正、負極片にて発光チップのダイボンディングおよび金ワイヤボンディング工程を行ない、ダイボンディングおよびワイヤボンディング工程後には該中空機能エリアの中に蛍光パウダーが混入されたシリコン接着剤を注入し、接着工程後に金属リードフレームを裁断およびテストする。 A conventional light emitting diode is prepared by first preparing a metal plate at the time of manufacture. When the metal plate is processed into a lead frame assembly by pressing or etching, a metal outer frame is formed. The metal lead frame includes a positive electrode piece and a negative electrode piece, and a plurality of the metal lead frames are molded with a rubber pedestal using a thermosetting plastic. After the manufacturing is completed, the die bonding and gold wire bonding process of the light emitting chip is performed with the positive and negative electrode pieces exposed to the outside in the hollow functional area of the rubber pedestal. After the die bonding and the wire bonding process, A silicon adhesive mixed with fluorescent powder is injected into the metal lead frame after the bonding process. The cross-sectional and testing.
従来の発光ダイオードは製造完成後に輝度および色度配合比のテストを行うので、発光ダイオードの輝度および色度の配合比が要求を満たさず、よって発光ダイオードの製造良品率は５０％前後に止まっていた。その主な原因は、該金属リードフレームにゴム台座を成形した後に金属リードフレームの正極片および負極片の連結部を裁断せず、該金属リードフレームの正極片および負極片はいずれも接続された状態にあり、ゴム台座の中空機能エリアに接着剤を注入した後にすぐ発光ダイオードの輝度および色度の配合比が正確か否かをテストできず、全工程が完成後にはじめて品質確認が可能なため、不良の発光ダイオードを適時に検出できないことにある。 Since the conventional light emitting diodes are tested for the luminance and chromaticity mixture ratio after the manufacture is completed, the luminance and chromaticity mixing ratio of the light emitting diodes does not meet the requirements, so the production rate of light emitting diodes is only around 50%. It was. The main cause was that after the rubber pedestal was molded on the metal lead frame, the positive electrode piece and the negative electrode piece of the metal lead frame were not cut, and both the positive electrode piece and the negative electrode piece of the metal lead frame were connected. Because it is not possible to test whether the blending ratio of the brightness and chromaticity of the light emitting diode is accurate immediately after injecting adhesive into the hollow functional area of the rubber pedestal, quality can only be checked after the entire process is complete This is because a defective light emitting diode cannot be detected in a timely manner.
よって、本発明の主な目的は従来の問題点を解決することにあり、本発明では発光ダイオードのリードフレームアセンブリーの金属リードフレームにてゴム台座を成形した後に所定の金属リードフレームの連結部を裁断し、その後のダイボンディング、ワイヤボンディングおよび接着工程においては、接着剤が硬化する前に前置測定作業を行って発光ダイオードの輝度および色度の配合比が正確か否かをテスト可能なため、発光ダイオードの製造良品率が９０％を上回り、さらに製造原価を大幅に下げることも可能になる。 Accordingly, a main object of the present invention is to solve the conventional problems. In the present invention, after a rubber pedestal is formed with a metal lead frame of a lead frame assembly of a light emitting diode, a predetermined metal lead frame connecting portion is formed. In the subsequent die bonding, wire bonding and bonding processes, it is possible to test whether the luminance and chromaticity ratio of the light emitting diode is accurate by performing a pre-measurement operation before the adhesive is cured. Therefore, the non-defective product ratio of the light emitting diode exceeds 90%, and the manufacturing cost can be significantly reduced.
上記目的を実現すべく、本発明は、発光ダイオードのリードフレームアセンブリーの製造方法であって、該製造方法は、
金属板材を用意するステップと、
該金属板材に金属外枠ならびに縦方向および横方向に配列された複数の金属リードフレームを成形するステップであって、該金属リードフレームには第一電極片および第二電極片を有して、該第一電極片は、該第二電極片の少なくとも一つの側辺とのあいだに連結部を有しており、該連結部は該縦方向および横方向の複数の金属リードフレームと該金属外枠とを連結するステップと、
該金属リードフレームにゴム台座を成形するステップであって、該ゴム台座の正面には該第一電極片および該第二電極片を外部に露出するための中空機能エリアを有するステップと、
縦方向または横方向に沿って各々の該金属リードフレームを連結する連結部を裁断するステップと、
該ゴム台座の中空機能エリア中の第二電極片に発光チップを固接するステップと、
金属ワイヤを用いて該発光チップと該第一電極片とを電気的に接続するステップと、
接着剤を該中空機能エリアに注入するステップと、
切断された金属リードフレーム上の連結部に電源を印加し、該第一電極片および該第二電極片に通電して該発光チップを点灯せしめて、輝度および色度の配合比テストを行なうステップと、
を備える前記製造方法、を提供している。
In order to achieve the above object, the present invention provides a method of manufacturing a lead frame assembly of a light emitting diode,
Preparing a metal plate,
Forming a metal outer frame and a plurality of metal lead frames arranged in a vertical direction and a horizontal direction on the metal plate material, the metal lead frame having a first electrode piece and a second electrode piece; The first electrode piece has a connecting portion between at least one side of the second electrode piece, and the connecting portion includes the plurality of metal lead frames in the vertical direction and the horizontal direction and the metal outer frame. Connecting the frame,
Forming a rubber pedestal on the metal lead frame, the front surface of the rubber pedestal having a hollow functional area for exposing the first electrode piece and the second electrode piece to the outside;
Cutting a connecting portion for connecting each of the metal lead frames along a vertical direction or a horizontal direction;
Fixing the light emitting chip to the second electrode piece in the hollow functional area of the rubber pedestal;
Electrically connecting the light emitting chip and the first electrode piece using a metal wire;
Injecting an adhesive into the hollow functional area;
A step of applying a power to the connecting portion on the cut metal lead frame, energizing the first electrode piece and the second electrode piece to light up the light emitting chip, and performing a luminance and chromaticity mixture ratio test When,
The manufacturing method is provided.
該金属外枠には離隔態様で配列された複数の長孔および短孔を有しており、二つの該短孔のあいだには貫通孔を有する。 The metal outer frame has a plurality of long holes and short holes arranged in a spaced manner, and a through hole is provided between the two short holes.
該長孔は切断ターゲットであって該連結部に対応する。 The long hole is a cutting target and corresponds to the connecting portion.
該第一電極片は、該第二電極片と隣り合わないかまたは対応しない側辺にはいずれも該連結部を有する。 Each of the first electrode pieces has the connecting portion on a side that is not adjacent to or does not correspond to the second electrode piece.
該第一電極片が長方形であり、かつ該第一電極片は、該第二電極片と隣り合うかまたは対応する側辺には、対応する二つの切り欠きを有する。 The first electrode piece is rectangular, and the first electrode piece has two corresponding notches on the side that is adjacent to or corresponds to the second electrode piece.
該第二電極片の二つの側辺には対応する二つの凹陥槽を有しており、該第二電極片の他方の側辺には凹陥口を有する。 There are two corresponding recessed tanks on the two sides of the second electrode piece, and a recessed opening on the other side of the second electrode piece.
該ゴム台座の裏面に二つの通孔を有しており、該二つの通孔は該第一電極片および該第二電極片を外部に露出するのに用いられる。 The rubber base has two through holes on the back surface, and the two through holes are used to expose the first electrode piece and the second electrode piece to the outside.
発光ダイオードを製造完成後に該第一電極片と該第二電極片とのあいだにＴ字形をなすゴム台座を形成しており、該Ｔ字形のゴム台座は第一電極片および該第二電極片の平面の高さから突出するため、水気の滲み込みおよび注入された接着剤が滲み出ることを防止する。 A rubber pedestal having a T-shape is formed between the first electrode piece and the second electrode piece after the light-emitting diode is manufactured, and the T-shaped rubber pedestal includes the first electrode piece and the second electrode piece. Since it protrudes from the height of the flat surface of the liquid, the penetration of water and the injected adhesive are prevented from bleeding.
リードフレームアセンブリーをプレスまたはエッチングした後に、該リードフレームアセンブリーの金属リードフレームに電気メッキにより一層の金属膜を施す。 After the lead frame assembly is pressed or etched, a metal film is applied to the metal lead frame of the lead frame assembly by electroplating.
該発光チップが単色または多色のチップである。 The light emitting chip is a monochromatic or multicolor chip.
該金属ワイヤが金ワイヤである。 The metal wire is a gold wire.
該接着剤がシリコン接着剤である。 The adhesive is a silicon adhesive.
該接着剤に蛍光パウダーが添加されている。 Fluorescent powder is added to the adhesive.
以下、図面に結合して本発明の技術内容および詳細な説明について説明を行う：
図１、図２、および図３に示すのは、本発明の製造の流れと、発光ダイオードのリードフレームアセンブリーと、および図２の局所拡大見取り図である。図に示すように、本発明の発光ダイオードのリードフレームアセンブリーはまず、ステップ１００において金属板材を用意する。
The technical contents and detailed description of the present invention will be described below in conjunction with the drawings:
1, 2, and 3 are a manufacturing flow of the present invention, a light-emitting diode lead frame assembly, and a locally enlarged view of FIG. 2. As shown in the drawing, the lead frame assembly of the light emitting diode according to the present invention first prepares a metal plate in step 100.
ステップ１０２において、プレスまたはエッチングにより該金属板材をリードフレームアセンブリーに加工しており、該リードフレームアセンブリー１０は金属外枠１および複数の金属リードフレーム２を備える。該金属外枠１には離隔態様で配列された複数の長孔１１および短孔１２を有しており、二つの該短孔１２のあいだには貫通孔１３を有する。該金属リードフレーム２は第一電極片２１および第二電極片２２を有しており、該第一電極片２１は長方形であり、かつ該第一電極片２１は、該第二電極片２２と隣り合うかまたは対応する側辺には対応する二つの切り欠き２１１を有しており、該第二電極片２２の二つの側辺には対応する二つの凹陥槽２２１を有して、該第二電極片２２の他方の側辺には凹陥口２２２を有しており、該側辺の二つの凹陥槽２２１および該凹陥口２２２により該第二電極片２２は上着如き形状をなす。該第一電極片２１は、該第二電極片２２と隣り合うかまたは対応する側辺に連結部（ｂａｒ）２３を有せず、それ以外の三つの側辺にはいずれも連結部を有しており、該連結部２３は、該縦方向および横方向の複数の金属リードフレーム２および該金属外枠１を連結する。 In step 102, the metal plate material is processed into a lead frame assembly by pressing or etching, and the lead frame assembly 10 includes a metal outer frame 1 and a plurality of metal lead frames 2. The metal outer frame 1 has a plurality of long holes 11 and short holes 12 arranged in a spaced manner, and a through hole 13 is provided between the two short holes 12. The metal lead frame 2 includes a first electrode piece 21 and a second electrode piece 22, the first electrode piece 21 is rectangular, and the first electrode piece 21 is connected to the second electrode piece 22. Two adjacent cutouts 211 are provided on adjacent or corresponding side sides, and two corresponding recessed tanks 221 are provided on two side sides of the second electrode piece 22. On the other side of the two electrode pieces 22, there is a recessed opening 222, and the second electrode piece 22 is shaped like a jacket by the two recessed tanks 221 and the recessed openings 222 on the side. The first electrode piece 21 does not have a connecting portion (bar) 23 on the side that is adjacent to or corresponds to the second electrode piece 22, and all the other three sides have a connecting portion. The connecting portion 23 connects the plurality of metal lead frames 2 and the metal outer frame 1 in the vertical and horizontal directions.
ステップ１０４において、リードフレームアセンブリー１０をプレスまたはエッチングした後に、該リードフレームアセンブリー１０の金属リードフレーム２に電気メッキを施して、該金属リードフレーム２に一層の金属膜を電気メッキする。 In step 104, after the lead frame assembly 10 is pressed or etched, the metal lead frame 2 of the lead frame assembly 10 is electroplated, and one metal film is electroplated on the metal lead frame 2.
ステップ１０６において、上記発光ダイオードのリードフレームアセンブリー１０を電気メッキ施した後に、熱硬化性プラスチックを用いて、熱硬化成形技術により該金属リードフレーム２にゴム台座３を成形しており、該ゴム台座３は成形後に該第一電極片２１、第二電極片２２および該連結部２３を包覆する。該ゴム台座３は正面に中空機能エリア３１を有しており、該中空機能エリア３１は図４に示すように、該第一電極片２１および該第二電極片２２を外部に露出する。同様に、該ゴム台座３は裏面に二つの通孔３２、３３を有しており、該二つの通孔３２、３３は第一電極片２１および第二電極片２２を外部に露出するのに用いられて、該第一電極片２１および該第二電極片２２が導通して発光チップ（図示せず）を点灯した際に、該二つの通孔３２、３３は図５に示すように、該第一電極片２１および第二電極片２２を放熱するのに用いられる。 In step 106, after the lead frame assembly 10 of the light emitting diode is electroplated, a rubber pedestal 3 is formed on the metal lead frame 2 by a thermosetting molding technique using a thermosetting plastic. The base 3 covers the first electrode piece 21, the second electrode piece 22, and the connecting portion 23 after being molded. The rubber pedestal 3 has a hollow functional area 31 on the front surface, and the hollow functional area 31 exposes the first electrode piece 21 and the second electrode piece 22 to the outside as shown in FIG. Similarly, the rubber pedestal 3 has two through holes 32 and 33 on the back surface, and the two through holes 32 and 33 are used to expose the first electrode piece 21 and the second electrode piece 22 to the outside. When the first electrode piece 21 and the second electrode piece 22 are used to turn on the light emitting chip (not shown), the two through holes 32 and 33 are formed as shown in FIG. The first electrode piece 21 and the second electrode piece 22 are used to dissipate heat.
ステップ１０８において、該リードフレームアセンブリー１０上の金属リードフレーム２のゴム台座３の製造が完成した後、ダイボンディング、ワイヤボンディングおよび接着を行なう前に、図６に示すように該ゴム台座３にて横方向切断線２０が裁断されて各々の該金属リードフレーム２を連結する連結部２３を切断し、かつ切断方向は図８、図９に示すようにゴム台座３の正面または裏面から裁断する。 In step 108, after the manufacture of the rubber pedestal 3 of the metal lead frame 2 on the lead frame assembly 10 is completed, before the die bonding, wire bonding and bonding, the rubber pedestal 3 is attached to the rubber pedestal 3 as shown in FIG. Then, the transverse cutting line 20 is cut to cut the connecting portions 23 for connecting the metal lead frames 2, and the cutting direction is cut from the front surface or the back surface of the rubber pedestal 3 as shown in FIGS. .
ステップ１１０において、該連結部２３を切断した後に、図６、図７、図８、図９に示すように該ゴム台座３の中空機能エリア３１にて外部に露出した第二電極片２２に発光チップ４を固接する。本図において、該発光チップ４は単色または多色のチップである。 In step 110, after the connecting portion 23 is cut, the second electrode piece 22 exposed to the outside in the hollow functional area 31 of the rubber pedestal 3 as shown in FIGS. 6, 7, 8, and 9 emits light. The chip 4 is firmly attached. In this figure, the light emitting chip 4 is a monochromatic or multicolor chip.
ステップ１１２において、図６、図７、図８、図９に示すように、該発光チップ４と該中空機能エリア３１の外部に露出した第一電極片２１とのあいだは金属ワイヤ５により電気的に接続されている。本図面において、該金属ワイヤ５は金ワイヤである。 In step 112, as shown in FIGS. 6, 7, 8, and 9, the metal wire 5 electrically connects the light emitting chip 4 and the first electrode piece 21 exposed outside the hollow functional area 31. It is connected to the. In the drawing, the metal wire 5 is a gold wire.
ステップ１１４において、ワイヤボンディング工程が完成後に該ゴム台座３の中空機能エリア３１内にて接着工程を行い、該中空機能エリア３１内に接着剤６を注入する。本図面において該接着剤６はシリコン接着剤である。 In step 114, after the wire bonding process is completed, an adhesion process is performed in the hollow functional area 31 of the rubber pedestal 3, and the adhesive 6 is injected into the hollow functional area 31. In the drawing, the adhesive 6 is a silicon adhesive.
ステップ１１６において、接着完成後に発光ダイオードに対して前置測定作業を行なうことが可能であるが、いわゆる前置測定作業とは、接着完成後および該接着剤６が硬化する前に、図６、図７、図８、図９に示すように、テスト作業者が連結部２３が切断された列全体または一つの金属リードフレーム２の該第一電極片２１および該第二電極片２２に電圧を印加して該発光チップ４を点灯せしめ、発生する光は該接着剤６に混入された蛍光パウダーと混色され、形成された色度および輝度が事前に設計された色度および輝度配合比の要求を満たすか否かを確認する作業のことを指す。 In step 116, it is possible to perform a pre-measurement operation on the light-emitting diode after completion of the adhesion. The so-called pre-measurement operation is performed after the completion of the adhesion and before the adhesive 6 is cured. As shown in FIGS. 7, 8, and 9, the test operator applies a voltage to the first electrode piece 21 and the second electrode piece 22 of the entire row from which the connecting portion 23 is cut or one metal lead frame 2. The light emitting chip 4 is turned on by applying the light, and the generated light is mixed with the fluorescent powder mixed in the adhesive 6, and the formed chromaticity and luminance are required to be designed in advance. Refers to the work to check whether or not
例えば、白色光の一つの発光ダイオードを製造する際に、該発光チップが青色光である場合、中空機能エリア３１に注入された接着剤６には黄色の蛍光パウダーが混入されており、接着剤６を注入後まだ硬化していないうちに、テスト作業者は連結部が切断された金属リードフレーム２の該第一電極片２１および該第二電極片２２に電源を印加して、発光チップ４と黄色の蛍光パウダーが混入された接着剤６の輝度および色度の配合比が正確か否かを確認可能である。 For example, when manufacturing one light emitting diode of white light, when the light emitting chip is blue light, yellow fluorescent powder is mixed in the adhesive 6 injected into the hollow functional area 31, and the adhesive The test operator applies power to the first electrode piece 21 and the second electrode piece 22 of the metal lead frame 2 whose connection portion has been cut after the injection of the light emitting chip 4. It is possible to confirm whether or not the mixing ratio of the luminance and chromaticity of the adhesive 6 mixed with the yellow fluorescent powder is accurate.
発光ダイオードの製造が完成後に、該第一電極片２１と該第二電極片２２とのあいだには図に示すようにＴ字形をなすゴム台座３’が形成されており、該Ｔ字形のゴム台座３’は第一電極片２１と該第二電極片２２の平面の高さから突出するため、水気の滲み込みおよび注入された接着剤６が滲み出ることを防止する機能を有する。 After the manufacture of the light emitting diode is completed, a T-shaped rubber pedestal 3 'is formed between the first electrode piece 21 and the second electrode piece 22 as shown in the figure. The pedestal 3 ′ protrudes from the planar height of the first electrode piece 21 and the second electrode piece 22, and thus has a function of preventing the seepage of water and the injected adhesive 6 from seeping out.
上記金属リードフレーム２にてゴム台座３の製造を完成後に金属リードフレーム２の連結部２３を裁断することにより、発光ダイオードを接着後に前置測定作業が可能になり、よって発光ダイオードの製造良品率は９０％以上まで上昇し、不良品の発生を減らした。 By cutting the connecting portion 23 of the metal lead frame 2 after the rubber pedestal 3 has been manufactured with the metal lead frame 2, it becomes possible to perform a pre-measurement work after the light emitting diode is bonded. Increased to over 90%, reducing the occurrence of defective products.
図１０に示すのは、本発明の発光ダイオードのリードフレームアセンブリーの異なる裁断方向の見取り図である。図に示すように、本発明のリードフレームアセンブリー上の金属リードフレーム２のゴム台座３は製造完成後、ダイボンディング、ワイヤボンディングおよび接着を行なう前に、縦方向切断線３０に沿って各々の該金属リードフレーム２を連結する連結部２３を切断する。 FIG. 10 is a schematic view of different cutting directions of the light emitting diode lead frame assembly of the present invention. As shown in the figure, the rubber pedestal 3 of the metal lead frame 2 on the lead frame assembly of the present invention is formed along the longitudinal cutting line 30 after completion of manufacture and before die bonding, wire bonding and bonding. The connecting portion 23 for connecting the metal lead frame 2 is cut.
該連結部２３を切断した後に、該ゴム台座３の中空機能エリア３１にて外部に露出した第二電極片２２に発光チップ４を固接し、該発光チップ４と該中空機能エリア３１の外部に露出した第一電極片２１とのあいだは金属ワイヤ５により電気的に接続される。 After cutting the connecting portion 23, the light emitting chip 4 is firmly attached to the second electrode piece 22 exposed to the outside in the hollow functional area 31 of the rubber pedestal 3, and the light emitting chip 4 and the hollow functional area 31 are outside. The exposed first electrode piece 21 is electrically connected by the metal wire 5.
ダイボンディングとワイヤボンディング工程が完成後に、該ゴム台座３の中空機能エリア３１内にて接着工程を行い、該中空機能エリア３１内に接着剤６を注入した後に、接着済の発光ダイオードに対して前置測定作業を行なうことが可能であるが、該前置測定作業とは、接着工程が完成後および該接着剤６が硬化する前に、該金属リードフレーム２を横方向に連結する連結部２３が切断されたので、テスト作業者は同様に列全体または一つの金属リードフレーム２の該第一電極片２１および該第二電極片２２に電圧を印加して該発光チップ４を点灯せしめ、発生する光は該接着剤６に混入された蛍光パウダーと混色され、形成された色度および輝度が事前に設計された色度および輝度配合比の要求を満たすか否かを確認する作業のことを指す。 After the die bonding and wire bonding processes are completed, an adhesion process is performed in the hollow functional area 31 of the rubber pedestal 3, and after the adhesive 6 is injected into the hollow functional area 31, the bonded light emitting diodes are bonded. It is possible to perform a pre-measurement operation. The pre-measurement operation is a connecting portion that connects the metal lead frame 2 in the lateral direction after the bonding process is completed and before the adhesive 6 is cured. 23 is cut, the test operator applies a voltage to the first electrode piece 21 and the second electrode piece 22 of the entire row or one metal lead frame 2 to turn on the light emitting chip 4. The generated light is mixed with the fluorescent powder mixed in the adhesive 6 to check whether the formed chromaticity and luminance satisfy the requirements of the predesigned chromaticity and luminance mixture ratio. The finger .
さらに、本発明の金属外枠１に複数の長孔１１を有するが、該長孔１１は切断ターゲットとすることが可能であり、各々の該金属リードフレーム２を連結する連結部２３を裁断する際に、裁断ツールが長孔１１を切断すれば、連結部２３が切断されたことを表すため、切断ターゲットとして判断に用いることが可能である。 Furthermore, although the metal outer frame 1 of the present invention has a plurality of long holes 11, the long holes 11 can be used as cutting targets, and the connecting portions 23 that connect the metal lead frames 2 are cut. At this time, if the cutting tool cuts the long hole 11, it represents that the connecting portion 23 has been cut, so that it can be used as a cutting target for judgment.
上記は本発明の好適な実施例であり、本発明の実施範囲を限定するためのものではない。およそ本発明の特許請求の範囲に従って行った均等な変化ならびに修飾は、いずれも本発明の特許範囲に含まれると見なすべきである。 The above are preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes and modifications made approximately in accordance with the claims of the present invention should be considered to be within the patent scope of the present invention.
１００〜１１６ ステップ
１０ リードフレームアセンブリー
１ 金属外枠
１１ 長孔
１２ 短孔
１３ 貫通孔
２ 金属リードフレーム
２１ 第一電極片
２１１ 切り欠き
２２ 第二電極片
２２１ 凹陥槽
２２２ 凹陥口
２３ 連結部
３、３’ ゴム台座
３１ 中空機能エリア
３２、３３ 通孔
４ 発光チップ
５ 金属ワイヤ
６ 接着剤
２０ 横方向切断線
３０ 縦方向切断線
100 to 116 Step 10 Lead frame assembly 1 Metal outer frame 11 Long hole 12 Short hole 13 Through hole 2 Metal lead frame 21 First electrode piece 211 Notch 22 Second electrode piece 221 Recessed tank 222 Recessed opening 23 Connecting part 3 3 'rubber pedestal 31 hollow functional area 32, 33 through-hole 4 light emitting chip 5 metal wire 6 adhesive 20 transverse cutting line 30 longitudinal cutting line
Claims (13)
ａ）金属板材を用意するステップと、
ｂ）前記金属板材に金属外枠ならびに縦方向および横方向に配列された複数の金属リードフレームを成形するステップであって、前記金属リードフレームには第一電極片および第二電極片を有し、前記第一電極片は、前記第二電極片の少なくとも一つの側辺とのあいだに連結部を有しており、前記連結部は前記縦方向および横方向の複数の金属リードフレームと前記金属外枠とを連結するステップと、
ｃ）前記金属リードフレームにゴム台座を成形するステップであって、前記ゴム台座の正面には前記第一電極片および前記第二電極片を外部に露出するための中空機能エリアを有するステップと、
ｄ）縦方向または横方向に沿って各々の前記金属リードフレームを連結する連結部を裁断するステップと、
ｅ）前記ゴム台座の中空機能エリア中の第二電極片に発光チップを固接するステップと、
ｆ）金属ワイヤを用いて前記発光チップと前記第一電極片とを電気的に接続するステップと、
ｇ）接着剤を前記中空機能エリアに注入するステップと、
ｈ）切断された金属リードフレーム上の連結部に電源を印加し、前記第一電極片および前記第二電極片に通電して前記発光チップを点灯せしめて、輝度および色度の配合比テストを行なうステップと、
を備える前記製造方法。 A method for manufacturing a lead frame assembly of a light emitting diode, comprising:
a) preparing a metal plate;
b) forming a metal outer frame and a plurality of metal lead frames arranged in the vertical direction and the horizontal direction on the metal plate material, the metal lead frame having a first electrode piece and a second electrode piece; The first electrode piece has a connecting portion between at least one side of the second electrode piece, and the connecting portion includes the plurality of metal lead frames in the vertical and horizontal directions and the metal. Connecting the outer frame;
c) forming a rubber pedestal on the metal lead frame, the front surface of the rubber pedestal having a hollow functional area for exposing the first electrode piece and the second electrode piece to the outside;
d) cutting a connecting portion for connecting the metal lead frames along the vertical direction or the horizontal direction;
e) attaching the light emitting chip to the second electrode piece in the hollow functional area of the rubber pedestal;
f) electrically connecting the light emitting chip and the first electrode piece using a metal wire;
g) injecting adhesive into the hollow functional area;
h) Applying power to the connecting part on the cut metal lead frame, energizing the first electrode piece and the second electrode piece to turn on the light emitting chip, and performing a blending ratio test of luminance and chromaticity Performing steps,
The said manufacturing method provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012181179A JP5686262B2 (en) | 2012-08-17 | 2012-08-17 | Manufacturing method of light emitting diode lead frame assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012181179A JP5686262B2 (en) | 2012-08-17 | 2012-08-17 | Manufacturing method of light emitting diode lead frame assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014038967A true JP2014038967A (en) | 2014-02-27 |
| JP5686262B2 JP5686262B2 (en) | 2015-03-18 |
Family
ID=50286864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012181179A Expired - Fee Related JP5686262B2 (en) | 2012-08-17 | 2012-08-17 | Manufacturing method of light emitting diode lead frame assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5686262B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017005247A (en) * | 2015-06-09 | 2017-01-05 | 日亜化学工業株式会社 | Method for manufacturing light-emitting device, and light-emitting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298173A (en) * | 2002-02-01 | 2003-10-17 | Sharp Corp | Semiconductor laser device, its manufacturing method and optical pickup using them |
| JP2011142254A (en) * | 2010-01-08 | 2011-07-21 | Citizen Holdings Co Ltd | Method of adjusting chromaticity of led light source device |
| JP2011222868A (en) * | 2010-04-13 | 2011-11-04 | Alpha- Design Kk | Led element inspection and taping apparatus |
| JP2011249807A (en) * | 2010-05-24 | 2011-12-08 | Lg Innotek Co Ltd | Light emitting device and light unit including the same |
| JP2012146816A (en) * | 2011-01-12 | 2012-08-02 | Dainippon Printing Co Ltd | Semiconductor device, method for manufacturing the same and lighting apparatus |
-
2012
- 2012-08-17 JP JP2012181179A patent/JP5686262B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298173A (en) * | 2002-02-01 | 2003-10-17 | Sharp Corp | Semiconductor laser device, its manufacturing method and optical pickup using them |
| JP2011142254A (en) * | 2010-01-08 | 2011-07-21 | Citizen Holdings Co Ltd | Method of adjusting chromaticity of led light source device |
| JP2011222868A (en) * | 2010-04-13 | 2011-11-04 | Alpha- Design Kk | Led element inspection and taping apparatus |
| JP2011249807A (en) * | 2010-05-24 | 2011-12-08 | Lg Innotek Co Ltd | Light emitting device and light unit including the same |
| JP2012146816A (en) * | 2011-01-12 | 2012-08-02 | Dainippon Printing Co Ltd | Semiconductor device, method for manufacturing the same and lighting apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017005247A (en) * | 2015-06-09 | 2017-01-05 | 日亜化学工業株式会社 | Method for manufacturing light-emitting device, and light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5686262B2 (en) | 2015-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014017460A (en) | Method for manufacturing lead frame assembly of light-emitting diode | |
| CN106663731B (en) | Semiconductor device and its manufacturing method | |
| KR19980064844A (en) | Light-emitting display device, method of connecting electric wiring board to same and manufacturing method thereof | |
| JP2017508302A (en) | LED light bar manufacturing method and light bar | |
| TWI536617B (en) | Light emitting diode lightbar and method for manufacturing the same | |
| US20150162502A1 (en) | Film wiring substrate and light emitting device | |
| JP5585638B2 (en) | Manufacturing method of light emitting diode frame structure | |
| US9041019B2 (en) | Method of and device for manufacturing LED assembly using liquid molding technologies | |
| CN103367557A (en) | Manufacturing method of light emitting diode wafer which emits white light directly | |
| TWI593133B (en) | Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device | |
| JP5686262B2 (en) | Manufacturing method of light emitting diode lead frame assembly | |
| CN109461727A (en) | A kind of moulding manufacture method showing screen and LED module | |
| TWI593144B (en) | Heterogeneous LED light-emitting components manufacturing process | |
| JP6056934B2 (en) | Light emitting device, resin package, resin molded body, and manufacturing method thereof | |
| JP5720957B2 (en) | Method for manufacturing light-emitting diode support structure (2) | |
| CN103579442A (en) | Manufacturing method of support structure of light-emitting diode | |
| JP5505735B2 (en) | Light-emitting diode support frame structure and manufacturing method thereof (2) | |
| JP2000124507A (en) | Surface-mounted light-emitting diode | |
| JP5660506B2 (en) | Method for manufacturing frame structure of light-emitting diode having thermosetting property | |
| JP6164355B2 (en) | Light emitting device, resin package, resin molded body, and manufacturing method thereof | |
| TW202018990A (en) | Wafer-class light-emitting panel module and the manufacturing method thereof | |
| JP2018121084A (en) | Light-emitting device and method for manufacturing light-emitting devices | |
| TWM540399U (en) | Heterogeneous LED lighting source component | |
| JP6489162B2 (en) | Lead frame with resin molded body, method of manufacturing the same, and lead frame used in the same | |
| JP2011129793A (en) | Manufacturing method of light-emitting diode light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140204 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140502 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140509 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140603 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141209 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150107 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5686262 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |