JP2014022587A - Mounting housing and mounting method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting housing which is capable of simplifying a component mounting process and is excellent in mass productivity, and to provide a mounting method using the same.SOLUTION: A mounting housing (1) includes: housing substrates (12, 21) of a three-dimensional structure, in which wiring is formed on a first mounting surface (13) and a second mounting surface (22) extending at a predetermined angle with respect to the first mounting surface (13); and a rotation support part (15) for defining a rotation center between the first mounting surface (13) and the second mounting surface (22). The mounting housing (1) is configured such that components to be mounted can be mounted on the first mounting surface (13) and the second mounting surface (22) from the same direction when the housing substrates (12, 21) are rotated around the rotation support part (15).

Description

  The present invention relates to a mounting case and a mounting method using the same.

  There is a wiring board having a three-dimensional structure in which a wiring circuit is formed on a horizontal mounting surface and a vertical mounting surface, and components are mounted on the wiring circuit. As an example of an apparatus including this type of wiring board, for example, a three-dimensional wiring board structure in which a second wiring board on which a component is mounted is vertically joined to a first wiring board on which the component is mounted. A semiconductor device has been proposed (see, for example, Patent Document 1).

JP 2001-274274 A

  Since the wiring board structure applied to the conventional semiconductor device described in Patent Document 1 differs in the orientation of the first wiring board and the second wiring board, the component mounting of the first wiring board and the components of the second wiring board are different. After performing the mounting individually, it is necessary to three-dimensionally assemble the first wiring board and the second wiring board.

  For this reason, there is a problem that not only the component mounting process becomes longer, but also the process becomes complicated and the mass productivity decreases.

  An object of the present invention is to provide a mounting housing that can simplify the component mounting process and is excellent in mass productivity, and a mounting method using the mounting housing.

[1] The present invention provides a housing substrate having a three-dimensional structure in which wiring is formed on a first mounting surface and a second mounting surface extending at a predetermined angle with respect to the first mounting surface, and the first mounting. A rotation support portion that defines a rotation center between a surface and the second mounting surface, and when the housing substrate is rotated about the rotation support portion, the first mounting surface and the first mounting surface 2. A component mounting structure characterized in that components mounted on a mounting surface can be mounted from the same direction.

[2] The present invention further uses the mounting housing according to the above-described claim 1 and rotates the housing substrate around the rotation support portion to thereby provide the first mounting surface and the second mounting surface. Provided is a mounting method using a mounting housing characterized in that each component is mounted.

  According to the present invention, the component mounting process can be simplified, and mass productivity can be improved.

It is a perspective view for demonstrating an example of the electronic component provided with the component mounting structure which concerns on suitable embodiment of this invention. (A) is a top view of FIG. 1, (b) is a left side view. It is a perspective view for demonstrating an example of the jig | tool used in order to mount components in the electronic component shown in FIG. It is principal part sectional drawing (a) and (b) for demonstrating the jig | tool shown in FIG. It is principal part sectional drawing for demonstrating another example of a jig | tool. It is a flowchart for demonstrating the component mounting method which concerns on suitable embodiment of this invention.

  Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

(Overall configuration of electronic components)
In FIG. 1, reference numeral 1 indicating the whole indicates an example of a typical electronic component according to this embodiment. The electronic component 1 according to the illustrated example is used for various switch operation devices such as a vehicle parking switch.

  As shown in FIG. 1, the electronic component 1 is configured by a mounting housing in which the components are mounted (hereinafter also referred to as “mounting housing 1”). The mounting housing 1 includes a first housing substrate 10 extending in the horizontal direction and a second housing substrate 20 extending in an upright direction with respect to one surface of the first housing substrate 10. ing. A connector portion 11 is provided on the other surface of the first housing substrate 10, and the first housing substrate 10, the connector portion 11, and the second housing substrate 20 are integrally formed of an insulating material. It is a three-dimensional structure. This three-dimensional structure has one main configuration of the mounting housing 1 according to this embodiment.

  As shown in FIG. 1, a first wiring substrate 12 is formed on the first housing substrate 10. On the second housing substrate 20, a second wiring substrate 21 is formed in an upright direction with respect to the first wiring substrate 12. Necessary wiring circuits are formed on the wiring boards 12 and 21. The first and second housing substrates 10 and 20 are configured with the wiring circuit inserted.

  As shown in FIG. 1 and FIG. 2A, the first wiring board 12 includes a first mounting surface 13 formed in a rectangular shape and a wiring pattern serving as an electrode formed on the first mounting surface 13. 14. The wiring pattern 14 has a structure that is electrically connected to a lead frame (not shown) of the connector portion 11.

  As shown in FIGS. 1 and 2A, the first wiring board 12 is configured as an LED board. On the first mounting surface 13 of the LED substrate, functional elements such as a light emitting diode 2 (hereinafter referred to as “LED2”) are die-bonded to the wiring pattern 14 and a device (not shown) via the lead frame of the connector portion 11. It is electrically connected to the connection object on the side.

  As shown in FIGS. 1 and 2B, one second wiring substrate 21 has a second mounting surface 22 formed in a rectangular shape and a wiring to be an electrode formed on the second mounting surface 22. Pattern 23. The wiring pattern 23 has a structure that is electrically connected to the lead frame of the connector portion 11.

  As shown in FIGS. 1 and 2B, the second wiring board 21 is configured as a sensor board. The sensor chip 3 is mounted on the second mounting surface 22 of the sensor substrate, and an IC chip 4 for processing a signal detected by the sensor chip 3 is mounted. The sensor chip 3 and the IC chip 4 are electrically connected to the wiring pattern 23 via a bonding wire, solder or the like (not shown), and are connected on the device side (not shown) via the lead frame of the connector portion 11. And is electrically connected.

(Configuration of rotation support part)
The mounting housing 1 has a rotation part that defines the rotation center of the first and second housing substrates 10 and 20. This rotating part has another main configuration of the mounting housing 1 according to this embodiment.

  As shown in FIG. 1, FIG. 2A and FIG. 2B, the rotating portion includes a rotating shaft 15 that is a pair of rotating support portions between the first mounting surface 13 and the second mounting surface 22. , 15 are formed to protrude. The rotation shaft 15 serves as a rotation center when the first mounting surface 13 and the second mounting surface 22 are rotated to the vertical position and the horizontal position, and each of the first mounting surface 13 and the second mounting surface 22 is set to a predetermined position. It is comprised so that it can position to a position. As a result, a component mounting structure in which component mounting can be performed from the same direction on the first mounting surface 13 and the second mounting surface 22 is obtained.

  In the illustrated example, the rotating shaft 15 is formed at a point where a portion corresponding to the length L1 of the first housing substrate 10 and a portion corresponding to the length L2 of the second housing substrate 20 intersect. . The length L1 of the first housing substrate 10 is set to be shorter than the length L2 of the second housing substrate 20. The thickness W1 of the first housing substrate 10 and the thickness W2 of the second housing substrate 20 are set to the same dimension.

(Configuration of jig)
As shown in FIG. 3, the mounting housing 1 configured as described above is effectively mounted on the first mounting surface 13 and the second mounting surface 22 by using a substrate holding jig 50. . The jig 50 has a rectangular parallelepiped shape with an open top, and a jig main body including a rectangular bottom 51 and side portions 52, 52, 53, 53 surrounding the front and rear and the left and right sides of the bottom 51. 54.

  As shown in FIG. 3, slit-shaped recesses 55, 55 are formed inside the side portions 52, 52 of the jig main body 54. The concave portion 55 is configured as a bearing portion that is a rotation support portion that rotatably supports the rotary shaft 15 of the mounting housing 1. Therefore, the recess 55 also serves as a rotation part that defines the rotation center of the first and second housing substrates 10 and 20.

  Inside the side portion 53 that constitutes one side of the jig main body 54, as shown in FIGS. 4A and 4B, a stepped portion 56 having a stepped surface is formed in a step shape. The step surface of the step portion 56 holds the end portion of the first housing substrate 10 horizontally. The side portion 53 constituting the other side is in a position where it does not interfere with the end portion of the first housing substrate 10 when the mounting housing 1 is rotated. A positioning mechanism 57 for horizontally positioning and holding the other end portion of the first housing substrate 10 and the end portion of the second housing substrate 20 is attached to the side portion 53.

  As the positioning mechanism 57, for example, a fluid cylinder such as air or hydraulic pressure is used as an actuator (hereinafter also referred to as “cylinder 57”). At the tip of the cylinder shaft of the cylinder 57, as shown in FIGS. 4A and 4B, an arm portion 57a that holds one end portion of the first housing substrate 10 faces the inside of the jig body 54. It is attached to move freely. A stepped portion 57b for positioning the substrate end portion is formed in a stepped shape at the end edge portion of the arm portion 57a.

  When the mounting housing 1 is set on the jig 50 with the first mounting surface 13 of the first housing substrate 10 facing upward on the opening side, as shown in FIG. The both end portions of the first housing substrate 10 are positioned and held by the step portion 56 of the tool body 54 and the step portion 57b of the arm portion 57a of the cylinder 57. On the other hand, when the mounting housing 1 is set on the jig 50 with the second mounting surface 22 of the second housing substrate 20 facing upward, as shown in FIG. The end portion of the second housing substrate 20 is positioned and held by the stepped portion 57b of the portion 57a.

  Accordingly, when the mounting housing 1 is rotated about the rotation shaft 15 as the rotation center, each of the first mounting surface 13 and the second mounting surface 22 can be held horizontally. Thus, a component mounting method that enables component mounting from the same direction on the first mounting surface 13 and the second mounting surface 22 is effectively obtained.

  In place of the cylinder 57, as shown in FIGS. 5A and 5B, a positioning mechanism 58 in which two rotating arm portions 58a and 58b are connected at a right angle is formed on the other side of the jig body 54. It is also possible to fix and support the inside of the side portion 53 that rotates. The rotating arm portions 58a and 58b of the positioning mechanism 58 are rotated 90 degrees by a power transmission mechanism (not shown) along with the rotation of the mounting housing 1 when the mounting housing 1 is rotated about the rotation shaft 15 as a rotation center. Configured. A stepped portion 58c for positioning the end portion of the first housing substrate 10 is formed in a stepped shape at the tip edge portion of the rotating arm portion 58a.

  The concave portion 55 of the jig main body 54 serves as a rotation support portion that defines the rotation center of the first and second housing substrates 10 and 20, so that the concave portion 55 serves as the rotation center of the jig main body 54. Can be configured as a part. Accordingly, the mounting housing 1 may be configured to rotate with respect to the jig main body 54, or the jig main body 54 may be configured to rotate together with the mounting housing 1.

(Effect of component mounting structure)
By adopting the mounting case 1 configured as described above, the following effects can be obtained in addition to the above effects.

(1) When the first housing substrate 10 and the second housing substrate 20 are rotated about the rotation shaft 15 as the rotation center, the first mounting surface 13 and the second mounting surface 22 are held in horizontal positions. Therefore, components can be easily mounted on the second mounting surface 22 perpendicular to the first mounting surface 13.
(2) A configuration in which the first housing substrate 10 and the second housing substrate 20 are integrally formed, and includes a rotation part that defines a rotation center between the first mounting surface 13 and the second mounting surface 22. Therefore, component mounting can be simplified, and a component mounting structure with excellent mass productivity can be obtained.

(Component mounting method)
In the component mounting method in this embodiment, before mounting the components on the first mounting surface 13 and the second mounting surface 22, the wiring patterns 14, 23, etc. on the first wiring substrate 12 and the second wiring substrate 21, respectively. The step of forming the wiring circuit as a three-dimensional structure is performed.

  As shown in FIG. 6, the component mounting method includes a jig preparation step, a first mounting surface holding step, a first component mounting step, first and second mounting surface rotating steps, and a second mounting surface holding. A series of processes for sequentially performing the process and the second component mounting process are provided. By the component mounting method including this process, component mounting of the mounting housing 1 in which the orientation of the wiring board is different is effectively achieved.

(Jig preparation process)
In the preparation process of the jig 50, the arm portion 57 a of the cylinder 57 is advanced into the jig main body 54. Next, the process proceeds to the first mounting surface holding step of the mounting housing 1.

(First mounting surface holding step)
In the first mounting surface holding step of the mounting housing 1, the rotating shaft 15 of the electronic component 1 is supported in the concave portion 55 of the jig main body 54, and the step portion 56 of the jig main body 54 and the arm portion 57 a of the cylinder 57. Thus, both end portions of the first housing substrate 10 of the mounting housing 1 are horizontally positioned and held. Next, the process proceeds to the first component mounting process.

(First component mounting process)
In the first component mounting step, a required component is die-bonded to the first mounting surface 13 and a wire circuit such as the wiring pattern 14 is wire-bonded according to a standard method. Next, the process proceeds to the first and second mounting surface rotating steps.

(First and second mounting surface rotation process)
In the first and second mounting surface rotating steps, the arm portion 57a of the cylinder 57 is retracted from the inside of the jig main body 54. During the retraction operation of the cylinder 57, the cylinder 57 is rotated 90 degrees in the forward direction around the rotation shaft 15 of the mounting housing 1. With this rotation, the posture of the first mounting surface 13 is changed from the horizontal position to the vertical position, and the posture of the second mounting surface 22 is converted from the vertical position to the horizontal position. Subsequently, the process proceeds to the next second mounting surface holding step.

(Second mounting surface holding step)
During the rotation operation of the mounting housing 1, the arm portion 57 a of the cylinder 57 is advanced into the jig main body 54. The second mounting surface 22 of the mounting housing 1 is held by the arm portion 57 a of the cylinder 57 and positioned in a horizontal position with respect to the bottom portion 51 of the jig main body 54. This state is shown in FIG. Next, the process proceeds to the second component mounting process.

(Second component mounting process)
In the second component mounting step, a required component is die-bonded to the second mounting surface 22 according to a standard method, and the mounted component and a wiring circuit such as the wiring pattern 23 are wire-bonded.

  After the wire bonding, the mounting housing 1 is rotated 90 degrees in the reverse direction with the rotation shaft 15 as the rotation center. During the rotation operation of the mounting housing 1, the arm portion 57 a of the cylinder 57 is retracted from the jig body 54. As the cylinder 57 is retracted, the posture of the first mounting surface 13 is converted from the vertical position to the horizontal position, and the posture of the second mounting surface 22 is converted from the horizontal position to the vertical position, thereby mounting housing 1 To the original state. This state is shown in FIG. Subsequently, the mounting housing 1 is taken out from the inside of the jig body 54 to stand by for the next component mounting.

  Through the above steps, the first component is mounted on the first mounting surface 13 and the second component is mounted on the second mounting surface 22 in an upright state with respect to the first mounting surface 13. Become. In addition, although the example which mounts mounting components in the 1st mounting surface 13 and the 2nd mounting surface 22 by rotating the mounting housing | casing 1 with respect to the jig | tool main body 54 was illustrated, it is not limited to this. Of course, for example, the jig main body 54 may be rotated together with the mounting housing 1.

(Effect of component mounting method)
By adopting the component mounting method configured as described above, the following effects can be obtained in addition to the above effects.

(1) The component mounting can be performed in a state where the first mounting surface 13 and the second mounting surface 22 are held horizontally inside the jig main body 54 simply by rotating the mounting housing 1 by 90 degrees. Automation in the component mounting apparatus can be achieved.
(2) If the mounting housing 1 is positioned and held on the jig main body 54, the mounting components can be accurately placed on the first mounting surface 13 and the second mounting surface 22 without removing the mounting housing 1 from the jig main body 54. Can be implemented.
(3) Positioning work of the first mounting surface 13 and the second mounting surface 22 in component mounting can be reduced, and workability of component mounting can be improved.

[Modification]
In the above embodiment, for example, the following modifications are possible.

(1) Although the example which formed the rotating shaft 15 in the protrusion was illustrated, it may be a recessed part. In this case, the concave portion of the counterpart jig body 54 is formed in a convex shape.
(2) Although an example in which components are mounted on one side of the first housing substrate 10 and one side of the second housing substrate 20 is illustrated, the present invention is not limited to this. A plurality of mounting surfaces can be applied to various mounting housings 1 having a three-dimensional structure with different angles.
(3) It is effective to appropriately select the type of components to be mounted on the first housing substrate 10 and the second housing substrate 20, the installation site, the number of installations and the form, and various changes are possible. Of course.

  As is clear from the above description, the mounting housing of the present invention and the mounting method using the same have been described based on the above-described embodiment, modification, and illustrated example. The present invention is not limited to the modified examples and the illustrated examples, and can be implemented in various modes without departing from the gist thereof.

  In the present invention, it should be noted that not all the combinations of features described in the above-described embodiments, modifications, and illustrated examples are essential to the means for solving the problems of the present invention. Should.

DESCRIPTION OF SYMBOLS 1 ... Electronic component (mounting housing | casing), 2 ... LED, 3 ... Sensor chip, 4 ... IC chip, 10 ... 1st housing substrate, 11 ... Connector part, 12 ... 1st wiring substrate, 13 ... 1st mounting surface , 14, 23 ... wiring pattern, 15 ... rotating shaft, 20 ... second housing substrate, 21 ... second wiring substrate, 22 ... second mounting surface, 50 ... jig, 51 ... bottom, 52, 53 ... side. 54 ... Jig body, 55 ... Recess, 56 ... Step part, 57 ... Positioning mechanism (cylinder), 57a ... Arm part, 57b, 58c ... Step part, 58 ... Positioning mechanism, 58a, 58b ... Rotating arm part, L1 , L2 ... length, W1, W2 ... thickness

Claims (2)

A housing substrate having a three-dimensional structure in which wiring is formed on a first mounting surface and a second mounting surface extending at a predetermined angle with respect to the first mounting surface;
A rotation support part that defines a rotation center between the first mounting surface and the second mounting surface;
With
A mounting housing configured to be capable of mounting components mounted on the first mounting surface and the second mounting surface from the same direction when the housing substrate is rotated around the rotation support portion. body.   Using the mounting housing according to claim 1, component mounting is performed on each of the first mounting surface and the second mounting surface by rotating the housing substrate around the rotation support portion. A mounting method using a mounting housing.

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