JP2015106657A - Mounting substrate and electronic component mounting body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting substrate which allows for easy inspection of mounting position misalignment of an electronic component.SOLUTION: A mounting substrate 1 includes an electronic component mounting region 3 where an electronic component is mounted. The planar shape and plane size of the electronic component mounting region 3 are same as those of the electronic component to be mounted. A position misalignment detection pattern 7 is arranged along the corner of the electronic component mounting region 3. The position misalignment detection pattern 7 includes a position misalignment detection pattern 7a arranged within the electronic component mounting region 3, and position misalignment detection patterns 7b, 7c arranged on the outside of the electronic component mounting region 3.

Description

  The present invention relates to a mounting substrate having an electronic component mounting area on which electronic components are mounted, and an electronic component mounting body in which electronic components are mounted in the electronic component mounting area of the mounting substrate.

  One method for mounting electronic components such as semiconductor chips is a flip chip bonding method. One of inspections of an electronic component mounting body on which electronic components are flip-chip mounted is an inspection for confirming mounting position deviation of the electronic components. As a method for confirming the mounting position shift of an electronic component, a mounting position shift inspection method using an infrared microscope using the infrared transparency of silicon is already known.

  However, in the inspection using an infrared microscope, there are problems that it takes time to focus and the image is unclear. For such a problem, a method for confirming a mounting position shift in flip chip mounting by a method other than infrared is disclosed (see, for example, Patent Documents 1 to 3).

  Patent Document 1 discloses providing a mechanism for capturing an image of an alignment mark of an IC (Integrated Circuit) chip and a corner portion of the IC chip for the purpose of facilitating confirmation of mounting position deviation and improving yield in flip chip mounting. Has been.

  Japanese Patent Application Laid-Open No. 2004-228688 discloses that the mounting position deviation is confirmed using a transparent accuracy confirmation substrate or the like for the purpose of facilitating confirmation of the mounting position deviation in flip chip mounting.

  Patent Document 3 discloses a method of using a substitute characteristic of a mounting position shift by a difference in wiring resistance value for the purpose of facilitating confirmation of a mounting position shift in flip-chip mounting.

  The mounting position shift inspection method in flip chip mounting disclosed in Patent Documents 1 to 3 does not use an infrared microscope.

However, the method disclosed in Patent Document 1 has a problem in that new tools such as upper and lower cameras are required.
In addition, the method disclosed in Patent Document 2 requires a transparent accuracy confirmation substrate, and the method disclosed in Patent Document 3 requires a wiring resistance measurement terminal, and there is a problem that the member is restricted. there were.

  Such a problem occurs not only in flip-chip mounting but also in a mounting position shift inspection when an electronic component is mounted on a mounting board by another method.

  An object of the present invention is to provide a mounting substrate that can easily inspect a mounting position shift of an electronic component.

  A mounting board according to the present invention is a mounting board having an electronic component mounting area on which an electronic component is mounted, and includes a displacement detection pattern arranged along a corner of the electronic component mounting area. The deviation detection pattern is arranged outside and inside the electronic component mounting area.

  The mounting board of the present invention can easily inspect the mounting position shift of the electronic component.

It is a schematic top view for demonstrating one Example of a mounting board | substrate. It is the schematic plan view which expanded and showed the vicinity of one corner | angular part of the electronic component mounting area | region in the mounting board | substrate of the Example. It is a schematic back view for demonstrating an example of an electronic component. It is a schematic plan view for demonstrating one Example of an electronic component mounting body. It is a schematic perspective view of the electronic component mounting body of the same Example. It is the schematic plan view which expanded and showed the vicinity of one corner | angular part of the electronic component mounting area | region in the mounting board | substrate of the Example. It is a schematic top view for demonstrating the other Example of the mounting board | substrate. It is the schematic top view which expanded and showed the vicinity of one corner | angular part of the electronic component mounting area | region in a mounting board | substrate for demonstrating the further another Example of a mounting board | substrate.

  In the mounting board of the present invention, an example in which the positional deviation detection pattern is L-shaped can be given. However, in the mounting board of the present invention, the arrangement shape of the misregistration detection pattern is not limited to the L shape. For example, one misregistration detection pattern may be divided into a plurality of misregistration detection patterns.

  In the mounting substrate of the present invention, the positional deviation detection pattern outside the electronic component mounting area and the positional deviation detection pattern inside the area have the same width dimension, and the positional deviation detection pattern outside the area An example in which the interval between the misregistration detection patterns in the region is the same as the thickness of the misregistration detection pattern can be given. However, in the mounting board of the present invention, the positional displacement detection pattern outside the electronic component mounting region and the positional displacement detection pattern in the region may have different width dimensions. Further, the interval between the positional deviation detection pattern outside the electronic component mounting area and the positional deviation detection pattern within the area may be the same as the width dimension of any of the positional deviation detection patterns. Each width may be different.

  In the mounting board of the present invention, the misregistration detection pattern is disposed at least at one or more of the corners of the electronic component mounting area. More preferably, the misregistration detection pattern is arranged at least at two corners located diagonally among the corners of the electronic component mounting area. More preferably, the misregistration detection pattern is arranged for all of the corners of the electronic component mounting area.

  In the mounting substrate of the present invention, an example in which the electronic component is a semiconductor chip can be given. However, in the mounting substrate of the present invention, the electronic component is not limited to the semiconductor chip, and may be another electronic component.

  The electronic component mounting body according to the present invention is characterized in that an electronic component is mounted in the electronic component mounting region of the mounting substrate of the present invention.

  In the electronic component mounting body of the present invention, an example in which the electronic component is mounted in the electronic component mounting region by flip chip mounting can be given. However, in the electronic component mounting body of the present invention, the electronic component may be mounted in the electronic component mounting region by a method different from the flip chip mounting.

  An embodiment of the present invention will be described. The present invention has the following characteristics when confirming a mounting position shift after mounting an electronic component. In short, since the mounting board of the present invention has a misalignment detection pattern at the corner of the electronic component mounting area, the misalignment between the IC and the board can be achieved without the need for a new tool such as an infrared microscope. The feature is that it can be detected.

  FIG. 1 is a schematic plan view for explaining one embodiment of a mounting board. FIG. 2 is a schematic plan view showing an enlarged vicinity of one corner of the electronic component mounting area on the mounting board of this embodiment.

  The mounting substrate 1 includes an electronic component mounting area 3 on which electronic components are mounted. The planar shape of the electronic component mounting area 3 is the same as the electronic component to be mounted, and is rectangular, for example. The size of the electronic component mounting area 3 is the same as the planar size of the electronic component to be mounted, for example, 5 × 15 mm (millimeters). However, in the mounting substrate of the present invention, the size of the electronic component mounting area and the electronic components are not limited to this embodiment.

  In the area of the electronic component mounting area 3, electrode pads 5 are arranged corresponding to the external connection terminals of the electronic parts to be mounted. The electrode pad 5 is formed by a metal material pattern formed on the surface of the base material of the mounting substrate 1, for example. Although not shown, a wiring pattern electrically connected to the electrode pad 5 is also formed on the surface of the base material of the mounting substrate 1.

  A misalignment detection pattern 7 is formed along the corner of the electronic component mounting area 3. The misregistration detection pattern 7 is arranged for every four corners of the electronic component mounting area 3. Each displacement detection pattern 7 includes three displacement detection patterns 7a, 7b, and 7c.

  The planar shape of the misregistration detection patterns 7a, 7b, 7c is, for example, L-shaped. In each positional deviation detection pattern 7, the positional deviation detection patterns 7a, 7b, 7c are arranged in the order of the positional deviation detection pattern 7a, the positional deviation detection pattern 7b, and the positional deviation detection pattern 7c from the center side of the electronic component mounting area 3. .

  The positional deviation detection patterns 7a, 7b, and 7c are formed with the same width dimension, for example. The width dimension of the positional deviation detection patterns 7a, 7b, and 7c is, for example, 5 μm (micrometer). The interval between the misregistration detection pattern 7a and the misregistration detection pattern 7b and the interval between the misregistration detection pattern 7b and the misregistration detection pattern 7c are, for example, the same as the width dimension of the misregistration detection patterns 7a, 7b, and 7c. It is.

  In each misregistration detection pattern 7, the misregistration detection pattern 7 a is arranged in the electronic component mounting region 3. The misregistration detection pattern 7a is arranged with an interval of 5 μm from the boundary of the electronic component mounting area 3.

  The misregistration detection pattern 7 b is arranged outside the electronic component mounting area 3. The misregistration detection pattern 7 b is arranged adjacent to the boundary of the electronic component mounting area 3.

  The misregistration detection pattern 7 c is arranged outside the electronic component mounting area 3. The positional deviation detection pattern 7b is arranged at a position opposite to the electronic component mounting area 3 with respect to the positional deviation detection pattern 7a. The positional deviation detection pattern 7b is arranged with an interval of 5 μm from the positional deviation detection pattern 7a.

  The misregistration detection patterns 7a, 7b, and 7c of the misregistration detection pattern 7 are made of, for example, a metal material or an insulating material. For example, the misregistration detection patterns 7a, 7b, and 7c are arranged on the surface of the base material of the mounting substrate 1 and are simultaneously formed of the same metal material as the electrode pads 5 and the wiring pattern. The metal material is, for example, Cu (copper) or Al (aluminum).

  A solder resist (not shown) that functions as a protective insulating film is formed on the surface of the base material of the mounting substrate 1. The misalignment detection pattern 7 and the wiring pattern formed on the surface of the base material of the mounting substrate 1 are covered with a solder resist. The solder resist on the center part of the electrode pad 5 is removed. In addition, the structure which the soldering resist on the position shift detection pattern 7 is removed and the position shift detection pattern 7 is exposed may be sufficient.

In the mounting board of the present invention, the structure of the misregistration detection pattern is not limited to the structure of the misregistration detection patterns 7a, 7b, and 7c.
For example, the misregistration detection pattern may be formed of a metal material in a separate process from the electrode pad and the wiring pattern. Note that the metal material for forming the misregistration detection pattern is not limited to Cu or Al, and may be another metal material.
The misregistration detection pattern may be formed on a layer different from the layer on which the electrode pad and the wiring pattern are formed, for example, on the surface of the protective insulating film.

  The misregistration detection pattern may be formed of an insulating material. For example, the misregistration detection pattern may be formed of the same material as the protective insulating film such as a solder resist. For example, the misregistration detection pattern is formed of a protective insulating film material in which a recess is formed in the protective insulating film around the misregistration detection pattern or the protective insulating film around the misregistration detection pattern is removed. The structure currently made can be mentioned. The misregistration detection pattern may be formed by a convex shape or a concave shape formed on the surface of the protective insulating film due to the convex shape or concave shape of the lower layer of the protective insulating film.

The misregistration detection pattern may be formed of an insulating material pattern formed separately from the protective insulating film, for example, an insulating material pattern formed on the surface of the protective insulating film by silk printing.
Thus, in the mounting substrate of the present invention, the material of the misalignment detection pattern and the layer on which the misalignment detection pattern is formed are not particularly limited.

FIG. 3 is a schematic back view for explaining an example of the electronic component.
The electronic component 9 is, for example, a flip chip mounting type semiconductor chip. The electronic component 9 includes an external connection terminal 9a on the back surface. The external connection terminal 9a is, for example, a solder bump.

  FIG. 4 is a schematic plan view for explaining one embodiment of the electronic component mounting body. FIG. 5 is a schematic perspective view of the electronic component mounting body of this embodiment. FIG. 6 is a schematic plan view showing, in an enlarged manner, the vicinity of one corner of the electronic component mounting region on the mounting board of this embodiment.

  The electronic component mounting body 11 is obtained by mounting the electronic component 9 on the mounting substrate 1 described with reference to FIGS. 1 and 2. The electronic component 9 is the same as that described with reference to FIG. The electronic component 9 is mounted on the mounting substrate 1 with the surface on which the external connection terminals 9a are disposed facing the mounting substrate 1 side.

  The external connection terminal 9 a of the electronic component 9 is connected to the electrode pad 5 of the mounting substrate 1. The connection between the external connection terminal 9a and the electrode pad 5 is performed by a flip chip mounting technique.

  The electronic component 9 is mounted on the mounting substrate 1 in alignment with the electronic component mounting area 3 of the mounting substrate 1. However, as shown in FIG. 6, the mounting position of the electronic component 9 may be shifted with respect to the electronic component mounting area 3.

  A misalignment detection pattern 7 is arranged on the mounting substrate 1. By observing the corners of the electronic component mounting area 3, the mounting position shift of the electronic component 9 can be easily detected. Observation of the corner of the electronic component mounting area 3 does not require a special device such as an infrared microscope, and can be performed by, for example, a normal optical general-purpose inspection machine. Here, a typical optical general purpose inspection machine is, for example, a substrate appearance inspection apparatus manufactured by OMRON Corporation.

  As described above, the inspection using the infrared microscope takes time for focusing. On the other hand, since the observation of the corner of the electronic component mounting area 3 with respect to the electronic component mounting body 11 does not require an infrared microscope, the mounting substrate 1 and the electronic component mounting body 11 require an inspection time after mounting the electronic component 9. It can be shortened.

  When the electronic component 9 is accurately mounted on the electronic component mounting area 3, the side adjacent to the electronic component mounting area 3 of the positional shift detection pattern 7 b of the positional shift detection pattern 7 (0 point in the X direction and 0 in the Y direction). The outline of the electronic component 9 matches the point). In this case, the mounting position deviation amount of the electronic component 9 is zero.

  In the mounted state shown in FIG. 6, the electronic component 9 overlaps with the misregistration detection pattern 7 b of the misregistration detection pattern 7 in the X direction (left and right direction on the paper surface) and the Y direction (up and down direction on the paper surface). In the X direction, the contour of the corner of the electronic component 9 is located between the misalignment detection pattern 7b and the misalignment detection pattern 7c. In the Y direction, the contour of the corner of the electronic component 9 overlaps with the misalignment detection pattern 7b. Therefore, the mounting position shift amount of the electronic component 9 is a shift of −5 to −10 μm in the X direction and a shift within +5 μm in the Y direction.

  Further, by observing the amount of displacement of the mounting position of the electronic component 9 using the displacement detection pattern 7 for a plurality of corners, how much the mounting position of the electronic component 9 is rotated with respect to the electronic component mounting area 3. You can also check whether they are present.

  FIG. 7 is a schematic plan view for explaining another embodiment of the mounting board. In FIG. 7, parts having the same functions as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the mounting substrate 1 of this embodiment, the misregistration detection pattern 7 is arranged at two corners located diagonally of the electronic component mounting area 3. If the misalignment detection patterns 7 are arranged for at least two corners among the four corners of the electronic component mounting area 3, the mounting position of the mounted electronic component is the electronic component mounting. It can be inspected how much the region 3 is rotating.

  The misregistration detection pattern 7 may be arranged at one corner among the four corners of the electronic component mounting region 3 or arranged at two adjacent corners. It may be arranged, and may be arranged with respect to three corners.

  FIG. 8 is a schematic plan view showing, in an enlarged manner, the vicinity of one corner of the electronic component mounting region on the mounting board for explaining still another embodiment of the mounting board. 8, parts having the same functions as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the mounting substrate 1 of this embodiment, the misregistration detection pattern 7 includes a set of misregistration detection patterns 7a-1 and 7a-2 arranged along the corners of the electronic component mounting area 3 and the misregistration detection pattern 7b-. 1 and 7b-2.

  The misregistration detection patterns 7a-1 and 7a-2 are arranged in the electronic component mounting area 3. The positional deviation detection pattern 7a-1 is arranged adjacent to the boundary of the electronic component mounting area 3 in the X direction. The positional deviation detection pattern 7a-2 is arranged adjacent to the boundary of the electronic component mounting area 3 in the Y direction.

  The misregistration detection patterns 7b-1 and 7b-2 are arranged outside the electronic component mounting area 3. The misregistration detection pattern 7b-1 is arranged opposite to the side of the electronic component mounting area 3 parallel to the Y direction of the electronic component mounting area 3 with an interval of 5 μm, for example. The misregistration detection pattern 7a-2 faces the side of the electronic component mounting area 3 parallel to the X direction, and is arranged with an interval of, for example, 5 μm from the electronic component mounting area 3.

  The width dimension (dimension in the X direction) of the misregistration detection patterns 7a-1 and 7b-1 is, for example, 5 μm. The width dimension (dimension in the Y direction) of the misregistration detection patterns 7a-2 and 7b-2 is, for example, 5 μm. The interval between the positional deviation detection pattern 7a-1 and the positional deviation detection pattern 7b-1 and the interval between the positional deviation detection pattern 7a-2 and the positional deviation detection pattern 7b-2 are, for example, 5 μm.

  The electronic component mounting body in which the electronic component is mounted on the mounting substrate 1 of this embodiment is easily inspected for a mounting position shift of the electronic component, similarly to the electronic component mounting body 11 described with reference to FIGS. it can. Thus, the shape of the positional deviation detection patterns 7a-1, 7a-2, 7b-1, 7b-2 may be a quadrangle. In the present invention, the planar shape of the misregistration detection pattern is not particularly limited.

  Note that “the positional deviation detection pattern arranged along the corner of the electronic component mounting area” means that the positional deviation detection pattern is arranged at a position facing two sides of the corner of the electronic component mounting area. Means. For example, like the displacement detection patterns 7a, 7b, and 7c shown in FIG. 1, the displacement detection patterns may be continuously arranged at positions facing the two sides of the corner of the electronic component mounting area. . Further, like the set of misalignment detection patterns 7a-1, 7a-2 and the set of misalignment detection patterns 7b-1, 7b-2 shown in FIG. You may divide | segment and arrange | position with respect to the position facing 2 sides of a part. One misregistration detection pattern is opposed to the misalignment detection pattern continuously arranged at the positions facing the two sides of the corner of the electronic component mounting area, and the two sides of the corner of the electronic component mounting area. It may be a combination of misregistration detection patterns arranged separately with respect to the position.

  As mentioned above, although the Example of this invention was described, the numerical value, material, arrangement | positioning, number, etc. in the said Example are examples, This invention is not limited to these, It was described in the claim Various modifications are possible within the scope of the present invention.

  For example, in the above embodiment, the electronic component 9 is a flip chip mounting type semiconductor chip. However, in the present invention, the electronic component is not limited to a flip chip mounting type semiconductor chip. In the present invention, the electronic component may be a surface mount type semiconductor chip other than the flip chip mount type, for example, a semiconductor chip having an out lead such as a QFP (Quad Flat Package). The electronic component may be an electronic component other than a semiconductor chip, such as a resistance element.

  Moreover, in the said Example, although any position shift detection pattern is adjacent to an electronic component mounting area | region in the mounting board | substrate 1, the mounting board | substrate of this invention is not limited to this. The mounting substrate of the present invention may have a configuration in which no misregistration detection pattern is adjacent to the electronic component mounting area.

  Moreover, in the said Example, although the corner | angular part of the electronic component mounting area 3 is a right angle, the mounting board | substrate of this invention is not limited to this. In the mounting substrate of the present invention, the corner of the electronic component mounting area may be rounded or formed at an angle other than a right angle in accordance with the planar shape of the electronic component to be mounted.

  Moreover, in the said Example, although the planar shape of the electronic component mounting area 3 is a rectangle, the mounting board | substrate of this invention is not limited to this. In the mounting board of the present invention, the planar shape of the electronic component mounting region may be a shape that matches the shape of the electronic component to be mounted. For example, the electronic component mounting region may be a rectangle other than a rectangle, or a polygon other than a rectangle. It may be.

  In addition, the number of misregistration detection patterns arranged for one corner of the electronic component mounting area is not particularly limited as long as it is arranged outside and inside the electronic component mounting area.

  For example, in the embodiment shown in FIG. 1, two misregistration detection patterns 7 b and 7 c are arranged outside the electronic component mounting region 3 with respect to one corner of the electronic component mounting region 3. In the mounting board of the present invention, the number of misregistration detection patterns arranged outside the electronic component mounting area with respect to one corner of the electronic component mounting area may be one, or three or more. There may be.

  In the embodiment shown in FIG. 1, one misregistration detection pattern 7 a is arranged in the electronic component mounting region 3 with respect to one corner of the electronic component mounting region 3. In the mounting board of the present invention, the number of misregistration detection patterns arranged in the area of the electronic component mounting area with respect to one corner of the electronic component mounting area may be two or more.

DESCRIPTION OF SYMBOLS 1 Mounting substrate 3 Electronic component mounting area 5 Electrode pads 7, 7a, 7b, 7c Misalignment detection pattern 7a-1, 7a-2, 7b-1, 7b-2 Misalignment detection pattern 9 Electronic component 11 Electronic component mounting body.

Japanese Patent No. 4768731 Japanese Patent No. 3400340 Japanese Patent No. 3306505

Claims (7)

In a mounting board with an electronic component mounting area on which electronic components are mounted,
A misalignment detection pattern arranged along a corner of the electronic component mounting area,
The mounting substrate, wherein the displacement detection pattern is arranged outside and inside the electronic component mounting area.   The mounting substrate according to claim 1, wherein the displacement detection pattern is L-shaped. The positional displacement detection pattern outside the electronic component mounting region and the positional displacement detection pattern within the region have the same width dimension,
3. The mounting board according to claim 1, wherein an interval between the misregistration detection pattern outside the region and the misregistration detection pattern within the region is the same as a thickness of the misregistration detection pattern.   The mounting substrate according to any one of claims 1 to 3, wherein the misregistration detection pattern is arranged in at least one of corners of the electronic component mounting area.   The mounting board according to claim 1, wherein the electronic component is a semiconductor chip.   An electronic component mounting body, wherein an electronic component is mounted in the electronic component mounting region of the mounting substrate according to any one of claims 1 to 5.   The electronic component mounting body according to claim 6, wherein the electronic component is mounted in the electronic component mounting region by flip chip mounting.

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