JP2014013947A - Method for manufacturing laminated mounting structure - Google Patents
Method for manufacturing laminated mounting structure Download PDFInfo
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- JP2014013947A JP2014013947A JP2013222092A JP2013222092A JP2014013947A JP 2014013947 A JP2014013947 A JP 2014013947A JP 2013222092 A JP2013222092 A JP 2013222092A JP 2013222092 A JP2013222092 A JP 2013222092A JP 2014013947 A JP2014013947 A JP 2014013947A
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- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
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- H05K2203/1316—Moulded encapsulation of mounted components
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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Abstract
Description
本発明は、積層実装構造体及び積層実装構造体の製造方法に関するものである。 The present invention relates to a stacked mounting structure and a manufacturing method of the stacked mounting structure.
従来、積層された電子回路基板を接続する基板間接続部材として、特許文献1(特開2001−144399号公報)に記載された基板間接続部材があった。この基板間接続部材は、剛性を有する導体からなる芯体を弾性体で覆うとともに、弾性体の周囲を導電性を有する材料で被覆するものである。基板間接続部材をこのように構成することにより、補修作業に際して電子回路基板を分離するのに加熱が必要でないという効果がある。 Conventionally, there has been an inter-substrate connection member described in Patent Document 1 (Japanese Patent Laid-Open No. 2001-144399) as an inter-substrate connection member for connecting stacked electronic circuit boards. This inter-substrate connecting member covers a core body made of a rigid conductor with an elastic body and covers the periphery of the elastic body with a conductive material. By configuring the inter-substrate connecting member in this way, there is an effect that heating is not required to separate the electronic circuit board during repair work.
また、別の従来例として、電子部品を内蔵していながら小型で高密度の基板を実現するために、配線基板本体の貫通穴に樹脂により電子部品を固定した後、樹脂に研磨や穴あけの加工を行うことで電子部品の電極を露出させ、さらに配線基板本体の表裏面に配線層を形成するものが提案されていた。 As another conventional example, in order to realize a small and high-density board with built-in electronic components, the electronic components are fixed to the through holes of the wiring board body with resin, and then polishing and drilling are performed on the resin. It has been proposed to expose the electrodes of the electronic component by performing the above and further form a wiring layer on the front and back surfaces of the wiring board body.
しかしながら、特許文献1に記載の基板間接続部材は、狭ピッチ化が可能であったとしても以下の課題があった。すなわち、(1)積層された電子回路基板を互いに着脱することを前提としたものであり、(2)接続部材を複数形成する場合の凹部への位置あわせ及び組み立てが困難であり、(3)電子回路基板を多数積層することは考慮されていない、(4)少なくとも芯体と弾性体という二つの部材が必要であるため小型化が困難であった。
However, the inter-substrate connection member described in
また、上記別の従来例は、基板厚さ内に内蔵できる電子部品は基板厚さより高さが小さい部品に限られている上に、基板本体表裏面の配線層を電子部品を介して接続しなければならず、配線層の設計上の制約が大きいという課題があった。基板本体表裏面の配線層を電子部品を介さずに接続する場合には、スルーホールを介して接続することはできるが、スルーホール径よりも大きな電極パッド(ランド電極)を設ける必要があり、基板接続部の狭ピッチ化が難しいため、基板主面の面積を小さくするのには限界があった。 In another conventional example, electronic components that can be built in the substrate thickness are limited to components whose height is smaller than the substrate thickness, and the wiring layers on the front and back surfaces of the substrate body are connected via electronic components. Therefore, there is a problem that the restriction on the design of the wiring layer is large. When connecting the wiring layers on the front and back surfaces of the substrate body without passing through electronic components, it is possible to connect through the through hole, but it is necessary to provide an electrode pad (land electrode) larger than the through hole diameter, Since it is difficult to reduce the pitch of the substrate connection portion, there is a limit to reducing the area of the main surface of the substrate.
本発明は、上記に鑑みてなされたものであって、狭ピッチ化を実現できるとともに、被実装部品を実装することのできる高さを確保することのできる積層実装構造体及び積層実装構造体の製造方法を提供することを目的とする。また、本発明のさらなる目的は、基板の配線自由度が高く、基板接続部の狭ピッチ化が可能なことにより、基板主面の面積が小さい積層実装構造体を提供することにある。 The present invention has been made in view of the above, and it is possible to realize a narrow mounting pitch and a stacked mounting structure and a stacked mounting structure capable of securing a height at which a mounted component can be mounted. An object is to provide a manufacturing method. A further object of the present invention is to provide a stacked mounting structure having a small substrate main surface area because the wiring flexibility of the substrate is high and the pitch of the substrate connecting portions can be reduced.
上述した課題を解決し、目的を達成するために、本発明の積層実装構造体は、少なくとも一方の主面上に被実装部品を設置、動作するために必要な実装領域、及び、被実装部品が動作するための信号伝達のための接続用領域、を備える複数の部材と、対向する部材との間の接続用領域に配置された導電部材と、を有し、導電部材の断面は、接続用領域と同じ又はそれより小さく、導電部材の端部は一方の部材主面から他方の部材主面に達し、導電部材の高さは、実装領域の間隔を規定することを特徴としている。 In order to solve the above-described problems and achieve the object, the stacked mounting structure of the present invention includes a mounting area required for installing and operating a mounted component on at least one main surface, and the mounted component. A plurality of members including a connection region for signal transmission to operate, and a conductive member disposed in a connection region between opposing members, and a cross section of the conductive member is connected The end of the conductive member reaches the other member main surface from one member main surface, and the height of the conductive member defines the interval between the mounting regions.
本発明の積層実装構造体において、導電部材の周囲に補強部材が設置されていることが好ましい。 In the stacked mounting structure of the present invention, it is preferable that a reinforcing member is provided around the conductive member.
本発明の積層実装構造体において、実装領域には被実装部品が実装されており、複数の部材間の実装領域の間隔は被実装部品の高さより高いことが望ましい。 In the stacked mounting structure of the present invention, the mounted component is mounted in the mounting region, and it is desirable that the interval of the mounting region between the plurality of members is higher than the height of the mounted component.
本発明の積層実装構造体において、補強部材は、対向する部材の間の実装領域に充填されているとよい。 In the stacked mounting structure of the present invention, the reinforcing member may be filled in a mounting region between the opposing members.
本発明の積層実装構造体において、導電部材が棒形状であることが好ましい。 In the stacked mounting structure of the present invention, the conductive member is preferably rod-shaped.
本発明の積層実装構造体において、導電部材は、一方の端部が連結された状態において、他方の端部を前記部材に実装した後、前記連結された部分を除去してなることが望ましい。 In the stacked mounting structure of the present invention, it is preferable that the conductive member is formed by removing the connected portion after mounting the other end portion on the member in a state where the one end portion is connected.
本発明の積層実装構造体において、補強部材の一方の端部に、少なくとも一部が導電部材と電気的に接続された導電パターンが形成されていることが好ましい。 In the stacked mounting structure of the present invention, it is preferable that a conductive pattern in which at least a part is electrically connected to the conductive member is formed on one end of the reinforcing member.
また、本発明の積層実装構造体の製造方法は、第1の部材に、被実装部品及び被実装部品の高さより高い導電部材を実装する工程と、第1の部材上の導電部材の周囲に、導電部材の第1の部材と逆側の端部を露出させて補強部材を形成する補強工程と、を備え、補強工程において、補強部材の第1の部材と逆の面を研磨して平坦化すると共に導電部材の端部を露出させることを特徴としている。 The method for manufacturing a stacked mounting structure of the present invention includes a step of mounting a mounted member and a conductive member higher than the height of the mounted component on the first member, and around the conductive member on the first member. A reinforcing step of exposing the end of the conductive member opposite to the first member to form a reinforcing member, and in the reinforcing step, the surface opposite to the first member of the reinforcing member is polished and flattened And the end of the conductive member is exposed.
本発明の積層実装構造体の製造方法において、導電部材の一方の端部を、複数の前記導電体が連結された状態に形成する連結工程をさらに備えることが望ましい。 In the method for manufacturing a stacked mounting structure according to the present invention, it is desirable to further include a connecting step of forming one end of the conductive member in a state where the plurality of the conductors are connected.
本発明の積層実装構造体の製造方法において、導電部材の第1の部材と逆側の端部を露出させて補強部材を形成した後、露出した導電部材の端部表面に金属膜を形成する工程と、導電部材端部表面の金属膜上にバンプを形成する工程と、を備えることが好ましい。 In the method for manufacturing a stacked mounting structure according to the present invention, after the end of the conductive member opposite to the first member is exposed to form a reinforcing member, a metal film is formed on the exposed end surface of the conductive member. It is preferable to include a step and a step of forming a bump on the metal film on the surface of the end portion of the conductive member.
本発明の積層実装構造体の製造方法において、第1の部材は複数のモジュールに相当する大きさであり、絶縁材料形成工程の後に個片化工程を備えるとよい。 In the method for manufacturing a stacked mounting structure according to the present invention, the first member may have a size corresponding to a plurality of modules, and may include an individualization step after the insulating material formation step.
本発明にかかる積層実装構造体及び積層実装構造体の製造方法によれば、狭ピッチ化を実現できるとともに、被実装部品を実装することのできる高さを確保することのできる積層実装構造体及び積層実装構造体の製造方法を提供することができるという効果を奏する。 According to the stacked mounting structure and the manufacturing method of the stacked mounting structure according to the present invention, a stacked mounting structure capable of realizing a narrow pitch and ensuring a height at which a mounted component can be mounted, and There exists an effect that the manufacturing method of a laminated mounting structure can be provided.
以下に、本発明にかかる積層実装構造体及び積層実装構造体の製造方法の実施例を図面に基づいて詳細に説明する。なお、この実施例によりこの発明が限定されるものではない。
本発明に係る積層実装構造体の製造方法は、回路基板上に被実装部品を実装すると同時に、その中の最も背の高い部品より長い導電部材を、回路基板上の電極に基板と垂直に固定・接続し、導電部材と被実装部品の間隙に樹脂を充填した後、研磨によって導電部材の頭部のみを露出させる。露出した導電部材に対して、第2の基板を接続、もしくは研磨面に印刷によって回路を形成することで、上下の回路基板を電気的、機械的に接続固定するものであって、これにより本発明に係る積層実装構造体が形成される。以下に具体的な実施例について説明する。
Embodiments of a stacked mounting structure and a manufacturing method of the stacked mounting structure according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.
In the method for manufacturing a stacked mounting structure according to the present invention, a mounted component is mounted on a circuit board, and at the same time, a conductive member longer than the tallest component is fixed to an electrode on the circuit board perpendicularly to the substrate. After connecting and filling the gap between the conductive member and the mounted component with resin, only the head of the conductive member is exposed by polishing. By connecting the second substrate to the exposed conductive member or forming a circuit on the polished surface by printing, the upper and lower circuit substrates are electrically and mechanically connected and fixed. A stacked mounting structure according to the invention is formed. Specific examples will be described below.
図1は、本発明にかかる積層実装構造体の実施例1の構成を、第1の基板20と第2の基板30に分離して示す斜視図である。図2は、実施例1に係る積層実装構造体10の構成を示す断面図である。
FIG. 1 is a perspective view showing a configuration of a first embodiment of a stacked mounting structure according to the present invention, separated into a
図1に示すように、第1の基板20の主面20aには電子部品26が実装されている。また、第2の基板30には電子部品36が実装されている。第1の基板20と第2の基板30は対向して配置される。第1の基板20及び第2の基板30には多層基板や電子部品内蔵基板を用いても良い。
As shown in FIG. 1, an
第1の基板20の電子部品26の間には電極22が設けられており、電極22上に略円柱状の導電部材21が設置されている。導電部材21の長さは全て略同一であり、第1の基板20に実装された電子部品26の中で最も高い高さよりも大きい。また、導電部材21の長さ方向と垂直な直交断面積は電極22の面積と同等以下となっている。
導電部材21は、円柱状の部品を用いれば、線材から切り出すことで容易に作成できる。このとき、導電部材21の第1の基板20に実装する側の端部の径を大きくしておけば、第1の基板20への実装を容易かつ確実に行うことができる。一方、導電部材の第1の基板20と逆側の端部は、いくつかの導電部材がつながった状態で実装することもできる。
If the cylindrical member is used for the
導電部材21は、電気抵抗の低い材料(例えばCu(銅))を用いることが好ましい。また、導電部材21の表面には、母材の酸化を防止するために、例えばAu(金)メッキを施すことが好ましい。さらに、導電部材21には、はんだづけを容易にするための表面処理が施されており、導電部材21の一方の端部と電極22ははんだづけで導電接合されている。なお、はんだづけに代えて、例えば、異方導電性材料を用いたACP工法やACF工法、NCP工法による接触導電によって導通をとることもできる。
The
図2に示すように、第1の基板20及び第2の基板30には配線層24、34がそれぞれ形成されている。第1の基板20上の電子部品26と導電部材21の周囲には、樹脂の絶縁材料(補強部材)が充填硬化されて絶縁層23が形成されている。この絶縁層23においては、第2の基板30側の面(上面)23aから、導電部材21の第2の基板30側の端部21aのみが露出している。
As shown in FIG. 2, wiring layers 24 and 34 are formed on the
第2の基板30の第1の基板20と対向する面30aの導電部材21と対向する位置には、電極32が設置されている。第2の基板30は、第1の基板20の導電部材21の端部21aと電極32とが電気的に接続されるように、絶縁材料23表面に接合される。なお、第2の基板30の露出面上の電極(不図示)に導電部材(不図示)を設置するなどし、積層数を更に増やしてもよい。
An
実施例1では、上下の回路基板を接続する導電部材は電子部品間に自由に配置できるため、各基板の配線設計の制約となることがない。さらに、導電部材を実装する電極はスルーホール電極でないためランド電極が必要なく、導電部材を狭ピッチで配置することができるため、基板主面の面積が小さい積層実装構造体を提供することができる。また、基板への貫通穴加工や、凹部加工を必要としないため、低価格でかつ基板主面の面積が小さい積層実装構造体を提供することができる。 In the first embodiment, since the conductive members that connect the upper and lower circuit boards can be freely arranged between the electronic components, there is no restriction on the wiring design of each board. Furthermore, since the electrode for mounting the conductive member is not a through-hole electrode, no land electrode is required, and the conductive member can be arranged at a narrow pitch, so that it is possible to provide a stacked mounting structure with a small substrate main surface area. . In addition, since a through-hole process and a recess process are not required in the substrate, it is possible to provide a stacked mounting structure that is inexpensive and has a small area on the main surface of the substrate.
図3は、本発明にかかる積層実装構造体の実施例2の構成を、第1の基板50と第2の基板60に分離して示す斜視図である。図4は、実施例2に係る導電部材と補強部材の関係を示す拡大斜視図である。
FIG. 3 is a perspective view showing the configuration of the second embodiment of the stacked mounting structure according to the present invention, separated into a
実施例2においては、導電部材51の周囲に実装領域の一部又は全部を露出させた状態で補強部材57を形成している点が実施例1と異なる。すなわち、実施例1の積層実装構造体10における第1の基板20、導電部材21、電極22、電子部品26、第2の基板30、電子部品36が、実施例2の積層実装構造体40における第1の基板50、導電部材51、電極52、電子部品56、第2の基板60、電子部品66に、それぞれ対応する。また、図示しないが、実施例2の積層実装構造体40においても、実施例1の積層実装構造体10の配線層24、34と同様の配線層が形成されている。
The second embodiment is different from the first embodiment in that the reinforcing
実施例2では、補強部材形成後において電子部品が露出しているため、第2の基板を接続する直前に電子部品の検査を行うことができ、積層実装構造体の不良品を減らすことが出来る。 In the second embodiment, since the electronic component is exposed after the reinforcing member is formed, the electronic component can be inspected immediately before the second substrate is connected, and defective products of the stacked mounting structure can be reduced. .
図4に例示するように、導電部材51の周囲には、第2の基板60側の端部51aを残すように補強部材57を配置している。補強部材57としては、例えば、導電部材51の周囲に配置するときには液状であって、配置の後に硬化する物質を用いる。
As illustrated in FIG. 4, the reinforcing
図5は、本発明に係る積層実装構造体の実施例3の構成を示す斜視図である。
実施例3の積層実装構造体70においては、実施例1の絶縁層23と同様に、第1の基板80上の電子部品(不図示)と導電部材81の周囲に樹脂の絶縁材料による絶縁層83が形成されるとともに、この絶縁層83のうち、第1の基板80から遠い面において、導電部材81を接続するように配線88が形成されている。すなわち実施例3においては、実施例1の第2の基板30及び実施例2の第2の基板60のような第2の基板を載置することなく、絶縁層83上に直接配線88を形成している。なお、配線88の形成方法はメッキ、スパッタ、蒸着やインクジェットやディスペンスによる印刷配線を用いれば良い。このような構成としたことにより、第2の基板の基材部分が不要となるため、設計の自由度を上げることができるとともに、積層高さが低くかつ基板主面の面積が小さい積層実装構造体を提供することができる。
FIG. 5 is a perspective view showing the configuration of Example 3 of the stacked mounting structure according to the present invention.
In the stacked mounting
(変形例)
次に、積層実装構造体の変形例を説明する。図11(a)、(b)、(c)、(d)は、変形例にかかる積層実装構造体の構成を示している。
上述したように、導電部材21の第1の基板20と逆側の端部は、いくつかの導電部材21がつながった状態で実装することもできる。いくつかの導電部材がつながった状態は、基材100上にCuなどのメッキで導電部材21を形成すること、またはCuなどの導電材料の板100にプレス加工を行うこと等で形成できる(図11(a))。
本例では、連結した導電部材21を第1の基板20と別に製作して、第1の基板20に接続している。図11(b)は、ピン基板接合の状態を示している。そして、図11(c)に示すように、第1の基板20と導電部材21が連結された部分の間に樹脂を塗布、硬化させる。ここで、先に第1の基板20に樹脂を塗布しておいても良い。
(Modification)
Next, a modified example of the stacked mounting structure will be described. FIGS. 11A, 11B, 11C, and 11D show the configuration of a stacked mounting structure according to a modification.
As described above, the end of the
In this example, the connected
第1の基板20と導電部材21とが連結された部分を研磨で除去して、各導電部材21を露出させる。露出した導電部材21の端部に導電部材21の酸化を防ぐ金属膜を形成する。最後に、図11(d)に示すように第2の基板30を積層して、基板20、30間を接続する。これにより、積層実装構造体を形成する。このため、電子部品26の高さが、例えば0.3mmから1mmなど比較的高い場合において、電子部品26の高さよりも長い導電部材21を第1の基板20の主面20aに自在に配置して、第1の基板20と第2の基板30を接続できる。また、接続ピッチを狭ピッチ化できる。
The portion where the
このように、導電部材21は、一方の端部が複数連結された状態で第1の基板20に一括して実装している。このため、導電部材21を容易に実装できる。また、突起電極は一括して製作できるため、より狭いピッチ化が可能である。この結果、積層実装構造体を容易に小さく製造できる。
Thus, the
つづいて、本発明に係る積層実装構造体の製造方法について、実施例4から実施例6を挙げて説明する。 Next, a method for manufacturing a stacked mounting structure according to the present invention will be described with reference to Examples 4 to 6.
図6は、実施例4に係る積層実装構造体の製造方法の流れを示すフローチャートである。実施例4の製造方法は、実施例1から実施例3及び変形例に適用することができ、実施例4から実施例6の説明においては、実施例1の符号を用いることとする。 FIG. 6 is a flowchart illustrating the flow of the manufacturing method of the stacked mounting structure according to the fourth embodiment. The manufacturing method of the fourth embodiment can be applied to the first to third embodiments and the modified examples, and the reference numerals of the first embodiment are used in the description of the fourth to sixth embodiments.
まず、第1の基板20に電子部品26を実装する(ステップS1)と同時に、第1の基板20の電極22上に導電部材21を実装する(ステップS2)。前者の実装は、一般的な表面実装プロセス等を用いればよい。また、後者の実装を例えばはんだづけで行う場合は、電極22上にクリームハンダとフラックスを印刷法等により供給しておき、実装装置や治具を用いて導電部材を電極22上に位置決め固定して加熱することで、導電部材21を実装することができる。なお、第1の基板20への電子部品26及び導電部材21の実装は、電子部品26を実装した後に導電部材21を実装してもよいし(実施例5又は実施例6を参照)、その逆でもよい。
First, the
次に、電子部品26と導電部材21が実装された第1の基板20上に、導電部材21の第1の基板20と逆側(第2の基板30側)の端面21aが露出する様に、液状封止樹脂等を塗布し、硬化させることで、第1の基板20上の電子部品26と導電部材21の周囲に絶縁層23を形成する。これにより、導電部材21及び電子部品26を封止する(ステップS3)。樹脂の硬化方法は熱硬化や2液混合などがある。第1の基板20の外形や所望の硬化後形状に合わせた型を用いれば硬化後の樹脂形状を容易に整えることが出来る。なお、実施例4を実施例2に適用する場合は、ステップS3において、樹脂の封止に代えて、補強部材を導電部材の周囲に配置する。
Next, on the
その後、導電部材21の第1の基板20と逆側の端面上に形成した金属膜状のバンプを介して、第2の基板30を第1の基板20に対して積層接続する。なお、実施例4を実施例3に適用する場合は、第2の基板30を積層することなく、絶縁層23の第1の基板20と逆側の面23aに直接配線を形成する。
Thereafter, the
以上の工程により積層実装構造体を製造するため、非常に少ない工程で、基板主面の面積が小さい積層実装構造体を提供することができる。 Since the stacked mounting structure is manufactured through the above steps, it is possible to provide a stacked mounting structure having a small area of the main surface of the substrate with very few processes.
図7は、実施例5に係る積層実装構造体の製造方法の流れを示すフローチャートである。実施例5は、電子部品実装(ステップS1)、導電部材実装(ステップS2)、及び樹脂封止(ステップS3)の各工程が実施例4と共通しているため、これらの工程についての説明は省略する。 FIG. 7 is a flowchart illustrating the flow of the manufacturing method of the stacked mounting structure according to the fifth embodiment. In the fifth embodiment, the steps of electronic component mounting (step S1), conductive member mounting (step S2), and resin sealing (step S3) are the same as those of the fourth embodiment. Omitted.
樹脂封止(ステップS3)の後に、絶縁層23の第1の基板20の主面20aと平行を保つように、絶縁層23の上面23aを研磨し、平坦化するとともに導電部材21の第1の基板20と逆側の端面21aを各々露出させる(ステップS4)。
After resin sealing (step S3), the
次に、露出した導電部材21の端面21a上に金属膜(UBM層)を形成する(ステップS5)。金属膜を形成することにより、導電部材21の酸化等を防ぐことができ、後の工程のバンプ形成時に電気抵抗が低く、高い強度のバンプを形成することができる。
Next, a metal film (UBM layer) is formed on the exposed
つづいて、露出した導電部材21の端面21a上に形成した金属膜上にバンプを形成する(ステップS6)。バンプ材質としては、はんだやAuを用いることができる。
その後、導電部材21の端面21a上に形成した金属膜上のバンプ29(図9、図10)を介して第2の基板30を積層接続する。
Subsequently, bumps are formed on the metal film formed on the exposed
Thereafter, the
このような方法で積層実装構造体を製造することにより、絶縁層23の上面23aが平坦化され、かつ、確実に第1の基板20の主面20aと平行になるため、導電部材21の端面21aは、第2の基板30が接続しやすいような構造となる。したがって、第1の基板20と第2の基板30との接続品質が高く、かつ、基板主面の面積が小さい積層実装構造体を提供することができる。
By manufacturing the stacked mounting structure by such a method, the
図8は、実施例6に係る積層実装構造体の製造方法の流れを示すフローチャートである。図9は、右側が図8のS1〜S6の工程に対応した積層実装構造体の構成を示す拡大斜視図であり、左側は右側図の個片化された積層実装構造体の集合状態を示す斜視図である。図10は、図8のS1〜S6の工程に対応した積層実装構造体の構成を示す側面図である。 FIG. 8 is a flowchart illustrating the flow of the method for manufacturing the stacked mounting structure according to the sixth embodiment. FIG. 9 is an enlarged perspective view showing the configuration of the stacked mounting structure corresponding to the steps S1 to S6 in FIG. 8 on the right side, and the assembled state of the separated stacked mounting structure on the right side is shown on the left side. It is a perspective view. FIG. 10 is a side view showing the configuration of the stacked mounting structure corresponding to the steps S1 to S6 in FIG.
実施例6は、電子部品実装(ステップS1)、導電部材実装(ステップS2)、樹脂封止(ステップS3)、研磨(ステップS4)、UBM層形成(ステップS5)、及びバンプ形成(ステップS6)の各工程が実施例5と共通している。バンプ29の形成後に、第1の基板20には、複数のモジュール90が形成されており、ダイシングなどの個片化工程により個別モジュール化する(ステップS7)。
In Example 6, electronic component mounting (step S1), conductive member mounting (step S2), resin sealing (step S3), polishing (step S4), UBM layer formation (step S5), and bump formation (step S6) These steps are the same as those in the fifth embodiment. After the formation of the
このような製造方法によれば、複数のモジュールを一度に製作できるため、モジュール製造のコストが低くかつ基板主面の面積が小さい積層実装構造体を提供することができる。 According to such a manufacturing method, since a plurality of modules can be manufactured at a time, it is possible to provide a stacked mounting structure having a low module manufacturing cost and a small area of the substrate main surface.
(変形例)
図12は、変形例に係る積層実装構造体の製造方法の流れを示すフローチャートである。すでに上述している各実施例の工程と同じ内容については、同一の符号を付し、重複する説明は省略する。まず、本変形例において、まず第1の基板20に電子部品26を実装する(ステップS1)。
基材100上の第1の基板20の電子部品26の間に設けられた電極と対向する位置に、Cuをメッキで成長させる。これにより、いくつかの導電部材21の一方の端部が連結された状態を形成する(ステップS2a)。
(Modification)
FIG. 12 is a flowchart showing the flow of the manufacturing method of the stacked mounting structure according to the modification. About the same content as the process of each Example already mentioned above, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted. First, in this modification, the
Cu is grown by plating at a position facing the electrodes provided between the
導電部材21の一方の端部がつながった状態は、基材100へCuをメッキで形成すること、さらにはCu等の導電材料の板100にプレス加工を行う等で導電部材21を形成すること、棒状の電導部材21を治具に並べた状態で端面にメッキすること等の種々の方法を用いることができる。導電部材21の高さ(長さ)は、電子部品26の高さよりも大きいように形成されている。
When one end of the
導電部材21の連結されていない側の端部を第1の基板20の主面20aの電極にはんだ等で接合する(ステップS2)。導電部材21の一方の端部が連結された状態で、その表面にAuメッキ等を施しておけば、Cuの酸化を防止してはんだづけを確実に行うことができる。
The end of the
第1の基板20と導電部材21が連結された部分の間に樹脂を塗布、硬化させる(ステップS3)。ここで、先に第1の基板20に樹脂を塗布しておいても良い。
A resin is applied and cured between the portions where the
第1の基板20と導電部材21とが連結された部分を研磨で除去して、各導電部材21を露出させる(ステップS4)。導電部材21の周囲は樹脂で補強されている。このため、安定して導電部材21を研磨できる。さらに、研磨により導電部材21の高さ(長さ)を精密に揃えることができる。このため、用いる導電部材21の長さの公差を広げることが出来る。
The portion where the
電子部品26の高さが、例えば0.3mmから1mmなど比較的高い場合において、電子部品26の高さよりも長い導電部材21を第1の基板20の主面20aに自在に配置して、第1の基板20と第2の基板30を接続できる。また、接続ピッチを狭ピッチ化できる。
When the height of the
その後、露出した導電部材21の端部に導電部材21の酸化を防ぐ金属膜を形成する。そして、第2の基板30を接続することで積層実装構造体を形成する。
Thereafter, a metal film that prevents oxidation of the
このように、導電部材21は、一方の端部が複数連結された状態で第1の基板20に一括して実装している。このため、導電部材21を容易に実装できる。また、突起電極は一括して製作できるため、より狭いピッチ化が可能である。この結果、積層実装構造体を容易に小さく製造できる。
Thus, the
以上説明したように、本発明によれば、上下の回路基板を接続する導電部材は電子部品間に自由に配置できるため、各基板の配線設計の制約となることがない。さらに、導電部材を実装する電極はスルーホール電極でないためランド電極が必要なく、導電部材を狭ピッチで配置することができるため、基板主面の面積が小さい積層実装構造体を提供することができる。 As described above, according to the present invention, since the conductive members that connect the upper and lower circuit boards can be freely arranged between the electronic components, there is no restriction on the wiring design of each board. Furthermore, since the electrode for mounting the conductive member is not a through-hole electrode, no land electrode is required, and the conductive member can be arranged at a narrow pitch, so that it is possible to provide a stacked mounting structure with a small substrate main surface area. .
以上のように、本発明にかかる積層実装構造体及び積層実装構造体の製造方法は、実装構造体の小型化に有用であり、特に、内視鏡先端撮像ユニットの高密度実装に適している。 As described above, the stacked mounting structure and the manufacturing method of the stacked mounting structure according to the present invention are useful for downsizing the mounting structure, and are particularly suitable for high-density mounting of the endoscope front-end imaging unit. .
10 積層実装構造体
20 第1の基板
20a 主面
21 導電部材
21a 端部
22 電極
23 絶縁層
23a 上面
24 配線層
26 電子部品
29 バンプ
30 第2の基板
32 電極
34 配線層
36 電子部品
40 積層実装構造体
50 第1の基板
51 導電部材
52 電極
56 電子部品
57 補強部材
60 第2の基板
66 電子部品
70 積層実装構造体
80 第1の基板
81 導電部材
83 絶縁層
88 配線
90 モジュール
DESCRIPTION OF
上述した課題を解決し、目的を達成するために、本発明の積層実装構造体の製造方法は、 第1の部材に、被実装部品を実装する工程と、被実装部品の高さより高い複数の導電部材の一方の端部が連結された状態を形成する連結工程と、被実装部品を実装した第1の部材表面に、複数の導電部材の連結した一方の端部とは逆側の端部を一括して接合し実装する工程と、第1の部材と複数の導電部材が連結された部分の間に補強部材を形成する補強工程と、複数の導電部材が連結された部分を研磨で除去して、複数の導電部材の端部を露出させる研磨工程と、露出した導電部材の端部表面に金属膜を形成する工程と、導電部材の端部表面の金属膜上にバンプを形成する工程と、を備えることを特徴とする。 In order to solve the above-described problems and achieve the object, a method for manufacturing a stacked mounting structure according to the present invention includes a step of mounting a mounted component on the first member, and a plurality of steps higher than the height of the mounted component. A connecting step for forming a state in which one end of the conductive member is connected, and an end opposite to the one end connected to the plurality of conductive members on the first member surface on which the mounted component is mounted Bonding and mounting in a lump, reinforcing step of forming a reinforcing member between a portion where the first member and a plurality of conductive members are connected, and removing a portion where the plurality of conductive members are connected by polishing Then, a polishing step for exposing end portions of the plurality of conductive members, a step for forming a metal film on the exposed end portion surfaces of the conductive members, and a step for forming bumps on the metal films on the end portion surfaces of the conductive members And.
本発明にかかる積層実装構造体の製造方法によれば、狭ピッチ化を実現できるとともに、被実装部品を実装することのできる高さを確保することのできる積層実装構造体の製造方法を提供することができるという効果を奏する。 According to the method of manufacturing stacked mounting structure according to the present invention, it is possible to realize a narrow pitch, to provide a method of manufacturing a stacked mounting structure capable of ensuring the height that can be implemented to be mounted components There is an effect that can be.
以上のように、本発明にかかる積層実装構造体の製造方法は、実装構造体の小型化に有用であり、特に、内視鏡先端撮像ユニットの高密度実装に適している。 As described above, the method for manufacturing a stacked mounting structure according to the present invention is useful for downsizing the mounting structure, and is particularly suitable for high-density mounting of an endoscope tip imaging unit.
Claims (11)
対向する前記部材との間の前記接続用領域に配置された導電部材と、を有し、
前記導電部材の断面は、前記接続用領域と同じ又はそれより小さく、前記導電部材の端部は前記一方の部材主面から他方の部材主面に達し、前記導電部材の高さは、前記実装領域の間隔を規定することを特徴とする積層実装構造体。 A plurality of members provided with a mounting region necessary for installing and operating the mounted component on at least one main surface, and a connection region for signal transmission for operating the mounted component;
A conductive member disposed in the connection region between the opposing members,
The cross section of the conductive member is the same as or smaller than the connection region, the end of the conductive member reaches the other member main surface from the one member main surface, and the height of the conductive member is the mounting A stacked mounting structure characterized by defining an interval between regions.
前記複数の部材間の実装領域の間隔は前記被実装部品の高さより高いことを特徴とする請求項1又は請求項2に記載の積層実装構造体。 The mounted component is mounted in the mounting area,
3. The stacked mounting structure according to claim 1, wherein an interval of a mounting region between the plurality of members is higher than a height of the mounted component.
前記第1の部材上の前記導電部材の周囲に、前記導電部材の前記第1の部材と逆側の端部を露出させて補強部材を形成する補強工程と、を備え、
前記補強工程において、前記補強部材の前記第1の部材と逆の面を研磨して平坦化すると共に導電部材の端部を露出させることを特徴とする積層実装構造体の製造方法。 Mounting a conductive member higher than the height of the mounted component and the mounted component on the first member;
A reinforcing step of forming a reinforcing member by exposing an end of the conductive member opposite to the first member around the conductive member on the first member;
In the reinforcing step, a surface of the reinforcing member opposite to the first member is polished and flattened, and an end portion of the conductive member is exposed, and a method for manufacturing a stacked mounting structure is provided.
前記導電部材端部表面の金属膜上にバンプを形成する工程と、を備えることを特徴とする請求項8に記載の積層実装構造体の製造方法。 Forming a metal film on the exposed end surface of the conductive member after exposing the end of the conductive member opposite to the first member to form the reinforcing member;
And a step of forming a bump on the metal film on the surface of the end portion of the conductive member.
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