JP2014013776A - Bulb type lighting device - Google Patents
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- JP2014013776A JP2014013776A JP2013211607A JP2013211607A JP2014013776A JP 2014013776 A JP2014013776 A JP 2014013776A JP 2013211607 A JP2013211607 A JP 2013211607A JP 2013211607 A JP2013211607 A JP 2013211607A JP 2014013776 A JP2014013776 A JP 2014013776A
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Abstract
Description
本発明は、発光ダイオード(以下LEDと記す)、Electroluminescence(以下ELと記す)等を光源とし、該光源を駆動する駆動回路を備える電球型の照明装置に関する。 The present invention relates to a light bulb-type lighting device that uses a light emitting diode (hereinafter referred to as LED), electroluminescence (hereinafter referred to as EL), or the like as a light source and includes a drive circuit that drives the light source.
近年、LEDを光源とする照明装置が様々な用途、形状で開発されている。その特徴として長寿命、低消費電力という利点がある。しかし、照明装置に求められる光量が大きくなるにつれて、光出力を高くするために複数のチップLEDを高密度に集積したLEDや、高出力型のLEDが光源として用いられる場合がある。 In recent years, lighting devices using LEDs as light sources have been developed in various applications and shapes. Its features include advantages of long life and low power consumption. However, as the amount of light required for the lighting device increases, an LED in which a plurality of chip LEDs are integrated at a high density or a high output type LED may be used as a light source in order to increase the light output.
そういった場合において、光出力や消費電力の増大に伴って光源や光源を駆動する駆動回路部に実装される、IC,抵抗,ダイオード等の駆動電流が流れることにより発熱する発熱部品からの、発熱量は大きくなる。特に、発熱部品からの発熱の影響により、駆動回路部に実装される発熱部品を含む駆動回路部への熱的負荷が高まり、それに伴う駆動回路部の劣化や故障に繋がるという問題が生じる。このためLEDやEL等を光源とする照明装置では、駆動回路部に実装される発熱部品からの熱を効率的に放熱する必要があった。 In such a case, the amount of heat generated from a heat generating component that generates heat when a drive current such as an IC, a resistor, or a diode is mounted on a light source or a drive circuit unit that drives the light source as the light output or power consumption increases. Will grow. In particular, due to the heat generated from the heat generating components, there is a problem that the thermal load on the drive circuit portion including the heat generating components mounted on the drive circuit portion is increased, leading to deterioration and failure of the drive circuit portion. For this reason, in the illuminating device which uses LED, EL, etc. as a light source, it was necessary to radiate | emit the heat from the heat-emitting components mounted in a drive circuit part efficiently.
従来、LED照明の放熱のための構造として、例えば光源であるLEDを配置した基板を取り付けた金属製のベースと、金属製の放熱部と一体に形成された光源取り付け面を面接触させる構造が知られている(特許文献1参照)。 Conventionally, as a structure for heat dissipation of LED lighting, for example, a structure in which a metal base on which a substrate on which an LED as a light source is arranged is attached and a light source mounting surface formed integrally with a metal heat dissipation portion are in surface contact with each other. It is known (see Patent Document 1).
特許文献1では、光源であるLEDからの熱の放熱効率を向上させる構造についての記載がなされている。 Patent Document 1 describes a structure that improves the heat dissipation efficiency of heat from an LED that is a light source.
本発明の電球型の照明装置は、光源と、該光源を駆動する駆動回路部と、内部に空洞が形成された放熱部と、前記駆動回路部の縁部を嵌合させる嵌合部を有し、前記空洞内に設けられている固定部とを備える照明装置において、前記放熱部は、前記光源側に、前記空洞方向に突出し、ねじ用穴が設けられたボス部を有し、前記固定部は、前記ボス部に対向させて位置決めをする位置決め部を有することを特徴とする。 The light bulb-type lighting device of the present invention includes a light source, a drive circuit unit that drives the light source, a heat dissipation unit that has a cavity formed therein, and a fitting unit that fits an edge of the drive circuit unit. And the fixing unit provided in the cavity, wherein the heat dissipating part has, on the light source side, a boss part protruding in the cavity direction and provided with a screw hole. The part has a positioning part for positioning the part to face the boss part.
本発明の電球型の照明装置は、前記ボス部は、前記空洞の周縁に複数設けられていることを特徴とする。 The bulb-type lighting device according to the present invention is characterized in that a plurality of the boss portions are provided on the periphery of the cavity.
本発明の電球型の照明装置は、前記ボス部は、前記空洞の周縁の3個所に設けられていることを特徴とする。 The bulb-type illumination device of the present invention is characterized in that the boss portion is provided at three locations on the periphery of the cavity.
(実施の形態1)
以下、本発明をその実施形態を示す図面に基づいて説明する。図1は本発明の実施の形態1に係る照明装置100の外観図であり、図2は図1の照明装置100の分解斜視図であり、図3は図1の照明装置100の要部横断面図であり、図4は図1の照明装置100の要部縦断面図であり、図5は図4における透光部の要部拡大縦断面図であり、図6は図2における駆動回路部の要部拡大斜視図である。
(Embodiment 1)
Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. 1 is an external view of a lighting device 100 according to Embodiment 1 of the present invention, FIG. 2 is an exploded perspective view of the lighting device 100 of FIG. 1, and FIG. 3 is a cross-sectional view of the main part of the lighting device 100 of FIG. 4 is a longitudinal sectional view of a main part of the illuminating device 100 of FIG. 1, FIG. 5 is an enlarged longitudinal sectional view of a main part of the light transmitting part in FIG. 4, and FIG. 6 is a drive circuit in FIG. It is a principal part expansion perspective view of a part.
実施の形態1に係る照明装置100は、図2に示すように光源である複数のLEDモジュール11が実装された光源モジュール1と、光源モジュール1を覆うドーム状の透光部2と、光源モジュール1を駆動するための複数の駆動回路部品31、31、31、…を有する駆動回路部3と、光源モジュール1と駆動回路部3が実装する発熱部品31a、31a、31a…が発する熱を放熱するための放熱部4と、駆動回路部3に電気的に接続され外部電源に接続される円筒状の口金部5と、口金部5と放熱部4とを連結する連結体6と、光源モジュール1が取り付けられ放熱部4に固定される放熱板7と、駆動回路部3を放熱部4内部に固定して収容するための固定部8と、駆動回路部3から放熱部4に熱を伝導するための熱伝導部材9とを備えている。 A lighting apparatus 100 according to Embodiment 1 includes a light source module 1 on which a plurality of LED modules 11 that are light sources are mounted, a dome-shaped translucent portion 2 that covers the light source module 1, and a light source module as shown in FIG. Radiates heat generated by the drive circuit unit 3 having a plurality of drive circuit components 31, 31, 31,... For driving 1, and the heat generating components 31 a, 31 a, 31 a, which are mounted by the light source module 1 and the drive circuit unit 3. A heat dissipating part 4, a cylindrical base part 5 electrically connected to the drive circuit part 3 and connected to an external power source, a coupling body 6 connecting the base part 5 and the heat dissipating part 4, and a light source module 1 to which the heat radiating plate 7 is attached and fixed to the heat radiating portion 4, the fixing portion 8 for fixing and housing the drive circuit portion 3 inside the heat radiating portion 4, and the heat conduction from the driving circuit portion 3 to the heat radiating portion 4. Heat conduction member 9 for To have.
光源モジュール1は、図2、図4に示すように、円盤状の光源基板12上に、本照明装置100の光源であるLEDモジュール11を実装し、LEDモジュール11を実装しない側の面にて放熱板7に設置し、ねじ(図示せず)で取り付けてある。LEDモジュール11は、例えば、LED素子と、該LED素子を封止し、蛍光体が分散された封止樹脂と、入力端子及び出力端子とを備えてなる表面実装型LEDである。光源モジュール1で発生した熱は、放熱板7の周縁から外部の空気中へ放熱するか、または放熱板7から放熱部4に伝導し、該放熱部4を通して外部の空気中へ放熱することができる。 As shown in FIGS. 2 and 4, the light source module 1 has an LED module 11 that is a light source of the illumination device 100 mounted on a disk-shaped light source substrate 12, and the surface on which the LED module 11 is not mounted. It is installed on the heat sink 7 and attached with screws (not shown). The LED module 11 is, for example, a surface-mounted LED that includes an LED element, a sealing resin that seals the LED element, and phosphors are dispersed, and an input terminal and an output terminal. The heat generated in the light source module 1 can be radiated from the periphery of the heat radiating plate 7 to the outside air, or can be conducted from the heat radiating plate 7 to the heat radiating portion 4 and radiated to the outside air through the heat radiating portion 4. it can.
放熱板7は、図2、図4に示すように透光部2側の面71の周縁には、溝状の取付溝72が設けてあり、面71の周縁部には三箇所のねじ用穴71a、71a、71aが設けてある。透光部2は外縁2aを取付溝72に嵌合した状態で、接着剤で接合することで放熱板7に取り付けられる。また放熱板7の放熱部4側の面73の周縁には、後述する放熱部4の係合溝42に係合するための凹凸形状の係合部74が設けてある。 As shown in FIGS. 2 and 4, the heat radiating plate 7 is provided with a groove-like mounting groove 72 at the periphery of the surface 71 on the side of the light transmitting portion 2, and three screws for the periphery of the surface 71. Holes 71a, 71a, 71a are provided. The translucent part 2 is attached to the heat sink 7 by bonding with an adhesive in a state where the outer edge 2 a is fitted in the attachment groove 72. Further, an uneven engaging portion 74 for engaging with an engaging groove 42 of the heat radiating portion 4 described later is provided on the periphery of the surface 73 on the heat radiating portion 4 side of the heat radiating plate 7.
放熱部4は、例えばアルミニウム等の熱伝導性の高い金属性材料からなり、口金部5を接続する方から透光部2の方(垂直方向)へかけて放熱部4の断面が拡径するような円筒形状をなしている。 The heat radiating part 4 is made of a metal material having high thermal conductivity such as aluminum, and the diameter of the cross section of the heat radiating part 4 increases from the direction connecting the base part 5 to the light transmitting part 2 (vertical direction). It has a cylindrical shape like this.
放熱部4の、透光部2に近い側の端部の周縁には鍔部41が設けてあり、該鍔部41の放熱板7に対向する側の周面には先述の係合部74と係合することで放熱板7に固定するための溝状の係合溝42が設けてある。さらに鍔部41の内側周縁において、三箇所に垂直方向に設けてあるねじ用穴43a、43a、43aを有するボス部43が設けてある。放熱部4と放熱板7を係合溝42と係合部74を係合させ、ねじ用穴71a、71a、71aとねじ用穴43a、43a、43aを整合させた状態で、放熱板7を放熱部4にねじで固定する。 A flange 41 is provided on the periphery of the end of the heat radiating part 4 on the side close to the translucent part 2, and the engaging part 74 described above is provided on the peripheral surface of the flange 41 facing the heat radiating plate 7. Is provided with a groove-like engagement groove 42 for fixing to the heat radiating plate 7. Further, on the inner peripheral edge of the collar portion 41, boss portions 43 having screw holes 43a, 43a, 43a provided in three vertical directions are provided. With the heat radiating portion 4 and the heat radiating plate 7 engaged with the engaging groove 42 and the engaging portion 74, the screw holes 71a, 71a, 71a and the screw holes 43a, 43a, 43a are aligned with each other. Secure to the heat dissipation part 4 with screws.
放熱部4の外周面には、垂直方向に長い複数の放熱溝44、44、44、…が形成され、放熱部4に伝わった熱は、放熱溝44、44、44、…の表面を介して外部の空気中に放熱することができる。 A plurality of heat radiation grooves 44, 44, 44,... That are long in the vertical direction are formed on the outer peripheral surface of the heat radiation part 4, and the heat transmitted to the heat radiation part 4 passes through the surface of the heat radiation grooves 44, 44, 44,. Heat can be dissipated into the outside air.
図3、図4に示すように、放熱部4は、内部に収容部45として空洞が形成されており、LEDモジュール11へ所要の電力を供給するための駆動回路部3を収容している。また、収容部45には、駆動回路部3を収容部45内で放熱部4の内側の壁面に隔離して固定するための固定部8が設けられている。固定部8は、電気絶縁性を有する樹脂等の材料製であり、収容部45へ挿入可能な口金部5の側から透光部2側へ拡径する略円筒形状をなしている。 As shown in FIGS. 3 and 4, the heat radiating unit 4 has a cavity formed therein as a housing unit 45 and houses the drive circuit unit 3 for supplying required power to the LED module 11. In addition, the accommodating portion 45 is provided with a fixing portion 8 for isolating and fixing the drive circuit portion 3 to the inner wall surface of the heat radiating portion 4 in the accommodating portion 45. The fixing portion 8 is made of a material such as an electrically insulating resin, and has a substantially cylindrical shape that expands from the base portion 5 side that can be inserted into the housing portion 45 to the translucent portion 2 side.
駆動回路部3は、固定部8内側の嵌合部81、81に駆動回路部3の縁部32aを嵌合させることにより固定部8に固定され収容部45へ挿入される。その際固定部8の周縁に設けられた位置決め部82、82、82と放熱部周縁に設けられたボス部43、43、43とが当接することにより放熱部4の周方向に対する固定部8の位置決めがなされる。また固定部8は、放熱部4の内側の底面に形成された支持凸部46と固定部8の放熱板7側の枠に設けられた突起83、84とにより放熱部4の長手方向に対する位置決めがなされる。 The drive circuit unit 3 is fixed to the fixed unit 8 and inserted into the housing unit 45 by fitting the edge 32 a of the drive circuit unit 3 to the fitting units 81, 81 inside the fixed unit 8. At that time, the positioning portions 82, 82, 82 provided on the periphery of the fixing portion 8 and the boss portions 43, 43, 43 provided on the periphery of the heat radiating portion abut on each other, thereby Positioning is done. Further, the fixing portion 8 is positioned in the longitudinal direction of the heat radiating portion 4 by the support convex portion 46 formed on the bottom surface inside the heat radiating portion 4 and the projections 83 and 84 provided on the frame on the heat radiating plate 7 side of the fixing portion 8. Is made.
また固定部8は、駆動回路部品31、31、31、…を構成する発熱部品31a、31a、31a…および発熱部品以外の回路部品31b、31b、31b、…と、放熱部4の内周面との間を固定部8が塞がないように、発熱部品31a、31a、31a…および回路部品31b、31b、31b、…に対向する面が部分的に切り取られたような形状をなしている。これにより駆動回路部品31、31、31、…からの熱は、固定部8に妨げられることなく放熱部4に伝導することができる。 Further, the fixing portion 8 includes the heat generating components 31a, 31a, 31a,... Constituting the drive circuit components 31, 31, 31,... And the circuit components 31b, 31b, 31b,. The surface facing the heat generating components 31a, 31a, 31a... And the circuit components 31b, 31b, 31b,. . Thereby, the heat from the drive circuit components 31, 31, 31,... Can be conducted to the heat radiating unit 4 without being blocked by the fixing unit 8.
放熱部4の内部には、駆動回路部3の発熱部品31a、31a、31a…に対向し、発熱部品31a、31a、31a…に近接するような面47aを有する凸型の伝熱部47が、放熱部4の内側の壁面に形成されている。発熱部品31a、31a、31a…と伝熱部47の面47aの近接する間隔Gは、後述する熱伝導部材9が挿入できる程度の3mmから5mmである。伝熱部47は、例えばアルミニウム等の熱伝導性に優れた金属性材料からなり、これは放熱部4と同材料で一体型であってもよいし、別体として接着剤等で放熱部4の内側の壁面に接続されていてもよい。 Inside the heat radiating section 4, there is a convex heat transfer section 47 having a surface 47a that faces the heat generating components 31a, 31a, 31a... Of the drive circuit section 3 and is close to the heat generating components 31a, 31a, 31a. It is formed on the inner wall surface of the heat radiation part 4. The gap G between the heat generating components 31a, 31a, 31a,... And the surface 47a of the heat transfer section 47 is 3 mm to 5 mm to the extent that a heat conduction member 9 described later can be inserted. The heat transfer section 47 is made of a metallic material having excellent thermal conductivity, such as aluminum, and may be of the same material as the heat dissipation section 4 or may be integrated with the heat dissipation section 4 using an adhesive or the like as a separate body. It may be connected to the inner wall surface.
伝熱部47を別体として形成する場合には、伝熱部47に放熱部4と比較して軽量である材料を用いることにより、収容部45の一部に伝熱部47を形成することによる照明装置100の重量化を抑制することができる。 When the heat transfer part 47 is formed separately, the heat transfer part 47 is formed in a part of the housing part 45 by using a material that is lighter than the heat dissipation part 4 for the heat transfer part 47. The weight of the lighting device 100 can be suppressed.
発熱部品31a、31a、31a…が伝熱部47の面47aに、対向して近接させるように収容部45に駆動回路部3を収容することで、発熱部品31a、31a、31a…から発生した熱が速やかに伝熱部47に伝導し、従来技術に比べ収容部45内での熱の滞留時間が短くなる。従って、収容部45内での温度上昇を軽減でき、これにより各駆動回路部品31、31、31、…やLEDモジュール11、その他部品への熱的負荷が軽減できる。 The heat generating components 31a, 31a, 31a,... Are generated from the heat generating components 31a, 31a, 31a, etc. by housing the drive circuit unit 3 in the housing portion 45 so that the heat generating components 31a, 31a, 31a,. Heat is quickly conducted to the heat transfer section 47, and the heat residence time in the housing section 45 is shorter than in the prior art. Therefore, the temperature rise in the accommodating part 45 can be reduced, and this can reduce the thermal load on each drive circuit component 31, 31, 31,..., The LED module 11, and other components.
図2、図4に示すように、放熱部4の口金部5側には、放熱部4と口金部5との間に連結体6が設けられており、連結体6は放熱部4と口金部5を連結する。連結体6は樹脂等の等の電気絶縁性を有する材料製であり、所要の電力を口金部5から駆動回路部3に供給するための電源線(図示せず)を通すため略円筒型をなしている。 As shown in FIGS. 2 and 4, a connecting body 6 is provided between the heat dissipating part 4 and the base part 5 on the base part 5 side of the heat dissipating part 4, and the connecting body 6 includes the heat dissipating part 4 and the base part. The parts 5 are connected. The connection body 6 is made of a material having electrical insulation properties such as resin, and has a substantially cylindrical shape for passing a power line (not shown) for supplying required power from the base portion 5 to the drive circuit portion 3. There is no.
連結体6は放熱部4と接続するための放熱部接続部61と、放熱部接続部61と一体的に形成され口金部5を保持する口金接続部62とからなる。放熱部4の連結体6側の面における周縁の内側の三箇所には、放熱部4と連結体6を接続するためのねじ用穴48、48、48があり、同様に放熱部接続部61の周縁に設けられたねじ用穴61a、61a、61aとねじ(図示せず)により放熱部4と放熱部接続部61は接続されている。口金接続部62は外周面にネジ加工が施してあり、口金部5の内周面と螺合して口金部5と接続されている。 The coupling body 6 includes a heat radiation part connection part 61 for connecting to the heat radiation part 4 and a base connection part 62 that is formed integrally with the heat radiation part connection part 61 and holds the base part 5. There are screw holes 48, 48, 48 for connecting the heat dissipating part 4 and the connecting body 6 at three positions inside the periphery of the surface of the heat dissipating part 4 on the side of the connecting body 6. The heat radiation part 4 and the heat radiation part connection part 61 are connected to each other by screw holes 61a, 61a, 61a and screws (not shown) provided on the periphery of the heat radiation part. The base connection portion 62 is threaded on the outer peripheral surface, and is screwed with the inner peripheral surface of the base portion 5 to be connected to the base portion 5.
口金部5は、内側に空洞51を有しており、一端側が開口し、他端側は底を有している。口金部は外周面に電球ソケットと螺合して外部の電源と電気的に接続するためのネジ加工が施されている一極端子52と、口金部5の底面に設けられた他極端子53とからなる。一極端子52と他極端子53とは絶縁されている。 The base part 5 has a cavity 51 on the inner side, one end side is open, and the other end side has a bottom. The base part is screwed on the outer peripheral surface with a light bulb socket and is threaded to be electrically connected to an external power source, and the other electrode terminal 53 provided on the bottom surface of the base part 5. It consists of. The one-pole terminal 52 and the other-pole terminal 53 are insulated.
また図3、図4に示すように、伝熱部47の面47aと発熱部品31a、31a、31a…との間には、高い熱伝導性と電気絶縁性を有し柔軟性のあるシート状の熱伝導部材9(例えば、シリコーンゲルシート)が伝熱部43と発熱部品31aに接するように設置されている。 Further, as shown in FIGS. 3 and 4, between the surface 47a of the heat transfer section 47 and the heat generating components 31a, 31a, 31a..., A flexible sheet shape having high thermal conductivity and electrical insulation. The heat conducting member 9 (for example, silicone gel sheet) is installed so as to be in contact with the heat transfer portion 43 and the heat generating component 31a.
熱伝導部材9は、電気絶縁性を有しているので、駆動回路部3と伝熱部47が短絡することを防ぐことができる。また、熱伝導部材9は柔軟性を有するので、発熱部品31a、31a、31a…と伝熱部47の面47aに密着させることで周部に熱を逃がさず、さらに高い熱伝導率を有するので発熱部品31a、31a、31a…から発生する熱を、収容部45内の空気を介して放熱部4に伝導するよりも効率的に放熱部4に熱伝導し放熱部4から効率的に放熱することができる。 Since the heat conducting member 9 has electrical insulation, the drive circuit unit 3 and the heat transfer unit 47 can be prevented from being short-circuited. Further, since the heat conducting member 9 is flexible, it does not let heat escape to the peripheral part by contacting the heat generating parts 31a, 31a, 31a... And the surface 47a of the heat conducting part 47, and has a higher thermal conductivity. The heat generated from the heat generating components 31 a, 31 a, 31 a... Is more efficiently conducted to the heat radiating portion 4 than the heat radiating portion 4 through the air in the housing portion 45 and efficiently radiated from the heat radiating portion 4. be able to.
透光部2は、図4、図5に示すように乳白色のガラス製であって、光源モジュール1からの光射出方向側を覆うようなドーム型の形状をなしている。透光部2の内側表面2bには、透光部に衝撃等の負荷がかかった際に透光部の飛散を防止するための飛散防止膜21が塗布してある。飛散防止膜21は、シリコーンゴム系合成樹脂等からなる膜基材21aと光源モジュール1からの光を拡散する拡散材21bを混合して塗布される。
拡散剤21bは、例えば、結晶構造を有し、光学的性質が、屈折率が大きく、光吸収能が小さく、光散乱能が高いものであればよい。拡散剤として、例えば、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素、炭酸カルシウム、二酸化珪素等が用いられる。
The translucent part 2 is made of milky white glass as shown in FIGS. 4 and 5, and has a dome shape that covers the light emission direction side from the light source module 1. The inner surface 2b of the light transmitting part 2 is coated with a scattering prevention film 21 for preventing the light transmitting part from scattering when a load such as an impact is applied to the light transmitting part. The scattering prevention film 21 is applied by mixing a film base material 21 a made of silicone rubber-based synthetic resin or the like and a diffusion material 21 b that diffuses light from the light source module 1.
The diffusing agent 21b may be, for example, a material having a crystal structure, optical properties, a large refractive index, a small light absorption ability, and a high light scattering ability. As the diffusing agent, for example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, calcium carbonate, silicon dioxide or the like is used.
また、膜基材21aに、拡散剤21bに加えて又は拡散剤21bに代えて蛍光体を添加してもよい。蛍光体として、例えば、イットニウムが用いられる。なお、本実施の形態において、飛散防止膜21の膜厚は、約30(μm)である。また、本実施の形態においては、膜基材21aとしてシリコーンゴムを用いているが、これに限定されず、衝撃によりカバー4が破損したときに破片が飛散しないように、破断することなく伸びることが可能な材料製であればよく、弾性又は延性を有する材料製であればよい。 Further, a phosphor may be added to the film substrate 21a in addition to the diffusing agent 21b or in place of the diffusing agent 21b. For example, yttrium is used as the phosphor. In the present embodiment, the film thickness of the scattering prevention film 21 is about 30 (μm). In the present embodiment, silicone rubber is used as the membrane base material 21a. However, the present invention is not limited to this, and the membrane base material 21a extends without breaking so that the fragments are not scattered when the cover 4 is damaged by impact. It is only necessary that the material is made of a material having elasticity or ductility.
飛散防止膜21は、透光部内側表面2bに吹き付けて全面に散布した後、100℃で予備乾燥にかけた後、150℃で焼き付けて固着させる。なお膜基材21aと拡散材21bは混合せずそれぞれ別々に重ねて塗布することもできる。飛散防止膜21は、塗布した際にLEDモジュール11からの光量が低下しない性質を有することが好ましい。なお飛散防止膜21の塗布面は透光部2の内側表面2bに限ったものではなく、外側表面または両面であってもよい。さらに、透光部2には、ポリカーボネート等の合成樹脂等を用いることもできる。 The anti-scattering film 21 is sprayed on the inner surface 2b of the light transmitting portion and sprayed over the entire surface, and then preliminarily dried at 100 ° C., and then baked and fixed at 150 ° C. In addition, the film | membrane base material 21a and the diffusion material 21b can also be apply | coated separately, respectively, without mixing. It is preferable that the scattering prevention film 21 has such a property that the amount of light from the LED module 11 does not decrease when it is applied. The application surface of the anti-scattering film 21 is not limited to the inner surface 2b of the translucent part 2, and may be the outer surface or both surfaces. Furthermore, a synthetic resin such as polycarbonate can be used for the light transmitting portion 2.
飛散防止膜21によって、透光部2に落下の衝撃等による負荷がかかった際に、飛散防止膜21を構成する膜基材21aが有する延性により、透光部2の破片が飛散することを防止できる。さらに、光源であるLEDモジュール11からの光は、透光部2の内側表面に塗布された飛散防止膜21に入射し、入射した光は飛散防止膜21を構成する拡散剤21bにより拡散されつつ透過して、透光部2から出射する。このように光を拡散させて照射させることにより、LEDのように光指向性の強い光源を用いる場合に生じる眩しさ(グレア)を低減させることが可能となる。 The scattering prevention film 21 causes the fragments of the light transmission part 2 to be scattered due to the ductility of the film substrate 21a constituting the scattering prevention film 21 when a load due to a drop impact or the like is applied to the light transmission part 2. Can be prevented. Further, the light from the LED module 11 that is a light source is incident on the scattering prevention film 21 applied to the inner surface of the translucent portion 2, and the incident light is diffused by the diffusion agent 21 b that constitutes the scattering prevention film 21. The light is transmitted and emitted from the light transmitting portion 2. By diffusing and irradiating light in this way, it is possible to reduce glare that occurs when using a light source with strong light directivity, such as an LED.
駆動回路部は、紙フェノール、またはガラスエポキシ等からなる基板32の両面に駆動回路部品31、31、31、…を実装している。基板32の、伝熱部47の面47aに近接する側の面には、駆動回路部品31を構成する複数の発熱部品31a、31a、31a…(例えばブリッジダイオード、IC、抵抗、ダイオード等)が実装されており、反対側の面には、駆動回路部品31を構成する発熱部品以外の回路部品31b、31b、31b、…が実装されている。 The drive circuit section has drive circuit components 31, 31, 31,... Mounted on both surfaces of a substrate 32 made of paper phenol or glass epoxy. A plurality of heat generating components 31a, 31a, 31a (for example, bridge diodes, ICs, resistors, diodes, etc.) constituting the drive circuit component 31 are provided on the surface of the substrate 32 on the side close to the surface 47a of the heat transfer section 47. The circuit components 31b, 31b, 31b,... Other than the heat generating components constituting the drive circuit component 31 are mounted on the opposite surface.
発熱部品31a、31a、31a…は、図6に示すように、垂直方向に長いシート状の熱伝導部材9が覆うことを容易にするために、垂直方向に列状に並んで配置されている。 As shown in FIG. 6, the heat generating components 31a, 31a, 31a,... Are arranged in a line in the vertical direction so that the sheet-like heat conducting member 9 that is long in the vertical direction can be easily covered. .
なお、全部の発熱部品31a、31a、31a…を基板32の伝熱部47の面47aに近接する側の面に配置する必要はなく、一部であっても良い。その際、少なくとも基板32の伝熱部47の面47aに近接する側の面に実装された発熱部品からの発熱量が、他方の面に実装された発熱部品からの発熱量より大きくなるように、発熱部品31a、31a、31a…を振り分けて配置する。 It is not necessary to arrange all of the heat generating components 31a, 31a, 31a... On the surface close to the surface 47a of the heat transfer section 47 of the substrate 32, and may be a part of them. At that time, the amount of heat generated from the heat-generating component mounted on at least the surface close to the surface 47a of the heat transfer section 47 of the substrate 32 is larger than the amount of heat generated from the heat-generating component mounted on the other surface. The heat generating components 31a, 31a, 31a,.
発熱部品31a、31a、31a…を基板32の伝熱部47の面47aに近い面へ集めることで、発熱部品31a、31a、31a…を熱伝導部材9に接触させ、発熱部品31a、31a、31a…をから発生する熱を直接熱伝導部材9へ伝え、発熱部品31a、31a、31a…からの熱が収容部45内の空気に伝導して収容部45内にとどまることを抑制し、熱伝導部材9から伝熱部47へとより効率的に伝導することができる。 The heat generating components 31a, 31a, 31a,... Are gathered on a surface close to the surface 47a of the heat transfer section 47 of the substrate 32 so that the heat generating components 31a, 31a, 31a,. The heat generated from 31a ... is directly transmitted to the heat conducting member 9, the heat from the heat generating components 31a, 31a, 31a ... is suppressed from being conducted to the air in the housing portion 45 and staying in the housing portion 45, and the heat Conduction can be more efficiently conducted from the conductive member 9 to the heat transfer section 47.
また基板32の両面に回路部品を実装可能とする構成とすることによって基板32の面積を有効に活用でき、基板32を大型化させることなく駆動回路部品31、31、31、…を実装することが可能となるので、駆動回路部3を小型にまとめることができる。 Further, by adopting a configuration in which circuit components can be mounted on both surfaces of the substrate 32, the area of the substrate 32 can be effectively utilized, and the drive circuit components 31, 31, 31,... Can be mounted without increasing the size of the substrate 32. Therefore, the drive circuit unit 3 can be reduced in size.
また、駆動回路部3を構成する基板32は収容部45の形状に合わせて、駆動回路部品31、31、31、…の実装面の水平方向の幅が口金部5の方に向かって狭く、透光部2の方に向かって広い形状となっている。基板32の口金部5側の端部32bの幅は、口金部5内部の空洞51の水平方向の幅よりも狭く、口金部5の内部に基板32の端部32bを収容することができるので、有効に収容部45の空間を利用することが可能となり、照明装置100全体の小型化に寄与している。
また、駆動回路部3と口金部5は、電源を駆動回路部3に供給するために電源線(図示せず)で接続されている。
In addition, the substrate 32 constituting the drive circuit unit 3 has a horizontal width of the mounting surface of the drive circuit components 31, 31, 31,... The shape is wide toward the translucent part 2. Since the width of the end portion 32 b on the base portion 5 side of the substrate 32 is narrower than the horizontal width of the cavity 51 inside the base portion 5, the end portion 32 b of the substrate 32 can be accommodated inside the base portion 5. Thus, it is possible to effectively use the space of the housing portion 45, which contributes to downsizing of the entire lighting device 100.
Further, the drive circuit unit 3 and the base unit 5 are connected by a power line (not shown) in order to supply power to the drive circuit unit 3.
(実施の形態2)
図7は本発明の実施の形態2に係る照明装置110の、要部横断面図である。なお、実施の形態1と同一の部分については同一の符号を付してその詳細な説明は省略する。
(Embodiment 2)
FIG. 7 is a cross-sectional view of the main part of the illumination device 110 according to Embodiment 2 of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
実施の形態2に係る照明装置110は、実施の形態1の放熱部4と同様に、放熱部4の内部に駆動回路部3を収容できる収容部45を有する。収容部45には、放熱部4の内周面から収容部45の一部を埋めるように、略半円柱状の伝熱部49が形成されている。 The illuminating device 110 according to Embodiment 2 has an accommodating portion 45 that can accommodate the drive circuit portion 3 inside the radiating portion 4, similarly to the radiating portion 4 of Embodiment 1. In the housing part 45, a substantially semi-cylindrical heat transfer part 49 is formed so as to fill a part of the housing part 45 from the inner peripheral surface of the heat radiating part 4.
また収容部45には、発熱部品31a、31a、31a…が伝熱部49の面49aに対向して近接するように、駆動回路部3が固定部8に固定されながら収容されている。発熱部品31a、31a、31a…と、伝熱部49の面49aが近接する間隔Gは3mmから5mmである。 Further, the drive circuit portion 3 is accommodated in the accommodation portion 45 while being fixed to the fixing portion 8 so that the heat generating components 31a, 31a, 31a... Are opposed to and close to the surface 49a of the heat transfer portion 49. A distance G between the heat generating components 31a, 31a, 31a, and the surface 49a of the heat transfer section 49 is 3 mm to 5 mm.
さらに、実施の形態1と同様に、駆動回路部3と伝熱部49の面49aとの間に、熱伝導部材9が発熱部品31a、31a、31a…と伝熱部49の面49aに接するように挿入されている。 Further, as in the first embodiment, between the drive circuit unit 3 and the surface 49a of the heat transfer unit 49, the heat conducting member 9 is in contact with the heat generating components 31a, 31a, 31a, and the surface 49a of the heat transfer unit 49. Has been inserted.
伝熱部49は例えばアルミニウム等の熱伝導性に優れた金属製材料からなり、放熱部4と同材料でも別材料でもよいし、放熱部4と一体に形成されていても別体として接着剤などで放熱部4に接続されていてもよい。また、伝熱部49の軽量化を図るために、伝熱部49内部に空洞や穴等を施してもよい。 The heat transfer section 49 is made of a metal material having excellent thermal conductivity, such as aluminum, and may be the same material as the heat radiating section 4 or a different material. For example, it may be connected to the heat radiating part 4. Further, in order to reduce the weight of the heat transfer section 49, a cavity, a hole, or the like may be provided inside the heat transfer section 49.
伝熱部49の形状を放熱部4の内周面から収容部45の一部を埋めるような略半円柱状とすることで、実施の形態1のような凸型の伝熱部47を形成する際に生じる伝熱部47と放熱部4の内周面との段差を埋められ、発熱部品31a、31a、31a…に近接する面49aの面積を拡大できる。これにより、発熱部品31a、31a、31a…に近接する面の幅に合わせて発熱部品31a、31a、31a…を配置する必要がない。従って、発熱部品31a、31a、31a…の位置が面49aと平行方向にずれても、発熱部品31a、31a、31a…を伝熱部49の面49aと近接させることができる。また、伝熱部49の体積を伝熱部47の体積よりも増大させることができるので、伝熱部47よりも熱抵抗を低減でき、照明装置110の温度上昇を軽減させることができる。 By forming the heat transfer portion 49 into a substantially semi-cylindrical shape that fills a part of the housing portion 45 from the inner peripheral surface of the heat radiating portion 4, the convex heat transfer portion 47 as in the first embodiment is formed. The step between the heat transfer portion 47 and the inner peripheral surface of the heat radiating portion 4 generated during the filling is filled, and the area of the surface 49a adjacent to the heat generating components 31a, 31a, 31a. Thereby, it is not necessary to arrange | position the heat-emitting components 31a, 31a, 31a ... according to the width | variety of the surface which adjoins heat-emitting components 31a, 31a, 31a .... Therefore, even if the positions of the heat generating components 31a, 31a, 31a,... Are shifted in the direction parallel to the surface 49a, the heat generating components 31a, 31a, 31a, etc. can be brought close to the surface 49a of the heat transfer section 49. Moreover, since the volume of the heat transfer part 49 can be made larger than the volume of the heat transfer part 47, thermal resistance can be reduced rather than the heat transfer part 47, and the temperature rise of the illuminating device 110 can be reduced.
(実施の形態3)
図8は本発明の実施の形態3に係る照明装置120の要部横断面図であり、図9は図8の放熱部の要部縦断面図である。なお、実施の形態1と同一の部分については同一の符号を付してその詳細な説明は省略する。
(Embodiment 3)
FIG. 8 is a cross-sectional view of the main part of the illumination device 120 according to Embodiment 3 of the present invention, and FIG. 9 is a vertical cross-sectional view of the main part of the heat dissipation part in FIG. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
実施の形態3に係る照明装置120は、伝熱部49において、実施の形態2と同じく図8に示すような略半円柱状である。放熱部4の内側には垂直方向に、深さ0.5mmから2mm、幅0.5mmから2mmの溝状の複数の凹凸で形成された吸熱溝410が形成されている。なお、放熱部4の内側の吸熱溝410は伝熱部49の面49aにおける熱伝導部材9と接触する部分には施されていない。なお放熱部4の内側の吸熱溝410の形状は放熱部4の内側壁面の表面積を増大させることが目的であるので、垂直方向の凹凸の溝に限定されるものではなく、水平方向の凹凸の溝、凹部、凸部、または格子状の溝等であってもよいし、寸法も上記に限ったものではない。 The illuminating device 120 which concerns on Embodiment 3 is a substantially semi-cylindrical shape as shown in FIG. Inside the heat radiating portion 4, a heat absorbing groove 410 is formed in the vertical direction. The heat absorbing groove 410 is formed by a plurality of groove-shaped irregularities having a depth of 0.5 mm to 2 mm and a width of 0.5 mm to 2 mm. In addition, the heat absorption groove 410 inside the heat radiating part 4 is not applied to the part in contact with the heat conducting member 9 on the surface 49 a of the heat transfer part 49. The shape of the heat absorbing groove 410 inside the heat radiating portion 4 is intended to increase the surface area of the inner wall surface of the heat radiating portion 4, and thus is not limited to the vertical concave and convex grooves. It may be a groove, a concave portion, a convex portion, a lattice-like groove, or the like, and the dimensions are not limited to the above.
上述の放熱部4の内側壁面の吸熱溝410により、放熱部4の内側の表面積を拡大することができ、収容部45内の空気との接触面積が広がり、発熱部品31a、31a、31a…から発生する熱を吸収する面積が増加することで放熱部4への伝導効率を向上させることができ、収容部45内の温度上昇を軽減することができる。なお、前記放熱部4の内側壁面の吸熱溝410は実施の形態3のみならず実施の形態1および実施の形態2にも用いることが可能であり、同様の効果を得ることができる。 The heat absorbing groove 410 on the inner wall surface of the heat radiating portion 4 can increase the surface area inside the heat radiating portion 4, increasing the contact area with the air in the housing portion 45, and from the heat generating components 31 a, 31 a, 31 a. By increasing the area that absorbs the generated heat, the efficiency of conduction to the heat radiating part 4 can be improved, and the temperature rise in the housing part 45 can be reduced. The heat absorbing groove 410 on the inner wall surface of the heat radiating portion 4 can be used not only in the third embodiment but also in the first and second embodiments, and the same effect can be obtained.
放熱部4の内部壁面には全面に黒色塗料(図示せず)を塗布してある。黒色塗料には赤外線の吸収効率が高い塗料(例えばカーボンが入った塗料)を使用している。これにより、放熱部4が発熱部品31a、31a、31a…から発生した放射熱を吸収する効率が上がり、速やかに放熱部から外気中へ放熱することで収容部45内の温度上昇を軽減することができる。なお、黒色塗料はカーボンが入った塗料に限定するものではなく、ラッカー等でもよく、黒色に限らず暗色系(例えば深灰色)の塗料であってもよい。また、前記黒色塗料は実施の形態1および実施の形態2にも用いることが可能であり、同様の効果を得ることができる。 A black paint (not shown) is applied to the entire inner wall surface of the heat radiating portion 4. As the black paint, a paint having a high infrared absorption efficiency (for example, a paint containing carbon) is used. This increases the efficiency with which the heat radiating part 4 absorbs the radiant heat generated from the heat generating components 31a, 31a, 31a, and reduces the temperature rise in the housing part 45 by quickly radiating heat from the heat radiating part to the outside air. Can do. The black paint is not limited to a paint containing carbon, but may be a lacquer or the like, and is not limited to black, and may be a dark color (for example, deep gray) paint. The black paint can also be used in the first and second embodiments, and the same effect can be obtained.
(実施の形態4)
以下、本発明の実施の形態4に係る照明装置を説明する。なお、上述した実施の形態1から3に係る照明装置と同様の構成については説明を省略し、実施の形態4の照明装置が有する特徴部分についてのみ説明する。
(Embodiment 4)
Hereinafter, a lighting apparatus according to Embodiment 4 of the present invention will be described. In addition, description is abbreviate | omitted about the structure similar to the illuminating device based on Embodiment 1 to 3 mentioned above, and only the characteristic part which the illuminating device of Embodiment 4 has is demonstrated.
実施の形態4に係る照明装置は、実施の形態1から3の照明装置のように発熱部品を近接させて発熱部品からの熱を放熱部に伝導させる伝熱部を有しておらず、駆動回路部に実装された発熱部品を直接放熱部の内側壁面に近接させるようにして収容部に駆動回路部を収容することにより、発熱部品から発生した熱を速やかに放熱部へ伝導させることができ、効率的に放熱部から放熱することを可能とするものである。 The illuminating device according to the fourth embodiment does not have a heat transfer unit that brings heat generating components close to each other and conducts heat from the heat generating components to the heat radiating unit, unlike the lighting devices of the first to third embodiments. Heat generated from the heat-generating component can be quickly conducted to the heat-dissipating part by accommodating the drive circuit part in the accommodating part so that the heat-generating component mounted on the circuit part is directly close to the inner wall surface of the heat-dissipating part. It is possible to efficiently dissipate heat from the heat radiating part.
なお、前記発熱部品と前記放熱部の内側壁面の間に、熱伝導性の高い熱伝導部材を介装していることが好ましい。上記実施の形態で説明した通り、熱伝導部材を介装することによって、発熱部品からの発熱をより効率よく放熱部に伝導させることが可能となる。 In addition, it is preferable that a heat conductive member having high heat conductivity is interposed between the heat generating component and the inner wall surface of the heat radiating portion. As described in the above embodiment, by interposing the heat conducting member, it is possible to more efficiently conduct heat generated from the heat generating component to the heat radiating portion.
以上説明したように、前記発熱部品を前記放熱部の内側壁面に近接させることで、該発熱部品から発生した熱が速やかに前記放熱部の内側壁面から該放熱部に伝導し、従来技術に比べ前記収容部内での熱の滞留時間が短くなる。従って、前記収容部内での温度上昇を軽減でき、前記駆動回路部品や、光源、その他部品への熱的負荷を軽減できる。 As described above, by bringing the heat generating component close to the inner wall surface of the heat radiating portion, heat generated from the heat generating component is quickly conducted from the inner wall surface of the heat radiating portion to the heat radiating portion, compared with the conventional technology. The residence time of heat in the housing part is shortened. Therefore, the temperature rise in the accommodating portion can be reduced, and the thermal load on the drive circuit component, the light source, and other components can be reduced.
以上、実施の形態1、2、3、および4において、光源としてLEDを採用した形態を例示して説明したが、これに限られるものではなく、EL(Electroluminescence)等でもよい。また照明装置の形態として、電球型の照明装置の形態を例示したが、本発明は既存の電球型の照明装置に限られるものではなく、ダウンライトやシーリングライト等のほかの形状の照明装置にも適用することが可能である。 As described above, in Embodiments 1, 2, 3, and 4, the embodiment in which the LED is used as the light source has been described as an example. However, the present invention is not limited to this, and EL (Electroluminescence) or the like may be used. Moreover, although the form of the light bulb type lighting apparatus has been exemplified as the form of the lighting apparatus, the present invention is not limited to the existing light bulb type lighting apparatus, and the lighting apparatus of another shape such as a downlight or a ceiling light is used. Can also be applied.
1 光源モジュール
3 駆動回路部
4 放熱部
9 熱伝導部材
31a 発熱部品
45 収容部
47 伝熱部
49 伝熱部
410 吸熱溝
DESCRIPTION OF SYMBOLS 1 Light source module 3 Drive circuit part 4 Heat radiating part 9 Heat conduction member 31a Heat generating component 45 Housing part 47 Heat transfer part 49 Heat transfer part 410 Heat absorption groove
Claims (3)
該光源を駆動する駆動回路部と、
内部に空洞が形成された放熱部と、
前記駆動回路部の縁部を嵌合させる嵌合部を有し、前記空洞内に設けられている固定部と
を備える照明装置において、
前記放熱部は、
前記光源側に、前記空洞方向に突出し、ねじ用穴が設けられたボス部を有し、
前記固定部は、
前記ボス部に対向させて位置決めをする位置決め部を有することを特徴とする電球型の照明装置。 A light source;
A drive circuit unit for driving the light source;
A heat dissipating part in which a cavity is formed;
In a lighting device comprising a fitting portion for fitting an edge portion of the drive circuit portion, and a fixing portion provided in the cavity,
The heat dissipation part is
On the light source side, it has a boss part protruding in the cavity direction and provided with a screw hole,
The fixing part is
A light bulb-type lighting device having a positioning portion that is positioned to face the boss portion.
前記空洞の周縁に複数設けられていることを特徴とする請求項1に記載の電球型の照明装置。 The boss is
The light bulb-type lighting device according to claim 1, wherein a plurality of light emitting devices are provided on a peripheral edge of the cavity.
前記空洞の周縁の3個所に設けられていることを特徴とする請求項2に記載の電球型の照明装置。
The boss is
The light bulb-type lighting device according to claim 2, wherein the light-bulb lighting device is provided at three locations on the periphery of the cavity.
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JP2004119324A (en) * | 2002-09-30 | 2004-04-15 | Hitachi Lighting Ltd | Compact self-ballasted fluorescent lamp |
JP2007242608A (en) * | 2006-02-10 | 2007-09-20 | Toshiba Lighting & Technology Corp | Compact self-ballasted fluorescent lamp, and illumination device |
US20090195186A1 (en) * | 2008-02-06 | 2009-08-06 | C. Crane Company, Inc. | Light emitting diode lighting device |
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JP2004119324A (en) * | 2002-09-30 | 2004-04-15 | Hitachi Lighting Ltd | Compact self-ballasted fluorescent lamp |
JP2007242608A (en) * | 2006-02-10 | 2007-09-20 | Toshiba Lighting & Technology Corp | Compact self-ballasted fluorescent lamp, and illumination device |
US20090195186A1 (en) * | 2008-02-06 | 2009-08-06 | C. Crane Company, Inc. | Light emitting diode lighting device |
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