JP2014011355A - 孔形成方法 - Google Patents
孔形成方法 Download PDFInfo
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- JP2014011355A JP2014011355A JP2012147609A JP2012147609A JP2014011355A JP 2014011355 A JP2014011355 A JP 2014011355A JP 2012147609 A JP2012147609 A JP 2012147609A JP 2012147609 A JP2012147609 A JP 2012147609A JP 2014011355 A JP2014011355 A JP 2014011355A
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 142
- 239000011521 glass Substances 0.000 claims abstract description 131
- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 238000001039 wet etching Methods 0.000 claims abstract description 14
- 238000000206 photolithography Methods 0.000 claims abstract description 9
- 238000000059 patterning Methods 0.000 claims abstract description 4
- 238000005422 blasting Methods 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 33
- 239000011651 chromium Substances 0.000 abstract description 26
- 229910052804 chromium Inorganic materials 0.000 abstract description 23
- 230000000149 penetrating effect Effects 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
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Abstract
【解決手段】ガラス基板1にその上面1aから下面1bに向かう孔10を形成する孔形成方法は、ガラス基板上面にクロム膜2を形成する第1工程と、フォトリソグラフィ技術を用いてクロム膜をパターニングすることにより、孔形成用のパターン21と外形加工用のパターン22とを有するクロムマスク2を形成する第2工程と、ガラス基板の下側を保護部材7で覆う第3工程と、クロムマスク越しにガラス基板をウェットエッチングすることにより、ガラス基板に孔10を形成すると共にこのガラス基板の外形を所定寸法に加工する環状溝11を形成する第4工程と、を含む。
【選択図】図1
Description
Claims (2)
- ガラス基板にその一方の面から他方の面に向かう孔を形成する孔形成方法において、
前記一方の面側を上とし、ガラス基板の上面及び下面の少なくとも一方にマスク膜を形成する第1工程と、
フォトリソグラフィ技術を用いて前記マスク膜をパターニングすることにより、孔形成用のパターンと外形加工用のパターンとを有するマスクを形成する第2工程と、
前記ガラス基板の下側を保護部材で覆う第3工程と、
前記マスク越しに前記ガラス基板をウェットエッチング又はブラスト処理することにより、前記ガラス基板に孔を形成すると共にこのガラス基板の外形を所定寸法に加工する第4工程と、を含むことを特徴とする孔形成方法。 - 前記第4工程にて、所定深さの孔を形成した後、この孔を保護部材で保護し、ガラス基板の外形の加工を続行することを特徴とする請求項1記載の孔形成方法。
Priority Applications (1)
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JP2012147609A JP5894875B2 (ja) | 2012-06-29 | 2012-06-29 | 孔形成方法 |
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JP2012147609A JP5894875B2 (ja) | 2012-06-29 | 2012-06-29 | 孔形成方法 |
Publications (2)
Publication Number | Publication Date |
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JP2014011355A true JP2014011355A (ja) | 2014-01-20 |
JP5894875B2 JP5894875B2 (ja) | 2016-03-30 |
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JP2012147609A Active JP5894875B2 (ja) | 2012-06-29 | 2012-06-29 | 孔形成方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017204527A (ja) * | 2016-05-10 | 2017-11-16 | 凸版印刷株式会社 | 配線回路基板及びその製造方法 |
JP7423907B2 (ja) | 2019-05-24 | 2024-01-30 | Toppanホールディングス株式会社 | 配線基板の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010070415A (ja) * | 2008-09-18 | 2010-04-02 | Tokyo Ohka Kogyo Co Ltd | 加工ガラス基板の製造方法 |
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2012
- 2012-06-29 JP JP2012147609A patent/JP5894875B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010070415A (ja) * | 2008-09-18 | 2010-04-02 | Tokyo Ohka Kogyo Co Ltd | 加工ガラス基板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017204527A (ja) * | 2016-05-10 | 2017-11-16 | 凸版印刷株式会社 | 配線回路基板及びその製造方法 |
JP7423907B2 (ja) | 2019-05-24 | 2024-01-30 | Toppanホールディングス株式会社 | 配線基板の製造方法 |
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