JP2013533122A - Flat structure electronic component and manufacturing method thereof - Google Patents

Abstract

The present invention proposes an electronic component and a manufacturing method thereof. The electronic component according to the present invention includes a substrate, and the substrate includes a notch penetrating the substrate, a first chip, and an external contact surface. The first chip is disposed inside the notch of the substrate. An external contact surface is provided to connect the first chip to an external switch environment.
[Selection] Figure 1

Description

  The present invention relates to an electronic component having a flat structure and a method for manufacturing the same.

  For electronic parts, there are increasing demands for downsizing and cost reduction. Modern electronic components can be manufactured cost-effectively by a multi-chamfer process and / or by using wafers. Such an electronic component can be used as a microphone, for example, a MEMS microphone.

  When a wafer is used, the electronic components can be manufactured more efficiently as the number of electronic components arranged on the wafer is increased by multi-cavity. Particularly in the case of flat electronic components, a thin and large-diameter wafer is required in order to increase the total number of components that can be manufactured from a single wafer. Since such a wafer becomes mechanically unstable as the film thickness or diameter increases, it is impossible to reduce the film thickness beyond a certain limit. In particular, thin wafers are prone to defects, irregularities and breakage.

  Patent Document 1 (US Pat. No. 6,781,231) discloses a MEMS microphone in which a MEMS chip is supported on a substrate and covered with a cap.

  Patent Document 2 (US Pat. No. 6,088,463) and Patent Document 3 (US Pat. No. 6,522,762) disclose an electronic component including a MEMS chip. In this electronic component, chips are arranged on both sides of the substrate.

  Patent Document 4 (US Patent Application Publication No. 20080279407) discloses a MEMS microphone having a reduced structural height.

US Pat. No. 6,781,231 US Pat. No. 6,088,463 US Pat. No. 6,522,762 US Patent Application Publication No. 2008/0279407

  The height of the electronic component described in the above patent document corresponds to the sum of at least the height of the MEMS chip and the height of the substrate that supports the MEMS chip.

  A problem with known electronic components, especially MEMS devices, is that the structural height is often excessive.

  Accordingly, an object of the present invention is to make it possible to manufacture an electronic component having a flat structure with excellent cost effectiveness. In particular, the manufacture of electronic components must be compatible with a rational multi-chamfer process in order to reduce the unit cost.

  This problem is solved according to the invention by the electronic component according to claim 1 or by the manufacturing method according to claim 8. Advantageous embodiments of the invention are as described in the dependent claims.

  The electronic component includes a substrate having a notch, a first chip, and a first contact surface. The notch penetrates the substrate and the chip is placed inside the notch. The external contact surface is provided to connect the first chip to the external switch means.

  When the electronic component has a substrate with a notch and the chip is placed inside the notch, it has been confirmed that it is possible to relatively increase the mechanical stability and simultaneously reduce the structural height. That is, it is not necessary to add the height of the substrate to the height of the chip component in order to calculate the total height of the electronic component. This is because the structural height of the entire electronic component according to the present invention is defined only by the height of the higher component of the substrate and the chip by arranging the chip inside the notch penetrating the substrate.

  For example, when the structural height of the chip is higher than the structural height of the substrate, the total height of the electronic component is defined by the structural height of the chip. Such an element can be provided with a thicker substrate as compared to a conventional element. This is because even if the structural height of the substrate increases, the height of the substrate does not adversely affect the total height of the electronic component as long as the total height of the substrate is lower than the total height of the chip. Accordingly, the mechanical stability of the electronic component can be maintained despite the low-height structure.

  In principle, a notch that penetrates the substrate weakens the substrate compared to a substrate that has no notch or that has a notch but does not penetrate. In order to compensate for this, it is possible to increase the mechanical stability of the electronic component by increasing the thickness of the substrate and compensating for the structural weakness caused by the notch by the increased substrate height. Regarding the thinning process in the manufacturing process, for example, the substrate material may be structurally weakened by etching the substrate and / or the chip. However, such a thinning process can be greatly or completely omitted. . This is because the electronic component is as flat as possible.

  Further, even when a thinning process is necessary, the process can be performed easily and quickly. In the case of the flat electronic component according to the present invention, since the initial thickness is thicker, structural weakening does not pose a problem, and this can reduce the manufacturing cost.

  The external contact surface can be disposed on the chip surface or the substrate surface.

  In one embodiment of the present invention, the electronic component includes an adhesive, which is applied in an opening between the first chip and the notch to connect the first chip to the substrate.

  The first tip can be fitted in the notch without a gap. However, the notch may be formed larger than the chip and an opening may be disposed between the substrate and the chip. In that case, the substrate is bonded to the chip by an adhesive. As a result, mechanical force is received by the chip and can be transmitted, so that the notch, which is a structural weak point in the substrate in principle, is mechanically stabilized by the chip. Therefore, an electronic component corresponding to the above-described configuration has a surprisingly high mechanical stability despite the penetration of the notch. Even in that case, it is not necessary to form the substrate to be particularly thick.

  As the adhesive, it is possible to apply a liquid resin that becomes a solid molding agent in terms of final material characteristics and adhesive characteristics after polymerization. In this case, curing can be started by adding a curing agent, heating, or ultraviolet irradiation. As the liquid resin, epoxy resin, silicon resin, phenol resin, urethane resin, acrylic resin, etc. can be applied. As an adhesive for connecting the substrate to the chip, a hot melt adhesive can be applied. In that case, the substrate and the chip are made of a material having sufficient heat resistance. Furthermore, solvent-based adhesives are also suitable as adhesives.

However, it is also possible to connect the notched substrate and the chip as one mechanically stable constituent material without using an adhesive. For this purpose, the substrate is heated to a temperature higher than that of the chip before connection, and the notch is expanded from the chip by thermal expansion, or the chip is cooled to a lower temperature and similarly contracted. In either case, the substrate temperature is set higher than the chip temperature, and then the chip is inserted into the notch. When the temperature of the substrate and the chip becomes the same, the “sitting” of the chip inside the notch is mechanically stabilized.

  In one embodiment, a coating is applied to a portion of the substrate surface of the electronic component or the first chip surface. The coating is placed on the surface where the coating is applied to assist in applying the adhesive. The above-mentioned part of the surface is particularly a surface portion to which an adhesive for connecting the substrate to the chip is applied.

  As an adhesive, an adhesive may be applied to the opening between the first chip and the substrate. An opening disposed between the substrate and the chip surrounds the chip in a ring shape. However, the chip may be brought into contact with the substrate at one place or two or more places, an opening may be disposed at the contact portion between the chip and the substrate, and the adhesive may be applied only to the contact portion.

  The chip may include a cover. The cover can be arranged on the substrate side, i.e. on the mounting side, or on the opposite side of the chip from the substrate. Such a cover protects the membrane or back plate of the MEMS chip. In particular, a cover disposed on the substrate side of the MEMS chip protects a MEMS mechanism such as a membrane or a back plate before contacting the adhesive.

  The adhesive may be applied directly or sprayed, for example. In this case, the adhesive can be applied to a corresponding portion of the substrate or chip surface by extruding or spraying the adhesive from a storage container using a cannula or a tube.

  Electronic components are coded. The coating facilitates the application of adhesive to the surface and allows the adhesive to be evenly distributed within the opening. In addition to being promoted by such a process, the distribution of adhesive can be promoted by heating.

  Additional adhesive reservoirs may be provided at additional chip attachment locations.

  In one embodiment, the electronic component includes a lid and covers a part on the upper side of the substrate, in particular, a notch part or a part on the upper side of the first chip. It is also possible to cover the entire upper side of the substrate with a lid, thereby covering the entire upper side of the first chip. The substrate further comprises an edge projecting around the chip, and the lid is mounted on the edge. Therefore, a cavity is formed by the edge of the lid and the substrate, and the chip is disposed inside the cavity and closed. As a result, the upper side of the chip is encapsulated. Since the lower side of the chip is also covered with the lower lid, the chip is completely enclosed inside the capsule.

  The lid may comprise a hard film, which is laminated during device fabrication, for example in a simple panel process. When the housing body is flat, or when the chip is higher than the substrate, the corresponding part of the substrate or chip surface can be covered with a cap-shaped cover.

  In one embodiment, the substrate is a multilayer structure comprising two or more dielectric layers and a metalizing layer disposed therebetween. A conductor path or an impedance element is formed on the metalizing layer. By the internal connection, the first chip, the impedance element or the conductor path, and the external contact surface are connected.

  The dielectric layer can comprise HTCC (high temperature co-fired ceramic multilayer substrate) or LTCC (low temperature co-fired ceramic multilayer substrate).

  A substrate having a multilayer structure has an additional contact surface, through which the conductor path or the impedance element of the substrate can be connected to the contact surface of the chip. One or more external contact surfaces may be implemented for connection to an external switch environment.

  Electronic components can be configured for HF (high frequency) signals. At that time, the impedance element inside the multilayer substrate can perform impedance matching or impedance conversion between the external contact surface or the external switch means and the corresponding switching element in the first chip each time.

  In this case, the internal connections can include bonding wires, bump connections and through contacts in addition to the conductor tracks.

  In one embodiment, the electronic component comprises at least one additional chip in addition to the first chip. The further chip may be composed of, for example, an ASIC chip (Application Specific Integrated Circuit). In one embodiment, the electronic component includes an ASIC chip fixed to the substrate and is connected to the first chip by an internal connection. A further tip is also placed inside the further notch. However, since the structure height of the IC chip is usually lower than that of the MEMS chip, for example, the total height of the element is not actually increased by the height of the added IC chip.

  The first chip can be a MEMS chip having a MEMS element structure. In this case, the ASIC chip can be equipped with a connection for adjusting the element structure or for evaluating a data signal generated from the element structure.

  In one embodiment, the first chip is a MEMS chip with a membrane and a back plate. A back volume is disposed inside the substrate or MEMS chip. The electronic component can be a microphone, and thus such a MEMS microphone includes a membrane and a back plate, and a bias voltage is usually applied between the membrane and the back plate. The ASIC chip has a connection capable of adjusting a bias voltage or a connection capable of evaluating an electric signal encoding an acoustic signal.

  Usually the MEMS microphone must have a back volume adjacent to the backplate or membrane. Normally, the structure shape of the MEMS microphone becomes large due to such a back volume. In the present invention, the structure shape of the MEMS microphone is flattened, for example, the back volume is disposed substantially adjacent to the MEMS chip inside the closed volume, and therefore, the total height of the MEMS microphone is obtained particularly by the presence of the back volume. Will not necessarily be high.

  In a device in which a conductor path is provided on a three-dimensional molded body, so-called MID (Molded Interconnected Devices), there is a further possibility that an internal connection is arranged in the element. For example, an organic laminate such as FR4 can be further mounted on the substrate. On the lower side or upper side of the substrate, for example, an SMD (surface mount component) solder pad or a bonding wire pad can be disposed as an external contact surface.

  The first chip or the further chip can be connected to the internal connection by wire bond technology or flip chip technology, for example, like an ASIC chip. The remaining adhesive reservoir for the adhesive connecting the first chip to the substrate can be held in place on the substrate to accept additional chips.

  Place the substrate on the support film, then apply adhesive to the uncovered part of the support film that is in the notch, and then place the first chip on the adhesive inside the notch, It is also possible to fill the opening between one chip with an adhesive.

A manufacturing method according to the present invention for manufacturing an electronic component having a flat structure includes the following steps:
Providing a substrate with a notch penetrating the substrate;
Providing a first chip,
-Placing the substrate on a support film;
Placing the first tip inside the notch; and fixing the first tip inside the notch.

  In one embodiment of this method, the film comprises a continuous or optionally structured adhesive layer on the side facing the substrate and chip.

  This facilitates accurate placement of the substrate and the first chip on the film, and particularly reduces the risk of deviation after placement.

One embodiment of the method further includes the following steps:
・ Providing a cover film,
• constructing a lid from the cover film; and • placing the lid on a portion of the substrate or chip.

  The support film used in the manufacture may remain after the electronic component is manufactured, but may be removed again.

  By providing the substrate with appropriate grooves, reservoirs, tubes or similar structures, the adhesive can be easily applied through the openings and can be easily dispersed within the openings.

  The sound wave input opening of the microphone can be formed by masked plasma etching. In the case of laser drilling, the sound wave input opening can also be configured by irradiating in an oblique direction. By irradiating in an oblique direction, the irradiation laser can be prevented from penetrating through a membrane that is easily damaged.

1 is a schematic diagram showing a basic shape of an electronic component. 1 is a schematic diagram showing a substrate through which a notch passes. 1 is a schematic diagram showing a substrate of an electronic component placed on a film, showing a situation where a chip is just inserted into a notch. It is the schematic which shows arrangement | positioning of the board | substrate and chip | tip on a film, and the opening part is arrange | positioned between the board | substrate and the chip | tip. 1 is a schematic diagram illustrating a situation where an adhesive is applied to connect a chip to a substrate. 1 is a schematic view showing an electronic component in which a chip is connected to a substrate by an adhesive. 1 is a schematic diagram showing an electronic component with a further chip bonded to a substrate. 1 is a schematic diagram showing a MEMS microphone with a sound wave input opening, the back volume being covered with a lid. 1 is a schematic view of an electronic component having a multilayer structure on a substrate.

  Hereinafter, specific details of the electronic component according to the present invention will be described in detail based on the embodiment and its schematic diagram.

  FIG. 1 shows an electronic component EB having a substrate TR and a first chip CH1. The substrate TR is provided with a notch AU, and the notch AU penetrates the substrate TR. Furthermore, the electronic component EB includes an external contact surface EK for connecting the first chip CH1 to an external switch environment. The first chip CH1 shown in the embodiment of FIG. 1 is a MEMS microphone chip. Since the first chip is arranged inside the notch penetrating the substrate TR, the structural height of the entire electronic component is reduced as compared with a known electronic component, and the mechanical stability is not reduced.

  FIG. 2 shows a substrate TR of an electronic component, and the substrate TR is provided with a notch AU penetrating the substrate TR in the vertical direction. The substrate TR includes a surface OT. In particular, the edge portion surrounding the notch AU is limited by a portion standing upright in the vertical direction of the surface OT. The significance of the surface of the substrate TR that defines the notch AU is described in detail in the following drawings, and has the meaning of coupling the substrate TR and the chip CH1.

  FIG. 3 shows the substrate TR, which is disposed on the support film HFO. FIG. 3 shows the moment when the first chip CH1 is just inserted into the notch AU during the manufacturing process. The first chip CH1 includes a membrane ME and a back plate RP. Further, a thin adhesive layer KS is disposed on the support film HFO, and the adhesive layer KS assists in arranging the substrate TR and the first chip CH1 on the support film HF1. The first chip has a surface OC. When the first chip CH is arranged inside the notch, the parallel portions of the surface OC of the first chip and the surface OT of the substrate TR stand up against each other inside the notch.

  FIG. 4 shows the first chip CH1, and the first chip is arranged inside the cutout of the substrate TR. The first chip CH1 and the substrate TR are disposed on the support film HFO. The first chip CH1 is disposed inside the notch so that the opening SP between the substrate TR and the first chip CH1 surrounds the first chip CH1 along the closed path.

  FIG. 5 shows the state of application of the adhesive KL that connects the substrate TR to the chip. The chip and the substrate TR are arranged on the support film HFO. Corresponding portions of the surface of the chip and the substrate TR face up in the notch and are provided with a coating BE. The coating BE facilitates the application of the adhesive KL to the corresponding portions of the substrate TR and the surface of the chip. At this time, the adhesive KL is applied so that the chip is frictionally bonded to the substrate TR after the adhesive KL is cured. The coating facilitates the application of adhesive to the corresponding part of the surface.

  In the electronic component of FIG. 6, the adhesive KL connects the chip to the substrate TR along a closed path that surrounds the chip. The overall structural height of the electronic component is reduced, and the chip receives the mechanical force and can transmit it, so that the mechanical stability is not reduced at the same time.

  The cover AD is located on the underside of the chip, thereby protecting the component configuration or other parts of the chip, such as the membrane, back volume, or back plate. In particular, the component configuration or the parts that come into contact with the adhesive KL are protected. It is also possible to cover the upper side of the chip with a protective cover.

  FIG. 7 shows an electronic component, and a further chip AC is provided beside the first chip CH1. The further chip AC is an ASIC chip. The ASIC chip is bonded to the substrate with the adhesive KL. The first chip CH1 and the ASIC chip AC are connected by a bonding wire BD.

  In the electronic component shown in FIG. 8, the upper side of the MEMS chip and the further chip is covered with a lid DE. The lid DE also covers the rear volume RV. Since the back volume RV is completely surrounded by the lid, the substrate, the adhesive, and the first chip, it is sealed against the periphery of the electronic component. The first chip, which is a MEMS chip, includes a sound wave input opening SEO on its lower side. Since the first chip CH1 includes the membrane ME and the back plate RP, the electronic component becomes a MEMS microphone having a flat structure height and excellent mechanical stability.

  In the arrangement of the electronic components shown in FIG. 9, the substrate TR has a multilayer structure and includes a dielectric layer DS. A metallizing layer ME is disposed between the dielectric layers. A capacitance element KE and an inductance element IE are formed on the metalizing layer ME. The contact surface of the first chip is connected to the contact surface of the substrate TR by a bonding wire BD. The inductance element IE and the capacitance element KE arranged inside the substrate TR are connected to the external contact surface EK on the lower side of the substrate TR by the through contact DK or the conductor path LB, and also to the ASIC chip AC. Internal connection of the electronic components is realized by the bonding wires BD, the impedance elements IE, KE, the ASIC chip AC arranged in the multilayer substrate TR, the bump connection between the ASIC chip AC and the substrate TR, and the metallizing line further provided. .

  The electronic component according to the present invention is not limited to the above-described embodiment. For example, combinations of different features and modifications including additional connecting elements, chips or notches are also included in embodiments of the present invention.

AC: ASIC chip AD: Cover AU: Notch BD: Bonding wire BE: Coating CH1: First chip DE: Lid DK: Through contact DS: Dielectric layer EB: Electronic component EK: External contact surface HFO: Support film IE: Inductance Element KE: Capacitance element KL: Adhesive KS: Adhesive layer LB: Conductor path ME: Membrane MS: Metalizing layer OC: Chip surface OT: Substrate surface RP: Back plate RV: Back volume SEO: Sound wave input opening SP: Opening part TR: substrate

Claims (10)

An electronic component (EB) having a flat structure,
A substrate (TR) having a notch (AU), a first chip (CH1), and an external contact surface (EK);
The notch (AH) penetrates the substrate (TR),
The first chip (CH1) is disposed inside the notch (AU),
An electronic component in which the external contact surface (EK) is provided to connect the first chip (CH1) to external switch means.   The electronic component according to claim 1, further comprising an adhesive (KL), wherein the adhesive (KL) is an opening (SP) between the first chip (CH1) and the notch (AU). ) Electronic components that are arranged inside and couple the first chip (CH1) to the substrate (TR).   The electronic component according to claim 1, further comprising a coating (BE), wherein the coating (BE) is formed on a surface (OT) of the substrate (TR) or a surface (OC) of the first chip. An electronic component that is applied to a part and supports the application of the adhesive (KL) to the part of the surface (OT, OC).   4. The electronic component according to claim 1, further comprising a lid (DE), wherein the lid (DE) is a part on an upper side of the substrate (TR) or the first chip. 5. An electronic component that covers a part of the upper side of (CH1). An electronic component according to any one of claims 1 to 4,
The substrate (TR) has a multilayer structure including two dielectric layers (DS) and a metallizing layer (MS) disposed between the dielectric layers (DS);
A conductor path (LB) or impedance element (IE, KE) is structured in the metalizing layer (MS),
An electronic component in which the first chip (CH1), the impedance element (IE, KE), and the external contact surface (EK) are connected by internal connection.   The electronic component according to any one of claims 1 to 5, further comprising an ASIC chip (AC), the ASIC chip (AC) being fixed to the substrate (TR) and being connected internally. An electronic component connected to the first chip (CH1). The electronic component according to any one of claims 1 to 6,
The first chip (CH1) is a MEMS chip including a membrane (ME) and a back plate (RP);
A rear volume (RV) is disposed inside the substrate (TR) or the MEMS chip (CH1);
-An electronic component in which the electronic component is a microphone. A method of manufacturing an electronic component having a flat structure,
-Preparing a substrate (TR) having a notch (AU) penetrated;
-Preparing a first chip (CH1);
Placing the substrate (TR) on a support film (HFO);
Arranging the first chip (CH1) inside the notch (AU);
Fixing the first chip (CH1) inside the notch (AU);
Including methods. 9. A method according to claim 8, comprising:
A method in which the support film (HFO) includes an adhesive layer (KS) on the side facing the substrate (TR) and the chip (CH1). The method of claim 9, further comprising:
-A step of preparing a cover film;
Structuring the lid (DE) from the cover film;
Disposing the lid (DE) on a part of the substrate (TR) or the chip (CH1).

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