JP2013532752A - 艶消仕上げポリイミドフィルムおよびそれに関連する方法 - Google Patents

艶消仕上げポリイミドフィルムおよびそれに関連する方法 Download PDF

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Publication number
JP2013532752A
JP2013532752A JP2013521769A JP2013521769A JP2013532752A JP 2013532752 A JP2013532752 A JP 2013532752A JP 2013521769 A JP2013521769 A JP 2013521769A JP 2013521769 A JP2013521769 A JP 2013521769A JP 2013532752 A JP2013532752 A JP 2013532752A
Authority
JP
Japan
Prior art keywords
base film
film
polyimide
dianhydride
polyamic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013521769A
Other languages
English (en)
Japanese (ja)
Inventor
エドワード カーニー トーマス
マイケル バートリン ジェフリー
エル．ダンバー メレディス
ジョン ハーマン スコット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/842,174 external-priority patent/US8574720B2/en
Priority claimed from US12/850,739 external-priority patent/US8541107B2/en
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2013532752A publication Critical patent/JP2013532752A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2013521769A 2010-07-23 2011-02-14 艶消仕上げポリイミドフィルムおよびそれに関連する方法 Pending JP2013532752A (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US12/842,174 2010-07-23
US12/842,174 US8574720B2 (en) 2009-08-03 2010-07-23 Matte finish polyimide films and methods relating thereto
USPCT/US2010/044202 2010-08-03
PCT/US2010/044202 WO2011017291A1 (en) 2009-08-03 2010-08-03 Matte finish polyimide films and methods relating thereto
US12/850,739 2010-08-05
US12/850,739 US8541107B2 (en) 2009-08-13 2010-08-05 Pigmented polyimide films and methods relating thereto
USPCT/US2010/045301 2010-08-12
PCT/US2010/045301 WO2011019899A1 (en) 2009-08-13 2010-08-12 Matte finish polyimide films and methods relating thereto
PCT/US2011/024745 WO2012011970A1 (en) 2010-07-23 2011-02-14 Matte finish polyimide films and methods relating thereto

Publications (1)

Publication Number Publication Date
JP2013532752A true JP2013532752A (ja) 2013-08-19

Family

ID=44259586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013521769A Pending JP2013532752A (ja) 2010-07-23 2011-02-14 艶消仕上げポリイミドフィルムおよびそれに関連する方法

Country Status (4)

Country Link
EP (1) EP2596052A1 (de)
JP (1) JP2013532752A (de)
CN (1) CN103168068A (de)
WO (1) WO2012011970A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017501907A (ja) * 2013-12-17 2017-01-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 多層フィルム
JP2017508637A (ja) * 2013-12-13 2017-03-30 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 多層フィルム

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
TW201302858A (zh) * 2011-06-24 2013-01-16 Du Pont 有色聚醯亞胺膜及與其有關之方法
JP6100892B2 (ja) * 2012-06-22 2017-03-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ ポリイミド金属張積層体
WO2013192466A1 (en) * 2012-06-22 2013-12-27 E. I. Du Pont De Nemours And Company Polyimide metal clad laminate
JP2014141575A (ja) * 2013-01-23 2014-08-07 Kaneka Corp 顔料添加ポリイミドフィルム
US9481150B2 (en) * 2014-12-10 2016-11-01 E I Du Pont De Nemours And Company Multilayer film
TWI650346B (zh) * 2016-11-30 2019-02-11 長興材料工業股份有限公司 聚醯亞胺前驅物組合物及其應用
CN114230830A (zh) * 2022-01-12 2022-03-25 江西冠德新材科技股份有限公司 一种易降解无胶亚光膜及其制备方法
TWI822297B (zh) * 2022-09-02 2023-11-11 達邁科技股份有限公司 黑色消光之聚醯亞胺膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131596A (ja) * 1990-02-05 1993-05-28 E I Du Pont De Nemours & Co すぐれた圧縮強さを有する被覆されたヒートシール可能な芳香族ポリイミドフイルム
JP2007063492A (ja) * 2005-09-02 2007-03-15 Kaneka Corp 欠陥の少ないポリイミドフィルム
JP2011080002A (ja) * 2009-10-09 2011-04-21 Kaneka Corp 絶縁性ポリイミドフィルム、カバーレイフィルム、及びフレキシブルプリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111359A (ja) 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5859171A (en) * 1997-05-21 1999-01-12 Dupont Toray Polyimide copolymer, polyimide copolymer resin molded products and their preparation
US6794031B2 (en) * 2001-09-28 2004-09-21 Ube Industries, Ltd. Cover-lay film and printed circuit board having the same
US7442727B2 (en) * 2003-06-04 2008-10-28 Degussa Ag Pyrogenically prepared, surface modified aluminum oxide
US7015260B2 (en) * 2003-06-04 2006-03-21 E.I. Du Pont De Nemours And Company High temperature polymeric materials containing corona resistant composite filler, and methods relating thereto
US20050215715A1 (en) * 2003-12-19 2005-09-29 Schmeckpeper Mark R Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
JP2007058154A (ja) * 2005-07-26 2007-03-08 Fuji Xerox Co Ltd 中間転写ベルト、その製造方法、及び画像形成装置
JP5462631B2 (ja) * 2007-11-30 2014-04-02 三井化学株式会社 ポリイミド系複合材料およびそのフィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131596A (ja) * 1990-02-05 1993-05-28 E I Du Pont De Nemours & Co すぐれた圧縮強さを有する被覆されたヒートシール可能な芳香族ポリイミドフイルム
JP2007063492A (ja) * 2005-09-02 2007-03-15 Kaneka Corp 欠陥の少ないポリイミドフィルム
JP2011080002A (ja) * 2009-10-09 2011-04-21 Kaneka Corp 絶縁性ポリイミドフィルム、カバーレイフィルム、及びフレキシブルプリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017508637A (ja) * 2013-12-13 2017-03-30 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 多層フィルム
JP2017501907A (ja) * 2013-12-17 2017-01-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 多層フィルム

Also Published As

Publication number Publication date
WO2012011970A1 (en) 2012-01-26
EP2596052A1 (de) 2013-05-29
CN103168068A (zh) 2013-06-19

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