JP2013522923A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013522923A5 JP2013522923A5 JP2013500473A JP2013500473A JP2013522923A5 JP 2013522923 A5 JP2013522923 A5 JP 2013522923A5 JP 2013500473 A JP2013500473 A JP 2013500473A JP 2013500473 A JP2013500473 A JP 2013500473A JP 2013522923 A5 JP2013522923 A5 JP 2013522923A5
- Authority
- JP
- Japan
- Prior art keywords
- charged particle
- layer
- converter element
- sensor
- beamlets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 82
- 239000002245 particle Substances 0.000 claims description 75
- 230000000903 blocking effect Effects 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011247 coating layer Substances 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000001039 wet etching Methods 0.000 claims description 2
- 238000010791 quenching Methods 0.000 claims 1
- 230000000171 quenching effect Effects 0.000 claims 1
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1037820A NL1037820C2 (en) | 2010-03-22 | 2010-03-22 | Lithography system, sensor, sensor surface element and method of manufacture. |
| NL1037820 | 2010-03-22 | ||
| PCT/EP2011/054372 WO2011117253A1 (en) | 2010-03-22 | 2011-03-22 | Lithography system, sensor, converter element and method of manufacture |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013522923A JP2013522923A (ja) | 2013-06-13 |
| JP2013522923A5 true JP2013522923A5 (cg-RX-API-DMAC7.html) | 2014-05-08 |
| JP5738973B2 JP5738973B2 (ja) | 2015-06-24 |
Family
ID=43034143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013500473A Active JP5738973B2 (ja) | 2010-03-22 | 2011-03-22 | リソグラフィーシステム、センサ、コンバータ素子、および、製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US8357906B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2550671B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5738973B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101667770B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102906850B (cg-RX-API-DMAC7.html) |
| NL (1) | NL1037820C2 (cg-RX-API-DMAC7.html) |
| RU (1) | RU2562126C2 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI533350B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2011117253A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1037820C2 (en) | 2010-03-22 | 2011-09-23 | Mapper Lithography Ip Bv | Lithography system, sensor, sensor surface element and method of manufacture. |
| EP2638562B1 (en) | 2010-11-13 | 2020-04-01 | ASML Netherlands B.V. | Method for determining a distance between two beamlets in a multi-beamlet exposure apparatus |
| NL2008174C2 (en) * | 2012-01-24 | 2013-08-21 | Mapper Lithography Ip Bv | Device for spot size measurement at wafer level using a knife edge and a method for manufacturing such a device. |
| US9665014B2 (en) * | 2012-03-08 | 2017-05-30 | Mapper Lithography Ip B.V. | Charged particle lithography system with alignment sensor and beam measurement sensor |
| US9653259B2 (en) * | 2012-05-14 | 2017-05-16 | Mapper Lithography Ip B.V. | Method for determining a beamlet position and method for determining a distance between two beamlets in a multi-beamlet exposure apparatus |
| KR102126061B1 (ko) | 2013-11-28 | 2020-06-23 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
| US20180217059A1 (en) * | 2015-07-31 | 2018-08-02 | Fei Company | Segmented detector for a charged particle beam device |
| NL2019503B1 (en) | 2016-09-08 | 2018-08-31 | Mapper Lithography Ip Bv | Fabricating unique chips using a charged particle multi-beamlet lithography system |
| US10079206B2 (en) | 2016-10-27 | 2018-09-18 | Mapper Lithography Ip B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
| US10714427B2 (en) | 2016-09-08 | 2020-07-14 | Asml Netherlands B.V. | Secure chips with serial numbers |
| KR102359084B1 (ko) | 2016-12-23 | 2022-02-07 | 에이에스엠엘 네델란즈 비.브이. | 하전 입자 멀티-빔렛 리소그래피 시스템을 이용한 고유 칩 제조 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3173769D1 (en) * | 1980-10-09 | 1986-03-27 | Dainippon Printing Co Ltd | Photomask blank and photomask |
| JPS62260335A (ja) * | 1986-05-06 | 1987-11-12 | Hitachi Ltd | パタ−ン検査方法および装置 |
| US4902898A (en) * | 1988-04-26 | 1990-02-20 | Microelectronics Center Of North Carolina | Wand optics column and associated array wand and charged particle source |
| US5136169A (en) | 1991-04-05 | 1992-08-04 | Massachusetts Institute Of Technology | Energy beam locating |
| JP2701764B2 (ja) * | 1994-12-28 | 1998-01-21 | 日本電気株式会社 | 荷電粒子ビームの寸法測定装置および測定方法 |
| US5872618A (en) | 1996-02-28 | 1999-02-16 | Nikon Corporation | Projection exposure apparatus |
| JPH09306400A (ja) * | 1996-05-15 | 1997-11-28 | Nippon Telegr & Teleph Corp <Ntt> | 電子ビ―ム計測用ナイフエッジ及びその製法並びに電子ビ―ム計測用ナイフエッジを用いた電子ビ―ム計測法 |
| US5910827A (en) * | 1997-02-26 | 1999-06-08 | Kwan; Katherine W. | Video signal decoding arrangement and method for improved error concealment |
| US5892230A (en) * | 1997-05-29 | 1999-04-06 | Massachusetts Institute Of Technology | Scintillating fiducial patterns |
| JPH11246300A (ja) * | 1997-10-30 | 1999-09-14 | Canon Inc | チタンナノ細線、チタンナノ細線の製造方法、構造体及び電子放出素子 |
| JP4505662B2 (ja) * | 1999-03-03 | 2010-07-21 | 株式会社ニコン | 基準マーク構造体、その製造方法及びそれを用いた荷電粒子線露光装置 |
| US6429090B1 (en) * | 1999-03-03 | 2002-08-06 | Nikon Corporation | Fiducial mark bodies for charged-particle-beam (CPB) microlithography, methods for making same, and CPB microlithography apparatus comprising same |
| JP2000315785A (ja) | 1999-04-30 | 2000-11-14 | Canon Inc | ナノ構造体の製造方法及びナノ構造体デバイス |
| US6791094B1 (en) * | 1999-06-24 | 2004-09-14 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for determining beam parallelism and direction |
| WO2001048560A1 (en) * | 1999-12-28 | 2001-07-05 | Toshiba Tec Kabushiki Kaisha | Image forming device and fixing device |
| DE10307545A1 (de) * | 2002-02-22 | 2003-11-06 | Hoya Corp | Zuschnitt für halbtonartige Phasenverschiebungsmaske und zugehörige Phasenverschiebungsmaske |
| CN1287221C (zh) * | 2002-06-18 | 2006-11-29 | Hoya株式会社 | 灰调掩模及其制造方法 |
| EP2302460A3 (en) | 2002-10-25 | 2011-04-06 | Mapper Lithography Ip B.V. | Lithography system |
| US6919570B2 (en) * | 2002-12-19 | 2005-07-19 | Advanced Electron Beams, Inc. | Electron beam sensor |
| JP2004251764A (ja) * | 2003-02-20 | 2004-09-09 | Tokyo Seimitsu Co Ltd | 電子ビーム像用ｔｄｉセンサ及びマスク検査装置 |
| JP4738723B2 (ja) * | 2003-08-06 | 2011-08-03 | キヤノン株式会社 | マルチ荷電粒子線描画装置、荷電粒子線の電流の測定方法及びデバイス製造方法 |
| US20050088633A1 (en) | 2003-10-24 | 2005-04-28 | Intel Corporation | Composite optical lithography method for patterning lines of unequal width |
| JP3962778B2 (ja) | 2004-06-02 | 2007-08-22 | 株式会社日立ハイテクノロジーズ | 電子ビーム検出器、並びにそれを用いた電子ビーム描画方法及び電子ビーム描画装置 |
| CN1907188A (zh) | 2005-07-25 | 2007-02-07 | 株式会社泉精器制作所 | 饮料制作器 |
| JP2007042803A (ja) | 2005-08-02 | 2007-02-15 | Honda Motor Co Ltd | イオン注入マスクおよびその製造方法、並びにイオン注入マスクを用いた炭化珪素半導体装置およびその製造方法 |
| EP1943662B1 (en) | 2005-09-15 | 2016-11-23 | Mapper Lithography IP B.V. | Lithography system, sensor and measuring method |
| US7868300B2 (en) * | 2005-09-15 | 2011-01-11 | Mapper Lithography Ip B.V. | Lithography system, sensor and measuring method |
| TWI407260B (zh) * | 2005-09-15 | 2013-09-01 | Mapper Lithography Ip Bv | 微影系統，感測器及測量方法 |
| US7521685B2 (en) | 2006-01-18 | 2009-04-21 | General Electric Company | Structured scintillator and systems employing structured scintillators |
| JP2008041890A (ja) * | 2006-08-04 | 2008-02-21 | Canon Inc | マルチ荷電粒子ビームの計測方法、露光装置、及びデバイス製造方法 |
| JP5301312B2 (ja) * | 2008-03-21 | 2013-09-25 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置の較正用基板及び描画方法 |
| NL1037820C2 (en) | 2010-03-22 | 2011-09-23 | Mapper Lithography Ip Bv | Lithography system, sensor, sensor surface element and method of manufacture. |
-
2010
- 2010-03-22 NL NL1037820A patent/NL1037820C2/en not_active IP Right Cessation
-
2011
- 2011-03-21 TW TW100109513A patent/TWI533350B/zh active
- 2011-03-22 EP EP11709423.5A patent/EP2550671B1/en active Active
- 2011-03-22 RU RU2012144624/07A patent/RU2562126C2/ru active
- 2011-03-22 CN CN201180025381.3A patent/CN102906850B/zh active Active
- 2011-03-22 KR KR1020127027493A patent/KR101667770B1/ko active Active
- 2011-03-22 WO PCT/EP2011/054372 patent/WO2011117253A1/en not_active Ceased
- 2011-03-22 JP JP2013500473A patent/JP5738973B2/ja active Active
- 2011-03-22 US US13/053,488 patent/US8357906B2/en not_active Ceased
-
2015
- 2015-01-22 US US14/602,294 patent/USRE47287E1/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013522923A5 (cg-RX-API-DMAC7.html) | ||
| RU2012144624A (ru) | Система литографии, датчик, элемент преобразователя и способ изготовления | |
| KR101959945B1 (ko) | 빔렛 위치를 결정하기 위한 방법 및 멀티 빔렛 노출 장치에서 2개의 빔렛들 간의 거리를 결정하기 위한 방법 | |
| JP5882348B2 (ja) | マルチ小ビーム露光装置における２つの小ビーム間の距離を決定する方法 | |
| TW201142905A (en) | Modulation device and charged particle multi-beamlet lithography system using the same | |
| JPS5834933B2 (ja) | マスク構造体およびその形成方法 | |
| JP2018061048A (ja) | アライメントセンサーとビーム測定センサーを備えている荷電粒子リソグラフィシステム | |
| JP2015517734A5 (cg-RX-API-DMAC7.html) | ||
| TWI407260B (zh) | 微影系統，感測器及測量方法 | |
| TW200844679A (en) | Apparatus with plasma radiation source and method of forming a beam of radiation and lithographic apparatus | |
| JP5199097B2 (ja) | リソグラフィシステム、センサ、測定方法 | |
| WO1982003126A1 (en) | Reregistration system for a charged particle beam exposure system | |
| US11322537B2 (en) | Imaging detection chip with an optical antenna comprising a plurality of antenna cells each comprising one or more nanocones coupled to photosensitive array | |
| WO2013112041A1 (en) | Device for spot size measurement at wafer level using a knife edge and a method for manufacturing such a device | |
| US20150146179A1 (en) | Low energy electron beam lithography | |
| Sato et al. | Sub-micrometer-sized Patterning of Photoresist by Electron Beam Projection Lithography Using Tabletop Scanning Electron Microscopy System and Stencil Masks. | |
| CN120085277A (zh) | 激光雷达接收系统及超构透镜的加工方法 | |
| Lu et al. | A new chemically amplified resist for high resolution patterning by E-beam lithography | |
| JP3497959B2 (ja) | 光パターンの測定方法 | |
| JP2003243284A (ja) | 露光方法 |