JP2013516628A - Automatic probe configuration station and method thereof - Google Patents

Abstract

  Probe system that facilitates inspection of the device under test. The system removes the storage rack, the probe bar gantry assembly, the probe assembly configured to be electrically mated to the device under test, and the probe assembly from the storage rack, and moves the probe assembly to the probe bar.・ Incorporate a robot system to be handed over to the gantry. The robotic system can also remove the probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack. The probe assembly includes a clamp assembly that attaches the probe assembly to a probe bar gantry or storage rack. The probe assembly includes an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly.

Description

Background of the Invention

CROSS REFERENCE TO RELATED APPLICATIONS This application is related to and claims priority from US Provisional Application No. 61 / 293,610, filed Jan. 8, 2010, the entire disclosure of which is hereby incorporated herein by reference. Incorporate.

  The present invention relates generally to the field of electrical inspection of large scale electronic devices, and in particular for the inspection of liquid crystal (LC) and organic light emitting diode (OLED) display devices, and for this inspection. Relates to optical and electronic systems.

  Liquid crystal display (LCD) panels incorporate liquid crystals that exhibit electric field-dependent light modulation characteristics. Liquid crystals are most often used to display images and other information in a variety of devices ranging from fax machines and laptop computer screens to large screen high resolution TVs. An active matrix type LCD panel has several functional layers: a polarizing film, a TFT glass substrate incorporating a thin film transistor, a storage capacitor, a pixel electrode, and a wiring for connection; a black matrix and a color filter array; A complex consisting of a color filter glass substrate incorporating a transparent common electrode, an oriented thin film made of polyimide, and an actual liquid crystal material incorporating plastic / glass spacers to maintain the proper LCD cell thickness It has a layered structure.

  LCD panels are produced in a clean room environment under highly controlled conditions to maximize yield. Nevertheless, many LCDs must be discarded due to production defects.

  As described above, in order to improve the manufacturing yield of complex electronic devices such as LCD panels, various inspection processes are performed to identify defects that may occur in the manufacturing process. The aforementioned inspection process may be performed between the manufacturing processes or after the entire manufacturing process is completed. One example of the aforementioned inspection process is testing of TFT arrays used in LC and OLED displays for electrical defects. The aforementioned tests are performed using various inspection devices. An exemplary apparatus that can be used for this purpose is the Array Checker AC5080 sold by Orbotech, Inc. of San Jose, California. Alternatively, the TFT array test may be performed using a commercially available electron beam inspection system known to those skilled in the art.

  Generally, in an electrical inspection system, a device under test (DUT) needs to be driven with an electrical signal or pattern that facilitates the detection of defects. These signals are transmitted from the pattern generator subsystem to the DUT by a structure comprising probe pins that physically contact contact pads located in the periphery of the active area of the DUT. In the case of electrical inspection of a TFT array, one or more shorting bars (mounted on the same substrate as the array) are between the contact pads used for testing the array and the panel drive lines. Often placed. These shorting bars are connected to a subset of the drive lines (for example, one shorting bar is connected every other gate line), which reduces the number of contacts required and simplifies the probe assembly. Become.

  Different devices generally have different test pad layouts (arrangements). Test pad layout depends on the size of the DUT, the distance between adjacent devices to be tested on the same substrate, the orientation of the DUT on the substrate, and other factors. Thus, when testing different devices on the same electrical inspection system, the probing structure must be modified to match the DUT configuration. Currently, reconfiguration of probe structures is accomplished using procedures involving intensive manual operations. For example, when testing different circuit layouts in an electrical inspection system that uses a manually constructed (shaped) probe structure, the machine operator installs a new probe structure and calibrates it. And you need to configure. This process requires the test machine to be shut down for an extended period of time, resulting in lower machine utilization. Processes that require a process control room require an operator to enter this room to perform a reconfiguration, which further stops the machine until this room returns to process conditions, There is a risk of putting workers at risk. When testing new panel layouts, customized probe structures must be developed with added customer costs. Since unused probe structures are stored outside the machine, additional floor space is required for storage.

  The methodology of the present invention is directed to a method and system that substantially eliminates one or more of the above and other problems associated with the prior art and facilitates the inspection of large-scale electronic devices.

  According to one aspect of the invention, a probe system for inspection of a device under test is provided. This probe system consists of a probe rack configured to electrically mate with the storage rack, probe bar gantry assembly, and device under test. A probe system is incorporated from the assembly and storage rack and a robotic system configured to deliver the probe assembly to the probe bar gantry is assembled. The robotic system is further configured to remove the probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack.

  Embodiments include a probe assembly that incorporates a clamping assembly configured to attach the probe assembly to a probe bar gantry or storage rack.

  In an embodiment, when the probe assembly is installed (attached, placed) on the probe bar gantry assembly, an array of contact pins configured to mate with conductive pads on the device under test is assembled. Embedded probe assembly.

  Embodiments include a probe assembly incorporating a contact assembly that includes multiple (multiple) contacts. The probe bar gantry assembly incorporates a gantry structure and an electric bus (electrical bus) mounted on (provided on) the gantry structure. Including multiple traces, the multiple contacts of the contact assembly are electrically connected to the multiple lines of the electrical bus when the probe assembly is installed on the probe bar gantry assembly. Configured to fit together.

  Embodiments include a controller configured to detect a predetermined probe assembly on an electrical bus.

  Embodiments include a controller configured to verify that the correct probe assembly is present in the electrical bus and to identify misplacement of the probe assembly.

  Embodiments include a test pattern generator configured to generate an electrical test pattern for a device under test. The test pattern generator described above is electrically connected to the electrical bus of the probe bar gantry assembly so that the electrical test pattern passes through at least one of the contacts of the contact assembly through the wire of the electrical bus. Applied to one.

  In an embodiment, a probe configured to receive (receive) a test pattern from an electrical bus through a contact assembly and apply the electrical test pattern to a device under test through an array of contact pins. Includes assembly.

  In an embodiment, when the probe assembly is installed anywhere along the length of the probe bar gantry assembly, the contacts of the probe assembly contact assembly may be connected to a plurality of wires of the electrical bus. It includes a plurality of linear bodies of electrical buses arranged along the length of the probe bar gantry assembly to mate with the body.

  Embodiments include a probe bar gantry configured to include an automated axis of motion for positioning the probe assembly at a specific location on the device under test.

  Embodiments include a robotic system that incorporates a gripping assembly that operates to grip the probe assembly.

  In an embodiment, a grip assembly incorporating a gripping arm that is pivotally movable with respect to a gripping device, and actuating the grip arm of the grip assembly And a robot system incorporating an actuator for the purpose.

  In an embodiment, when the probe assembly is gripped by the grip assembly, the clamping assembly of the probe assembly is opened to release the storage rack or probe bar gantry assembly. Includes an operating grip assembly.

  Embodiments include a robotic system that incorporates at least one sensor configured to identify and locate a probe assembly.

  Embodiments include sensors that are RFID readers. The probe assembly includes an RFID tag configured to be read by an RFID reader, wherein the RFID tag is at least one of a unique probe assembly identifier, probe type (type) information, and calibration information. Is saved (stored, stored).

  Embodiments include a sensor that is an edge detection sensor configured to detect an edge of the probe assembly.

  In an embodiment, the amount of correction required to compensate for probe bar gantry assembly surface distortion during placement or removal of the probe assembly is determined. Including a configured controller.

  In an embodiment, the probe assembly includes an array of contact pins configured to mate with conductive pads on the device under test, a contact assembly having a plurality (multiple) contacts, and a plurality (multiple) contacts. A probe assembly controller configured to route one or more signals from one or more of the plurality of signals to one or more contact pins.

  Embodiments include a probe assembly controller having a serial protocol interface coupled to a contact assembly, the contact assembly being electrically connected to an electrical bus of the probe bar gantry assembly So that the serial protocol interface can be controlled through the electrical bus of the probe bar gantry assembly using the serial protocol.

  Embodiments include a probe assembly controller server operable to send serial protocol commands over the electrical bus to the probe assembly serial protocol interface.

  Embodiments include a plurality (group) of test pattern generators configured to generate a group (group) of electrical test pattern signals for a device under test. The contact assembly is configured to electrically mate with the electrical bus of the probe bar gantry assembly, and multiple groups of electrical test pattern signals are applied to the electrical bus. The probe assembly controller is configured to route one of a plurality of groups of electrical test pattern signals to a plurality (multiple) contact pins.

  In an embodiment, one or more signals detected from a device under test are routed from one or more contact pins to one or more of a plurality (multiple) contacts of a contact assembly. A probe assembly controller configured as described above.

  In an embodiment, the probe assembly includes a probe assembly controller having a memory device that stores (saves) a unique identifier of the probe assembly, wherein the unique identifier of the probe assembly includes instructions (commands) for the probe assembly. • Used to send to the controller.

  In an embodiment, a probe assembly controller configured to route signals from any one of a plurality (multiple) contacts to any one of a plurality (multiple) contact pins including.

  Embodiments include contact pins of a probe assembly that are pre-positioned according to a predetermined device under test configuration.

  Embodiments include a probe assembly having at least one of an optical probing device, an electrical probe device, a thermal probing device, and an alignment probing device.

  Embodiments include a probe bar gantry assembly that operates to position the probe assembly anywhere on the device under test.

  In accordance with another aspect of the present invention, a probe system for inspection of a device under test is provided. The probe system includes a storage rack having a first rail, and a gantry structure having a second rail and an electric having a plurality of multiple traces attached to the gantry structure. Incorporates a probe bar gantry assembly having a bus (electrical bus). The probe system further incorporates a probe assembly that includes a plurality of pins configured to electrically mate with contact pads on the device under test, and the probe assembly on the probe bar gantry assembly. A plurality of (multiple contacts) configured to mate with the linear body of the electrical bus when positioned with a clamp and configured to engage the first rail and the second rail An assembly. The probe system further incorporates a robot system that is configured to remove the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry. The probe assembly is removed from and configured to be delivered to the storage rack.

  In accordance with yet another aspect of the present invention, a storage rack, a first gantry assembly, a second gantry assembly, an access area accessible to the first gantry assembly, a first robotic A system incorporating a system and a second robot system is provided. The second robotic system is configured to reposition a payload in any of the storage rack, the first gantry assembly, and the second gantry assembly. The second robotic system incorporates at least one edge detection sensor configured to identify and locate the load by detecting at least one edge of the load. Yes.

  In the following description, several additional aspects relating to the present invention are set forth, which will be apparent from the description and will be apparent from the practice of the invention. Aspects of the invention may be realized and achieved using elements and combinations of elements, and in particular using the aspects recited in the detailed description below and the appended claims.

  It is to be understood that both the foregoing and following description are exemplary and are intended for purposes of illustration only and are not intended to limit the claimed invention or its application in any way.

  The present specification includes accompanying drawings, which form a part of the specification, illustrate embodiments of the present invention, and together with the description, explain and exemplify the technical principles of the present invention. Specifically, it is as follows.

1 is a perspective view showing a portion of an exemplary embodiment of a probe configuration station (PCS) and its major components of the present invention. FIG. FIG. 5 illustrates an exemplary embodiment of a probe assembly with mate contacts to a PCS bus trace. 2 is an illustration of an exemplary embodiment of a PCS gripper assembly viewed from different directions. 2 is an illustration of an exemplary embodiment of a PCS gripper assembly viewed from different directions. It is a figure which shows an example structure provided with several (multiple) pattern generators (multiple pattern generators) which send out a drive pattern signal group (group) through a PCS bus | bath. Fig. 2 shows an RFID read / write system (write / read system) and edge detection sensor used in the PCS embodiment of the present invention. FIG. 6 illustrates an exemplary embodiment of circuitry that interconnects between a PCS bus board, a probe assembly controller (PAC), and a probe nose. FIG. 4 shows an exemplary embodiment of a switching bank of driving channels. FIG. 6 illustrates an exemplary embodiment of a sense pin and sense channel switching configuration. FIG. 6 illustrates an exemplary embodiment of a 24 × 24 switching configuration that allows flexible pin assignment.

Detailed description

  In the following detailed description, reference will be made to the accompanying drawing (s), in which identical functional elements are designated with like numerals. The foregoing accompanying drawings are presented for purposes of illustration and are not intended to be limited to the specific examples and embodiments consistent with the principles of the invention. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, but other embodiments may be utilized and structures may be used without departing from the scope and spirit of the invention. It should be understood that the above modifications and / or various element substitutions are possible. The following detailed description is, therefore, not to be construed as limiting.

  In accordance with one or more embodiments of the inventive concept, replacement of the current manual probe structure required when different devices (specifically TFT arrays) are electrically tested Procedures and associated probe structures can be used remotely (and automatically) according to the layout of the DUT, replacing the probe structure with reconfigurable innovative procedures and associated mechanisms It is done.

  FIG. 1 shows an exemplary mechanical embodiment 100 of a probe configuration (placement, formation, adaptation) (former probe) station (PCS) of the present invention according to one or more embodiments of the present invention. As shown in FIG. 1, the PCS includes, in part, a pick and place robotic system (PCS robot) 100 and one or more probe assemblies. 102, a probe assembly storage rack 103, and a probe bar gantry 104. The PCS robot 101 is used to move the probe assembly 102 between the probe bar gantry 104 and the probe assembly storage rack 103. In one or more embodiments, the probe assembly storage rack 103 incorporates at least one storage rack rail.

  In one or more embodiments of the present invention, the storage rack 103 is mounted in a static configuration to the probe bar gantry 104 on the support frame assembly 105 while the PCS. The robot 101 is movable on its own track assembly 106 using a computer controlled actuator (not shown in FIG. 1).

  The probe assembly 102 is a customizable module, full of contact pins designed to engage with signal receiving conductive pads on the DUT to drive the DUT during electrical test operations. -Provide a full array. In many cases, the aforementioned conductive pads are located at the periphery of the DUT. If the DUT is a TFT panel, the probe assembly 102 may deliver drive and / or data signals to the DUT to enable electrical test operations.

  In addition to the contact pins described above, the probe assembly includes a clamping mechanism designed to position and securely secure the probe assembly on the probe bar gantry 104 and probe assembly storage rack 103. . In one or more embodiments, the aforementioned clamping mechanism is configured to engage a rail or groove in the probe bar gantry 104 and the probe assembly storage rack 103.

  The probe assembly 102 includes support electronics configured to send and receive electrical signals to the contact pins described above. The assisting electronics of the probe assembly 102 are electrically mated (to, mated with, combined with, touching) the probe configuration station bus attached to the probe bar gantry 104, Electrically connected to a set of electrical contacts designed to be electrically mate with. FIG. 2 shows the probe assembly 102 with contacts 201 mating with PCS bus 203 traces 202. The aforementioned mating (pairing) occurs when the probe assembly 102 is placed on the probe bar gantry 104.

  In one or more embodiments of the present invention, the PCS bus 203 is coupled to the PCS bus 203 and the probe assembly when the probe assembly 102 is positioned anywhere along the length of the probe bar gantry 104. It is attached to the bottom side of the probe bar gantry 104 in such a way that an electrical connection is established with the 102 electrical contacts 201. For this purpose, the electrical traces 202 of the PCS bus 203 are arranged along the length of the probe bar gantry 104. In another embodiment of the invention, the PCS bus 203 is mounted on the upper side of the probe bar gantry 104. In one or more embodiments of the PCS of the present invention, the PCS bus 203 is configured to supply power to the DUT via the probe assembly 102.

  According to one or more embodiments of the inventive concept, the probe bar gantry 104 positions the probe assembly 102 at a specific position along the length of the LCD glass according to the DUT configuration. It has an automated axis of motion that is used for this purpose. Finally, storage rack 103 is used to store spare probe assemblies 102 or other assemblies used for other DUT layouts.

  According to one or more embodiments of the inventive concept, the PCS robot 101 uses a PCS gripper assembly 300, which is a highly integrated mechanism, an exemplary embodiment of which is shown in FIG. 3A. And shown in FIG. 3B. The PCS gripper assembly 300 is used to “pick and place” the probe assembly 102 from the storage rack 103 to the probe gantry 104 and from the probe gantry 104 to the storage rack 103. Is done. The PCS gripper assembly 300 incorporates a gripping arm 301, which is pivotally movable relative to the rest of the PCS gripper assembly 300, for example, an air (pressure) cylinder (not shown). Z)). When the grip arm 301 is engaged, it is designed to open the probe assembly clamping mechanism and grip the body of the probe assembly 102. The gripping fingers 302 and 303 are designed to hold the probe assembly 102 in the gripper assembly 300 during a repositioning operation. When the grip arm 301 stops moving (disengaged), the clamping mechanism of the probe assembly 102 automatically closes and the probe assembly 102 is released from the PCS gripper assembly 300. .

  According to one or more embodiments of the inventive concept, the gripper assembly 300 incorporates an integral, mechanical linkage that allows the gripper fingers 302 and 303 to be opened and closed by actuation of the gripper air cylinder. This ensures that the gripper fingers 302 can grip the probe assembly 102 reliably. In the same or other embodiments, the integral mechanical linkage described above can raise and lower a lever that opens and closes the clamp mechanism of the probe assembly 102.

  According to one or more embodiments of the inventive concept, the gripper assembly 300 incorporates a banking cylinder 306, which holds the gripped probe assembly 102 into the probe bar gantry 104 or Operate to bank on storage rack 103 or pull out from probe bar gantry 104 or storage rack 103.

  According to one or more embodiments of the inventive concept, during the aforementioned pick-and-place operation, the PCS gripper assembly 300 is configured to a single stroke of the aforementioned air cylinder that actuates the grip arm 301. Then, the following sequential operation is executed. That is, it grips the probe assembly 102, opens and closes the clamping mechanism of the probe assembly, and retracts and expands the full array contactor. The clamping mechanism of the probe assembly can attach itself to the storage rack 103 and / or the probe bar gantry 104. In one or more embodiments of the invention, the PA is probed using the juxtaposed cylinder 306 of the gripper assembly 300 so that the contacts of the probe assembly 102 are always aligned with the linear body of the PCB bus 203. It is juxtaposed to the bar gantry 104 or the storage rack 103. In one or more embodiments, both the probe bar gantry 104 and the storage rack 103 have closely controlled juxtaposition and clamping surfaces.

  In one or more embodiments, the probe assembly 102 incorporates an integral, mechanical linkage mechanism that opens and closes the clamp and clamps and unclamps on the probe bar gantry 104 or storage rack 103. At the same time, the contacts of the probe assembly 102 can be moved up and down to obtain electrical contact (contact) with the linear body of the PCB bus 203.

  In accordance with one or more embodiments of the inventive concept, the probe bar gantry 104 includes at least a portion of a rigid gantry structure 107 in which the probe assembly 102 is disposed, and a vertically long conductive wire. Incorporating a PCB bus 203 (FIG. 2) with an array of bodies, electrical signals can be supplied to the probe assembly 102 regardless of its position along the probe bar gantry 104, as shown in FIG.

  In accordance with one or more embodiments of the inventive concept, one or more electrical test signals are used to activate a drive circuit on an LCD glass or other DUT for electrical testing. Generated by one or more of the pattern generators 401-404 of the test system. Please refer to FIG. As shown in FIG. 4, the one or more electrical test signals described above are routed to the PCS bus 203 on the probe bar gantry 104. The probe assembly receives (receives) electrical signals from the PCS bus 203 through the contacts 201 of the full array contactor 204 of the probe assembly 102. When an electrical signal is passed to the LCD glass or other DUT through the probe pins of the probe assembly 102 appropriately positioned on the probe bar gantry 104, the electrical circuit is complete. ) (Completed).

  In accordance with one or more embodiments of the inventive concept, the location, configuration and / or other information associated with the probe assembly 102 is constantly known (monitored) and the storage rack 103 or To locate the position of the probe assembly on the probe bar gantry 104, the PCS robot 101 is equipped with an RFID read / write system 501 and an edge detection sensor 502, as shown in FIG. Each probe assembly 102 has an RFID tag 503 that is read or written (read / write) by the robot's RFID read / write system 501. The RFID tag 503 stores (stores) other relevant parameters in addition to the unique probe assembly ID, probe type (type), and XY offset calibration value. In order to perform alignment, measurement, energy operation, heat transfer to the substrate, etc., such as a camera, a lighting device, a laser, other sensors (wired / wireless), etc. It can be added to the embodiment. In one or more embodiments of the present invention, the system of the present invention also incorporates a probe assembly 102 presence sensor (not shown in FIG. 5), which can be reconfigured without failure. to detect the presence / absence of the probe assembly 102 on the gripper assembly 300.

  In one or more embodiments of the invention, vertical software is used to compensate for any flatness or distortion of the probe bar gantry 104 surface using the edge detection sensor 502 of the PCS robot 101. Compensate to ensure that probe assembly replacement can be performed without failure. In one or more embodiments, the innovative software algorithm drives signals to and from the PAC to detect the PAC ID in each probe assembly on the PCB bus 203. , Detecting a unique probe assembly on the probe bar gantry 104. This algorithm detects if there is a deficiency on the PCB bus 203 and locates the misplaced probe assembly.

  In one or more embodiments of the present invention, a probe pin tester module mounted behind a tilted chuck is used to detect missing or broken pins on the nose of the probe assembly; Thus, the time required for DUT inspection is saved. The probe assembly mounted on the probe bar gantry 104 is driven on the probe pin tester module, the probe pins descend onto the pin tester plate, and then the software algorithm And detect missing or broken pins.

  According to one or more embodiments of the inventive concept, the electrical array test electrical stimulus signal is provided by a plurality of independent drive channels with sensing capability. These signals are configured and applied to the panel by a probe assembly controller (PAC) 601 that can be placed on the probe assembly 102, as schematically shown in FIG. In accordance with one or more embodiments of the inventive concept, multiple (many) of the aforementioned probe assembly controllers 601 can be controlled through the PAC server 405 by the host computer 406. The PAC server 405 translates high level instructions from the host computer into the probe assembly controller 601 signals. The probe assembly controller 601 is addressed by the PAC server 405 using, for example, a unique identifier stored in the non-volatile memory of the probe assembly controller 601.

  In accordance with one or more embodiments of the inventive concept, the primary function of the aforementioned probe assembly controller 601 is to provide multiple drive channels so that electrical stimulation can be applied to an LCD or other DUT pad layout. Enabling configurable pin assignment within a group. In an embodiment of the present invention, communication from the host computer 406 to the PAC 601 is accomplished via a serial protocol interface (SPI) using RS485 signals as a physical layer (single master, multiple slave), for example. However, as will be appreciated by those skilled in the art, the present invention is not limited to a particular communication protocol, and other suitable protocols may be utilized. In one or more embodiments, this communication is performed through a PAC server 405, as shown in FIG.

  According to one or more embodiments of the inventive concept, the drive pattern of an LCD panel or other DUT is generated from one or more pattern generators 401-404 at a remote location. In an embodiment, a single channel of the pattern is defined as a series of electrical pulses of a predetermined value, for example in the amplitude range between plus and minus 50 volts.

  According to one or more embodiments of the inventive concept, one or more drive channel groups (groups) 602 that can be input to a single PAC 601 are provided. Next, the PAC 601 is connected to each individual drive pin 701 in the probe nose of the probe assembly 102, as shown in FIG. 7, through a relay switching matrix including, for example, a 3 × 1 multiplexer 702. The drive channels PG1.1 to PG3.24 are multiplexed. The PAC 601 uses an SPI interface and obtains commands such as switching (switching) and ID programming from the PAC server 405. In an embodiment, each PAC has a unique ID so that it can be individually addressed and stored (stored) in, for example, a non-volatile memory device. The aforementioned ID can be reprogrammed through the same SPI interface.

  In one or more embodiments of the inventive concept, the inventive PAC system comprises a field-programmable gate array (FPGA), which interprets commands. An SPI interface is provided that operates to control a complex multiplexer matrix and is configured to route test electrical signals. In one exemplary embodiment, the aforementioned system is implemented using, for example, a solid state relay.

  In addition to the drive channels described above, the system of the present invention additionally includes multiple (multiple) electrical signal sense (sense) channels configured to allow electrical measurements during inspection of a panel or other DUT. including. In one or more embodiments, a switching matrix similar to the drive channel switching matrix described above is provided so that the sense channel can switch the sensing pins. An exemplary embodiment of such a switching matrix 800 is shown in FIG. In the illustrated embodiment, 3 × 1 multiplexer 802 and 24 × 1 multiplexer 801 are used in pin assignment control to achieve substantially flexible channel assignment, and any channel PG1. SENSE to PG3. Allows SENSE to route to any pin SENSE_PIN1-SENSE_PIN24.

  In FIG. 9, an exemplary embodiment of the flexible pin assignment control mechanism described above is shown. Pin control is accomplished using 2 × 2 and 3 × 3 four-layer 901, 902, 903 and 904 multiplexers well known to those skilled in the art. As will be appreciated by those skilled in the art, the concepts of the present invention are not limited to the switching matrix embodiment shown in FIG. 9, but can be used to generate flexible force pins using other suitable embodiments. Alternatively, the same purpose as the detection pin designation can be achieved.

  According to one or more embodiments of the inventive concept, the system comprises a second (possibly in addition to the aforementioned robot and (first) gantry arranged in front of the system) arranged behind the system. Including robots. Also located at the rear is a second area accessible by any automated means through an access area such as a window or other opening, and a system operator (operator) or access area. There is a movable gantry. The second movable gantry repositions (over the (first) gantry) so that it can be accessed by the (first, forward) robotic system. The forward robot system is configured to reposition the payload within any of the storage rack, the first gantry assembly, and the second gantry assembly. One or more edge detection sensors configured to identify and locate the load by detecting the edge of the load.

  Loading a probe assembly onto a storage rack or (first) gantry involves the following steps.

  The second robot (rear) stops at a predetermined position.

  An operator manually loads the probe assembly onto the second gantry (rear) through the access area.

  The second gantry (rear) moves over the (first) robot (front), and the (first) robot removes the probe assembly.

  The (first) robot (front) stores the probe assembly on the storage rack (front) or the (first) gantry (front).

  The unloading procedure can be accomplished in the reverse order.

  As will be appreciated by those skilled in the art, the advantages of the PCS system of the present invention described herein include an electrical inspection system for testing new products, reducing downtime for product replacement. Reducing the cost of doing so, and reducing the exposure of workers to safety hazards.

  The procedure and associated mechanism of the present invention for remotely (and / or automatically) reconfiguring the probe structure to conform to the DUT configuration can be achieved with a specific test device, or Note that it is not limited to a particular test system or method. The concepts described can be used for LCD or OLED panels and any other electronic devices using any known testing technique, including electron beam, voltage imaging or any other known or later developed testing technique. May be used for testing. In addition, the system of the present invention is not limited to the handling of probe assemblies or specific test equipment, and the handling of any payload, including but not limited to cameras, sensors or any other equipment. However, it may be used regardless of whether it is a test or otherwise.

  Finally, it should be understood that the processes (methods) and techniques described herein are not inherently related to a particular instrument and may be implemented by any suitable combination of parts. In addition, various types of general purpose devices can be used in accordance with the teachings described herein. It may also be advantageous to construct special equipment that performs the method steps described herein. Although the invention has been described with reference to specific embodiments, it is intended in all respects to be illustrative and not limiting.

  Furthermore, other embodiments of the invention will be apparent to those skilled in the art from consideration of the details of the invention disclosed herein. The aspects and / or components of the described embodiments may be used alone or in any combination in a system for testing electronic devices. The detailed description and examples are intended to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims (29)

A probe system for inspection of a device under test,
a. Storage racks,
b. Probe bar gantry assembly,
c. A probe assembly configured to electrically mate with the device under test; and d. The probe assembly is removed from the storage rack, the probe assembly is configured to be delivered to the probe bar gantry, and the probe assembly is further removed from the probe bar gantry. A probe system including a robotic system configured to be delivered to the storage rack.   The probe system of claim 1, wherein the probe assembly includes a clamp assembly configured to attach the probe assembly to the probe bar gantry or the storage rack.   The probe assembly includes an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly. The probe system according to claim 1.   The probe assembly includes a contact assembly including a plurality of contacts, the probe bar gantry assembly includes a gantry structure and an electric bus mounted on the gantry structure, and the electric bus includes a plurality of linear shapes. And the plurality of contacts of the contact assembly are electrically connected to the plurality of linear bodies of the electric bus when the probe assembly is installed on the probe bar gantry assembly. The probe system of claim 1, wherein the probe system is configured to fit.   The probe system of claim 4, further comprising a controller configured to detect a predetermined probe assembly on the electrical bus.   The probe system of claim 5, wherein the controller is further configured to verify that a correct probe assembly is present in the electrical bus and to identify a misplacement of the probe assembly.   And a test pattern generator configured to generate an electrical test pattern for the device under test, wherein the test pattern generator includes the linear body of the electrical bus. The probe system of claim 4, wherein the probe system is electrically connected to the electrical bus of the probe bar gantry assembly such that it is applied to at least one of the plurality of contacts of the contact assembly. .   The probe assembly is configured to receive the test pattern from the electrical bus through the contact assembly and apply the electrical test pattern to the device under test through the array of contact pins. Item 8. The probe system according to Item 7.   When the probe assembly is installed anywhere along the length of the probe bar gantry assembly, the plurality of contacts of the contact assembly of the probe assembly are the plurality of contacts of the electrical bus. The probe system of claim 4, wherein the plurality of linear bodies of the electrical bus are arranged along the length of the probe bar gantry assembly to mate with the linear bodies.   The probe system of claim 1, wherein the probe bar gantry is configured to include an automatically actuated axis for positioning the probe assembly at a specific location on the device under test.   The probe system of claim 1, wherein the robotic system includes a grip assembly operable to grip the probe assembly.   12. The probe of claim 11, wherein the grip assembly includes a grip arm that is rotationally movable with respect to the grip device, and wherein the robotic system includes an actuator for actuating the grip arm of the grip assembly. ·system.   When the probe assembly is gripped by the grip assembly, the grip assembly causes the clamp assembly of the probe assembly to open and the storage rack or the probe bar gantry assembly to move. 12. The probe system of claim 11, operable to release.   The probe system of claim 1, wherein the robotic system includes at least one sensor configured to identify and locate a probe assembly.   The sensor is an RFID reader, and the probe assembly includes an RFID tag configured to be read by the RFID reader, the RFID tag having a unique probe assembly identifier, probe type information, and calibration information. 15. The probe system of claim 14, wherein at least one of the is stored.   The probe system of claim 14, wherein the sensor is an edge detection sensor configured to detect an edge of the probe assembly.   17. The controller of claim 16, further comprising a controller configured to determine a correction amount required to compensate for surface distortion of the probe bar gantry assembly during placement or movement of the probe assembly. The described probe system.   The probe assembly includes an array of contact pins configured to mate with conductive pads on the device under test, a contact assembly including a plurality of contacts, and a probe assembly controller; The assembly controller of claim 1, wherein the assembly controller is configured to route one or more signals from one or more of the plurality of contacts to one or more contact pins. Probe system.   The probe assembly controller includes a serial protocol interface coupled to the contact assembly, the contact assembly configured to electrically mate with an electrical bus of the probe bar gantry assembly, thereby 19. The probe system of claim 18, wherein the serial protocol interface is controllable through the electrical bus of the probe bar gantry assembly using a serial protocol.   The probe system of claim 19 further comprising a probe assembly controller server capable of executing serial protocol instructions over the electrical bus to the serial protocol interface of the probe assembly.   A plurality of test pattern generators configured to generate a plurality of groups of electrical test pattern signals for the device under test, wherein the contact assembly is an electrical bus of the probe bar gantry assembly; And the plurality of groups of electrical test pattern signals are applied to the electrical bus, and the probe assembly controller is configured to apply one of the plurality of groups of electrical test pattern signals to the electrical bus. The probe system of claim 18, wherein the probe system is configured to route to a plurality of contact pins.   The probe assembly controller transmits one or more signals detected from the device under test from one or more contact pins to one or more of the contacts of the contact assembly. The probe system of claim 18, wherein the probe system is configured to route to a probe.   The probe assembly controller of the probe assembly includes a memory device that stores a unique identifier of the probe assembly, wherein the unique identifier of the probe assembly sends an instruction to the probe assembly controller The probe system of claim 18, wherein the probe system is used to   The probe assembly controller is configured to route signals from any one of the plurality of contacts to any one of the plurality of contact pins. The described probe system.   The probe system of claim 18, wherein the contact pins of the probe assembly are pre-positioned according to a predetermined device under test configuration.   The probe system of claim 1, wherein the probe assembly includes at least one of an optical probe device, an electrical probe device, a thermal probe device, and an alignment probe device.   The probe system of claim 1, wherein the probe bar gantry assembly is operable to position the probe assembly anywhere on the device under test. A probe system for inspection of a device under test, the probe system comprising:
a. A storage rack including a first rail;
b. A probe bar gantry assembly including a gantry structure including a second rail and an electric bus attached to the gantry structure and having a plurality of linear bodies;
c. A plurality of pins configured to electrically mate with contact pads on the device under test; and the linear body of the electrical bus when the probe assembly is positioned on the probe bar gantry assembly A probe assembly including a plurality of contacts configured to mate with said first rail and a clamp assembly configured to engage said first rail and second rail; and d. The probe assembly is configured to be removed from the storage rack, the probe assembly is configured to be delivered to the probe bar gantry, and the probe assembly is further removed from the probe bar gantry. A probe system comprising a robot system configured to deliver a storage rack to the storage rack. a. Storage racks,
b. A first gantry assembly,
c. A second gantry assembly,
d. An access area accessible to the first gantry assembly;
e. A first robot system, and f. Configured to reposition the load in any of the storage rack, the first gantry assembly, and the second gantry assembly, and detecting at least one edge of the load. A second robot system including at least one edge detection sensor configured to identify and locate the load.

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