JP2013513221A - ホルダアセンブリ - Google Patents
ホルダアセンブリ Download PDFInfo
- Publication number
- JP2013513221A JP2013513221A JP2012543347A JP2012543347A JP2013513221A JP 2013513221 A JP2013513221 A JP 2013513221A JP 2012543347 A JP2012543347 A JP 2012543347A JP 2012543347 A JP2012543347 A JP 2012543347A JP 2013513221 A JP2013513221 A JP 2013513221A
- Authority
- JP
- Japan
- Prior art keywords
- holder assembly
- terminal
- frame
- terminals
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 4
- 239000011449 brick Substances 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 238000003491 array Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012053 enzymatic serum creatinine assay Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/717—Structural association with built-in electrical component with built-in light source
- H01R13/7175—Light emitting diodes (LEDs)
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/945—Holders with built-in electrical component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【選択図】なし
Description
本願は、全てが参照することにより本明細書に組み込まれる、2010年1月13日に出願された米国仮出願第61/294,746号、2010年1月15日に出願された米国仮出願第61/295,550号、2010年2月5日に出願された米国仮出願第61/301,828号、および2010年7月21日に出願された米国仮特許第61/366,260号に基づく優先権を主張する。
Claims (14)
- カバーと、
該カバーによって支持されるレンズと、
前記カバーを支持するように構成されるフレームであって、内部開口と、複数の受け口と、複数の保持機構とを含むフレームと、
前記複数の受け口の中に取り付けられる複数の端子であって、該複数の端子のそれぞれが、2方向から端子内に差し込まれるワイヤを受け入れて止めるように構成される、複数の端子と、
を備える、ホルダアセンブリ。 - 前記端子のそれぞれは片持ち梁式に支えられた接点を含み、該接点は前記内部開口内に配置される、請求項1に記載のホルダアセンブリ。
- 第1および第2のトレースが前記フレーム上に配置され、前記第1および前記第2のトレースは、相互に電気的に分離される、請求項1に記載のホルダアセンブリ。
- 端子ブリックを更に備え、該端子ブリックは少なくとも第1および第2の端子を支持し、第1の端子が前記第1のトレースと導通し、第2の端子が前記第2のトレースと導通する、請求項3に記載のホルダアセンブリ。
- 前記端子ブリックの第1および第2の端子は端子アレイに含まれ、該端子アレイは少なくとも4つの端子を含み、前記端子アレイの各端子は前記内部開口の中に伸びる接点を有する、請求項4に記載のホルダアセンブリ。
- AC電力をDC電力に変換するように構成された変換回路を更に備える、請求項4に記載のホルダアセンブリ。
- 前記変換回路が、120VACをDCに変換するように構成された集積チップを含む、請求項6に記載のホルダアセンブリ。
- 前記複数の受け口と位置合わせされた複数の溝プレートを更に備え、該溝プレートは、前記複数の端子を定位置に拘束するように前記フレーム上に取り付けられるとともに、第1および第2のワイヤトラップ経路を提供するために前記フレームおよび前記端子と協調するように構成される、請求項1に記載のホルダアセンブリ。
- 前記カバーが複数の突起を含み、前記フレームが複数の保持機構を含み、前記カバーおよびフレームは、ともに取り外し可能に固定されるように構成される、請求項8に記載のホルダアセンブリ。
- 前記複数のプレートが前記フレームに熱かしめされる、請求項8に記載のホルダアセンブリ。
- 前記カバーおよびフレームが、ともに熱かしめされる、請求項1に記載のホルダアセンブリ。
- 前記内部開口は、少なくとも2つの領域に沿って配置される棚を含み、該棚は、動作中、LEDアレイの基板に係合するように構成される、請求項1に記載のホルダアセンブリ。
- 前記棚が、前記基板が所定の向きであることを保証するために、動作中、基板に係合するように構成される少なくとも1つの突起を含む、請求項12に記載のホルダアセンブリ。
- 前記フレームおよびカバーが、該カバーおよびフレームに圧力をかける締め具で固定されるように構成される、請求項1に記載のホルダアセンブリ。
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29474610P | 2010-01-13 | 2010-01-13 | |
US61/294,746 | 2010-01-13 | ||
US29555010P | 2010-01-15 | 2010-01-15 | |
US61/295,550 | 2010-01-15 | ||
US30182810P | 2010-02-05 | 2010-02-05 | |
US61/301,828 | 2010-02-05 | ||
US36626010P | 2010-07-21 | 2010-07-21 | |
US61/366,260 | 2010-07-21 | ||
PCT/US2011/021132 WO2011088212A2 (en) | 2010-01-13 | 2011-01-13 | Holder assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013513221A true JP2013513221A (ja) | 2013-04-18 |
JP5956346B2 JP5956346B2 (ja) | 2016-07-27 |
Family
ID=44304969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012543347A Expired - Fee Related JP5956346B2 (ja) | 2010-01-13 | 2011-01-13 | ホルダアセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8926135B2 (ja) |
JP (1) | JP5956346B2 (ja) |
CN (2) | CN102667327B (ja) |
TW (1) | TWM409543U (ja) |
WO (1) | WO2011088212A2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015118900A (ja) * | 2013-12-17 | 2015-06-25 | モレックス インコーポレイテドMolex Incorporated | カバーアセンブリ |
KR20160104674A (ko) * | 2014-01-02 | 2016-09-05 | 티이 커넥티비티 네덜란드 비.브이. | Led 소켓 조립체 |
JP2016527674A (ja) * | 2013-07-02 | 2016-09-08 | モレックス エルエルシー | Ledホルダシステム |
JP2016528697A (ja) * | 2013-08-09 | 2016-09-15 | モレックス エルエルシー | ホルダ組立体 |
KR102252463B1 (ko) * | 2020-12-15 | 2021-05-14 | 주식회사 리플렉스 | 고전압 승압장치용 2차 권선 및 이를 포함하는 고전압 승압장치 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8651711B2 (en) | 2009-02-02 | 2014-02-18 | Apex Technologies, Inc. | Modular lighting system and method employing loosely constrained magnetic structures |
TWI483478B (zh) | 2011-03-17 | 2015-05-01 | Molex Inc | Connectors and connector systems |
US8690389B2 (en) * | 2011-05-16 | 2014-04-08 | Molex Incorporated | Illumination module |
DE102011082209A1 (de) * | 2011-09-06 | 2013-03-07 | Osram Opto Semiconductors Gmbh | Leuchtmittel und verwendung |
US9170002B2 (en) * | 2012-01-05 | 2015-10-27 | Molex, Llc | Holder and LED module using same |
US8568001B2 (en) * | 2012-02-03 | 2013-10-29 | Tyco Electronics Corporation | LED socket assembly |
EP2648289B1 (en) * | 2012-04-02 | 2018-03-07 | TE Connectivity Nederland B.V. | Contact element, clamping element, base and arrangement for holding and contacting an LED |
AT13737U1 (de) * | 2012-12-21 | 2014-07-15 | Tridonic Connection Technology Gmbh & Co Kg | Leuchtmittel, insbesondere LED-Modul |
TWM460990U (zh) * | 2013-01-02 | 2013-09-01 | Molex Taiwan Ltd | 發光裝置及其安裝座 |
CN105143764B (zh) * | 2013-03-11 | 2018-09-07 | 莫列斯有限公司 | 固持座、固持座组件及采用固持座组件的led组件 |
ITMI20130843A1 (it) * | 2013-05-24 | 2014-11-25 | A A G Stucchi Srl | Adattatore per moduli led del tipo package/array. |
US8941129B1 (en) | 2013-07-19 | 2015-01-27 | Bridgelux, Inc. | Using an LED die to measure temperature inside silicone that encapsulates an LED array |
TWM472152U (zh) * | 2013-09-05 | 2014-02-11 | Molex Taiwan Ltd | 安裝座與照明裝置 |
WO2015069889A1 (en) * | 2013-11-06 | 2015-05-14 | Molex Incorporated | Led holder |
US9099801B2 (en) | 2013-11-22 | 2015-08-04 | Casco Products Corporation | Short circuit protection for electric cigar lighter and power outlet sockets |
DE102013114209A1 (de) * | 2013-12-17 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Verfahren zur Montage einer Chipträger-LED auf einen Trägerkörper und optoelektronisches Bauelement mit einer Chipträger-LED und einem Trägerkörper |
WO2015106192A1 (en) * | 2014-01-10 | 2015-07-16 | Molex Incorporated | Insert and led holder assembly using same |
US9439299B2 (en) | 2014-03-29 | 2016-09-06 | Bridgelux, Inc. | Low-profile outdoor lighting module with light emitting diodes |
US9277618B2 (en) | 2014-06-27 | 2016-03-01 | Bridgelux, Inc. | Monolithic LED chip in an integrated control module with active circuitry |
DE202014103064U1 (de) * | 2014-07-03 | 2015-10-06 | Zumtobel Lighting Gmbh | Leuchtenanordnung für Leuchten beispielsweise mit LEDs |
TWM502309U (zh) * | 2015-02-03 | 2015-06-01 | Apix Inc | 可調式支架裝置 |
CN105180115B (zh) * | 2015-08-10 | 2018-05-01 | 漳州立达信光电子科技有限公司 | Led灯的电连接件 |
EP3181987A1 (en) * | 2015-12-15 | 2017-06-21 | TE Connectivity Nederland B.V. | Led socket for receiving a cob-led and base for such led socket |
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JPS54115585U (ja) * | 1978-02-03 | 1979-08-14 | ||
JPS57122688U (ja) * | 1981-01-23 | 1982-07-30 | ||
JPS58130387U (ja) * | 1982-02-26 | 1983-09-03 | 株式会社山本窯業 | 電球ソケツトの電線咬着構造 |
JPS625490U (ja) * | 1985-06-21 | 1987-01-13 | ||
JP2003068130A (ja) * | 2001-08-28 | 2003-03-07 | Matsushita Electric Works Ltd | 照明器具 |
JP2009176733A (ja) * | 2008-01-24 | 2009-08-06 | Bjb Gmbh & Co Kg | Ledの電気接続用接触素子 |
US20090207617A1 (en) * | 2008-02-20 | 2009-08-20 | Merchant Viren B | Light emitting diode (led) connector clip |
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US4133595A (en) | 1978-03-06 | 1979-01-09 | Amp Incorporated | Double ended receptacle |
JPS57122688A (en) * | 1981-01-19 | 1982-07-30 | Ricoh Co Ltd | Control circuit for several dc motors |
US4547840A (en) * | 1984-10-02 | 1985-10-15 | United Technologies Automotive, Inc. | Lamp holder for mounting a lamp on a circuit board |
JP4562161B2 (ja) * | 2001-05-23 | 2010-10-13 | 株式会社オートネットワーク技術研究所 | コネクタ |
JP2003068111A (ja) * | 2001-08-29 | 2003-03-07 | Matsushita Electric Works Ltd | 照明器具 |
DE102004054203A1 (de) * | 2004-11-10 | 2006-05-11 | Erni Elektroapparate Gmbh | Schneidklemm-Steckkontaktleiste für elektrische Steckverbinder |
TWM305311U (en) * | 2006-08-08 | 2007-01-21 | Tera Autotech Corp | LED lantern cup module |
US20080266869A1 (en) * | 2006-09-13 | 2008-10-30 | Yun Tai | LED module |
US20080089072A1 (en) * | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
CN201209837Y (zh) | 2008-06-20 | 2009-03-18 | 陈洋怀 | 大功率冷光源防爆照明灯 |
-
2011
- 2011-01-12 TW TW100200669U patent/TWM409543U/zh not_active IP Right Cessation
- 2011-01-13 WO PCT/US2011/021132 patent/WO2011088212A2/en active Application Filing
- 2011-01-13 US US13/513,802 patent/US8926135B2/en not_active Expired - Fee Related
- 2011-01-13 CN CN201180004948.9A patent/CN102667327B/zh not_active Expired - Fee Related
- 2011-01-13 CN CN2011200422170U patent/CN202216194U/zh not_active Expired - Lifetime
- 2011-01-13 JP JP2012543347A patent/JP5956346B2/ja not_active Expired - Fee Related
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JPS54115585U (ja) * | 1978-02-03 | 1979-08-14 | ||
JPS57122688U (ja) * | 1981-01-23 | 1982-07-30 | ||
JPS58130387U (ja) * | 1982-02-26 | 1983-09-03 | 株式会社山本窯業 | 電球ソケツトの電線咬着構造 |
JPS625490U (ja) * | 1985-06-21 | 1987-01-13 | ||
JP2003068130A (ja) * | 2001-08-28 | 2003-03-07 | Matsushita Electric Works Ltd | 照明器具 |
JP2009176733A (ja) * | 2008-01-24 | 2009-08-06 | Bjb Gmbh & Co Kg | Ledの電気接続用接触素子 |
US20090207617A1 (en) * | 2008-02-20 | 2009-08-20 | Merchant Viren B | Light emitting diode (led) connector clip |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016527674A (ja) * | 2013-07-02 | 2016-09-08 | モレックス エルエルシー | Ledホルダシステム |
JP2016528697A (ja) * | 2013-08-09 | 2016-09-15 | モレックス エルエルシー | ホルダ組立体 |
JP2015118900A (ja) * | 2013-12-17 | 2015-06-25 | モレックス インコーポレイテドMolex Incorporated | カバーアセンブリ |
KR20160104674A (ko) * | 2014-01-02 | 2016-09-05 | 티이 커넥티비티 네덜란드 비.브이. | Led 소켓 조립체 |
KR102091795B1 (ko) * | 2014-01-02 | 2020-05-08 | 티이 커넥티비티 네덜란드 비.브이. | Led 소켓 조립체 |
KR102252463B1 (ko) * | 2020-12-15 | 2021-05-14 | 주식회사 리플렉스 | 고전압 승압장치용 2차 권선 및 이를 포함하는 고전압 승압장치 |
Also Published As
Publication number | Publication date |
---|---|
US8926135B2 (en) | 2015-01-06 |
JP5956346B2 (ja) | 2016-07-27 |
CN202216194U (zh) | 2012-05-09 |
US20130084748A1 (en) | 2013-04-04 |
CN102667327B (zh) | 2015-06-03 |
CN102667327A (zh) | 2012-09-12 |
WO2011088212A2 (en) | 2011-07-21 |
TWM409543U (en) | 2011-08-11 |
WO2011088212A3 (en) | 2011-11-10 |
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