JP2013509682A - ガス放電光源用の電極システム - Google Patents
ガス放電光源用の電極システム Download PDFInfo
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- JP2013509682A JP2013509682A JP2012535966A JP2012535966A JP2013509682A JP 2013509682 A JP2013509682 A JP 2013509682A JP 2012535966 A JP2012535966 A JP 2012535966A JP 2012535966 A JP2012535966 A JP 2012535966A JP 2013509682 A JP2013509682 A JP 2013509682A
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- 239000007772 electrode material Substances 0.000 claims abstract description 29
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 14
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 239000010419 fine particle Substances 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 18
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 5
- 150000001247 metal acetylides Chemical class 0.000 claims description 4
- 229910052723 transition metal Inorganic materials 0.000 claims description 4
- 150000003624 transition metals Chemical class 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 3
- 150000002830 nitrogen compounds Chemical class 0.000 claims description 3
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 16
- 230000000930 thermomechanical effect Effects 0.000 abstract description 5
- 230000003628 erosive effect Effects 0.000 description 15
- 238000000576 coating method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- -1 La203 Chemical class 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000753 refractory alloy Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—X-ray radiation generated from plasma
- H05G2/003—X-ray radiation generated from plasma being produced from a liquid or gas
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
- G03F7/2039—X-ray radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K5/00—Irradiation devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—X-ray radiation generated from plasma
- H05G2/003—X-ray radiation generated from plasma being produced from a liquid or gas
- H05G2/005—X-ray radiation generated from plasma being produced from a liquid or gas containing a metal as principal radiation generating component
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- X-Ray Techniques (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Rs=λσ/Eα
ここでλは熱伝導率、σは引張強さ、Eはヤング率で、αは線形膨張係数である。熱衝撃挙動は(上記の方程式により表されるように)クラックの開始及びクラックの伝播と関連がある点に留意することが重要である。第一段階では、Rsが大きい場合、欠陥が始まる可能性は僅かである。第二段階では、即ちクラックが存在する場合、損傷耐性又は熱衝撃によるクラックの伝播の範囲が次式で表される。
〜(K1c)2 〜 σ2
ここでK1cは破壊靭性である(下付き添字1cはモード1、即ちクラックが開いて通常の応力であることを示す)。このようにK1cは、既存のクラックから始まる破壊からの不良に対する材料の抵抗性を記述している。
K=λ/ρcp
ここでρは質量密度である。高い温度伝導率を有する材料は、急速に同材料の初期の温度傾斜を同材料の周囲環境の温度傾斜へと減じる。何故ならば当該材料が、同材料の体積熱容量又は「熱容量」cpと比較すると、熱を迅速に伝導するからである。
2 電極(陰極)
3 アイソレータ
4 コンデンサ・バンク
5 ピンチ・プラズマ
6 照射光
7 Sn(スズ)のフィルム
8 レーザ
9 液体Snを有する容器
10 コーティング
11 レーザ光線
Claims (9)
- 主要構成要素としてMo若しくはW、又はMo若しくはWの合金を含む電極材から形成された少なくとも二つの電極を有する電極システムであって、
前記電極材が500 nm以下の平均サイズをもつ微粒子を有する微細粒構造をもつことを特徴とする、電極システム。 - 前記電極材が、分散したナノ・サイズの粒子でドーピングされることを特徴とする、請求項1に記載の電極システム。
- 前記電極材がLa203、Hf02、C、Y203、Ce02、Ti02、及び金属カーバイドのグループに属する分散したナノ・サイズの粒子でドーピングされることを特徴とする、請求項1に記載の電極システム。
- 前記電極材が5重量%までの量の分散したナノ・サイズの粒子を含むことを特徴とする、請求項1に記載の電極システム。
- 前記電極が少なくとも最も大きな熱-機械負荷及び/又は最も大きな熱-化学負荷のかかる領域では、セラミック材にてコーティングを施されることを特徴とする、請求項1に記載の電極システム。
- 前記セラミック材がグループIV-B、グループV-B、及びグループVI-Bに属する耐火性遷移金属のホウ化物、カーバイド、窒素化合物、及びシリサイドのうちの一つから形成されることを特徴とする、請求項5に記載の電極システム。
- ガス放電デバイスの電極システムの電極本体及び/又は他の構成部品を形成するために、主要構成要素としてMo若しくはW、又はMo若しくはWの合金を含む材料の使用であって、当該材料が500 nm以下の平均サイズをもつ微粒子を有する微細粒構造を有することを特徴とする、材料の使用。
- ガス放電チャンバを有するガス放電デバイスであって、請求項1に記載の電極システムが配置され、電源が前記電極システムの前記電極へと電気的に接続されていることを特徴とする、ガス放電デバイス。
- 請求項8に記載のガス放電デバイスであって、
− 液体金属を前記電極の表面に供給するための供給デバイスと、
− レーザ光線により前記電極の表面から前記液体金属の一部を蒸発させるレーザと、
を更に有し、
前記電極が回転可能に載置されていることを特徴とする、ガス放電デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09174429 | 2009-10-29 | ||
EP09174429.2 | 2009-10-29 | ||
PCT/IB2010/054379 WO2011051839A1 (en) | 2009-10-29 | 2010-09-29 | Electrode system, in particular for gas discharge light sources |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013509682A true JP2013509682A (ja) | 2013-03-14 |
JP5896910B2 JP5896910B2 (ja) | 2016-03-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012535966A Active JP5896910B2 (ja) | 2009-10-29 | 2010-09-29 | ガス放電光源用の電極システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8749178B2 (ja) |
EP (1) | EP2494854B1 (ja) |
JP (1) | JP5896910B2 (ja) |
KR (1) | KR101706908B1 (ja) |
CN (1) | CN102598874B (ja) |
WO (1) | WO2011051839A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018163873A (ja) * | 2017-02-07 | 2018-10-18 | ザ・ボーイング・カンパニーThe Boeing Company | 区別された液体ジェットの円筒状アレイを注入するシステム及び注方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102013000407B4 (de) * | 2013-01-11 | 2020-03-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Verbesserung der Benetzbarkeit einer rotierenden Elektrode in einer Gasentladungslampe |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000149691A (ja) * | 1998-09-07 | 2000-05-30 | Mitsubishi Electric Corp | ガス遮断器 |
US20050031502A1 (en) * | 2003-08-07 | 2005-02-10 | Robert Bristol | Erosion resistance of EUV source electrodes |
WO2009020390A1 (en) * | 2007-08-06 | 2009-02-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US6744060B2 (en) * | 1997-05-12 | 2004-06-01 | Cymer, Inc. | Pulse power system for extreme ultraviolet and x-ray sources |
US7180081B2 (en) | 2000-06-09 | 2007-02-20 | Cymer, Inc. | Discharge produced plasma EUV light source |
US6972421B2 (en) | 2000-06-09 | 2005-12-06 | Cymer, Inc. | Extreme ultraviolet light source |
US6809328B2 (en) | 2002-12-20 | 2004-10-26 | Intel Corporation | Protective coatings for radiation source components |
DE10342239B4 (de) | 2003-09-11 | 2018-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Erzeugen von Extrem-Ultraviolettstrahlung oder weicher Röntgenstrahlung |
DE102005023060B4 (de) * | 2005-05-19 | 2011-01-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gasentladungs-Strahlungsquelle, insbesondere für EUV-Strahlung |
US7759663B1 (en) * | 2006-12-06 | 2010-07-20 | Asml Netherlands B.V. | Self-shading electrodes for debris suppression in an EUV source |
-
2010
- 2010-09-29 WO PCT/IB2010/054379 patent/WO2011051839A1/en active Application Filing
- 2010-09-29 US US13/503,394 patent/US8749178B2/en active Active
- 2010-09-29 JP JP2012535966A patent/JP5896910B2/ja active Active
- 2010-09-29 CN CN201080048670.0A patent/CN102598874B/zh active Active
- 2010-09-29 EP EP10765684.5A patent/EP2494854B1/en active Active
- 2010-09-29 KR KR1020127013692A patent/KR101706908B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000149691A (ja) * | 1998-09-07 | 2000-05-30 | Mitsubishi Electric Corp | ガス遮断器 |
US20050031502A1 (en) * | 2003-08-07 | 2005-02-10 | Robert Bristol | Erosion resistance of EUV source electrodes |
WO2009020390A1 (en) * | 2007-08-06 | 2009-02-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018163873A (ja) * | 2017-02-07 | 2018-10-18 | ザ・ボーイング・カンパニーThe Boeing Company | 区別された液体ジェットの円筒状アレイを注入するシステム及び注方法 |
JP7057657B2 (ja) | 2017-02-07 | 2022-04-20 | ザ・ボーイング・カンパニー | 区別された液体ジェットの円筒状アレイを注入するシステム及び注入方法 |
Also Published As
Publication number | Publication date |
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KR101706908B1 (ko) | 2017-02-15 |
JP5896910B2 (ja) | 2016-03-30 |
US20120212158A1 (en) | 2012-08-23 |
EP2494854A1 (en) | 2012-09-05 |
CN102598874A (zh) | 2012-07-18 |
EP2494854B1 (en) | 2013-06-19 |
US8749178B2 (en) | 2014-06-10 |
CN102598874B (zh) | 2016-02-10 |
WO2011051839A1 (en) | 2011-05-05 |
KR20120112425A (ko) | 2012-10-11 |
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